KR20080079409A - Liquid cooling system of semiconductor device - Google Patents

Abstract

A liquid cooling system of a semiconductor device is provided to prevent the degradation of cooling capacity by reducing a load of a pump for supplying a refrigerant to a water block. A water block(110) is installed at a side of a semiconductor device. A refrigerant discharged form the water block is flowed into a reservoir(120). The refrigerant is thermally exchanged in the water block. The refrigerant is flowed into a radiator(140). The refrigerant dissipates heat in the reservoir. A pump(130) supplies the refrigerant that circulates the radiator to dissipates heat to the water block again. A ventilation fan(150) sends air to the radiator and the reservoir. The water block is connected to the reservoir by at least one pipe. The radiator includes an inlet unit(142) into which the refrigerant is flowed and a discharge unit(144) at which the refrigerant is discharged. Plural radiating pins are formed on the pump at regular intervals.

Description

Liquid cooling system of semiconductor device

1 is a configuration diagram showing the operation principle of a water-cooled cooling device of a conventional semiconductor device.

Figure 2 is a perspective view of a water-cooled cooling device of a semiconductor device according to the present invention.

Figure 3 is an exploded perspective view for explaining the principle of operation of the water-cooled cooling device of a semiconductor device according to the present invention.

4 is a perspective view of a state covered with the cover in FIG.

<Description of the symbols for the main parts of the drawings>

100: cooling device 110: water block

112,122: Heat radiation fins 114,124,132: Piping

120: reservoir 130: pump

140: radiator 142: inlet end

144: discharge stage 150: blowing fan

160: cover 162: discharge hole

The present invention relates to a water-cooled cooling device for a semiconductor device, and more particularly, to effectively cool heat generated during operation of an information processing terminal such as a computer, as well as compact and compact installation space for easy installation. It relates to a water-cooled cooling device for semiconductor devices.

In general, an information processing terminal such as a computer includes an input unit for inputting information, that is, data, a central processing unit (CPU) for processing data input through the input unit in a desired state, and data processed by the CPU. It consists of an output unit for outputting.

Therefore, when the user inputs data through the input unit, the input data is processed by the CPI which is a representative component of the semiconductor device and output through the output unit.

Here, the CPI is installed in the main body together with a main board on which a plurality of chips are mounted, a hard disk for storing various data, and various connection parts that exchange signals with the input and output parts. The electric elements generate heat according to the driving of the information processing terminal.

As such, when heat is generated, heat is transferred not only to the electric device itself but also to the entire body, thereby degrading or shortening the life of various electric devices.

Particularly, among the many electric devices installed in the main body, CFIU, which is the most important function, may lose the entire function of the information processing terminal when high heat is generated, so that a separate cooling device is provided to cool the heat. I'm trying to.

That is, conventionally, by installing an exhaust fan in the case of the main body to discharge the high heat inside the main body to the outside to lower the temperature inside the main body to maintain the performance and service life of various electrical elements.

In addition, in the case of CPI, which is a core device, a separate heat sink is installed, and heat exchange between the heat sink and CAPI fluid absorbs the high temperature of CAPI fluid to the heat sink to cool the CPI fluid. By additionally inducing the flow of air on the surface of the heat sink, the heat exchange efficiency is increased to further improve the cooling performance of the seed oil.

However, the conventional CPI fluid cooling apparatus is installed in a narrow space, and the heat sink has a plurality of heat dissipation fins, and thus there is a limit to increasing the number of heat dissipation fins for increasing the heat exchange surface area of the heat sink. In the air flow due to the short contact time between the air and the heat sink, the cooling efficiency can not be increased, and since the high heat generated from CPI is released into the main body, it has a disadvantage of causing a major increase in the temperature inside the main body. there was.

In addition, due to the continuous development of hardware, high capacity information processing terminals have been spread, and the CPI has to be improved in its capacity, but the cooling efficiency should be further increased. However, the conventional air-cooled cooling device has been difficult to achieve its purpose.

Therefore, recently, a water-cooled cooling device for more effectively cooling the heat of the CAPI oil by using a refrigerant has been widely used.

FIG. 1 is a block diagram showing the operation principle of a CPI fluid-cooled water cooling device, which is a core component of a conventionally provided semiconductor device. As shown in FIG. Is installed on one side of the water block (Water Block) 30 is a heat exchange, the refrigerant passing through the water block 30 is passed through the radiator 40 and the radiator 40 is radiated by blowing air, and passes through the radiator 40 It comprises a storage tank 50 in which one refrigerant is stored, and a pump 60 for pumping the refrigerant in the storage tank 50 back to the water block 30.

Here, the water block 30, the radiator 40, the storage tank 50, and the pump 60 are connected by one circulation pipe 70.

Therefore, when the CPI 20 is operated by the driving of the information processing terminal, the pump 60 is driven to transport the refrigerant stored in the storage tank 50 to the water block 30.

As such, the refrigerant collected in the water block 30 absorbs the heat generated from the CPI 20 and moves to the radiator 40. The refrigerant absorbing the heat is transferred to the blower fan 42 while circulating the radiator 40. After being radiated by the air blown by the air, it is collected by the storage tank 50 again.

Therefore, the refrigerant absorbing the heat generated from the seed oil 20 is radiated by the blower fan 42 installed in the radiator 40, so that the heat of the seed oil 20 is released to the outside.

In other words, the heat generated from the seed oil 20 through continuous circulation of the refrigerant is released to the outside, thereby cooling the seed oil 20.

However, in the conventional CPI fluid-cooled cooling device 10 having the above configuration, each component, that is, the water block 30, the radiator 40, the storage tank 50 and the pump 60 is one pipe Bar 70 is configured to be circulated to be connected, there is a risk that the cooling function is completely lost if the leakage occurs in a portion of the pipe (70).

In addition, since the refrigerant constituting the heat exchange with the CAPI oil 20 is circulated only in one direction, since the amount of movement of the refrigerant absorbing heat is limited, when the calorific value of the CAPI oil 20 is large, By increasing the moving speed, there was a problem that the load on the pump 60 can be applied.

As described above, when the load on the pump 60 is applied, it is difficult to smoothly transfer the refrigerant, and as a result, the function of the cooling device 10 is deteriorated, so that it is difficult to smoothly cool the CPI 20, and thus the information processing terminal itself. This causes a problem of deterioration of the performance.

In addition, each part is connected in parallel to take a lot of installation space, thereby causing a problem that is not easy to install.

The present invention has been made in view of the above problems, the refrigerant in the water block absorbing heat generated by the semiconductor device in direct contact with the semiconductor device is dispersed to be transferred to the next component of the heat dissipation function, It is an object of the present invention to provide a water-cooled cooling device for a semiconductor device that reduces the load of a pump for supplying a refrigerant to a water block and eventually maintains the performance of an information processing terminal.

In addition, an object of the present invention is to provide a water-cooled cooling device for a semiconductor device to increase the cooling efficiency by allowing the heat exchanged refrigerant in the water block to be radiated in two stages.

It is also an object of the present invention to provide a water-cooled cooling device for a semiconductor device in which each part is assembled in series and integrated, thereby reducing its overall size and making it compact, thereby reducing its installation area and making it easy to install. .

The present invention for achieving the above object, the water block is provided on one side of the semiconductor device; A reservoir into which the refrigerant discharged in a state of performing heat exchange in the water block is introduced; A radiator into which the refrigerant, which is radiated from the reservoir, is introduced; A pump for circulating the radiator and supplying the heat-dissipated refrigerant back to the water block; It characterized in that it comprises a blowing fan for blowing to the radiator and the reservoir.

Here, the water block is preferably connected to the reservoir by at least one pipe.

In addition, the radiator includes an inlet end through which the refrigerant is introduced, and a discharge end through which the refrigerant is discharged, and the discharge end is preferably connected to a pump.

On the other hand, the present invention is a water block provided on one side of the semiconductor device; A radiator into which the refrigerant discharged in a state of performing heat exchange in the water block is introduced; A coolant in which heat radiation is introduced while circulating the radiator, and a reservoir installed in series with the radiator; A pump for supplying the heat-dissipated refrigerant back to the water block in the reservoir; It is also characterized by including a blower fan for blowing to the radiator and the reservoir.

Here, the water block is preferably connected to the radiator by at least one pipe.

In addition, the radiator includes an inlet end through which the refrigerant is introduced, and a discharge end through which the refrigerant is discharged, and the discharge end is preferably connected to the reservoir.

On the other hand, the water pump is a plurality of heat radiation fins having a predetermined area is formed at a predetermined interval, the reservoir is preferably made of a cylindrical shape, the heat radiation fins having a predetermined area on the outer surface is preferably formed in a spiral.

In addition, the water block and the pump is not connected to a separate pipe, it is preferable to be connected to be in direct contact to achieve watertight.

In addition, the reservoir, the radiator and the blowing fan are preferably installed on the same line, more preferably the reservoir and the radiator are installed on the same line in the blowing fan blowing direction.

On the other hand, it is preferable that the cover further comprises a cover which surrounds the water block, the pump, the reservoir, the radiator, and has a plurality of discharge holes for the air blown out by the blower fan.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 is a perspective view of a water-cooled cooling device of a semiconductor device according to the invention, Figure 3 is an exploded perspective view for explaining the operating principle of the water-cooled cooling device of the semiconductor device according to the invention, Figure 4 is a cover covered in Figure 2 It is a perspective view of a state.

For reference, in describing the present invention, a semiconductor device will be described using CPU as an example.

As shown, the water-cooled cooling device 100 of the semiconductor device according to the present invention, the water block 110 is installed on one side of the semiconductor device (CPU, not shown) to directly absorb the heat generated from the CPI fluid 110 ), The reservoir 120 into which the refrigerant discharged in the state of heat exchange from the water block 110 is introduced, the radiator 140 into which the refrigerant, which is primarily heated, is introduced from the reservoir 120; Pump 130 for circulating the radiator 140 and supplying the second heat generated refrigerant to the water block 110 again, and a blowing fan 150 for blowing to the radiator 140 and the reservoir 120 Consists of including.

The water block 110 is installed in a direct contact manner by the CPI and the base plate 170 (see Fig. 4), the refrigerant is supplied to form a space to stay for a certain period of time.

Inside the water block 110, a plurality of heat radiation fins 112 having a predetermined area are formed at regular intervals. Accordingly, the refrigerant introduced into the water block 110 absorbs heat generated from the CPI and forms heat exchange while circulating between the heat dissipation fins 112 for a long time.

Both sides of the water block 110 are connected to the pipes 114 in parallel with both sides of the reservoir 120.

Therefore, the refrigerant introduced into the water block 110 absorbs heat generated from the CPI and performs heat exchange, and then is distributed and discharged to the reservoir 120 through both pipes 114.

The water block 110 and the reservoir 120 are illustrated as being connected to a pair of pipes 114 side by side in both directions, but may be two or more as necessary and at least one may be necessary. Bar and the number is not limited.

On the other hand, the reservoir 120 is the refrigerant is stored to primarily radiate heat, both sides of the water block 110 and the pipe 114 is connected to both sides as described above is made of a cylindrical, the outer surface In the heat dissipation fin 122 having a predetermined area is formed spirally.

The reservoir 120 is primarily responsible for lowering the temperature of the refrigerant by releasing heat primarily by the air blown by the blower fan 150 to be described later.

One side of the reservoir 120 is connected to the inlet end 142 of the radiator 140 and the pipe 124. Therefore, the refrigerant discharged from the water block 110 flows into the radiator 140 through the pipe 124 connected to the inlet end 142 of the radiator 140 by being primarily radiated by air. Discharged.

The radiator 140 has an inlet end 142 and an outlet end 144 formed at both sides, respectively, and the discharge end 144 is a pump 130 and a pipe (120) for supplying refrigerant to the water block 110 again. 132).

Therefore, the refrigerant that is primarily radiated from the reservoir 120 flows into the inlet end 142 of the radiator 140 through the pipe 124, and then circulates the radiator 140 to blow the fan 150. By heat exchange with the air blown by the secondary heat is released to lower the temperature of the refrigerant.

As such, the refrigerant having the temperature lowered by heat exchange in two stages by the reservoir 120 and the radiator 140 is again pumped along the pipe 132 through the discharge end 144 of the radiator 140. It is supplied to, the pump 130 is to supply the refrigerant of low temperature back to the water block 110 to absorb the heat generated from the semiconductor element, and then to cool the Cfi oil while continuously circulating.

Here, the blowing fan 150 is preferably located on the same line as the radiator 140 and the reservoir 120 so as to blow air to both the radiator 140 and the reservoir 120, the radiator ( 140 and the reservoir 120 may be in contact with each other if the contact is made with the air blown from the blower fan 150.

That is, preferably installed so as to be located on the same line in the order of the blower fan 150, the radiator 140, the reservoir 120, or of the blower fan 150, the reservoir 120, the radiator 140 It may be installed in the same line in order.

Here, the blowing fan 150, the radiator 140, the reservoir 120, the pump 130, the water block 110 is more preferably installed in the same line in series.

The reason for this is that, if they are provided on the same line in series with each other, the length of the pipe, which is the circulation passage of the refrigerant, can be reduced, and the assembly can be made more compact.

In addition, the coolant flowing through the radiator 140 and the coolant flowing through the reservoir 120 may be cooled in two stages by the air blown by the blower fan 150. In addition, the pump ( 130 and because the refrigerant present in the water block 110 can also be cooled, the cooling efficiency can be maximized.

In addition, since the pump 130 and the water block 110 are integrally connected by being tightly connected by direct contact, an additional connection pipe is excluded, and thus, a more compact cooling device 100 may be realized. .

Meanwhile, as shown in FIG. 4, the air blown by the blower fan 150 surrounds the water block 110, the pump 130, the reservoir 120, and the radiator 140, and the radiator 140. And a cover 160 in which a plurality of discharge holes 162 are formed to form heat exchange with the refrigerant circulating in the reservoir 120 and then discharged to the outside.

As described above, the cover 160 is assembled with the water block 110, the pump 130, the reservoir 120, and the radiator 140 wrapped, thereby providing a more integrated cooling device 100. You will also be responsible for the functions you implement.

Referring to the operational relationship of the water-cooled cooling device 100 of the semiconductor device having the above configuration as follows.

When the information processing terminal is driven, the pump 130 is driven to supply the refrigerant to the water block 110 and at the same time the blowing fan 150 is operated to blow air toward the radiator 140 and the reservoir 120. .

The refrigerant supplied to the water block 110 absorbs heat generated from the CPI while passing through the plurality of heat dissipation fins 112 to form heat exchange, and then passes through the pipes 114 formed on both sides to the reservoir 120. Discharged.

Since the refrigerant supplied to the reservoir 120 absorbs a lot of heat, it is in a very high temperature state. At this time, the air blown by the blower fan 150 is helically radiated to the outer surface of the reservoir 120. While passing between the 122 to absorb the heat of the refrigerant to form a heat exchange, the heat radiation is primarily made.

Air that has undergone heat exchange with the refrigerant circulating in the reservoir 120 exits to the outside of the cooling apparatus 100 through the discharge hole 162 of the cover 160.

Refrigerant having a predetermined heat exchange rate by circulating the reservoir 120 and lowering a predetermined portion thereof is discharged to the inlet end 142 of the radiator 140 through the pipe 124 again.

The refrigerant supplied to the inlet end 142 circulates the radiator 140, and heat-exchanges with the air blown by the blower fan 150 to perform heat radiation secondarily.

That is, the air blown by the blower fan 150 absorbs the heat of the refrigerant circulating through the radiator 140 and exits to the outside of the cooling apparatus 100 through the discharge hole 162 of the cover 160. The refrigerant circulated through the radiator 140 is further lowered in temperature.

As described above, the refrigerant having undergone heat exchange in two stages by the reservoir 120 and the radiator 140 and whose temperature is lowered is connected to the discharge end 144 of the radiator 140 and the pump 130. 132 is supplied to the pump 130, and the pump 130 supplies the refrigerant to the water block 110 again.

Accordingly, the refrigerant circulating in the water block 110, the reservoir 120, the radiator 140, and the pump 130 absorbs heat generated from the CPI from the water block 110, and thus, the reservoir 120 and the reservoir 120. The radiator 140 is to cool the heat of the seed oil while repeating the heat dissipation in two steps.

On the other hand, although not shown, as described above, the position of the radiator 140 and the reservoir 120 may be changed, where the refrigerant circulation order of the radiator 140 and the reservoir 120 may be changed. .

That is, after the refrigerant discharged from the water block 110 is supplied to the radiator 140, the refrigerant is again supplied to the reservoir 120, and the pipes are connected to supply the pump 130 from the reservoir 120. It may be.

That is, the refrigerant discharged from the water block 110 is supplied to the radiator 140, the primary heat dissipation is performed by the blowing by the blowing fan 150, and is supplied to the reservoir 120 again to the blowing fan 150 After the secondary heat dissipation is made by the blowing by air, it may be configured to supply a low temperature refrigerant to the pump 130.

Also in this case, the blowing fan 150, the radiator 140, the reservoir 120 is preferably installed in series on the same line, more preferably radiator 140 in the blowing direction of the blowing fan 150 ) And the reservoir 120 are installed in series on the same line.

As described above, according to the water-cooling type cooling apparatus of the semiconductor device according to the present invention, the refrigerant in the water block that is in direct contact with the semiconductor device to absorb the heat generated by the semiconductor device is dispersed and transferred to the heat radiation function component The load of the pump for supplying the coolant to the water block is reduced, thereby reducing the cooling performance.

In addition, the present invention has the effect that the refrigerant heat exchanged in the water block is radiated in two stages by the reservoir and the radiator, thereby increasing the cooling efficiency.

In addition, according to the present invention, since the parts are assembled and integrated in series, the overall size thereof is reduced and compacted, thereby reducing the installation area and thus making the installation easier.

Claims (12)

 A water block provided on one side of the semiconductor device; A reservoir into which the refrigerant discharged in a state of performing heat exchange in the water block is introduced; A radiator into which the refrigerant, which is radiated from the reservoir, is introduced; A pump for circulating the radiator and supplying the heat-dissipated refrigerant back to the water block; And a blower fan for blowing air into the radiator and the reservoir. The method of claim 1, The water block is a water-cooled cooling device of a semiconductor device, characterized in that connected to the reservoir by at least one pipe. The method of claim 1, The radiator includes an inlet end through which the refrigerant is introduced, and a discharge end through which the refrigerant is discharged, and the discharge end is connected to a pump. A water block provided on one side of the semiconductor device; A radiator into which the refrigerant discharged in a state of performing heat exchange in the water block is introduced; A coolant in which heat radiation is introduced while circulating the radiator, and a reservoir installed in series with the radiator; A pump for supplying the heat-dissipated refrigerant back to the water block in the reservoir; And a blower fan for blowing air into the radiator and the reservoir. The method of claim 4, wherein The water block is a water-cooled cooling device of a semiconductor device, characterized in that connected to the radiator by at least one pipe. The method of claim 4, wherein The radiator includes an inflow end through which the refrigerant is introduced, and a discharge end through which the refrigerant is discharged, and the discharge end is connected to a reservoir. The method according to claim 1 or 4, And a plurality of heat dissipation fins having a predetermined area in the water pump at a predetermined interval. The method according to claim 1 or 4, The reservoir has a cylindrical shape, the water-cooled cooling device of a semiconductor device, characterized in that the heat radiation fin having a predetermined area on the outer surface formed in a spiral. The method according to claim 1 or 4, The water block and the pump is not connected to a separate pipe, the water-cooled cooling device of a semiconductor device, characterized in that the direct contact is connected to achieve watertight. The method according to claim 1 or 4, And the reservoir, the radiator, and the blower fan are positioned on the same line. The method of claim 10, And the reservoir and the radiator are positioned in the same line in a direction in which the blowing fan blows. The method according to claim 1 or 4, And a cover surrounding the water block, the pump, the reservoir, and the radiator, the cover having a plurality of discharge holes formed therein for exiting the air blown by the blower fan.

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