KR20090039784A - System and method for processing high purity materials - Google Patents

Abstract

Systems and methods for processing high purity materials are disclosed. A unit operation processes a material stream, an operational parameter of the unit operation is monitored, and a standby unit is charged with pressurized gas to achieve system pressure. The material stream is diverted to the standby unit in response to the operational parameter of the unit operation registering a threshold value. Flow exiting the standby unit is first vented via an outlet, and then directed toward a point of use after the pressurized gas has been purged. The unit operation may then be serviced and subsequently brought back online. A second unit operation may process a second material stream simultaneously, and the second material stream may be periodically diverted to the standby unit in like manner, thus reducing line pressure variation. The disclosed method may be performed manually or implemented automatically through use of a controller.

Description

SYSTEM AND METHOD FOR PROCESSING HIGH PURITY MATERIALS {SYSTEM AND METHOD FOR PROCESSING HIGH PURITY MATERIALS}

One or more embodiments of the present invention relate to systems and methods for treating high purity materials, and more particularly to systems and methods for treating high purity materials, such as abrasive slurries.

High purity materials are required, for example, in the pharmaceutical, cosmetic and semiconductor industries. In the semiconductor industry, mixed process materials are typically prepared using a production system in which raw materials are introduced into the mixing subsystem. Precision is required to produce batch process materials of batches that are acceptable for the intended use and to ensure batch-to-batch consistency. The batch is then processed downstream, typically via filtration or further mixing, etc., prior to delivery to the tool.

For many applications, it is necessary to continuously feed the mixing process material to the point of use. Standby units are typically used to facilitate bringing one or more process elements offline periodically for servicing. However, even small fluctuations in process parameters associated with such transitioning can cause significant disruption to the continuous delivery and / or quality of high purity materials. For example, harmful pressure drops within the system can be particularly important.

In accordance with one or more embodiments, the present invention relates generally to systems and apparatus for treating high purity materials.

According to one or more embodiments, the present invention relates to a method for treating high purity materials, comprising introducing a flow of a first material into a first unit operation, and operating parameters of the first unit operation. parameter), filling the pressurized gas with the second unit operation unit, purging the pressurized gas from the second unit operation unit, and operating parameters of the first unit operation unit recording the limit values. In response to diverting the flow of the first material to the second unit operator.

According to one or more embodiments, the invention also relates to a system for processing high purity materials, comprising: a first material supply line, a first unit operation portion in fluid communication with a downstream portion of the first material supply line, and the first material A second unit operation unit fluidly connected to a downstream portion of the supply line, a first sensor arranged to sense an operating parameter of the second unit operation unit, a pressurized gas supply line fluidly connected to the first unit operation unit and the second unit operation unit, And an outlet fluidly connected to the first unit operation unit and the second unit operation unit, and a controller in communication with the first sensor, the second sensor, and the outlet. The controller is configured to provide a first control signal from the pressurized gas supply line to the pressurized gas for filling the second unit operation unit and the first sensor from the first unit operation unit to the outlet in response to recording the threshold value. Generate a second control signal for redirecting the flow of one material and a third signal for introducing the flow of first material toward the tool via the second unit control after purging the pressurized gas from the second unit control; do.

Other advantages, new features and objects of the invention will become apparent upon consideration of the following detailed description of the invention in conjunction with the accompanying drawings.

The accompanying drawings are not intended to be drawn to scale. Each identical or nearly identical component that is illustrated in various forms in the figures is designated by a like numeral. For the sake of clarity, not all components of the drawings are labeled. Preferred and non-limiting embodiments will be described with reference to the accompanying drawings.

1-5 show schematic diagrams illustrating one system and various flow flow patterns therein in accordance with one or more embodiments of the present invention;

6 and 7 show schematic diagrams illustrating various flow flow patterns therein and alternative systems in accordance with one or more embodiments of the present invention.

The invention is not limited in its application to the details of construction and arrangement of components shown in the following description and drawings. The invention may be practiced according to embodiments and may be practiced or carried out in various ways beyond the scope illustrated herein.

As with one or more embodiments, the present invention generally relates to systems and methods for treating one or more high purity materials. The systems and methods described herein can be used to prepare materials for use in a wide variety of industries, including, for example, the cosmetic, pharmaceutical, semiconductor industries, as well as other industries where continuous and / or precise supply of high purity materials may be required. Can be.

Embodiments of the present invention generally involve the introduction of a flow of a substance into a unit operator. The unit operation unit may include all process elements having a volume to be filled. For example, the unit operator can act on the material by a bonding, reaction or separation process. In some embodiments, the unit operator may include a filter, such that a differential pore filter, such as a filter bank or system, can filter the material in stages. The choice of filter and void can be determined based on the material to be treated and the intended use. Other unit controls may include, for example, ion exchange beds, grinders, heating devices, or cooling devices.

The unit operator can then direct the material downstream for further processing, storage or end user delivery. The material directed to the unit operator may include any compound or mixture, such as a chemical mechanical polishing (CMP) slurry, that needs to be processed by the unit operator. The material may comprise a composite that has been treated such as mixing or separation upstream of the unit operator, or may comprise a raw feed material initially treated by the unit operator. Some embodiments of the present invention may include a plurality of mass flows introduced into a plurality of primary unit controls to be discussed below. For example, the first material supply line may be in fluid connection with the first unit operation part while the second material supply line is in fluid connection with the second unit operation part. In some embodiments, the first and second unit controls can function simultaneously.

The system of the present invention may further comprise one or more sensors for sensing, measuring and / or monitoring the characteristics or operating parameters of the unit operation unit. For example, the sensor may include one or more pressure sensors (eg, pressure transducers) configured to monitor the differential pressure across the unit operator. The differential pressure can be measured directly, or can be measured based on the records obtained both upstream and downstream of the unit operation unit. Other operating parameters may include, for example, temperature, conductivity, flow rate, or power consumption. In some embodiments, the sensor can generate a signal based on the collected data and can also deliver the signal to an operator or controller of the system. The information gathered by these sensors helps, for example, to evaluate the performance of the unit operation unit and the maintenance requirements of the unit operation unit.

During operation of the system, it may be desirable or necessary to take the unit control off-line for maintenance or maintenance. One unit operation unit can be maintained at regular intervals or in response to limit values recorded in operating parameters. For example, a pressure sensor in communication with the filter bank may record a differential pressure across the filter bank that is above a predetermined threshold. Limit values may vary between operators or based on the intended use. For example, if the differential pressure across a new or used unit control unit records 6 psi, then a differential pressure of 9 psi can be predetermined as a threshold. Maintenance generally requires cleaning of the unit controls and / or replacement of components as well as isolation of the unit controls. If the unit operation comprises a filter, the maintenance may be further particularly concerned with, for example, flushing, backwashing and other cleaning regimes generally known to those skilled in the art.

The system according to one or more embodiments of the present invention may also include one or more secondary unit controls to support and / or support the primary unit controls to facilitate continuous processing and / or delivery of material downstream. have. This secondary unit operation unit may be referred to herein as a standby unit or backup unit. When the primary unit control unit is taken offline for maintenance or maintenance, the flow of material to be treated is temporarily diverted to the atmospheric unit until flow to the primary unit control unit is recovered, thereby preventing the downstream delivery of the material. You can stop it. In general, the standby unit may be functionally identical to the primary unit operating portion it supports or may replace the primary unit operating portion. According to some embodiments, one standby unit will support one or more primary unit controls.

One or more embodiments of the present invention may further include features for reducing line pressure variations within the system. When transitioning between the primary unit operation unit and the standby unit operation unit, such as when performing the above-mentioned maintenance, it would be desirable to prevent the line pressure drop in the operating unit. Regardless of any particular theory, changes in line pressure will have a detrimental effect on accuracy and / or soft properties in the processing and delivery of high purity materials where precision is critical.

Therefore, in accordance with one or more embodiments of the present invention, the primary or secondary unit controls may be fluidly connected to a source of pressurized fluid, such as pressurized gas, to be injected prior to transition between unit controls. More specifically, the unit operation unit brought online may be first filled with pressurized gas to achieve system pressure. The pressurized gas to be used may include any gas that is compatible with the components of the system (eg pressurized nitrogen gas). As will be discussed in more detail below with reference to the various figures, the flow of treated material can then be redirected to a temporarily prepared atmospheric unit operation unit without experiencing a significant line pressure drop.

The system may also include an outlet fluidly connected to each unit operation unit to facilitate purging pressurized gas from the system as needed. One or more configurations of the system, such as various valves (eg, needle valves) associated with the flow line within the system, may be adjusted and / or adjusted to limit and / or control the rate at which pressurized gas is discharged from the unit operator. will be. The rate at which the material to be treated replaces the pressurized gas at the unit operating unit can be assisted in such a way that the line pressure does not change while the material to be treated moves between the unit operating units. By adjusting the rate at which the pressurized gas is discharged from the unit operation unit, the inflow of the material for treatment can be directly controlled.

Implementation of one or more embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, in which the thick line represents the fluid flow in the system.

1-5 illustrate a system in accordance with one or more embodiments of the present invention. The flow of material to be treated is introduced from the material supply unit 110 to the first unit operation unit 120. The processed material exiting the first unit operator 120 is directed towards the tool 130 or downstream for further processing. Alternatively, the processed material exiting from the first unit operation unit 120 may be supplied to, for example, a semiconductor manufacturing line. The operating parameters of the first unit operation unit 120 are monitored by a sensor 140 such as a differential pressure sensor. Additional sensors may be provided before and after the first unit operator 120 (eg, supply and outlet lines). As shown in FIG. 1, the second unit operation unit 150 is filled with pressurized gas from the pressurized gas source 180 to achieve system pressure. This preparatory work may occur while the first unit operation unit 120 actively processes the material. In addition, the pressurized gas may be maintained in the second unit operation unit 150, as shown in FIG. 1, and continuously discharged from the system 100 via the outlet 170 as shown in FIG. 2.

According to one or more embodiments, the transition between the unit manipulation units may be initiated in accordance with the operating parameters of the first unit manipulation unit 120 which records a predetermined limit value as sensed by the sensor 140. Alternatively, the transition may occur periodically, intermittently or at predetermined time intervals by the operator of system 100. During the transition, the material from the material supply 110 may first be introduced into both the first and second unit controls 120, 150 for processing. FIG. 3 illustrates two operation processes in which pressurized gas is purged from the system 100 while the flow exiting the second unit operation unit 150 is discharged through the outlet 170. Once the pressurized gas is sufficiently discharged, then the flow exiting the second unit operator 150 is directed towards the tool 130 as shown in FIG. 4. Then, the mass flow may be completely redirected from the first unit operating unit 120 to the second unit operating unit 150 as shown in FIG. 5. The described switching between the first unit operation unit 120 and the second unit operation unit 150 can be achieved without disturbing the continuous downstream delivery of the treated material, for example without a significant drop in line pressure, for example Less than 1psig, can be achieved. The second unit manipulation unit 150 may be online while the first unit manipulation unit 120 avoids a pressure transient.

The operating parameter of the second unit operation unit 150 is monitored by the second sensor 160. While the second unit operation unit 150 is online processing the material as the backup support unit, the first unit operation unit 120 may be maintained. For example, the first unit operator 120 can be isolated from the rest of the system 100 from which components can be cleaned and / or replaced. In this way, the operating parameters of the first unit operation unit 120 can be restored to below the limit value.

After holding, the first unit operation unit 120 is prepared to return to the online state while the second unit operation unit 150 is still operating. The first unit operation unit 120 may be filled with pressurized gas from the pressurized gas source 180. Again, the pressurized gas will be retained in the first unit operator 120 or continuously discharged via the outlet 170 as shown in FIG. 5.

The flow of the processed material from the material supply unit 110 may then be returned to the first unit operation unit 120. The transition back to the first unit operation unit 120 may occur while performing pressurization and maintenance of the first unit operation unit 120. Alternatively, the transition may be a monitored operation of the second unit operation unit 150 which records a second predetermined limit value (eg, a value indicating that the second unit operation unit 150 needs information). You can proceed according to the parameters. The change of direction or reverse travel from the second unit operation unit 150 to the first unit operation unit 120 may occur in the same manner as the first transition. For example, when the substance is introduced into both the first and second unit operation units 120 and 150, and the pressurized gas is purged after the flow discharged from the first unit operation unit 120 is discharged through the outlet 170. Guided toward the tool 130, the flow of material may then be completely redirected from the second unit operation unit 150 to the first unit operation unit 120. The operating parameters of the first unit operation unit 120 can be monitored, and the second unit operation unit 150 can be serviced and prepared for later maintenance and return to the online state as needed. During the process cycle described herein, non-operating unit controls can generally be serviced and / or introduce system operating parameters.

As shown in FIGS. 6 and 7, the alternative system 200 may further include a third unit operator 220 fluidly connected downstream of the second material supply 210 and to the pressurized gas source 180. The first material supply unit 110 and the second material supply unit 210 may include the same material or may be derived from the same supply unit. The third sensor 240 monitors operating parameters of the third unit manipulation unit 220.

The flow exiting from the third unit manipulation unit 220 may be transferred to the second tool 230 downstream. According to one or more embodiments, the second unit manipulation unit 150 is fluidly connected to the first material supply unit 110 and the second material supply unit 210 as well as the first tool 130 and the third tool 230. It may function as a standby unit unit or a backup unit unit for the first unit operation unit 120 and the third unit operation unit 220. The first tool 130 and the second tool 230 may be the same or different tools. In one embodiment, both the first unit operation unit 120 and the third unit operation unit 220 are configured to supply a single semiconductor manufacturing line.

During operation of the system 200, the first unit manipulation unit 120 may first function simultaneously with the third unit manipulation unit 220. Either of the first material supply unit 110 or the second material supply unit 210, the second unit operation unit 150 to maintain any one of each of the first unit operation unit 120 and the third unit operation unit 220 Can be redirected temporarily. Accordingly, the second unit operation unit 150 may function simultaneously with either the first unit operation unit 120 or the third unit operation unit 220 during the maintenance for any one of the primary unit operation units. Redirection or transition between unit controls may proceed as discussed above with respect to system 100 according to FIGS. 1-5 to minimize harmful line pressure changes. For example, an inoperable unit control unit may be filled with pressurized gas to achieve system pressure before it comes online, and the flow exiting the operating unit control unit may be filled with pressurized gas through the outlet before being directed towards the tool. Could be purged. In an embodiment having two or more primary units, a switchover may proceed without overlapping the operation of the units in progress while continuing to maintain continuous downstream delivery, such as through a method of completely reversing the initial direction of the material. Can be.

As exemplarily shown in FIG. 6, the first unit operation unit 120 and the third unit operation unit 220 simultaneously process the material from each of the first material supply unit 110 and the second material supply unit 210. Can function. The second unit operation unit 150 is temporarily offline and functions as a standby unit unit. As described, the second unit operator 150 is filled with pressurized gas from the pressurized gas source 180 to achieve system pressure. Likewise, the pressurized gas may be retained in the second unit operation unit 150 as shown, or alternatively, may be continuously released via the outlet 170. The operating parameters of the first unit operation unit 120 and the third unit operation unit 220 are each sensors (eg, to assist in determining whether one should go offline or both go offline for maintenance). 140, 240 may be monitored.

FIG. 7 shows the same system, but the second material supply temporarily turns from the third unit operation unit 220 to the second unit operation unit 150 in response to the third sensor 240 recording the limit value. do. The third unit control unit 220 is isolated for maintenance and will likewise be filled with pressurized gas to achieve system pressure. The third unit operation unit 220 may be in an on-line state in response to an operating parameter of the second unit operation unit for recording a limit value or alternatively after maintenance and preparation of the third unit operation unit 220 is completed.

In some applications, the request to the downstream of the treated material can sometimes be reduced or stopped. Regardless of any particular theory, recycling of material through the unit operation unit is detrimental to the performance of the suspension and / or unit operation unit, as the polishing suspension recycles through the filter. In this situation, the flow of material can be planned to be diverted to a bypass loop without associated unit controls until the downstream request is resumed. To prevent pressure changes in the line, the bypass loop can be filled with pressurized gas before it comes online according to the method discussed above for the standby unit operation.

The described method for treating high purity materials may be performed manually or may be performed automatically through the use of a controller integrated into the system. For example, the system may include a controller to communicate with the sensor and may include unit controls, tools, and various valves associated with flow at the outlet. The controller controls the flow of the first material in the first unit operation in response to the first control signal for filling the second unit operation portion with the pressurized gas from the pressurized gas supply line and the first sensor recording the threshold value. Directing a flow of the first material toward the tool via the second unit operation unit after the second control signal and the pressurized gas are purged to the second unit operation unit for diverting to the exit via the second unit operation unit; May be configured to generate a third signal. The controller may also be configured to generate a fourth signal that redirects the flow of the second material from the third unit operation unit to the second unit operation unit in response to the third sensor recording the second limit value. The controller may also be configured to isolate the first unit control unit for maintenance, and in response to the second sensor recording a third limit value or for recording a value less than the limit value of the first sensor. In response, may be configured to resume the flow of the first material to the first unit operation unit.

The controller may be one or more computer systems, such as an Intel PENTIUM®-type processor, a Motorola PowerPC® processor, a Sun UltraSPARC® processor, It may be implemented using a general purpose computer such as a HewlettPackard PA-RISC® processor or any other type of processor or combination thereof. Alternatively, the computer system may include a controller that is intended for specially programmed, special-purpose hardware, such as an application specific semiconductor (ASIC) or material handling system.

Computer systems typically comprise one or more storage devices, for example, one or more disk drive memories, flash memory devices, RAM memory devices, or other devices for storing data. It may include one or more processors connected. Memory is typically used to store programs and data while the material processing system and / or computer system is operating. For example, the memory may be used to store operational data as well as historical data related to parameters over a period of time. Software comprising programming code for carrying out embodiments of the present invention may be stored on a computer capable of reading and / or writing to a nonvolatile recording medium, and then typically copied to memory, which is then processor Can be executed by Such programming code includes a number of programming languages, such as Java, Visual Basic, C, C #, or C ++, Fortran, It can be read as Pascal, Eiffel, Basic, COBAL, or various combinations thereof.

The components of a computer system may be coupled by one or more interconnection mechanisms, which may comprise one or more buses (eg, between components integrated within the same device) and / or a network ( For example, between components in separate, separate devices). Interconnecting mechanisms typically enable communication (eg, data, instructions) that can be exchanged between components of a computer system.

The computer system may also include one or more output devices, such as printing devices, display screens, or speakers, as well as one or more input devices, such as keyboards, mice, trackballs, microphones, touch screens, and other user-machines (man). -machine) interface device may be included. In addition, the computer system may include an interface (not shown) that may connect one or more computer systems to a communication network (in addition to or instead of a network that may be formed by one or more components of the computer system).

In accordance with one or more embodiments of the present invention, one or more input devices may include sensors for measuring parameters of the material processing system and / or its components. Alternatively, the sensor, metering device and / or other components may be connected to a communication network operatively coupled to the computer system. Any one or more of the above may be coupled to another computer system or component for communicating with a computer system across one or more communication networks. Such a configuration may enable any sensor or signal-generating device to be located at a significant distance from the computer system, and / or allow any sensor to be located at a significant distance from any subsystem and / or controller. You can do that, and still provide data between them. Such a communication mechanism may be accomplished by using any suitable technique, including an apparatus using a wireless protocol.

The controller may include one or more computer storage media, such as a non-volatile recording medium that can read, write, or store a signal that defines a program executed by one or more processors. For example, the medium may be a disk or flash memory. In a typical task, a processor may retrieve data from a storage medium, such as code that executes one or more embodiments of the invention, into data that is interpreted by the one or more processors into memory allowing faster access than the medium to the information. Memory is typically volatile random access memory, such as random access memory (DRAM) or static memory (SRAM) or other suitable device that facilitates information to or from the processor.

It should be understood that the present invention is not limited to running on software or on a computer system as exemplarily discussed herein. Of course, for example, instead of being run on a general purpose computer system, controller or components or subsections thereof, alternatively as a dedicated system or as a dedicated programmable logic controller (PLC) or in a distributed control system. Will be executed. In addition, it should be understood that one or more configurations and aspects of the invention may be implemented in software, hardware or firmware, or any combination thereof. For example, portions of one or more algorithms executable by a controller may be performed on a separate computer, thereby communicating over one or more networks.

Other embodiments of the systems and methods of the present invention may be considered beyond the scope described herein by way of example.

The term "plurality" as used herein refers to two or more items or configurations. The terms "comprising", "including", "carrying", "having", "containing", and "involving" shall be in writing Unlimited terminology in the description or the claims, and the like, ie, "including but not limited to". Therefore, use of this term is meant to include the listed items and their equivalents and added items. Only the phrases "consisting of" and "consisting essentially of" are connection terms individually or somewhat restrictive in accordance with the claims.

The use of terms indicating the order such as "first," "second," "third," and so forth, to modify the elements of a claim in a claim is solely defined as the difference between an element of a claim and another. It does not mean a preponderance, precedence, or temporal order in the operation of the order or method performed, but merely means that an element of a claim has the same name (except for the use of an ordered term) as long as it has a name. It is only put in order to distinguish it from the elements of other claims.

Those skilled in the art should understand that the parameters and shapes described herein are exemplary and that the actual parameters and / or shapes will depend upon the particular use in which the systems and techniques of the present invention are used. In addition, those skilled in the art should recognize that only those which have undergone conventional experimentation are equivalent to specific embodiments of the present invention and should be able to determine. Therefore, the embodiments described herein are merely described by way of example and may be understood to be within the scope of the appended claims and equivalent thereto, and the invention may be practiced otherwise than as specifically described.

Claims (26)

For the treatment of high purity materials, Introducing a flow of first material into the first unit operator; Monitoring operating parameters of the first unit operation unit; Filling the pressurized gas into the second unit operation unit; Purging the pressurized gas from the second unit operation unit; Redirecting a flow of the first material to a second unit operation in response to the operating parameter of the first unit operation recording a limit value. The method of claim 1, further comprising isolating the first unit operation portion. The method of claim 2, further comprising flushing the first unit operator. The method of claim 2, further comprising restoring an operating parameter of the first unit operation unit to a value less than the limit value. The method of claim 4, wherein recovering the operating parameter comprises replacing a component of the first unit operator. 5. The method of claim 4, further comprising filling pressurized gas into the first unit operation unit. 7. The method of claim 6, further comprising resuming flow of the first material to the first unit operator. 8. The method of claim 7, wherein resuming flow of the first material to the first unit operation unit comprises purging pressurized gas from the first unit operation unit. The method of claim 1, further comprising introducing a flow of second material into the third unit operation unit and monitoring operating parameters of the third unit operation unit. 10. The high purity material of claim 9, further comprising redirecting the flow of the second material to the second unit operation portion in response to the operating parameter of the third unit operation portion recording a second limit value. Method for processing The method of claim 10, further comprising restoring an operating parameter of the third unit operation unit to a value less than the second limit value. The method of claim 11, further comprising resuming flow of the second material to a third unit operator. The method of claim 1, wherein the first unit operation portion and the second unit operation portion comprise a filter. The method of claim 1, wherein the operating parameter of the first unit operation unit is a differential pressure across the first unit operation unit. 10. The method of claim 9, wherein the first unit operation portion and the third unit operation portion function simultaneously. System for processing high purity materials, A first material supply line; A first unit operation portion in fluid communication with a downstream portion of the first material supply line; A second unit operation portion in fluid communication with a downstream portion of the first material supply line; A first sensor arranged to sense operating parameters of the first unit manipulation unit; A second sensor arranged to sense operating parameters of the second unit manipulation unit; A pressurized gas supply line fluidly connected to the first unit operation unit and the second unit operation unit; An outlet fluidly connected to the first unit operation unit and the second unit operation unit; A first control signal in fluid communication with the first sensor, the second sensor and the outlet, for filling the second unit operation portion with pressurized gas from the pressurized gas supply line, and for recording the threshold value by the first sensor. In response, a second control signal for diverting the flow of the first substance from the first unit operating portion to the outlet via the second unit operating portion, and after the pressurized gas is purged to the second unit operating portion, the first substance And a controller configured to generate a third signal for directing a flow of the light toward the tool via the second unit operating portion. The system of claim 16, wherein the first sensor comprises a differential pressure sensor. The system of claim 16, wherein the first unit operation portion and the second unit operation portion comprise a filter. 18. The system of claim 16, further comprising a second material supply line in fluid communication with an upstream portion of the second unit operation portion. 20. The system of claim 19, further comprising a third unit operation fluidly connected with an upstream portion of the second material supply line. 21. The system of claim 20, further comprising a third sensor arranged to sense operating parameters of the third unit operation portion. 21. The method of claim 20, wherein the controller redirects the flow of the second material from the third unit operation unit to the second unit operation unit in response to the third sensor recording a second limit value. A system for processing high purity materials further configured to generate a control signal. The method of claim 16, wherein the controller is further configured to resume flow of the first material to the first unit operator in response to the second sensor recording a third limit value. system. The system of claim 16, wherein the controller is further configured to isolate the first unit operation portion for maintenance. 25. The method of claim 24, wherein the controller is configured to resume flow of the first material to the first unit operator in response to the first sensor recording a value less than the threshold. System. The system of claim 20, wherein the first unit operation portion and the third unit operation portion are configured to function simultaneously.

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