KR20090029583A - Apparatus for preventing subside of substrate and method thereof - Google Patents

Apparatus for preventing subside of substrate and method thereof Download PDF

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KR20090029583A
KR20090029583A KR1020070094936A KR20070094936A KR20090029583A KR 20090029583 A KR20090029583 A KR 20090029583A KR 1020070094936 A KR1020070094936 A KR 1020070094936A KR 20070094936 A KR20070094936 A KR 20070094936A KR 20090029583 A KR20090029583 A KR 20090029583A
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substrate
finger
transfer robot
deflection
present
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KR1020070094936A
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Korean (ko)
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KR100914527B1 (en
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노일호
권오성
하종의
이세원
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

An apparatus for preventing the subsiding of substrate and a method thereof are provided to prevent the substrate from being bent by maintaining the substrate to the dome shape. An apparatus for preventing the subsiding of substrate of the substrate transfer robot comprises a finger part(10), an elevating member(20), a driving part, a sensing part, and a controller. The finger part supports the edge of substrate. A part of the finger part is mobile from side to side. The elevating member is positioned under the substrate and supports the center of substrate. The sensing part senses the warp state and the boost state of substrate. The driving part runs the finger part and the elevating member. The controller controls the driving part in order to maintain the center of substrate to dome shape.

Description

기판 이송 로봇의 기판 처짐 방지 장치 및 방법{Apparatus for preventing subside of substrate and method thereof}Apparatus for preventing subside of substrate and method according to substrate transfer robot

본 발명은 기판 처짐 방지 장치 및 방법에 관한 것으로, 보다 상세하게는 기판 이송 로봇에 의한 대면적 기판 이송시 상기 기판의 처짐을 방지할 수 있는 기판 이송 로봇의 기판 처짐 방지 장치 및 방법에 관한 것이다.The present invention relates to a substrate deflection prevention apparatus and method, and more particularly to a substrate deflection prevention apparatus and method of the substrate transfer robot that can prevent the deflection of the substrate during large area substrate transfer by the substrate transfer robot.

일반적으로 다이오우드, 트랜지스터, 사이리스터 등과 같은 반도체 소자를 제조하기 위해서는 기판 상에 사진(photo), 확산(diffusion), 증착(deposition), 식각(etching) 및 이온 주입(ion implant) 등의 다양한 공정을 수행하게 된다. 따라서, 이러한 각 공정들을 모두 수행하기 위해서는 각 공정을 수행한 후 기판들이 다른 공정으로 이송되어야 한다. 이를 위해 각 반도체 소자 제조 공정이 진행되는 공정 챔버로 기판을 이송하기 위한 기판 이송 로봇이 사용된다.Generally, to manufacture semiconductor devices such as diodes, transistors, thyristors, etc., various processes such as photo, diffusion, deposition, etching, and ion implantation are performed on a substrate. Done. Therefore, in order to perform all of these processes, the substrates must be transferred to another process after each process. To this end, a substrate transfer robot for transferring a substrate to a process chamber in which each semiconductor device manufacturing process is performed is used.

상기 기판 이송 로봇은 다관절 형태의 암부에 핑거부가 고정되며, 상기 핑거부에 기판이 지지된 상태에서 상기와 같은 공정을 수행하게 된다. 이때 상기 기판의 하중에 의한 상기 기판의 중심부 처짐 현상이 발생하게 된다. The substrate transfer robot is fixed to the arm portion of the articulated art, the finger is fixed, the substrate is carried out as described above the substrate is supported on the finger portion. At this time, the central sag of the substrate due to the load of the substrate occurs.

지금까지 반도체 소자의 제조에 많이 사용되고 있는 기판의 사이즈는 대략 470*370이며, 이 정도의 기판 사이즈에서는 상기 기판의 중심부 처짐 발생이 미소하였다.Until now, the size of a substrate that has been widely used for the manufacture of semiconductor devices is approximately 470 * 370, and at this substrate size, the occurrence of central deflection of the substrate was minute.

그러나, 반도체 소자의 생산성을 향상시키기 위해 상기 기판의 사이즈가 대략 920*730 이상으로 증대됨에 따라 상기 대면적 기판의 하중에 의한 상기 기판의 중심부 처짐 현상이 더욱 심화되고 있다. 이와 같이 상기 대면적 기판의 중심부 처짐 현상이 심화된 상태에서 상기와 같은 공정들을 수행하는 경우에는 제품 불량 등의 문제가 있다.However, as the size of the substrate is increased to about 920 * 730 or more to improve the productivity of the semiconductor device, the central sag of the substrate due to the load of the large-area substrate is intensified. As described above, when the above processes are performed in a state where the central area deflection of the large-area substrate is intensified, there is a problem such as a product defect.

본 발명은 상기와 같은 점을 해결하기 위하여 안출된 것으로서, 기판 이송 로봇에 의한 대면적 기판 이송시 상기 기판의 중심부 처짐을 방지할 수 있는 이송기판 이송 로봇의 기판 처짐 방지 장치 및 방법을 제공하는데 그 목적이 있다.The present invention has been made to solve the above problems, and provides a substrate deflection prevention apparatus and method of the transfer substrate transfer robot that can prevent the central sag of the substrate when transferring a large area substrate by the substrate transfer robot. There is a purpose.

본 발명의 목적들은 이상에서 언급한 목적들로 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 당업자에게 명확하게 이해되어질 수 있을 것이다.The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

상기 목적을 달성하기 위한 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 장치는, 기판의 양단을 지지하며, 적어도 일측은 좌우방향으로 이동 가능하게 기판 이송 로봇에 구비되는 핑거부, 상기 기판의 중심부 하부에 상하방향으로 이동 가능하게 구비되는 적어도 하나 이상의 승강부재, 상기 핑거부 및 승강부재를 이동시키는 구동부, 상기 기판의 중심부 처짐 및 상승 상태를 센싱하는 센서부, 및 상기 센서부의 센싱 결과에 따라 상기 기판이 돔 형상을 유지하도록 상기 구동부를 제어하는 제어부를 포함한다.Device for preventing sagging of the substrate transfer robot according to an embodiment of the present invention for achieving the above object, the finger portion provided on the substrate transfer robot to support both ends of the substrate, at least one side to be movable in the left and right directions, At least one elevating member which is provided to be movable up and down in the lower portion of the center of the substrate, a driving unit for moving the finger and the elevating member, a sensor unit for sensing the deflection and the rising state of the center of the substrate, and the sensing result The control unit includes a control unit for controlling the driving unit to maintain the dome shape.

상기 다른 목적을 달성하기 위한 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 방법은, 기판 이송 로봇의 핑거부에 지지된 기판의 처짐 발생시 승강부재를 상승시켜 상기 기판의 중심부를 평형점 이상으로 들어올리는 단계, 및 상기 기판이 상승한 상태에서 상기 기판을 지지하도록 상기 핑거부를 이동시켜 상기 기판을 돔 형상으로 유지시키는 단계를 포함한다.In the substrate deflection prevention method of the substrate transfer robot according to an embodiment of the present invention for achieving the above another object, when the deflection of the substrate supported by the finger portion of the substrate transfer robot rises the lifting member to balance the center of the substrate Lifting as described above, and the step of maintaining the substrate in a dome shape by moving the finger portion to support the substrate in the raised state.

기타 실시예들의 구체적인 사항들은 상세한 설명 및 도면들에 포함되어 있다.Specific details of other embodiments are included in the detailed description and the drawings.

상기한 바와 같은 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 장치 및 방법에 의하면, 대면적 기판의 중심부 처짐 현상 발생시 상기 기판을 돔 형상으로 유지시켜 상기 기판의 처짐을 방지함으로써, 기판 이송 로봇은 대면적 기판을 안정적으로 이송할 수 있다.According to the apparatus and method for preventing substrate deflection of a substrate transfer robot according to an embodiment of the present invention as described above, when the central area deflection phenomenon of a large area substrate occurs, the substrate is held in a dome shape to prevent the substrate from deflection. The transfer robot can stably transfer the large area substrate.

본 발명의 효과들은 이상에서 언급한 효과들로 제한되지 않으며, 언급되지 않은 또 다른 효과들은 특허청구범위의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.Effects of the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하고, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성요소를 지칭한다Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

이하, 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 장치 및 방법을 상세히 설명하기로 한다. 참고로 본 발명을 설명함에 있어서 관련된 공지 기능 혹은 구성에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다.Hereinafter, an apparatus and method for preventing sagging of a substrate of a substrate transfer robot according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. For reference, in the following description of the present invention, if it is determined that a detailed description of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

도 1은 본 발명의 일 실시예에 따른 기판 처짐 방지 장치를 구비한 기판 이송 로봇의 사시도이고, 도 2는 본 발명의 일 실시예에 따른 기판 처짐 방지 장치의 개략도이다.1 is a perspective view of a substrate transfer robot having a substrate deflection prevention apparatus according to an embodiment of the present invention, Figure 2 is a schematic diagram of a substrate deflection prevention apparatus according to an embodiment of the present invention.

도 1 및 2에 도시된 바와 같이, 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 장치는 핑거부(10), 승강부재(20), 구동부(30), 센서부(40) 및 제어부(50) 등을 구비한다.1 and 2, the substrate deflection prevention apparatus of the substrate transfer robot according to an embodiment of the present invention is the finger portion 10, the lifting member 20, the driving unit 30, the sensor unit 40 and The control part 50 etc. are provided.

상기 핑거부(10)는 이송 로봇 아암(3)의 단부에 결합되어 축부(5)에 의해 승강 및 회전 운동하며, 기판(S)을 지지하는 역할을 한다. 상기 이송 로봇(1)은 진공 상태에서 공정 챔버(미도시)에 기판(S)을 이송하는 동작을 수행하는 공지된 기술의 로봇으로 이해 가능하므로 구체적인 설명은 생략한다. 핑거부(10)는 대면적 기판(S)의 좌우 양단을 지지하도록 소정 간격을 두고 구비되는 적어도 두 개 이상의 핑거부재를 포함한다. 예를 들어, 핑거부(10)는 좌우측에 소정 간격을 두고 서로 나란하게 구비된 제 1 및 제 2 핑거부재(11)(12)와, 제 1 및 제 2 핑거부재(11)(12)의 사이에 나란하게 구비된 제 3 핑거부재(13)를 구비한다. 제 1 및 제 2 핑거부재(11)(12)는 기판(S)이 쉽게 이탈되지 않도록 기판(S)의 양단을 각각 클램핑할 수 있는 클램핑부재(11a, 11b)(12a, 12b)를 구비하는 것이 바람직하다. 핑거부(10)는 제 1 및 제 2 핑거부재(11)(12) 중 적어도 하나는 좌우방향으로 이동 가능하게 구비된다. 본 실시예에서는 제 1 핑거부재(11)가 고정되고, 제 2 핑거부재(12)가 좌우방향으로 이동 가능한 구성을 예시하여 설명한다.The finger portion 10 is coupled to the end of the transfer robot arm 3 and lifts and rotates by the shaft portion 5, and serves to support the substrate S. Since the transfer robot 1 may be understood as a robot of a known technique that performs an operation of transferring the substrate S to a process chamber (not shown) in a vacuum state, a detailed description thereof will be omitted. The finger part 10 includes at least two finger members provided at predetermined intervals so as to support both left and right ends of the large area substrate S. For example, the finger part 10 may include the first and second finger members 11 and 12 and the first and second finger members 11 and 12 provided side by side at a predetermined interval on the left and right sides thereof. The third finger member 13 provided in parallel with each other is provided. The first and second finger members 11 and 12 are provided with clamping members 11a, 11b and 12a and 12b that can clamp both ends of the substrate S so that the substrate S is not easily separated. It is preferable. The finger portion 10 is provided with at least one of the first and second finger members 11 and 12 to be movable in the left and right directions. In the present embodiment, the first finger member 11 is fixed, and the second finger member 12 will be described by illustrating a configuration in which the left and right directions can be moved.

상기 승강부재(20)는 기판(S)의 중심부 하부에 상하방향으로 이동 가능하게 구비된다. 승강부재(20)는 제 3 핑거부재(13)의 상면에 수직방향으로 적어도 하나 이상 구비되며, 바람직하게는 기판(S)의 중심부를 기준으로 좌우측에 각각 일렬로 나란하게 구비된다. 승강부재(20)는 기판(S)과 접촉시 파티클 등의 발생을 최소화하기 위해 기판(S)과 접촉되는 면적을 최소화하는 소정의 형상을 갖는다. 예를 들어, 본 실시예에서 승강부재(20)는 상단부(21)가 첨단으로 형성된 봉 형태의 구성을 예시하였으나, 이에 한정되지 않고 그 밖의 다양한 형태의 구성이 가능하다.The elevating member 20 is provided to be movable in the vertical direction under the central portion of the substrate (S). The elevating member 20 is provided with at least one or more in the vertical direction on the upper surface of the third finger member 13, preferably on the left and right sides with respect to the center of the substrate (S) in parallel in a line. The lifting member 20 has a predetermined shape to minimize the area in contact with the substrate S in order to minimize the generation of particles and the like when contacting the substrate S. For example, in the present embodiment, the lifting member 20 exemplifies a rod-shaped configuration in which the upper end portion 21 is formed as a tip, but is not limited thereto and may be configured in various other forms.

상기 구동부(30)는 핑거부(10)의 일측, 예컨대 제 2 핑거부재(12)를 좌우방향으로 이동시키며, 승강부재(20)를 상하방향으로 이동시킨다. 도면에 도시된 바 없지만, 구동부(30)는 통상의 구동모터, 기어, 샤프트 등을 포함하여 구성된다. The driving part 30 moves one side of the finger part 10, for example, the second finger member 12 in the left and right direction, and moves the lifting member 20 in the vertical direction. Although not shown in the drawings, the driving unit 30 includes a conventional driving motor, a gear, a shaft, and the like.

상기 센서부(40)는 기판(S)의 중심부 처짐 및 상승 상태를 센싱한다. 보다 상세하게는, 센서부(40)는 기판(S)의 중심부 처짐 상태를 센싱하고, 승강부재(20)의 상승에 의해 기판(S)이 평형점 이상으로 상승한 후 정지된 상태를 센싱한다.The sensor unit 40 senses the deflection and the rising state of the center portion of the substrate S. FIG. More specifically, the sensor unit 40 senses the deflection state of the central portion of the substrate S, and senses the stopped state after the substrate S rises above the equilibrium point by the lifting of the elevating member 20.

상기 제어부(50)는 센서부(40)의 센싱 결과에 따라 기판(S)이 돔(dome) 형상을 유지하도록 구동부(30)를 제어한다.The controller 50 controls the driver 30 to maintain the dome shape of the substrate S according to the sensing result of the sensor 40.

이하, 도 3 및 4를 참조하여, 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 방법을 구체적으로 설명한다.3 and 4, a method of preventing substrate deflection of the substrate transfer robot according to an embodiment of the present invention will be described in detail.

도 3a 내지 3c는 본 발명에 따른 기판 이송 로봇의 기판 처짐 방지 방법을 순차적으로 도시한 도면이고, 도 4는 본 발명에 따른 기판 이송 로봇의 기판 처짐 방지 방법을 설명하기 위한 흐름도이다.3A to 3C are diagrams sequentially illustrating a method of preventing substrate deflection of the substrate transfer robot according to the present invention, and FIG. 4 is a flowchart illustrating a method of preventing substrate deflection of the substrate transfer robot according to the present invention.

도 3 및 4에 도시된 바와 같이, 본 발명의 일 실시예에 따른 기판 이송 로봇의 기판 처짐 방지 방법은, 기판(S)의 하중에 의해 기판(S)의 중심부에서 처짐이 발생하면 센서부(40)에서 기판의 처짐 상태를 센싱한다(S101). 다음으로, 승강부재(20)를 상승시켜 기판(S)의 중심부를 평형점 이상으로 들어올린다(S102). 다음으로, 기판(S)이 상승한 상태에서 기판(S)의 우측단을 지지하도록 제 2 핑거부재(12)를 좌측으로 이동시켜서 기판(S)을 돔 형상으로 유지시킨다.(S103). 이때, 승강부재(20)는 기판(S)의 중심부 하부를 지지한다. 다음으로, 기판(S)을 돔 형상으로 유지한 상태에서 이송 로봇(1)은 기판(S)을 이송한다(S104). 따라서, 대면적 기판(S)의 하중에 의한 기판(S)의 중심부 처짐을 방지함으로써, 이송 로봇(1)은 대면적 기판(S)을 안정적으로 이송할 수 있다.3 and 4, the substrate deflection prevention method of the substrate transfer robot according to an embodiment of the present invention, if the deflection occurs in the center of the substrate (S) by the load of the substrate (S) ( In step 40, the deflection state of the substrate is sensed (S101). Next, the elevating member 20 is raised to lift the central portion of the substrate S above the equilibrium point (S102). Next, in the state where the substrate S is raised, the second finger member 12 is moved to the left to support the right end of the substrate S to maintain the substrate S in a dome shape (S103). At this time, the lifting member 20 supports the lower portion of the central portion of the substrate (S). Next, the transfer robot 1 transfers the board | substrate S in the state which hold | maintained the board | substrate S in the dome shape (S104). Therefore, the transfer robot 1 can stably transfer the large area substrate S by preventing sagging of the central portion of the substrate S due to the load of the large area substrate S. FIG.

이상 첨부된 도면을 참조하여 본 발명의 실시예를 설명하였지만, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

도 1은 본 발명의 일 실시예에 따른 기판 처짐 방지 장치를 구비한 기판 이송 로봇의 사시도.1 is a perspective view of a substrate transfer robot having a substrate deflection prevention apparatus according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 기판 처짐 방지 장치의 개략도.2 is a schematic view of a substrate deflection prevention apparatus according to an embodiment of the present invention.

도 3a 내지 3c는 본 발명에 따른 기판 이송 로봇의 기판 처짐 방지 방법을 순차적으로 도시한 도면.3A to 3C are views sequentially showing a method of preventing substrate deflection of the substrate transfer robot according to the present invention.

도 4는 본 발명에 따른 기판 이송 로봇의 기판 처짐 방지 방법을 설명하기 위한 흐름도.Figure 4 is a flow chart for explaining a substrate deflection prevention method of the substrate transfer robot according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10 : 핑거부 11 : 제 1 핑거부 10: finger portion 11: first finger portion

12 : 제 2 핑거부 13 : 제 3 핑거부12: second finger portion 13: third finger portion

20 : 승강부재 30 : 구동부20: lifting member 30: drive unit

40 : 센서부 50 : 제어부40: sensor unit 50: control unit

Claims (5)

기판의 양단을 지지하며, 적어도 일측은 좌우방향으로 이동 가능하게 기판 이송 로봇에 구비되는 핑거부;Supporting both ends of the substrate, at least one side finger portion provided in the substrate transfer robot to be movable in the horizontal direction; 상기 기판의 중심부 하부에서 상기 기판을 지지하며, 상하방향으로 이동 가능하게 구비되는 적어도 하나 이상의 승강부재;At least one elevating member supporting the substrate under a central portion of the substrate and provided to be movable in a vertical direction; 상기 핑거부 및 승강부재를 이동시키는 구동부;A driving unit for moving the finger portion and the elevating member; 상기 기판의 중심부 처짐 및 상승 상태를 센싱하는 센서부; 및A sensor unit configured to sense a deflection and an elevated state of the center portion of the substrate; And 상기 센서부의 센싱 결과에 따라 상기 기판이 돔 형상을 유지하도록 상기 구동부를 제어하는 제어부를 포함하는 기판 이송 로봇의 기판 처짐 방지 장치.And a control unit for controlling the driving unit to maintain the dome shape according to the sensing result of the sensor unit. 제 1 항에 있어서,The method of claim 1, 상기 핑거부는 소정 간격을 두고 적어도 두 개 이상의 핑거부재를 구비하는 기판 이송 로봇의 기판 처짐 방지 장치.And said finger portion has at least two finger members at predetermined intervals. 제 2 항에 있어서,The method of claim 2, 상기 승강부재는 상기 핑거부의 중심부에 위치하는 상기 핑거부재에 구비되는 기판 이송 로봇의 기판 처짐 방지 장치.The lifting member is a substrate deflection prevention apparatus of the substrate transfer robot provided in the finger member located in the center of the finger portion. 제 1 항에 있어서,The method of claim 1, 상기 승강부재는 상기 기판과 접촉 면적을 최소화하는 소정의 형상을 가지는 기판 이송 로봇의 기판 처짐 방지 장치.And the elevating member has a predetermined shape for minimizing a contact area with the substrate. 기판 이송 로봇에서 기판의 양단을 지지하며 적어도 일측은 좌우 방향으로 이동 가능하게 상기 기판 이송 로봇에 구비되는 핑거부에 지지된 기판의 처짐 발생시, 상기 기판의 중심부 하부에서 상기 기판을 지지하며 상하방향으로 이동 가능하게 구비되는 적어도 하나의 승강부재를 상승시켜 상기 기판의 중심부를 평형점 이상으로 들어올리는 단계; 및The substrate transfer robot supports both ends of the substrate, and at least one side of the substrate moves in a vertical direction while supporting the substrate at a lower portion of the center of the substrate when deflection of the substrate supported by the finger portion provided in the substrate transfer robot occurs. Lifting the central portion of the substrate above the equilibrium point by raising at least one lifting member provided to be movable; And 상기 기판이 상승한 상태에서 상기 기판을 지지하도록 상기 핑거부를 이동시켜 상기 기판을 돔 형상으로 유지시키는 단계를 포함하는 기판 이송 로봇의 기판 처짐 방지 방법.And moving the finger portion to support the substrate while the substrate is raised to maintain the substrate in a dome shape.
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