KR20080075078A - 마이크로 열 교환기 및 상기 마이크로 열 교환기의전자부품을 위한 유체 냉각제로서의 용도 - Google Patents

마이크로 열 교환기 및 상기 마이크로 열 교환기의전자부품을 위한 유체 냉각제로서의 용도 Download PDF

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Publication number
KR20080075078A
KR20080075078A KR1020087002055A KR20087002055A KR20080075078A KR 20080075078 A KR20080075078 A KR 20080075078A KR 1020087002055 A KR1020087002055 A KR 1020087002055A KR 20087002055 A KR20087002055 A KR 20087002055A KR 20080075078 A KR20080075078 A KR 20080075078A
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KR
South Korea
Prior art keywords
heat transfer
inlet
heat exchanger
micro
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087002055A
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English (en)
Korean (ko)
Inventor
클라우스 슈베르트
쥐르겐 브랜드너
율리히 쉬굴라
유진 아누쥬
에드가 한스요스텐
Original Assignee
포르슝스첸트룸 칼스루에 게엠베하
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Application filed by 포르슝스첸트룸 칼스루에 게엠베하 filed Critical 포르슝스첸트룸 칼스루에 게엠베하
Publication of KR20080075078A publication Critical patent/KR20080075078A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020087002055A 2005-12-09 2006-12-08 마이크로 열 교환기 및 상기 마이크로 열 교환기의전자부품을 위한 유체 냉각제로서의 용도 Withdrawn KR20080075078A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005058780.1 2005-12-09
DE102005058780A DE102005058780A1 (de) 2005-12-09 2005-12-09 Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile

Publications (1)

Publication Number Publication Date
KR20080075078A true KR20080075078A (ko) 2008-08-14

Family

ID=37864534

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087002055A Withdrawn KR20080075078A (ko) 2005-12-09 2006-12-08 마이크로 열 교환기 및 상기 마이크로 열 교환기의전자부품을 위한 유체 냉각제로서의 용도

Country Status (6)

Country Link
US (1) US8047273B2 (enExample)
EP (1) EP1958254B1 (enExample)
JP (1) JP5135225B2 (enExample)
KR (1) KR20080075078A (enExample)
DE (1) DE102005058780A1 (enExample)
WO (1) WO2007065705A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
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US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US8788848B2 (en) * 2007-03-22 2014-07-22 Microsoft Corporation Optical DNA
US20140060789A1 (en) * 2008-10-03 2014-03-06 Modine Manufacturing Company Heat exchanger and method of operating the same
JP5178872B2 (ja) * 2011-04-01 2013-04-10 三菱電機株式会社 冷却器
US9398721B2 (en) * 2013-07-25 2016-07-19 Hamilton Sundstrand Corporation Cooling fluid flow passage matrix for electronics cooling
JP5913245B2 (ja) * 2013-09-24 2016-04-27 株式会社フィルテック 張り合わせ流体熱交換装置
JP5932757B2 (ja) * 2013-11-15 2016-06-08 株式会社フィルテック 流体熱交換装置
JP6115959B2 (ja) * 2013-12-11 2017-04-19 株式会社フィルテック 流体熱交換装置
JP6075299B2 (ja) * 2014-01-14 2017-02-08 トヨタ自動車株式会社 冷却器とその製造方法
JP6477276B2 (ja) * 2015-06-12 2019-03-06 富士通株式会社 クーリングプレート及びクーリングプレートを備える情報処理装置
EP3655718A4 (en) 2017-07-17 2021-03-17 Alexander Poltorak MULTIFRACTAL HEAT SINK SYSTEM AND PROCESS
WO2019043801A1 (ja) 2017-08-29 2019-03-07 株式会社Ｗｅｌｃｏｎ ヒートシンク
JP7002384B2 (ja) * 2018-03-22 2022-01-20 三菱重工業株式会社 冷却装置及びそれを備える電気機器
JP2020150170A (ja) * 2019-03-14 2020-09-17 富士通株式会社 冷却プレート、冷却装置及び電子機器
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
DE102021119213B4 (de) 2021-07-25 2023-02-09 Fachhochschule Kiel, Körperschaft des öffentlichen Rechts Helix-Kanal-Kühler-Einheit
DE202021103958U1 (de) 2021-07-25 2021-08-03 Fachhochschule Kiel Helix-Kanal-Kühler-Einheit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
DE19536115C2 (de) 1995-09-28 2001-03-08 Behr Gmbh & Co Mehrfluid-Wärmeübertrager mit Plattenstapelaufbau
US6052284A (en) * 1996-08-06 2000-04-18 Advantest Corporation Printed circuit board with electronic devices mounted thereon
EP1767886B1 (en) * 1999-03-27 2016-04-13 CHART HEAT EXCHANGERS Limited Partnership Fluid mixing means
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
DE10324190B4 (de) * 2003-05-28 2009-07-23 M.Pore Gmbh Wärmetauscher
JP2005166752A (ja) * 2003-11-28 2005-06-23 Ngk Spark Plug Co Ltd 半導体部品の冷却装置及び冷却装置付き半導体部品
US7201217B2 (en) * 2005-05-24 2007-04-10 Raytheon Company Cold plate assembly

Also Published As

Publication number Publication date
JP5135225B2 (ja) 2013-02-06
US8047273B2 (en) 2011-11-01
EP1958254B1 (de) 2019-05-15
WO2007065705A1 (de) 2007-06-14
JP2009518615A (ja) 2009-05-07
US20080173435A1 (en) 2008-07-24
EP1958254A1 (de) 2008-08-20
DE102005058780A1 (de) 2007-06-14

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Date Code Title Description
PA0105 International application

Patent event date: 20080125

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid