KR20080078165A - 레이저 리페어 시스템 - Google Patents
레이저 리페어 시스템 Download PDFInfo
- Publication number
- KR20080078165A KR20080078165A KR1020070017861A KR20070017861A KR20080078165A KR 20080078165 A KR20080078165 A KR 20080078165A KR 1020070017861 A KR1020070017861 A KR 1020070017861A KR 20070017861 A KR20070017861 A KR 20070017861A KR 20080078165 A KR20080078165 A KR 20080078165A
- Authority
- KR
- South Korea
- Prior art keywords
- laser light
- slit
- light blocking
- unit
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Nonlinear Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070017861A KR20080078165A (ko) | 2007-02-22 | 2007-02-22 | 레이저 리페어 시스템 |
| JP2007165779A JP2008200749A (ja) | 2007-02-22 | 2007-06-25 | レーザーリペアシステム |
| TW097106077A TW200844620A (en) | 2007-02-22 | 2008-02-21 | Laser repair system |
| US12/072,091 US20080218833A1 (en) | 2007-02-22 | 2008-02-22 | Laser repair system |
| CNA2008100951425A CN101265022A (zh) | 2007-02-22 | 2008-02-22 | 激光修复系统 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070017861A KR20080078165A (ko) | 2007-02-22 | 2007-02-22 | 레이저 리페어 시스템 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080078165A true KR20080078165A (ko) | 2008-08-27 |
Family
ID=39741340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070017861A Withdrawn KR20080078165A (ko) | 2007-02-22 | 2007-02-22 | 레이저 리페어 시스템 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080218833A1 (enExample) |
| JP (1) | JP2008200749A (enExample) |
| KR (1) | KR20080078165A (enExample) |
| CN (1) | CN101265022A (enExample) |
| TW (1) | TW200844620A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5853331B2 (ja) * | 2011-03-11 | 2016-02-09 | 株式会社ブイ・テクノロジー | レーザ照射装置及びそれを使用した液晶表示パネルの輝点修正方法 |
| CN104493366A (zh) * | 2014-12-16 | 2015-04-08 | 昆山国显光电有限公司 | 激光修复系统 |
| KR101999397B1 (ko) * | 2018-12-26 | 2019-09-27 | 주식회사 에이치비테크놀러지 | 파장 분기를 위한 개폐형 미러를 포함하는 레이저 리페어 장치 |
| CN111922515A (zh) * | 2020-09-01 | 2020-11-13 | 苏州科韵激光科技有限公司 | 一种激光修复装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6090528A (en) * | 1999-10-27 | 2000-07-18 | Gordon; Michael S. | Spot-to-spot stitching in electron beam lithography utilizing square aperture with serrated edge |
| DE10244850A1 (de) * | 2002-09-24 | 2004-04-01 | Carl Zeiss Jena Gmbh | Einstellbares Pinhole |
-
2007
- 2007-02-22 KR KR1020070017861A patent/KR20080078165A/ko not_active Withdrawn
- 2007-06-25 JP JP2007165779A patent/JP2008200749A/ja not_active Withdrawn
-
2008
- 2008-02-21 TW TW097106077A patent/TW200844620A/zh unknown
- 2008-02-22 US US12/072,091 patent/US20080218833A1/en not_active Abandoned
- 2008-02-22 CN CNA2008100951425A patent/CN101265022A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008200749A (ja) | 2008-09-04 |
| CN101265022A (zh) | 2008-09-17 |
| TW200844620A (en) | 2008-11-16 |
| US20080218833A1 (en) | 2008-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102380747B1 (ko) | 레이저 가공 장치 및 레이저 가공 방법 | |
| TWI647043B (zh) | Laser processing device and laser processing method | |
| EP0656241B1 (en) | Apparatus and method for laser machining | |
| TWI659793B (zh) | 用於使用可調整雷射束焦線來處理透明材料的系統及方法 | |
| JP6039217B2 (ja) | レーザ加工方法 | |
| KR101757937B1 (ko) | 가공대상물 절단방법 | |
| JP6272302B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
| JP5905274B2 (ja) | 半導体デバイスの製造方法 | |
| JP6272300B2 (ja) | レーザ加工装置及びレーザ加工方法 | |
| TW202600274A (zh) | 雷射加工設備、其操作方法以及使用該雷射加工設備加工工件的方法 | |
| US20120234808A1 (en) | Laser processing method | |
| TW201607660A (zh) | 雷射加工裝置及雷射加工方法 | |
| JP7700265B2 (ja) | レーザービームの線状焦点を用いて基板内に導入されるエネルギー分布を制御するための方法および基板 | |
| JP3371304B2 (ja) | レーザ加工装置及びレーザ加工方法並びに液晶パネル | |
| TWI910325B (zh) | 雷射加工方法及雷射加工裝置 | |
| KR100778316B1 (ko) | 레이저를 이용한 액정패널의 흑화장치 및 방법 | |
| WO2016204019A1 (ja) | 成膜マスク及び成膜マスクの製造方法 | |
| JP2008200749A (ja) | レーザーリペアシステム | |
| TWI425283B (zh) | 用於修復顯示裝置之亮點故障的設備 | |
| CN106990615B (zh) | 形成液晶显示装置的配向层的方法及显示装置 | |
| KR100789277B1 (ko) | 투명도전막 식각방법 | |
| KR20080022415A (ko) | 액정 표시 장치용 리페어 장치 및 방법 | |
| JP2003154478A (ja) | レーザ加工装置及びレーザ加工方法並びに液晶パネル | |
| CN119535824A (zh) | 一种显示面板维修方法 | |
| JP4923787B2 (ja) | レーザ光による欠陥修正方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| R18 | Changes to party contact information recorded |
Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |