KR100851810B1 - Cooler For Water Cooling Device For Electronics by Using PCM - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water cooler for a water-cooled electronic device cooling apparatus using a PCM that cools an electronic device that generates heat, such as a computer, using natural convection and latent heat of phase change of a refrigerant (PCM).

The present invention is a body formed with a flow path therein; A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface; Upper and lower lids each having a space communicating with an internal flow path of the body and covering the upper and lower ends of the body to form a closed space; A cooling water pipe extending in a flow path of the body and connected to a circulation cooling pipe of the water cooling device, and flowing coolant therein; And a refrigerant filling the inner space of the flow path of the body and the upper and lower covers to cool the cooling water in the cooling water pipe by using the latent heat of phase change.

According to the present invention, by cooling the cooling water using natural convection and latent heat of phase change of a refrigerant (PCM), an excellent cooling effect can be obtained even with a simple structure, and an effect that can be put to practical use is obtained.

Natural Convection Cooling, Water Cooled Electronic Chillers, Chillers, Cooling Fins, Refrigerants (PCM: Phase Change Materials)

Description

Cooler for water cooling device using PCM {Cooler For Water Cooling Device For Electronics by Using PCM}

1 is an explanatory diagram showing a structure in which a cooler of the present invention is applied to a water-cooled electronic device cooling device to cool a computer;

2 is a schematic diagram illustrating a structure in which a cooler according to an embodiment of the present invention is applied to a water-cooled electronic device cooling device to cool a computer.

3 is an exploded perspective view showing a cooler for a water-cooled electronic device cooling apparatus using a PCM according to an embodiment of the present invention;

4 is a view showing the cooling block and the electronic device of the water-cooled electronic device cooling apparatus to which the present invention is applied,

a) exploded perspective view, b) drawing sectional view;

5 is an exploded perspective view showing a cooler for a water-cooled electronic device cooling apparatus using a PCM according to a modified embodiment of the present invention;

6 is a cross-sectional view showing a cooler for a water-cooled electronic device cooling apparatus using a PCM according to a modified embodiment of the present invention;

7 is a system diagram showing a water-cooled cooling apparatus for circulating water as a refrigerant to cool electronic devices according to the related art.

       <Explanation of symbols for the main parts of the drawings>

1,1 '..... Chiller according to the invention

5,5 '..... Cooling fins 5a .... Pointed section

10,10 '.... Bodybuilder 12,12' .... Euro

19,19 '.... Refrigerant charging port 20a, 20b, 20a', 20b '... upper and lower cover

22a ', 22b' ... dividers

24a, 24b, 24a ', 24b' ... Space 28,28 '.... Inlet

30,30 '.... Outlet 35,35' .... Pedestal

100 .... Water-cooled electronic device cooling apparatus to which the present invention is applied

105. Computer 110 .... Circulating cooling piping

120 ... electronics 130 .... cooling block

140 ... Casing 142 .... Entrance

144 ... Exit 148 ... Screw

150 ... frame 200 .... conventional water cooling chiller

201 ... CPU 202 .... VGA

203 .... HDD 204 .... refrigerant circulation line

205 .... Radiator 206 .... Cooling Fan

207 .... Refrigerant Tank 208 .... Refrigerant Circulation Pump

210 .... conventional refrigerant K .... pump

P .... refrigerant of the present invention

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooler used in a water-cooled electronic device cooling device for cooling a heat-generating electronic device such as a computer. More specifically, the present invention uses natural convection and latent heat of phase change of a refrigerant (PCM). The present invention relates to a water cooler for a water-cooled electronic device cooling apparatus using a PCM which can obtain a large cooling effect even with a simple structure by cooling the cooling water.

In general, the cooling device is a device that removes the heat of the electronic device to generate heat to maintain the electronic device within the proper temperature range to ensure that the parts work properly and maintain a constant life.

Such a cooling device is typically an air cooling type using a cooling fin, a compressed refrigerant method that absorbs heat by vaporization of a liquid and compresses a gas to form a liquid to release heat, and performs a process of endothermic and heat dissipation while the cooling liquid is circulated. Water-cooled and the like.

An important electronic device currently in use is a computer. Such a computer has heat-generating electronic devices such as CPU, video card (VGA), hard disk driver (HDD), etc., and heats it directly to CPU, video card, or hard disk driver to cool them. An air-cooled chiller having a fin and a cooling fan for forcibly supplying air to the heat dissipation fin is widely used.

However, as the performance of the computer is gradually improved, the amount of heat generated by the components is greatly increased, and in order to cool these components, a plurality of speeded-up cooling fans are used, which inevitably causes noise and increases.

In addition, electronic devices such as computers are approaching the cooling capacity of such air-cooled cooling devices as the number of transistors per unit area and the operating speed increase due to the development of semiconductor manufacturing processes.

Therefore, in recent years, in order to improve the problems of the conventional air-cooled cooling device, as shown in Figure 7, the computer CPU (CPU) 201, VGA (VGA) 202, or a hard disk driver In order to cool heat generating electronic devices, such as (HDD) 203, the water-cooled cooling apparatus 200 which circulates with water as a refrigerant is developed.

The conventional water-cooled cooling device 200 has a water-cooled refrigerant circulation system in which a circulation line 204 of a refrigerant in thermal contact with the electronic device is installed so that heat generated from the electronic device may be absorbed into the refrigerant 210.

In addition, the water-cooled cooling device 200 is provided with a radiator 205 for a separate heat generation, and a cooling fan 206 for forcibly air cooling the radiator 205.

The conventional water-cooled cooling device 200 includes a refrigerant tank 207 for accommodating the circulating refrigerant 210 therein and a refrigerant circulation pump 208 for forcibly circulating the refrigerant 210. It consists of a configuration mounted on the circulation line (204).

However, the conventional water-cooled cooling device 200 is equipped with a cooling fan 206 for forced air cooling of the radiator 205, the noise is generated by the operation of the cooling fan 206 installed in the radiator 205. Since it is inevitably generated, the noise is still generated, and a separate power and power for operating the cooling fan 206 are consumed, thereby preventing energy saving.

In addition, the conventional water-cooled cooling device 200 as described above has a large size of the device, can not achieve a small natural structure, there is a problem that requires a high cost in the configuration of the device.

The present invention is to solve the above-mentioned conventional problems, the purpose of the cooling and heat dissipation performance is excellent while having a simple structure that does not use a separate power, it is possible to increase the cooling time to obtain a large cooling effect The present invention provides a cooler for a water-cooled electronic device chiller using PCM.

And another object of the present invention, through the application of a simple structure can further reduce the component configuration of the water-cooled electronic device cooling apparatus, and it is possible to cheap device configuration according to the water-cooled electronic device using the PCM improved to be suitable for practical use A chiller for a chiller is provided.

In order to achieve the above object, the present invention, in the cooler for water-cooled cooling device for cooling the electronic device that generates heat, such as a computer,

A body having a flow path formed therein;

A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface;

Upper and lower lids each having a space communicating with an internal flow path of the body and covering the upper and lower ends of the body to form a closed space;

A cooling water pipe extending in a flow path of the body and connected to a circulation cooling pipe of the water cooling device, and flowing coolant therein; And

It is filled in the inner space of the flow path and the upper and lower cover of the body to provide a cooler for a water-cooled electronic device cooling device using a PCM comprising a; refrigerant for cooling the cooling water in the cooling water pipe using the latent heat of phase change. .

And the present invention is preferably the body partitions the inner space having a plurality of side-by-side flow path, the upper and lower cover has a plurality of partitions therein to form one long passage extending up and down It provides a cooler for water-cooled electronic device cooling apparatus using a PCM, characterized in that configured.

In another aspect, the present invention preferably provides a cooler for a water-cooled electronic device cooling apparatus using a PCM, characterized in that the plurality of cooling fins are formed to protrude from the body along the inner flow path of the body.

And the present invention preferably provides a cooler for a water-cooled electronic device cooling apparatus using a PCM, characterized in that the upper and lower cover is formed on the outer surface of the cooling fins of the same type as the cooling fins of the body.

In another aspect, the present invention preferably provides a cooler for a water-cooled electronic device cooling device using a PCM, characterized in that the cooling fin is roughened surface is formed to have a wide surface area.

And the present invention preferably is characterized in that the lower cover is configured to smoothly cool the air of natural convection by forming a certain height with the ground is equipped with a plurality of pedestals of upper and lower light (上 狹 下 廣) on the lower surface It provides a cooler for a water-cooled electronic device cooling device using a PCM.

In another aspect, the present invention preferably provides a cooler for a water-cooled electronic device cooling apparatus using a PCM, characterized in that the refrigerant is a phase change material (PCM).

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

1 shows a water-cooled electronic device cooling apparatus 100 equipped with a cooler 1 according to the present invention. The water-cooled electronic device cooling apparatus 100 as described above is connected to the cooler 1 of the present invention, the circulating cooling pipe 110 connected to the cooler 1, and the circulating cooling pipe 110 and the CPI. And a plurality of cooling blocks 130 for absorbing and cooling heat from a heat generating electronic device 120 such as a V-A card (VGA) or a hard disk driver (HDD).

The circulation cooling pipe 110 flows cooling water therein, and connects the cooler 1 and the cooling block 130 of the present invention. In addition, the circulation cooling pipe 110 is provided with a pump (k) forcibly circulating the cooling water flowing therein so as to flow between the cooler 1 and the cooling block 130 of the present invention.

2 is a schematic diagram of a water-cooled electronic device cooling apparatus 100 equipped with a cooler 1 according to the present invention. As can be seen in such a system diagram, the cooler 1 according to the present invention is disposed separately outside the computer 105, and the circulation cooling pipe 110 discharged through the cooling blocks 130 in the computer 105. The high temperature coolant inside is radiated and regenerated with low temperature coolant.

In this process, the pump k circulates the cooling water and moves the heat absorbed from the cooling block 130 to the cooler 1 side according to the present invention.

In the above, the pump k is shown as an external type in the drawings, but the present invention is not limited thereto. That is, the pump k may be configured to operate in the interior of the computer 105, and the present invention is applicable to such a structure.

Cooler 1 according to an embodiment of the present invention has a structure as shown in FIG. The cooler 1 of the present invention has a body 10 having a plurality of cooling fins 5 formed on an outer surface thereof, and has a structure in which a flow passage 12 is formed in the body 10.

The plurality of cooling fins 5 are formed so as to protrude from the body 10, the cooling fins 5 can be maintained at the same temperature because the plurality of cooling fins 5 are in contact with the surface of the flow path 12 through which the coolant flows. Therefore, the heat dissipation performance is excellent.

And the structure of such a body 10 can be conveniently manufactured by extrusion, the production cost can be cheap.

In addition, the cooling fins 5 are formed on the outer surface of the body 10, respectively, and have a structure formed while forming a pointed end surface 5a. Thus, the pointed end surface 5a structure enables the weight reduction of the body 10 and prevents excessive design, thereby obtaining a lighter and cheaper cooler 1 structure.

In addition, the surface of the cooling fin 5 is roughened to have a wide surface area. That is, the cooling fins 5 may be formed on the surface of the grooves such as dimples (dimples) or may be roughened, such as scratch (scratch). Such rough surface can make the heat dissipation surface area relatively larger than the smooth surface, and can further improve the heat dissipation effect obtained from the large surface area.

In addition, the upper and lower portions of the body 10, the cover (20a, 20b) is mounted, respectively, the cover (20a, 20b) has a structure of the X-shaped cross section, respectively. These covers 20a and 20b are connected to the body 10 to block the flow path 12 of the body 10 from the outside thereof. In addition, a plurality of cooling fins 5 may be formed in the cover 20a and 20b in the same shape as the body 10.

The upper and lower lids 20a and 20b may be integrally connected to the upper and lower edges of the body 10 by screwing to which a welding or sealing seal is applied, and the covers 20a and 20b are illustrated in FIG. 2. As described above, each has an inlet port 28 through which the coolant flows into the cooler 1, and an outlet port 30 through which the coolant flows out of the cooler 1.

These inlets 28 and outlets 30 may be mounted on any one of the upper and lower lids 20a and 20b, respectively, through which cooling water may be introduced or discharged.

In FIG. 3, the inlet port 28 is formed on the lower cover 20b side, and the outlet port 30 is formed on the upper cover 20a side, but the present invention is not limited thereto. An inlet 28 is formed at the side of the 20a, the outlet 30 may be formed at the lower cover 20b side, respectively formed on one side of the body 10 instead of the upper and lower cover 20a, 20b It may be a structure.

In the cooler 1 according to the present invention, the coolant pipe 17 passes through the internal flow path 12 of the body 10 in the form of a double pipe, and a coolant P is provided outside the coolant pipe 17. The method is filled in the body 10. That is, the cooling water pipe 17 passes through the flow path 12 in the body 10 of the cooler 1, and the coolant P is filled in the flow path 12.

In such a structure, the cooling water pipes 17 respectively pass through the inlets 28 and the outlets 30 of the upper and lower lids 20a and 20b, and are respectively connected to the circulation cooling pipe 110 to circulate the cooling water.

In addition, the coolant P filled in the body 10 of the cooler 1 has lids 20a and 20b mounted on upper and lower sides of the body 10, and a coolant pipe 17 is connected thereto. The refrigerant is filled in the interior of the body 10 through the charging port (19).

The refrigerant P used in the above is a phase change material (PCM, hereinafter referred to as PCM for convenience), wherein the PCM is a solid to liquid at a predetermined temperature, for example, a temperature range of 30 to 70 ° C. Or vice versa.

Such PCM is a material capable of absorbing heat during melting, and examples thereof include organic or inorganic latent heat storage materials such as paraffin and inorganic hydrates.

Therefore, such a PCM exists in the interior of the body 10 in a solid state, and when high temperature coolant flows in through the cooling water pipe 17, the PCM phase-changes into a liquid state.

On the other hand, the PCM needs to be sealed (or sealed) in order to absorb heat from the cooling water flowing in the cooling water pipe 17 while the phase transitions from, for example, a solid to a liquid. This is to prevent the loss due to leakage to the outside that occurs in the process of the PCM is transferred to the liquid.

Therefore, the body 10 filled with the PCM and the inner spaces 24a and 24b of the upper and lower lids 20a and 20b are sealed to maintain a completely sealed state with the outside.

In addition, the PCM may cause a volume change while acting as a heat absorbing and releasing action, and the body 10 and the upper and lower lids 20a and 20b have sufficient rigidity to sufficiently withstand the volume change.

According to the present invention having such a structure, when the high temperature cooling water absorbing heat of the electronic device through the cooling block 130 flows into the cooling water pipe 17 through the cooling circulation system, the cooling unit 130 of the cooler 1 body 10 The PCM filled in the flow passage 12 is cooled while being liquefied from a solid state to a liquid state. The endothermic action of the PCM is performed in the process of liquefying the PCM. The endothermic action of the PCM is performed until the phase is changed from solid to liquid.

In this process, since the PCM uses the latent heat of phase change from solid to liquid, the cooler 1 of the present invention has excellent cooling performance.

At the same time, the cooler 1 of the present invention has a plurality of cooling fins 5 formed on the outer surface of the body 10 to radiate heat, thereby dissipating heat to the outside.

Through this process, the PCM in the body 10 effectively absorbs heat from the cooling water of the cooling water pipe 17, and in this process, the latent heat of PCM is used, and consequently the cooling water in the cooling water pipe 17 Is cooled at a faster rate, and can cool the cooling water to a lower temperature over a longer period of time.

As such, when the coolant temperature in the coolant pipe 17 is lowered, it is supplied by the pump K to the cooling block 130 and consequently circulated through the cooling block 130 to effectively remove electronic devices in the computer 105. Cool down quickly.

Such a structure is due to the effective cooling action using the latent heat of phase change of the PCM, thereby making the size of the cooler 1 of the present invention simpler. Since PCM uses phase change materials, the cooling capacity per unit size is increased, and thus a greater cooling effect can be obtained.

On the other hand, the lower cover 20b is equipped with a plurality of pedestals 35 for maintaining a state in which the cooler 1 of the present invention is upright. The pedestal 35 has a cross-sectional structure of upper and lower beams and can be fixed to the lower cover 20b by welding or the like.

Since the pedestal 35 has the body 10 positioned at a predetermined height from the ground, the air can be smoothly flowed to the lower side of the body 10, and accordingly, the lower portion of the pedestal 35 is located along the cooling fins 5. By smoothly moving the air to the upper side, the air cooling of the cooling fins 5 can be made more effectively.

In addition, the plurality of cooling blocks 130 may be mounted in a heat generating electronic device 120 such as a CPU, a VGA, a hard disk driver, or the like, inside the computer 105. Heat is absorbed and cooled from these.

Such cooling blocks 130 are shown in detail in FIG. 4.

Such cooling blocks 130 have a hollow casing 140 having a space in which cooling water flows, and the inlet 142 and the outlet 144 to which the circulation cooling pipe 110 is connected. Has The casing 140 is made of a material such as copper (Cu) or aluminum (Al) having excellent heat transfer rate, and one side thereof is CPI, V-A card (VGA), or a hard disk driver (HDD). Surface contact with the heating electronic device 120, and the like. By contacting the surface in this way it receives heat directly from the heat generating electronic device 120 as described above to cool it efficiently.

The cooling block 130 is fixed to the frame 150 in the computer 105 through a screw 148 or the like.

The cooler 1 of the present invention having the structure as described above is circulated by the pump K in the state where the cooling water is filled with the circulation cooling pipe 110 and the plurality of cooling blocks 130 therein. The phase change latent heat of the PCM is used to remove heat from heat generating electronics 120 such as CPU, V-A card (VGA), hard disk driver (HDD), etc. of the computer 105.

Once the computer 105 is operated, the temperature of the cooling water contained in the cooling block 130 is raised, and at the same time, the pump K is also operated to circulate the cooling water in the circulation cooling pipe 110. In this process, heat generated from the heat generating electronic device 120 of the computer 105 is transferred to the coolant, and the high temperature coolant flows into the cooler 1 through the cooling circulation pipe 110 and the cooling water pipe ( It is radiated and cooled while passing through 17).

According to the present invention having such a structure, when the high temperature cooling water absorbing heat of the electronic device through the cooling block 130 flows into the cooling water pipe 17 through the cooling circulation system, the cooling unit 130 of the cooler 1 body 10 The PCM filled in the flow passage 12 is cooled while being liquefied from a solid state to a liquid state. The endothermic action of the PCM is performed in the process of liquefying the PCM. The endothermic action of the PCM is performed until the phase is changed from solid to liquid.

In this process, since the PCM uses the latent heat of phase change from solid to liquid, the cooler 1 of the present invention has excellent cooling performance.

At the same time, the cooler 1 of the present invention has a plurality of cooling fins 5 formed on the outer surface of the body 10 to radiate heat, thereby dissipating heat to the outside.

Through this process, the PCM in the body 10 effectively absorbs heat from the cooling water of the cooling water pipe 17, and in this process, the latent heat of PCM is used, and consequently the cooling water in the cooling water pipe 17 Is cooled at a faster rate, and can cool the cooling water to a lower temperature over a longer period of time.

As such, when the coolant temperature in the coolant pipe 17 is lowered, it is supplied by the pump K to the cooling block 130. As a result, the electronic devices in the computer 105 are rapidly and efficiently cooled through the cooling block 130. You can.

Such a structure is due to the effective cooling action using the latent heat of phase change of the PCM, thereby making the structure of the cooler 1 of the present invention simpler. In addition, since the latent heat of PCM is used, the cooling capacity per unit size is increased, and thus a large cooling effect can be obtained more efficiently.

5 and 6 show another structure of the present invention.

Since the modified structure of the present invention is substantially similar to the structure shown in FIG. 3, the same structure and parts are given the same numbers, and only the subscripts (') will be indicated on the drawings.

In the cooler 1 ′ according to a modified embodiment of the present invention, the coolant pipe 17 ′ passes through the internal flow passage 12 ′ of the body 10 ′ in the form of a double pipe, but the body 10 ′ is The inner space is divided to include a plurality of side-by-side flow passages 12 ', and the upper and lower lids 20a' and 20b 'have a plurality of partitions 22a' and 22b 'therein to provide the flow passages 12'. ') Are configured to form one long passage extending up and down.

In this structure, the cooling water pipe 17 'passes through the inlet 28' and the outlet 30 'of the upper and lower cover 20a' and 20b ', respectively, and is connected to the circulation cooling pipe 110, respectively. Cooling water is circulated.

In addition, such a deformed structure is such that the inner spaces 24a 'and 24b' of the flow path 12 'and the upper and lower lids 20a' and 20b 'in the body 10' filled with the PCM are completely isolated from the outside. Sealed to maintain the sealed state.

Each of the cooling fins 5 'formed on the outer surface of the body 10' has a structure formed by forming a pointed end surface 5a. Thus, the pointed end surface 5a structure enables the weight reduction of the body 10 'and prevents excessive design, thereby obtaining a lighter and cheaper cooler 1' structure.

Since the cooler 1 ′ according to the modified embodiment of the present invention configured as described above is formed to be elongated by repeatedly extending up and down the flow passage 12 ′ in the body 10 ′, the structure shown in FIGS. While the coolant stays in the body 10 'for a long time, the latent heat of phase change of the PCM can be utilized for a longer time, and as a result, an effective cooling action can be achieved. Therefore, the cooling effect of the low temperature can be supplied to the cooling block 130 by further increasing the heat dissipation effect. Therefore, more effective large heat dissipation effect can be obtained.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited to such a specific structure. Those skilled in the art may variously modify or change the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. For example, it is natural that the number of passages formed in the body and the number of partitions formed on the upper and lower lids may be variously changed according to the difference in cooling capacity. In addition, modification of the above-mentioned materials with high heat transfer efficiency is naturally possible. Nevertheless, it will be apparent that all such modifications or variations will fall within the scope of the present invention.

As described above, according to the present invention, since the cooling water can be cooled by using natural convection and latent heat of PCM without using a separate power source, it has a simple structure and has excellent heat dissipation performance to effectively cool electronic devices. Can be.

In addition, it is possible to reduce the configuration of the parts of the water-cooled electronics cooling device through the application of a compact structure and a simple structure, and thus it is possible to make a cheaper device configuration, and to obtain an excellent effect improved for practical use. have.

Claims (6)

In the cooler for water-cooled chillers for cooling electronic devices that generate heat, such as computers, A body having a flow path formed therein; A plurality of cooling fins formed on an outer surface of the body and formed with a pointed end surface; Upper and lower lids each having a space communicating with an internal flow path of the body and covering the upper and lower ends of the body to form a closed space; A cooling water pipe which is drawn out through the flow path of the body and connected to the circulation cooling pipe of the water-cooled cooling device, and has cooling water flowing in one direction; And Water-cooled electronics cooling using a PCM comprising a; refrigerant is filled in the inner sealed space between the body and the upper and lower lids to cool the cooling water flowing inside the cooling water pipe extending into the body using the latent heat of phase change. Chiller for the device. The cooler of claim 1, wherein the plurality of cooling fins are formed to protrude from the body along an inner flow path of the body. The cooler of claim 1, wherein the upper and lower covers have cooling fins having the same shape as the cooling fins of the body on the outer surface thereof. The cooler of claim 1 or 2, wherein the cooling fin has a roughened surface and a wide surface area. The PCM according to claim 1, wherein the lower cover is configured to smoothly cool air by natural convection by mounting a pedestal of upper and lower beams on the lower surface thereof to form a predetermined height with the ground. Chiller for water-cooled electronics chiller using delete

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