KR20080080925A - Substrate processing apparatus - Google Patents

Abstract

A substrate processing apparatus is provided to reduce costs required for the apparatus and improve productivity when processing plural processed substrates. A conveyance unit horizontally conveys a processed substrate(G) on a conveyance path as upwardly placing the processed substrate. A chamber unit(1,2,3) is installed on the conveyance path, and performs drying processing for the substrate carried by the conveyance unit. The chamber unit includes an air supply unit(81a,81b,81c) installed in a downstream side of a substrate conveyance direction, and an exhausting unit(82a,82b,82c) installed in an upstream side of the substrate conveyance direction or includes an air supply unit installed in an upstream side of the substrate conveyance direction, and an exhausting unit installed in a downstream side of the substrate conveyance direction. Drying gas is supplied by the air supply unit. The supplied drying gas is exhausted by the exhausting unit. Therefore, a drying gas flow contacted with an upper surface of the substrate conveyed into the chamber unit is formed.

Description

Substrate Processing Unit {SUBSTRATE PROCESSING APPARATUS}

TECHNICAL FIELD This invention relates to the substrate processing apparatus which dry-processes the to-be-processed substrate to which the process liquid was apply | coated in order to form a coating film in a photolithography process.

For example, in the manufacture of a flat panel display (FPD), after forming a predetermined film on a substrate to be processed (a glass substrate or the like), a resist film is formed by applying a photoresist (hereinafter referred to as a resist) which is a processing liquid, A circuit pattern is formed by a so-called photolithography step in which a resist film is exposed in correspondence with the circuit pattern, and the development process is performed.

In the formation process of the said resist film, the pressure reduction drying process which dries a coating film by pressure reduction is performed after resist coating to a board | substrate.

Conventionally, as an apparatus which performs such a reduced pressure drying process, the structure which performs a process in a chamber like the reduced pressure drying unit disclosed by patent document 1, for example was mainstream. That is, as shown in the cross-sectional view of FIG. 5, the reduced pressure drying unit 200 disclosed in Patent Document 1 includes a lower chamber 201 and an upper chamber 202 provided to be opened and closed to cover the upper chamber. The stage 203 for mounting the substrate G in the center of the lower chamber 201 is installed.

In this reduced pressure drying unit 200, after the substrate G is placed on the stage 203, the inside of the chamber is sealed and a predetermined reduced pressure atmosphere is formed in the chamber to perform a reduced pressure drying process.

Patent Document 1: Japanese Unexamined Patent Publication No. 2000-181079

However, in the structure of the reduced pressure drying unit 200 shown in Fig. 5, with the recent increase in the size of the substrate, the chamber, the pump for reducing the pressure in the chamber, etc. become larger, so that the cost of the apparatus increases. There was.

Moreover, since time is required for opening and closing operations of the chamber and carrying out of the substrate, there is a problem that productivity is lowered when processing a plurality of substrates.

This invention is made | formed under the circumstances as mentioned above, The substrate processing apparatus which forms a coating film by performing the drying process of the said process liquid with respect to the to-be-processed substrate to which the process liquid was apply | coated, WHEREIN: The cost of an apparatus is reduced, Moreover, it aims at providing the substrate processing apparatus which can improve the productivity at the time of processing a several to-be-processed substrate.

In order to solve the said subject, the substrate processing apparatus which concerns on this invention forms the coating film by performing the drying process of the said processing liquid with respect to the to-be-processed substrate to which the processing liquid was apply | coated, The said to-be-processed object It is provided with the conveyance means which conveys a conveyance path image in a horizontal direction with a board | substrate facing upward, and the chamber unit provided on the said conveyance path, and performing a drying process with respect to the said board | substrate carried in by the said conveying means, The chamber unit includes air supply means provided on the downstream side in the substrate conveyance direction and exhaust means provided on the upstream side in the substrate conveyance direction, or air supply means provided on the upstream side in the substrate conveyance direction and exhaust means provided on the downstream side in the substrate conveyance direction. And supplying dry air by the air supply means, and exhausting the supplied dry air by the exhaust means. A dry air flow in contact with the upper surface of the substrate to be conveyed is formed in the chamber unit.

By configuring in this way, since a some board | substrate can be processed, carrying out a flat stream conveyance, productivity can be improved.

In addition, as in the conventional chamber apparatus, a pump for depressurizing the chamber, a lifting apparatus for opening / closing the chamber, and the like are unnecessary, so that the apparatus can be constructed at low cost even when processing a large substrate.

Moreover, it is preferable that the said chamber unit is provided in multiple numbers on the said conveyance path along the conveyance direction of a to-be-processed board | substrate, and formation control of the said dry air flow is performed for every said chamber unit.

With this configuration, it is possible to perform the stepwise drying treatment on the substrate and to adjust the dry air flow for each chamber unit, so that it is possible to complete the formation of the coating film in an appropriate state as a treatment of the entire substrate processing apparatus. .

Moreover, it is preferable that the heater which heats the to-be-processed substrate conveyed by the said conveying means is provided in the front end of the said chamber unit on the said conveyance path.

By providing a heater in this way, a board | substrate can be heated beforehand and a solvent tends to volatilize before evaporating a solvent with dry air flow.

Moreover, in the said chamber unit, it is preferable that the said conveyance path is provided with the board | substrate floating means which conveys a to-be-processed board | substrate to the horizontal direction in the state which floated by the air pressure.

Thus, by carrying out the board | substrate conveyance in a chamber unit in the state which floated the board | substrate, the dry air flow formed above a board | substrate can be prevented from being influenced by the turbulent flow which arises easily by roller conveyance. Moreover, the vibration and the warpage of the substrate which are likely to occur at the time of roller conveyance can be reduced, the horizontality of the entire substrate can be improved, and the uniform drying treatment can be performed.

Moreover, the roller conveyance part which roller-transfers a board | substrate is provided in the front end and the rear end of each chamber unit provided in multiple stages on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, of the said board | substrate floating means in each chamber unit. The length dimension of a board | substrate conveyance direction is comprised shorter than the length dimension of the same direction of the said to-be-processed board | substrate, and when the said to-be-processed board | substrate passes through the said chamber unit, the said board | substrate conveys the roller of the front end or the rear end of the said chamber unit. It is preferable to move to a conveyance direction by a part.

By this structure, even if the board | substrate conveyance path in a chamber unit is comprised by the board | substrate floating means, a to-be-processed board | substrate can be reliably conveyed.

Moreover, in the said chamber unit provided in multiple stages on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, the temperature of the dry air flow formed in the chamber unit of a first stage is set to predetermined temperature, and is provided to the chamber unit of a later stage. It is preferable that the temperature of the dry air stream formed is set higher than the temperature of the dry air stream formed in the chamber unit of the said first stage.

Moreover, in the said chamber unit provided in multiple stages on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, the flow velocity of the dry air flow formed in the chamber unit of a first stage is set to a predetermined speed, and the chamber unit of a rear stage is It is preferable that the flow rate of the dry air flow formed in the air flow rate is set faster than the flow rate of the dry air flow formed in the first stage chamber unit.

In this way, the evaporation amount of the solvent can be suppressed in a small amount in the chamber unit at the first stage, and a larger amount of solvent can be evaporated in the chamber unit at the later stage. In addition, the evaporated solvent can be rapidly exhausted from the unit in the rear stage. That is, drastic drying of the resist liquid is suppressed, and in the latter stage, even if a dry air stream having a high flow rate and a high temperature is brought into contact with the upper surface of the substrate G, the resist film is not uneven and has a small variation in film thickness. You can get it.

According to the present invention, in the substrate processing apparatus which forms a coating film by performing the drying process of the said processing liquid with respect to the to-be-processed board | substrate with which the process liquid was apply | coated, the cost of an apparatus is reduced and a some process board is processed. The substrate processing apparatus which can improve the productivity at the time of carrying out can be obtained.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which concerns on this invention is described based on drawing. 1 is a plan view of a coating and developing treatment system including a substrate processing apparatus according to the present invention.

This coating and developing processing system 10 is installed in a clean room, for example, using a glass substrate for LCD as a substrate to be treated, and cleaning, resist coating, prebaking, developing and post in a photolithography process in an LCD manufacturing process. A series of processes, such as baking, are performed. An exposure process is performed by the external exposure apparatus 12 provided adjacent to this system.

The coating and developing processing system 10 arranges a horizontally long process station (P / S) 16 at the center, and interfaces with the cassette station (C / S) 14 at both ends in the longitudinal direction (X direction). The station (I / F) 18 is arranged.

The cassette stations (C / S) 14 are ports for carrying in and out of the cassette C accommodated in plural sheets by stacking the substrates G in multiple stages, and arranged up to four in one horizontal direction (Y direction). The cassette stage 20 which can be mounted, and the conveyance mechanism 22 which perform the taking-out of the board | substrate G with respect to the cassette C on this stage 20 are provided. The conveyance mechanism 22 has the means which can hold | maintain the board | substrate G, for example, the conveyance arm 22a, is operable by four axes of X, Y, Z, and (theta), and is adjacent to the process station P / It is possible to exchange the substrate G with the S) 16 side.

The process station (P / S) 16 arranges each processing unit in a process flow or process sequence in a pair of parallel and reverse lines A and B extending in the horizontal system longitudinal direction (X direction) and have.

More specifically, on the process line A of the upstream portion from the cassette station (C / S) 14 side toward the interface station (I / F) 18 side, the cleaning process unit 24 and the first thermal processing unit (26), the application | coating process part 28 and the 2nd thermal processing part 30 are arrange | positioned in a line. Here, the cleaning process part 24 is provided with the excimer UV irradiation unit (e-UV) 34 and the scrubber washing | cleaning unit (SCR) 36 sequentially from the upstream along the flat stream conveyance path 32. As shown in FIG. The first thermal processing unit 26 is provided with an advision unit (AD) 40 and a cooling unit (COL) 42 in order from the upstream side along the flat flow conveyance path 32.

Moreover, the application | coating process part 28 and the 2nd thermal process part 30 are provided in the downstream of the 1st thermal process part 26 along the flat stream conveyance path 32. As shown in FIG. The coating process unit 28 includes a resist coating unit (CT) 44 and a reduced pressure drying unit (VD) 46, and the second thermal processing unit 30 sequentially turns the prebaking unit PREBAKE ( 50) and a cooling unit (COL) 52 are provided.

On the other hand, the process unit B downstream of the interface station (I / F) 18 side toward the cassette station (C / S) 14 side has a developing unit (DEV) 54 and an i-ray UV irradiation unit ( i-UV) 56, post-baking unit (POBAKE) 58, cooling unit (COL) 60 and inspection unit (AP) 62 are arranged in a line.

These units 54, 56, 58, 60, 62 are provided in this order from the upstream side along the flat stream conveyance path 33. As shown in FIG. In addition, the post baking unit (POBAKE) 58 and the cooling unit (COL) 60 constitute a third thermal processing unit 59.

Moreover, the auxiliary conveyance space 66 is formed between both process lines A and B, and the process line is not shown by the drive mechanism which is not shown by the shuttle 68 which can arrange | position the board | substrate G horizontally by one unit. It is possible to move in both directions in the direction (X direction).

In addition, the interface station (I / F) 18 is adjacent to the conveying apparatus 70 and the exposure apparatus 12 for performing exchange | exchange of the board | substrate G with the flow path conveyance of both process lines A and B. Moreover, as shown in FIG. ) And a transfer device 72 for exchanging the substrate G, and a buffer stage (BUF) 74, an extension cooling stage (EXT COL) 76, and a peripheral device 78 around them. I am placing it.

In the buffer stage BUF 74, a stationary buffer cassette (not shown) is placed. The extension cooling stage (EXT-COL) 76 is a stage for substrate exchange with a cooling function, and is used when the substrate G is exchanged between the transfer devices 70 and 72. The peripheral apparatus 78 should just be the structure which piled up the titler TITLER and the peripheral exposure apparatus EE up and down, for example. Each conveying apparatus 70 and 72 has conveyance arms 70a and 72a which can hold | maintain the board | substrate G, and can access each adjacent part for the exchange of the board | substrate G. As shown in FIG.

FIG. 2 shows the procedure of the processing for one substrate G in this coating and developing processing system 10. As shown in FIG. First, in the cassette station (C / S) 14, the conveyance mechanism 22 takes out one board | substrate G from any cassette C on the stage 20, and takes out the board | substrate G ) Is brought into the upward position (with the surface to be processed of the substrate facing up) at the time point of the flat flow conveyance path 32, which is the carry-in portion on the process line A side of the process station (P / S) 16 (Fig. 2). Step S1).

In this way, the board | substrate G is conveyed toward the downstream side of the process line A in the attitude | position up on the flat stream conveyance path 32. As shown in FIG. In the first stage cleaning process unit 24, the substrate G is sequentially subjected to an ultraviolet cleaning process and a scrubbing cleaning process by an excimer UV irradiation unit (e-UV) 34 and a scrubber cleaning unit (SCR) 36. It carries out (step S2, S3).

In the scrubber cleaning unit (SCR) 36, by removing the particulate matter from the surface of the substrate by performing brushing or blow cleaning on the substrate G moving on the flat stream conveyance path 32, and then rinsing. The treatment is carried out, and finally, the substrate G is dried using an air knife or the like. After a series of cleaning treatments in the scrubber cleaning unit (SCR) 36 are completed, the substrate G descends the flat stream conveyance path 32 as it is and passes through the first thermal processing unit 26.

In the first thermal processing unit 26, the substrate G is first subjected to a heat dehydration baking process when the substrate G is loaded into the advision unit AD 40 to remove moisture. Subsequently, the substrate G performs an advision process using a vapor-shaped HMDS to hydrophobize the surface to be treated (step S4). After the completion of the advision process, the substrate G is cooled to the predetermined substrate temperature in the cooling unit (COL) 42 (step S5). Subsequently, the substrate G conveys the planar conveyance path 32 and is conveyed to the coating process unit 28.

In the application | coating process part 28, while the board | substrate G conveys the plane flow conveyance path 32 image, the upper surface of a board | substrate (for-process surface) using the slit nozzle, for example in the resist coating unit (CT) 44 for the first time. Application of the resist liquid is performed, and immediately afterwards, the drying treatment by the reduced pressure is received in the vacuum drying unit (VD) 46 adjacent to the downstream side (step S6). In addition, since the vacuum processing unit (VD) 46 can apply the substrate processing apparatus which concerns on this invention most suitably, the structure is mentioned later in detail.

Subsequently, the substrate G carries the flat stream conveyance path 32 and passes through the second thermal processing unit 30. In the second thermal processing unit 30, the substrate G is first subjected to prebaking as a heat treatment after resist application or a heat treatment before exposure in the prebaking unit PREBAKE 50 (step S7). By this prebaking, the solvent remaining in the resist film on the substrate G is evaporated and removed, and the adhesion of the resist film to the substrate is also enhanced.

Next, the board | substrate G is cooled to predetermined | prescribed board | substrate temperature by the cooling unit (COL) 52 (step S8). Then, the board | substrate G is taken in to the conveyance apparatus 70 of the interface station (I / F) 18 from the end point (discharge part) of the flat stream conveyance path 32. As shown in FIG.

At the interface station (I / F) 18, the substrate G is carried from the extension cooling stage (EXT COL) 76 to the peripheral exposure apparatus EE of the peripheral device 78, where the substrate G After the exposure to remove the resist attached to the periphery at the time of development, it is sent to the neighboring exposure apparatus 12 (step S9).

In the exposure apparatus 12, a predetermined circuit pattern is exposed to the resist on the substrate G. Subsequently, when the substrate G, which has been subjected to the pattern exposure, is returned to the interface station (I / F) 18 from the exposure apparatus 12, first, the substrate G is carried into the titler TITLER of the peripheral apparatus 78, and therefrom Predetermined information is recorded in a predetermined portion on the substrate (step S10).

After that, the substrate G is returned to the extension cooling stage (EXT COL) 76. The conveyance of the board | substrate G in the interface station (I / F) 18, and the exchange of the board | substrate G with the exposure apparatus 12 are performed by the conveying apparatus 70,72. Finally, the board | substrate G is carried in from the conveyance apparatus 72 to the start point (loading part) of the flat stream conveyance path 33 attached to the process line B side of the process station (P / S) 16. As shown in FIG. .

In this way, the board | substrate G is conveyed toward the downstream side of the process line B this time in the attitude which turned up on the flat stream conveyance path 33 upward.

In the first developing unit (DEV) 54, the substrate G is subjected to a series of developing processes such as developing, rinsing and drying while being conveyed to the stream (step S11).

The board | substrate G which completed the series of image development processing in the image development unit (DEV) 54 is carried out by the i-line irradiation unit (i-UV) 56 adjacent to the downstream side in the state which was loaded on the flat stream conveyance path 33 as it is. After that, it receives the discoloration process by i-ray irradiation (step S12). Even after that, the board | substrate G passes through the 3rd thermal processing part 59 and test | inspection unit (AP) 62 sequentially in the state loaded on the flat stream conveyance path 33. FIG.

In the third thermal processing unit 59, the substrate G is first subjected to post-baking as a heat treatment after development in the post-baking unit POBAKE 58 (step S13). By this post-baking, the developer and the cleaning liquid remaining in the resist film on the substrate G are evaporated and removed, thereby enhancing the adhesion of the resist pattern to the substrate.

Next, the board | substrate G is cooled by the cooling unit (COL) 60 to predetermined | prescribed board | substrate temperature (step S14). In the inspection unit (AP) 62, non-contact line width inspection, film quality, film thickness inspection, etc. are performed with respect to the resist pattern on the board | substrate G (step S15).

And on the cassette station (C / S) 14 side, the conveyance mechanism 22 received the board | substrate G which completed the whole process of application | coating development process from the end point (export part) of the flat stream conveyance path 33, and received it. The board | substrate G is accommodated in the cassette C of any one (usually the former) (return to step S1).

In the coating and developing processing system 10, the present invention can be applied to the vacuum drying unit (VD) 46 as described above.

Next, the structure of this reduced pressure drying unit (VD) 46 is demonstrated. FIG. 3 shows a schematic cross-sectional view of the reduced pressure drying unit (VD) 46, and FIG. 4 shows a plan view of the substrate conveying unit in the reduced pressure drying unit (VD) 46. As shown in FIG.

As shown in FIG. 3, in the vacuum drying unit (VD) 46, a plurality of chamber units 1, 2, and 3 (three in the drawing) are located upstream along the flat flow conveyance path 32 (conveying means). They are all installed in order. The horizontal flow conveyance path 32 in the pressure reduction drying unit (VD) 46 is comprised by the floating conveyance part 4 (substrate floating means) in each chamber unit 1, 2, and 3, and is between chamber units. Is comprised by the roller conveyance part 7.

Here, when the board | substrate G is conveyed to the pressure reduction drying unit (VD) 46, any one of the some roller conveyance parts 7 will necessarily contact with the lower surface of the board | substrate G to be conveyed, and rotational drive of a roller will be carried out. The board | substrate G is comprised so that it may move to a conveyance direction. That is, as shown in FIG. 3, FIG. 4, the length dimension of the float conveyance part 4 in the board | substrate conveyance direction in one chamber unit is comprised shorter than the length dimension of the board | substrate conveyance direction of the board | substrate G. As shown in FIG.

The floating conveyance part 4 functions to form a predetermined buoyancy force (called the floating air pressure) on the stage 5, and to make the board | substrate G float. However, since the movement in the board | substrate conveyance direction of the board | substrate G is performed by the roller conveyance part 7 as mentioned above, the float height of the board | substrate G by the float conveyance part 4 is a roller conveyance part. In (7), the floating air pressure is adjusted so as not to be higher than the height of the contacting roller.

In order to form floating air pressure on the stage 5, a plurality of vent holes 84 are formed in a zig-zag houndstooth check on the upper surface of the stage 5, as shown in FIG. These vent holes 84 consist of a blow hole 84a for blowing air in the predetermined direction on the stage 5, and an intake hole 84b for sucking air blown out from the blow hole 84a. In addition, the density of the plurality of vent holes 84 formed in the stage 5 is preferably about 500 pieces / m 2.

In addition, the floating air pressure control means which supplies compressed dry air to the blowing hole 84a of the ventilation hole 84, and sucks the air above the stage 5 from the intake hole 84b below each stage 5 ( 6) is provided, and it is comprised so that the control of the floating air pressure on each stage 5 may be performed.

In addition, the heaters 8a, 8b, 8c are provided at a plurality of locations in the conveyance direction of the flat flow conveying path 32, preferably at least at a plurality of locations including the front end of the chamber unit 1, and the substrate ( G) is to be heated. By this heating, a solvent is liable to volatilize from the resist liquid on the board | substrate G. This heater 8a, 8b, 8c is comprised by any one of a carbon heater, a plate heater, an infrared lamp heater, etc., for example.

Moreover, the chamber cover 9 is provided in the ceiling part of each chamber unit 1, 2, 3, and the air chamber 9a (air supply means) is formed in this chamber cover 9 downstream of a board | substrate conveyance direction. The exhaust path 9b (exhaust means) is formed on the upstream side. The air supply path 9a and the exhaust path 9b of each chamber unit 1, 2, 3 are the upper air flow formed by the first air supply means 81a and the first exhaust means 82a in the chamber unit 1. It is connected to the control part 80a, and is connected to the upper air flow control part 80b which consists of the 2nd air supply means 81b and the 2nd exhaust means 82b in the chamber unit 2, and the 3rd air supply in the chamber unit 3, It is connected to the upper airflow control part 80c which consists of a means 81c and the 3rd exhaust means 82c.

Specifically, taking the chamber unit 1 of the first stage in the substrate conveyance direction as an example, air supply means for supplying compressed air with a predetermined temperature and a predetermined flow rate to the air supply path 9a from above the air supply path 9a downward. The 81a is connected, and the exhaust means 82a which performs the suction operation | movement for exhausting the air under the chamber cover 9 to the exhaust path 9b is connected. Thereby, under the chamber cover 9, the dry air flow which contacts the upper surface of the board | substrate G which flows facing the board | substrate conveyance direction and is conveyed is formed.

In addition, the upper air flow controllers 80a, 80b, and 80c provided for each of the chamber units 1, 2, and 3 are configured to adjust the temperature and flow rate of the dry air flow formed under the chamber cover 9 in units of units, respectively. have. Thereby, the drying effect with respect to the board | substrate G in each chamber unit 1, 2, 3 can be made different, and also the adjustment of the drying effect in the whole pressure reduction drying unit (VD) 46 is possible. Done.

As a specific example, the temperature of the dry air flow formed in the chamber unit 1 is set to 24 ° C + 5 to 10 ° C when the set temperature of the heater by the controller is 24 ° C, and the rear chamber unit 2 And the temperature of the dry air stream in 3) is set to 24 ° C + 20 ° C. That is, the temperature of the chamber units 2 and 3 of the rear stage is set higher than the temperature of the drying air flow in the chamber unit 1 of the first stage.

Further, the flow rate of the dry air flow formed in the chamber unit 1 is set to 1 to 5 m / sec, and the flow rate of the dry air flow in the chamber units 2 and 3 in the rear stage is set faster than that.

In this way, the evaporation amount of the solvent can be suppressed in a small amount in the chamber unit at the first stage, so that a larger amount of solvent can be evaporated in the chamber unit at the later stage. In addition, the evaporated solvent can be rapidly exhausted from the unit in the rear stage. That is, drastic drying of the resist liquid is suppressed, and in the latter stage, even if a dry air stream having a high flow rate and a high temperature is brought into contact with the upper surface of the substrate G, the resist film is not uneven and has a small variation in film thickness. You can get it.

Moreover, the air supply 9a is provided with the rectifying plate 83 in which the some ventilation hole was formed, and is comprised so that the supplied dry compressed air may be rectified. The rectifying plate 83 is preferably formed of a sintered metal, whereby the air can be uniformly dispersed uniformly, thereby improving the rectifying effect.

Moreover, below each roller conveyance part 7 in the flat stream conveyance path 32, the exhaust path 7a is provided, and these exhaust paths 7a are connected to the exhaust means 85 which performs a suction operation | movement. have. That is, by exhausting the atmosphere (solvent evaporated from the board | substrate upper surface etc.) which flows in from the upstream of the roller conveyance part 7 from the exhaust path 7a, it does not produce the bad influence to a downstream unit.

The board | substrate G by which the resist liquid was apply | coated in the resist coating unit (CT) 44 is carried in to the pressure reduction drying unit (VD) 46 comprised in this way by the flat flow conveyance path 32. As shown in FIG.

The substrate G is first heated by passing above the heater 8a, and heated up to a predetermined temperature, for example, 100 ° C to 120 ° C, so that the solvent in the resist film is likely to volatilize.

Next, the board | substrate G is carried in to the chamber unit 1 from the front-end | tip of a board | substrate by the roller conveyance part 7. As shown in FIG. Here, under the chamber cover 9, it flows facing a board | substrate conveyance direction, and predetermined temperature contacting the board | substrate G upper surface (when setting temperature of the heater by a controller is set to 24 degreeC, for example, 24 degreeC + 5-10 And a dry air stream having a predetermined flow rate (1 to 5 m / sec) are formed. Since the board | substrate G is heated up by the heater 8a, and the solvent in a resist film is a state which is easy to volatilize, evaporation of a solvent advances effectively because dry air flows to the upper surface of a board | substrate, and the evaporated solvent It flows to the back of the board | substrate G, and is exhausted from the exhaust path 9b.

In addition, although the board | substrate G which passes through the chamber unit 1 moves to the conveyance direction by the roller conveyance part 7 provided before and behind the chamber unit 1 in the flat flow conveyance path 32, the chamber unit 1 ) Is made to rise to a predetermined height by floating air pressure formed on the stage 5. Thereby, the dry air flow formed above the board | substrate G can be prevented from being influenced by the turbulent flow which arises easily by roller conveyance. In addition, vibration and warpage of the substrate G, which tends to occur at the time of roller conveyance, are reduced, the horizontality of the entire substrate can be improved, and a uniform drying treatment can be performed.

As for the board | substrate G in which the drying process is performed sequentially from the board | substrate front end side, after the drying process in the chamber unit 1, the drying process in the chamber unit 2 and the drying process in the chamber unit 3 are stepwise. Is continued. In addition, the temperature of the drying air flow in the chamber units 2 and 3 is set to 24 degreeC + 20 degreeC, for example, when the preset temperature of the heater by a controller is set to 24 degreeC, and a flow velocity is set to the chamber unit 1 The flow rate is set faster than the setting of.

In addition, the heaters 8b and 8c are provided in the chamber units 2 and 3 in the conveying direction of the stage 5, and the excess solvent in the resist applied to the substrate G is always in a state where volatilization is easy. The effect of the air flow formed above the substrate G is obtained in the same manner as in the case of the chamber unit 1, and the drying treatment advances each time the chamber unit passes.

In addition, since the temperature, the flow rate, and the like of the dry air flow reaching the upper surface of the substrate G in each chamber unit 1, 2, 3 can be adjusted in units of units as described above, the substrate G is used in all chamber units. After passing through (1, 2, 3), the formation of the resist film can be completed in an appropriate state.

As described above, according to the embodiment of the substrate processing apparatus of the present invention, in the vacuum drying unit (VD) 46, the substrate G continuously passes while conveying the flat stream conveyance path 32. Drying step is carried out in steps 2, 3).

Therefore, a pump for pressure reduction in a chamber, a lifting device for opening / closing a chamber, and the like are unnecessary in the conventional chamber device, and a low cost device can be constructed even when a large substrate is processed.

Moreover, since a some board | substrate can be processed, performing a flat stream conveyance, productivity can be improved.

Moreover, in the said embodiment, in each chamber unit 1, 2, 3, the air supply path 9a (air supply means) is formed in the downstream of a board | substrate conveyance direction, and the exhaust path 9b (exhaust means) is located upstream. Has been formed, but in the substrate processing apparatus of the present invention, the air supply passage 9a (air supply means) is formed on the upstream side of the substrate conveyance direction, and the exhaust passage 9b on the downstream side. You may have a structure in which (exhaust means) is provided.

In addition, the to-be-processed board | substrate in this invention is not limited to an LCD board | substrate, Various board | substrates for flat panel displays, a semiconductor wafer, a CD board | substrate, a glass board | substrate, a photomask, a printed board, etc. are also possible.

INDUSTRIAL APPLICABILITY The present invention can be applied to a substrate processing apparatus that performs a drying treatment on a substrate to which a treatment liquid is applied, and can be suitably used in the semiconductor manufacturing industry, the electronic device manufacturing industry, and the like.

1 is a plan view of a coating and developing treatment system to which a substrate processing apparatus according to the present invention can be applied.

FIG. 2 is a flow for explaining the flow of substrate processing in the coating and developing processing system of FIG. 1; FIG.

3 is a schematic cross-sectional view of a reduced pressure drying unit included in the coating and developing treatment system of FIG.

4 is a plan view of a substrate conveyance unit in the reduced pressure drying unit of FIG.

5 is a sectional view showing a schematic configuration of a conventional vacuum drying unit.

<Explanation of symbols for the main parts of the drawings>

1, 2, 3: chamber unit

4: injury return unit

5: stage

6: floating air pressure control means

7: roller conveying part

8a, 8b, 8c: heater

9: chamber cover

9a: by air supply (air supply means)

9b: exhaust passage (exhaust means)

10: coating and developing treatment system

46: vacuum drying unit (substrate processing apparatus)

80a, 80b, 80c: upper air flow control

81a: first air supply means

81b: second air supply means

81c: third air supply means

82a: first exhaust means

82b: second exhaust means

82c: third exhaust means

83: rectification plate

84: vent hole

84a: blowout hole

84b: intake hole

85: exhaust means

G: Substrate

Claims (12)

In the substrate processing apparatus which forms a coating film by performing the drying process of the said process liquid with respect to the to-be-processed substrate to which the process liquid was apply | coated, A conveying means for conveying a conveying path image in a horizontal direction with the substrate to be processed upward and a chamber unit provided on the conveying path and carrying out a drying process on the substrate loaded by the conveying means; and, The chamber unit includes air supply means provided on the downstream side in the substrate conveyance direction and exhaust means provided on the upstream side in the substrate conveyance direction, or air supply means provided on the upstream side in the substrate conveyance direction and exhaust means provided on the downstream side in the substrate conveyance direction. Including, The substrate processing apparatus characterized by supplying dry air by the air supply means and exhausting the supplied dry air by the exhaust means to form a dry air flow in contact with the upper surface of the substrate conveyed into the chamber unit. . The substrate processing apparatus according to claim 1, wherein the chamber unit is provided in a plurality of stages on the conveying path along the conveying direction of the substrate to be processed, and formation control of the dry air flow is performed for each chamber unit. The substrate processing apparatus according to claim 1, wherein a heater for heating the substrate to be conveyed by the conveying means is provided at a front end of the chamber unit on the conveying path. The substrate processing apparatus according to claim 2, wherein a heater for heating the substrate to be conveyed by the conveying means is provided at the front end of the chamber unit on the conveying path. The said conveyance path is provided with the board | substrate floating means which conveys a to-be-processed board | substrate to a horizontal direction in the state which floated the to-be-processed board | substrate by pneumatic pressure in the said chamber unit. Substrate processing apparatus. The said chamber unit as described in any one of Claims 2-4 provided in the conveyance path in multiple stages along the conveyance direction of the said to-be-processed board | substrate, The temperature of the dry air flow formed in the first stage chamber unit is set to a predetermined temperature, And a temperature of the dry air stream formed in the chamber unit at the rear stage is set higher than a temperature of the dry air stream formed in the chamber unit at the first stage. The said chamber unit as described in any one of Claims 2-4 provided in the conveyance path in multiple stages along the conveyance direction of the said to-be-processed board | substrate, The flow rate of the dry air flow formed in the chamber unit of the first stage is set at a predetermined speed, And a flow rate of the dry air flow formed in the chamber unit at the rear stage is set faster than a flow rate of the dry air flow formed in the chamber unit at the first stage. The roller conveyance part of Claim 5 which roller-feeds a board | substrate is provided in the front end and the rear end of each chamber unit provided in multiple stages on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, The length dimension of the board | substrate conveyance direction of the said board | substrate floating means in each chamber unit is comprised shorter than the length dimension of the board | substrate conveyance direction of the said to-be-processed board | substrate, When the substrate to be processed passes through the chamber unit, the substrate moves in a conveying direction by a roller conveying unit at the front end or the rear end of the chamber unit. The said chamber unit of Claim 5 provided in the conveyance path in multiple stages along the conveyance direction of the said to-be-processed board | substrate, The temperature of the dry air flow formed in the first stage chamber unit is set to a predetermined temperature, And a temperature of the dry air stream formed in the chamber unit at the rear stage is set higher than a temperature of the dry air stream formed in the chamber unit at the first stage. The said chamber unit of Claim 5 provided in the conveyance path in multiple stages along the conveyance direction of the said to-be-processed board | substrate, The flow rate of the dry air flow formed in the first stage chamber unit is set at a predetermined speed, And a flow rate of the dry air flow formed in the chamber unit at the rear stage is set faster than a flow rate of the dry air flow formed in the chamber unit at the first stage. The said chamber unit of Claim 8 provided in multiple steps on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, The temperature of the dry air flow formed in the first stage chamber unit is set to a predetermined temperature, And a temperature of the dry air stream formed in the chamber unit at the rear stage is set higher than a temperature of the dry air stream formed in the chamber unit at the first stage. The said chamber unit of Claim 8 provided in multiple steps on the said conveyance path along the conveyance direction of the said to-be-processed board | substrate, The flow rate of the dry air flow formed in the first stage chamber unit is set at a predetermined speed, And a flow rate of the dry air flow formed in the chamber unit at the rear stage is set faster than a flow rate of the dry air flow formed in the chamber unit at the first stage.

Images