KR100851809B1 - Cooler of Natural Convection Type For Water Cooling Device For Electronics - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooler for a natural convection type water-cooled electronic device chiller for cooling heat-generating electronic devices such as a computer.

The present invention, the body is formed with a flow path therein; A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface; Upper and lower lids each having a space communicating with an internal flow path of the body and covering an upper and lower ends of the body to form a closed space; And an inlet and an outlet configured to be connected to the flow passage of the body and the circulation cooling pipe of the water cooling device, respectively, to allow the cooling water to flow from the pipe.

According to the present invention, it is possible to cool electronic devices using air convection without using a separate power source, and due to the unique heat dissipation fin, the heat dissipation performance is excellent while having a simple structure. In addition, the present invention enables a cheap device configuration through the application of a simple structure, and obtains an effect suitable for practical use.

Convection Cooling, Water Cooled Electronics Chillers, Chillers, Cooling Fins, Cooling Blocks

Description

COOLER OF NATURAL CONVEction TYPE FOR WATER COOLING DEVICE FOR ELECTRONICS

1 is an explanatory diagram showing a structure in which a cooler of the present invention is applied to a water-cooled electronic device cooling device to cool a computer;

2 is a schematic diagram showing a structure in which a cooler of the present invention is applied to a water-cooled electronic device cooling device to cool a computer.

Figure 3 is an exploded perspective view showing a cooler for a natural convection type water-cooled electronic device cooling apparatus according to an embodiment of the present invention;

4 is a view showing the cooling block and the electronic device of the water-cooled electronic device cooling apparatus to which the present invention is applied,

a) exploded perspective view, b) drawing sectional view;

5 is an exploded perspective view showing a cooler for a natural convection type water-cooled electronic device cooling apparatus according to a modified embodiment of the present invention;

6 is a cross-sectional view showing a cooler for a natural convection type water-cooled electronic device cooling apparatus according to a modified embodiment of the present invention;

7 is a system diagram of a water-cooled chiller for circulating water as a refrigerant to cool electronic devices according to the related art.

       <Explanation of symbols for the main parts of the drawings>

1,1 '..... Cooler 5 ..... cooling fins according to the invention

5a ..... Pointed section 10 ..... Body

12,12 '..... Euro 20a, 20b .... cover

22a ', 22b' .... Partition 28 ..... Inlet

30 ..... outlet 35 ..... pedestal

100 .... Water-cooled electronic device cooling apparatus to which the present invention is applied

105. Computer 110 .... Circulating cooling piping

120 ... electronics 130 .... cooling block

140 ... Casing 142 .... Entrance

144 ... Exit 148 ... Screw

150 ... frame 200 .... conventional water cooling chiller

201 ... CPU 202 .... VGA

203 .... HDD 204 .... refrigerant circulation line

205 .... Radiator 206 .... Cooling Fan

207 .... Refrigerant Tank 208 .... Refrigerant Circulation Pump

210 .... conventional refrigerant K ..... pump

The present invention relates to a cooler used in a water-cooled electronic device cooling device for cooling the electronic device that generates heat, such as a computer, and more particularly, by using a cooling fin having a sharp and wide heat dissipation surface area in the process of circulating the refrigerant. The present invention relates to a cooler for a natural convection type water-cooled electronics cooling device that can obtain a great cooling effect even with a simple structure by cooling a coolant.

In general, the cooling device is a device that removes the heat of the electronic device to generate heat to maintain the electronic device within the proper temperature range to ensure that the parts work properly and maintain a constant life.

Such a cooling device is typically an air cooling type using a cooling fin, a compressed refrigerant method that absorbs heat by vaporization of a liquid and compresses a gas to form a liquid to release heat, and performs a process of endothermic and heat dissipation while the cooling liquid is circulated. Water-cooled and the like.

An important electronic device currently in use is a computer. Such a computer has heat-generating electronic devices such as CPU, video card (VGA), hard disk driver (HDD), etc., and heatsinks directly to the CPU, video card, or hard disk driver to cool them. And air-cooled cooling device equipped with a cooling fan for forcibly supplying air to the heat dissipation fin is widely used.

However, as the performance of the computer is gradually improved, the amount of heat generated by the components is greatly increased, and in order to cool these components, a plurality of speeded-up cooling fans are used, which inevitably causes noise and increases.

In addition, electronic devices such as computers have reached the limit of the cooling capacity of such air-cooled cooling devices as the number of transistors per unit area and the operating speed increase due to the development of semiconductor manufacturing processes.

Therefore, in recent years, in order to improve the problems of the conventional air-cooled cooling device, as shown in Figure 7, the computer CPU (201), VGA (VGA) (202), or a hard disk driver In order to cool heat generating electronic devices, such as (HDD) 203, the water-cooled cooling apparatus 200 which circulates with water as a refrigerant is developed.

The conventional water-cooled cooling device 200 has a water-cooled refrigerant circulation system in which a circulation line 204 of a refrigerant in thermal contact with the electronic device is installed so that heat generated from the electronic device may be absorbed into the refrigerant 210.

In addition, the water-cooled cooling device 200 is provided with a radiator 205 for a separate heat generation, and a cooling fan 206 for forcibly air cooling the radiator 205.

The conventional water-cooled cooling device 200 includes a refrigerant tank 207 for accommodating the circulating refrigerant 210 therein and a refrigerant circulation pump 208 for forcibly circulating the refrigerant 210. It consists of a configuration mounted on the circulation line (204).

However, the conventional water-cooled cooling device 200 is equipped with a cooling fan 206 for forced air cooling of the radiator 205, the noise is generated by the operation of the cooling fan 206 installed in the radiator 205. Since it is inevitably generated, the noise is still generated, and a separate power and power for operating the cooling fan 206 are consumed, thereby preventing energy saving.

In addition, the conventional water-cooled cooling device 200 as described above has a large size of the device, can not achieve a small natural structure, there is a problem that requires a high cost in the configuration of the device.

The present invention is to solve the above-mentioned conventional problems, the purpose is to provide a simple structure that does not use a separate power, excellent heat dissipation performance, natural convection type water-cooled electronic device cooling device that can obtain a large cooling effect To provide a cooler for the.

And another object of the present invention, through the application of a simple structure can further reduce the component configuration of the water-cooled electronic device cooling apparatus, and accordingly the cheaper device configuration is possible improved natural convection type water-cooled electronic device suitable for practical use A chiller for a chiller is provided.

In order to achieve the above object, the present invention, in the cooler for water-cooled cooling device for cooling the electronic device that generates heat, such as a computer,

A body having a flow path formed therein;

A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface;

Upper and lower lids each having a space communicating with an internal flow path of the body and covering an upper and lower ends of the body to form a closed space; And

And inlets and outlets respectively connected to the flow path of the body and the circulation cooling pipe of the water-cooled cooling device to allow the cooling water to flow from the pipe.
An inlet and an outlet configured to be connected to the flow path of the body and the circulation cooling pipe of the water-cooled cooling device, respectively, to allow the cooling water to flow from the pipe, wherein the inlet is provided in any one of the upper and lower covers and the body. The discharge port is provided in the other one, and the upper and lower covers provide a cooler for a natural convection type water-cooled electronics cooling device, characterized in that the cooling fins of the same type as the cooling fins of the body is formed on the outer surface.

And the present invention preferably the body has a plurality of side-by-side passages by partitioning the inner space, the upper and lower cover has a plurality of partitions therein to form a long passage in which the passages are extended up and down It provides a cooler for a natural convection type water-cooled electronic device chiller characterized in that configured.

In another aspect, the present invention preferably provides a cooler for a natural convection-type water-cooled electronics cooling device, characterized in that the plurality of cooling fins are formed to protrude from the body along the inner flow path of the body.

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In another aspect, the present invention preferably provides a cooler for a natural convection type water-cooled electronics cooling device, characterized in that the cooling fin is roughened surface is formed to have a wide surface area.

And the present invention preferably provides a cooler for a natural convection type water-cooled electronic device chiller, characterized in that the body is produced through an extrusion operation.

In addition, the lower cover is preferably provided with a plurality of upper and lower pedestals (上 狹 下 廣) on the lower surface of the floor to form a certain height with the air movement and cooling along the cooling fins from the bottom to the upper side It provides a cooler for a natural convection type water-cooled electronic device cooling device, characterized in that configured to be made smoothly.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

1 shows a water-cooled electronic device cooling apparatus 100 equipped with a cooler 1 according to the present invention. The water-cooled electronic device cooling apparatus 100 as described above is connected to the cooler 1 of the present invention, the circulating cooling pipe 110 connected to the cooler 1, and the circulating cooling pipe 110 and the CPI. And a plurality of cooling blocks 130 for absorbing and cooling heat from a heat generating electronic device 120 such as a V-A card (VGA) or a hard disk driver (HDD).

The circulation cooling pipe 110 flows cooling water therein, and connects the cooler 1 and the cooling block 130 of the present invention. In addition, the circulation cooling pipe 110 is provided with a pump (k) and the cooling water flowing therein is forced circulation and flows between the cooler 1 and the cooling block 130 of the present invention.

2 is a schematic diagram of a water-cooled electronic device cooling apparatus 100 equipped with a cooler 1 according to the present invention. As can be seen in such a system diagram, the cooler 1 according to the present invention is disposed separately outside the computer 105, and the circulation cooling pipe 110 discharged through the cooling blocks 130 in the computer 105. The high temperature coolant inside is radiated and regenerated with low temperature coolant. In this process, the pump k circulates the cooling water and moves the heat absorbed from the cooling block 130 to the cooler 1 side according to the present invention.

In the above, the pump k is shown as an external type in the drawings, but the present invention is not limited thereto. That is, the pump k may be configured to operate in the interior of the computer 105, and the present invention is applicable to such a structure.

Cooler 1 according to an embodiment of the present invention has a structure as shown in FIG.

The cooler 1 according to an embodiment of the present invention has a body 10 having a plurality of cooling fins 5 formed on an outer surface thereof, and has a structure in which a flow passage 12 is formed in the body 10.

The plurality of cooling fins 5 are formed so as to protrude from the body 10, the cooling fins 5 can be maintained at the same temperature because the plurality of cooling fins 5 are in contact with the surface of the flow path 12 through which the coolant flows. Therefore, the heat dissipation performance is excellent.

And the structure of such a body 10 can be conveniently manufactured by extrusion, accordingly the manufacturing cost can be low.

In addition, the cooling fins 5 are formed on the outer surface of the body 10, respectively, and have a structure formed while forming a pointed end surface 5a. Thus, the pointed end surface 5a structure enables weight reduction of the body 10 and prevents excessive design, thereby obtaining a lighter and cheaper cooler structure 1.

In addition, the surface of the cooling fin 5 is roughened to have a wide surface area. That is, the cooling fins 5 may be formed on the surface of the grooves such as dimples (dimples) or may be roughened, such as scratch (scratch). Such a rough surface can make the heat dissipation surface area relatively larger than a smooth surface, and can further improve the heat dissipation effect.

In addition, the upper and lower portions of the body 10, the cover (20a, 20b) is mounted, respectively, the cover (20a, 20b) has a structure of the X-shaped cross section, respectively. These covers 20a and 20b are connected to the body 10 to block the flow path 12 of the body 10 from the outside thereof. In addition, a plurality of cooling fins 5 may be formed in the cover 20a and 20b in the same shape as the body 10.

The upper and lower lids 20a and 20b may be integrally connected to the upper and lower edges of the body 10 by welding or by screwing with a sealing seal applied thereto, and the lids 20a and 20b are illustrated in FIG. 2. As shown, each has an inlet port 28 through which the coolant flows into the cooler 1, and an outlet port 30 through which the coolant flows out of the cooler 1.

These inlets 28 and outlets 30 may be mounted on any one of the upper and lower lids 20a and 20b, respectively, through which cooling water may be introduced or discharged.

In FIG. 2, the inlet port 28 is formed on the lower cover 20b side, and the outlet port 30 is formed on the upper cover 20a side, but the present invention is not limited thereto. An inlet 28 is formed at the side of the 20a, the outlet 30 may be formed at the lower cover 20b side, respectively formed on one side of the body 10 instead of the upper and lower cover 20a, 20b It may be a structure.

In addition, the inlets 28 and the outlets 30 are connected to the circulating cooling pipes 110, respectively, and the coolant passing through the inlets 28 passes through the flow passage 12 in the body 10, and has excellent heat transfer. Heat is radiated to the outside through the body 10 made of a material such as copper (Cu) or aluminum (Al), the cooling fins 5, and the upper and lower lids 20a and 20b. And the cooling fins 5 provided in the body 10 can be produced in a light weight by reducing the material by the structure is made of a pointed end (5a), the surface is formed rough, so that the heat dissipation surface area is large Because it is formed, it is possible to achieve heat radiation from the cooling water effectively.

In addition, a plurality of pedestals 35 for maintaining the state in which the cooler 1 of the present invention is upright are mounted on the lower cover 20b. The pedestal 35 has a cross-sectional structure of upper and lower beams and can be fixed to the lower cover 20b by welding or the like.

The pedestal 35 allows the body 10 to be positioned at a predetermined height from the ground, so that the air can be smoothly flowed to the lower side of the body 10, and thus the air follows the cooling fins 5. By smoothly flowing from the lower side to the upper side, the cooling action of the cooling fins by air can be made more effectively.

On the other hand, the plurality of cooling blocks 130 are mounted on the heat generating electronics 120, such as CPU, V-A card (VGA), hard disk driver (HDD), etc. inside the computer 105, respectively. Heat is absorbed and cooled from these.

Such cooling blocks 130 are shown in detail in FIG. 4.

Such cooling blocks 130 have a hollow casing 140 having a space in which cooling water flows, and the inlet 142 and the outlet 144 to which the circulation cooling pipe 110 is connected. Has The casing 140 is made of a material such as copper (Cu) or aluminum (Al) having excellent heat transfer rate, and one side thereof is CPI, V-A card (VGA), or a hard disk driver (HDD). Surface contact with the heating electronic device 120, and the like. By contacting the surface in this way it receives heat directly from the heat generating electronic device 120 as described above to cool it efficiently.

The cooling block 130 is fixed to the frame 150 in the computer 105 through a screw 148 or the like.

The cooler 1 of the present invention having the above structure has a circulation cooling pipe 110 and a plurality of cooling blocks 130, along with the circulation of the cooling water by the pump k in the state where the cooling water is filled therein. The heat is removed from the heat generating electronics 120 such as the CPU, the V-A card, the HDD of the computer 105, and the like.

Once the computer 105 is operated, the temperature of the cooling water contained in the cooling block 130 is raised, which is caused by the operation of the pump k to circulate the cooling water in the circulation cooling pipe 110. In this process, heat generated from the heat generating electronic device 120 of the computer 105 is transferred to the coolant, and the high temperature coolant flows into the cooler 1 through the cooling circulation pipe 110, and an internal flow path thereof. The heat radiation is cooled while passing through (12).

The cooler 1 of the present invention efficiently cools the cooling water because a plurality of cooling fins 5 having sharp and heat dissipating surface areas are formed along the flow path 12 and outside. In this way, the coolant cooled while passing through the cooler 1 continuously removes heat from the cooling block 130 while continuously circulating toward the cooling block 130.

5 and 6 show another structure of the present invention.

Since the modified structure of the present invention is substantially similar to the structure shown in FIG. 3, the same structure and parts are given the same numbers, and only the subscripts (') are given to the structurally different parts to be displayed on the drawings.

The cooler 1 ′ according to a modified embodiment of the present invention has a body 10 having a plurality of cooling fins 5 formed on an outer surface thereof, and a plurality of flow paths partitioned up and down in the body 10. 12 ') are formed through.

The plurality of cooling fins 5 are formed to protrude from the body 10 along the inner flow passage 12 ′ of the body 10, and the flow passage 12 ′, that is, the flow passage 12 ′ where the coolant flows. Since all the surfaces of the cooling fins 5 are in contact with each other, the heat dissipation performance is excellent.

In addition, the upper and lower portions of the body 10, the cover (20a, 20b) is mounted, respectively, the cover (20a, 20b) has a structure of the X-shaped cross section, respectively. These lids 20a and 20b are respectively provided with partitions 22a 'and 22b' which allow the flow passage 12 'of the body 10 to be turned up and down inside thereof.

In addition, a plurality of cooling fins 5 may be formed in the cover 20a and 20b in the same shape as the body 10.

The upper and lower lids 20a and 20b may be integrally connected to the upper and lower edges of the body 10 by welding or screwing, and the inner spaces 24a and 24b of the covers 20a and 20b may be connected to each other. The flow paths 12 ′ in the body 10 communicate with each other and change directions. In addition, each of the lids 20a and 20b has an oil inlet 28 through which the coolant flows into the cooler 1, and an outlet 30 through which the coolant flows out of the cooler 1.

These inlets 28 and outlets 30 may be mounted on any one of the upper and lower lids 20a and 20b, respectively, through which coolant is introduced or discharged. In addition, the upper and lower lids 20a and 20b may be formed on one side of the body 10, respectively.

The inlets 28 and outlets 30 are connected to the circulating cooling pipes 110, respectively, and the coolant passing through the inlets 28 passes through the flow passage 12 ′ in the body 10 in the vertical direction. In addition, heat is radiated to the outside through the body 10 made of a material such as copper (Cu) or aluminum (Al) having excellent heat transfer, the cooling fins 5, and upper and lower lids 20a and 20b.

Since the cooler 1 ′ according to the modified embodiment of the present invention configured as described above is formed to be elongated by repeatedly extending up and down the flow passage 12 ′ in the body 10, the coolant 1 ′ is cooler than the structure shown in FIGS. 2 and 3. Can stay in the body 10 for a long time. Therefore, the cooling effect of the low temperature can be supplied to the cooling block 130 by further increasing the heat dissipation effect.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited to such a specific structure. Those skilled in the art will be able to variously modify or change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. For example, it is natural that the number of passages formed in the body and the number of partitions formed on the upper and lower lids may be variously changed according to the difference in cooling capacity. In addition, modification of the above-mentioned materials with high heat transfer efficiency is naturally possible. Nevertheless, it will be apparent that all such modifications or variations will fall within the scope of the present invention.

As described above, according to the present invention, it is possible to cool electronic devices using natural air convection without using a separate power source. Allow the appliance to cool.

In addition, it is possible to further reduce the configuration of the components of the water-cooled electronic device cooling apparatus through the application of such a simple structure can be a cheap device configuration can be obtained an excellent effect improved to be suitable for practical use.

Claims (7)

In the cooler for water-cooled chillers for cooling electronic devices that generate heat, such as computers, A body having a flow path formed therein; A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface; Upper and lower lids each having a space communicating with an internal flow path of the body and covering an upper and lower ends of the body to form a closed space; And And inlets and outlets respectively connected to the flow path of the body and the circulation cooling pipe of the water-cooled cooling device to allow the cooling water to flow from the pipe. The inlet is provided in any one of the upper and lower cover and the body, the outlet is provided in the other, The upper and lower cover is a cooler for a natural convection type water-cooled electronics cooling device, characterized in that the cooling fins of the same type as the cooling fins of the body formed on the outer surface. 2. The body of claim 1, wherein the body defines a plurality of side-by-side flow passages that define an inner space, and the upper and lower lids have a plurality of partitions therein to form one long passage in which the flow passages extend up and down. Cooler for natural convection type water-cooled electronics device chiller, characterized in that. The cooler of claim 2, wherein the plurality of cooling fins are formed to protrude from the body along an inner flow path of the body. delete The cooler of any one of claims 1 to 3, wherein the cooling fin has a roughened surface and a wide surface area. The cooler of claim 1, wherein the body is manufactured through an extrusion operation. According to claim 1, wherein the lower cover is provided with a plurality of bases of the upper and lower light beams on the lower surface to form a certain height with the ground to move air and cooling along the cooling fins from the lower to the upper side Cooler for natural convection type water-cooled electronics cooling device, characterized in that configured to be made smoothly.

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