KR20090019053A

KR20090019053A - Substrate grinding apparatus

Info

Publication number: KR20090019053A
Application number: KR1020070083186A
Authority: KR
Inventors: 배기환
Original assignee: 주식회사 케이엔제이
Priority date: 2007-08-20
Filing date: 2007-08-20
Publication date: 2009-02-25

Abstract

The present invention relates to a substrate polishing apparatus, and more particularly, to a substrate polishing apparatus capable of continuously polishing a substrate without a loading time.

Substrate polishing apparatus according to the present invention comprises a transfer means for moving the substrate; A grinding unit provided with a grinding wheel and a spindle; And a support table which maintains a constant height of the edge surface while the substrate is moved and the edge surface is polished. In particular, the conveying means is preferably a conveyor for moving the substrate in a state where the substrate is vacuum-adsorbed.

Description

Substrate grinding apparatus

In general, a bare glass (hereinafter, referred to as a substrate), which is a flat panel display panel or a material of the panel, has a sharp edge, causing cracks or cracks during the process. Therefore, in order to prevent cracks and the like, a process of grinding a sharp edge is essential.

1 shows a general substrate polishing apparatus. As shown in the drawing, the polishing table 110 vacuum-adsorbs the substrate S, and the polishing unit 120 polishes upper and lower edge surfaces of the long sides and short sides of the substrate adsorbed by the polishing table 110.

Figure 2 shows the operating state of the polishing apparatus shown in FIG.

The polishing table 110 is formed with a vacuum hole 111 to vacuum the substrate, the polishing unit 120 is provided on both sides with the substrate (S) in between.

First, the substrate S is loaded into the polishing table 110 and vacuum is applied to the vacuum hole 111 to vacuum the substrate (see (a)).

In this state, the polishing table 110 is horizontally moved through the pair of polishing units 120. In this manner, during the horizontal transfer, the polishing unit 120 polishes the edge surface (see (b) and (c)).

When polishing is completed as described above, the substrate S is unloaded, and the substrate S is returned to the initial position to load a new substrate.

The conventional polishing apparatus operated as described above requires a time for polishing one substrate and then returning to the starting position in order to receive a new substrate again. Therefore, there is a problem that a plurality of substrates are not polished continuously and are disconnected.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate polishing apparatus capable of continuously polishing a substrate without a loading time.

In order to solve the above technical problem, the substrate polishing apparatus according to the present invention comprises a transfer means for moving the substrate; A grinding unit provided with a grinding wheel and a spindle; And a support table which maintains a constant height of the edge surface while the substrate is moved and the edge surface is polished.

In particular, the transfer means is preferably a conveyor for moving the substrate in a state in which the substrate is vacuum-adsorbed.

In addition, the support table preferably includes a blower for injecting air toward the substrate and an adsorption unit for sucking air toward the substrate.

Substrate polishing method according to the present invention comprises the steps of: 1) adsorbing the substrate by the transfer means; And 2) polishing while maintaining a constant height of the edge surface of the substrate moved by the transfer means in the polishing region.

According to the present invention, there is an effect that the substrate can be continuously polished without a loading time.

Hereinafter, with reference to the accompanying drawings will be described the structure and operation of the substrate polishing apparatus according to the present invention.

3 to 5, the structure of the substrate polishing apparatus according to the present invention will be described.

As shown, the substrate polishing apparatus according to the present invention is composed of a conveying means 10, a polishing portion 120, and support tables 20a and 20b.

In the present embodiment, the conveying means 10 are conveyors 11, 12 and 13 capable of continuously conveying the substrate. In particular, a vacuum hole (not shown) is formed on the upper surfaces of the conveyors 11, 12, and 13, and the vacuum holes may be continuously transferred in a state in which the vacuum line is connected and the substrate S is vacuum-adsorbed. .

The polishing unit 120 is composed of an abrasive grinding wheel 122 for polishing in contact with the edge surface of the substrate (S), and a spindle 121 for rotating the abrasive grinding wheel 122.

The support tables 20a and 20b precisely hold the edge surface of the substrate so that the height of the substrate does not fluctuate in the region where the substrate is polished.

The structure of the said support table 20a, 20b is demonstrated concretely with reference to FIG. The support tables 20a and 20b have a blower 22 which floats the substrate by injecting high pressure air from the lower side of the substrate S, and, on the contrary, the suction that sucks air from the lower side of the substrate S to adsorb the substrate. It can be seen that the portions 21 are intermingled with each other. Interaction between the blower 22 and the suction unit 21 may impart sufficient rigidity to the edge surface of the substrate. In other words, the height of the edge surface of the substrate can be kept constant, thereby improving the polishing quality.

On the other hand, due to the interaction between the blower 22 and the suction unit 21, the substrate is not directly in contact with the support tables 20a and 20b, but is kept in a finely spaced state (floating state) therefrom. That is, the height of the edge surface is kept constant in the state finely spaced apart from the support tables 20a and 20b.

If the substrate is adhered or adsorbed to the support tables 20a and 20b, it will be impossible to transport the substrate by the conveyors 11, 12 and 13. Therefore, since the substrate is finely spaced apart from the support table as described above, the conveyor can continuously transport the substrate.

Therefore, the number and arrangement of the blowers 22 and the adsorption portion 21 can be freely changed as long as the substrate can be finely spaced from the support tables 20a and 20b to provide sufficient rigidity for polishing.

Referring to Figure 3 will be described the operation state and polishing method of the substrate polishing apparatus according to the present invention.

First, when the substrate S is loaded on the conveyors 11, 12, and 13, the conveyor horizontally transfers the substrate in a state in which the substrate is vacuum-adsorbed by the vacuum suction force applied through the vacuum hole.

When the substrate to be transported in this manner reaches the polishing region, the blower of the support tables 20a and 20b (see '22' in FIG. 6) and the suction part (see '21' in FIG. 6) of the support tables 20a and 20b provided below the edge surface. By interaction, the rigidity is imparted such that the height of the edge surface remains constant. Of course, since the substrates are finely floated from the support tables 20a and 20b at this time, the substrates S are continuously being transferred by the conveyors 11, 12 and 13.

In this manner, during the transfer through the conveyor, the edge surface of the substrate is kept constant in the polishing area, and the edge surface is polished by the polishing unit 120.

When the edge surface of the substrate S is polished as described above, the conveyors 11, 12 and 13 are continuously transported and unloaded. On the other hand, the conveyors (11, 12, 13) are continuously transported by horizontally adsorbing a new substrate without pause. Therefore, the processing time is shortened because the polishing table does not retreat to the initial starting position for loading a new substrate as in the prior art.

Figure 7 shows another embodiment according to the present invention. In the embodiment shown in Fig. 3, the support tables 20a and 20b support only a part of one side (polishing area) of the substrate, whereas in the present embodiment, the support tables 30a and 30b are supported on one side of the substrate S. You can see that they support both. Since other configurations are the same, repeated descriptions will be omitted.

1 shows a conventional polishing apparatus.

Figure 2 shows the operating state of the polishing apparatus shown in Figure 1 in order.

3 is a plan view showing a polishing apparatus according to the present invention.

4 and 5 are front views of the polishing apparatus shown in FIG.

6 is a side view of the polishing apparatus shown in FIG.

Figure 7 shows another embodiment according to the present invention.

** Description of the symbols for the main parts of the drawings **

10: conveyor 20a, 20b: support table

21: adsorption part 22: blower

120: grinding portion 121: spindle

122: abrasive grindstone

Claims

Transfer means for moving the substrate;

A grinding unit provided with a grinding wheel and a spindle; And

And a support table that maintains a constant height of the edge surface while the substrate is moved while the edge surface is polished.

The method of claim 1,

And the conveying means is a conveyor.

The method of claim 2,

And the conveyor moves the substrate in a state in which the substrate is vacuum-adsorbed.

The method of claim 1,

The support table,

A blower for injecting air toward the substrate,

Substrate polishing apparatus, characterized in that provided with an adsorption portion for sucking air toward the substrate.

1) adsorbing and transferring the substrate by the transfer means; And

2) polishing the substrate while maintaining a constant height of the edge surface of the substrate moved by the transfer means in the polishing region.

The method of claim 5, wherein

The conveying means is a substrate polishing method, characterized in that the conveyor.

The method of claim 5, wherein

Step 2),

Substrate polishing method characterized in that is performed by blowing the edge surface at the same time while adsorbing.