JP5135225B2 - マイクロ熱伝達器ならびに電子素子のための流体冷却器として用いるマイクロ熱伝達器の使用 - Google Patents

マイクロ熱伝達器ならびに電子素子のための流体冷却器として用いるマイクロ熱伝達器の使用 Download PDF

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Publication number
JP5135225B2
JP5135225B2 JP2008543742A JP2008543742A JP5135225B2 JP 5135225 B2 JP5135225 B2 JP 5135225B2 JP 2008543742 A JP2008543742 A JP 2008543742A JP 2008543742 A JP2008543742 A JP 2008543742A JP 5135225 B2 JP5135225 B2 JP 5135225B2
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Japan
Prior art keywords
heat transfer
passage structure
passage
micro heat
micro
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JP2008543742A
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English (en)
Japanese (ja)
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JP2009518615A (ja
JP2009518615A5 (enExample
Inventor
シューベルト クラウス
ブラントナー ユルゲン
シィグラ ウルリヒ
アヌルエフ オイゲン
ハンスヨステン エドガー
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Karlsruher Institut fuer Technologie KIT
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Forschungszentrum Karlsruhe GmbH
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Publication of JP2009518615A5 publication Critical patent/JP2009518615A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2008543742A 2005-12-09 2006-12-08 マイクロ熱伝達器ならびに電子素子のための流体冷却器として用いるマイクロ熱伝達器の使用 Expired - Fee Related JP5135225B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005058780A DE102005058780A1 (de) 2005-12-09 2005-12-09 Mikrowärmeübertrager sowie die Verwendung desselben als Fluidkühler für elektronische Bauteile
DE102005058780.1 2005-12-09
PCT/EP2006/011849 WO2007065705A1 (de) 2005-12-09 2006-12-08 Mikrowärmeüberträger sowie die verwendung desselben als fluidkühler für elektronische bauteile

Publications (3)

Publication Number Publication Date
JP2009518615A JP2009518615A (ja) 2009-05-07
JP2009518615A5 JP2009518615A5 (enExample) 2012-09-06
JP5135225B2 true JP5135225B2 (ja) 2013-02-06

Family

ID=37864534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008543742A Expired - Fee Related JP5135225B2 (ja) 2005-12-09 2006-12-08 マイクロ熱伝達器ならびに電子素子のための流体冷却器として用いるマイクロ熱伝達器の使用

Country Status (6)

Country Link
US (1) US8047273B2 (enExample)
EP (1) EP1958254B1 (enExample)
JP (1) JP5135225B2 (enExample)
KR (1) KR20080075078A (enExample)
DE (1) DE102005058780A1 (enExample)
WO (1) WO2007065705A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7331378B2 (en) * 2006-01-17 2008-02-19 Delphi Technologies, Inc. Microchannel heat sink
US8788848B2 (en) * 2007-03-22 2014-07-22 Microsoft Corporation Optical DNA
US20140060789A1 (en) * 2008-10-03 2014-03-06 Modine Manufacturing Company Heat exchanger and method of operating the same
JP5178872B2 (ja) * 2011-04-01 2013-04-10 三菱電機株式会社 冷却器
US9398721B2 (en) * 2013-07-25 2016-07-19 Hamilton Sundstrand Corporation Cooling fluid flow passage matrix for electronics cooling
JP5913245B2 (ja) * 2013-09-24 2016-04-27 株式会社フィルテック 張り合わせ流体熱交換装置
JP5932757B2 (ja) * 2013-11-15 2016-06-08 株式会社フィルテック 流体熱交換装置
JP6115959B2 (ja) * 2013-12-11 2017-04-19 株式会社フィルテック 流体熱交換装置
JP6075299B2 (ja) * 2014-01-14 2017-02-08 トヨタ自動車株式会社 冷却器とその製造方法
JP6477276B2 (ja) * 2015-06-12 2019-03-06 富士通株式会社 クーリングプレート及びクーリングプレートを備える情報処理装置
WO2019018446A1 (en) 2017-07-17 2019-01-24 Fractal Heatsink Technologies, LLC SYSTEM AND METHOD FOR MULTI-FRACTAL THERMAL DISSIPATOR
US11948860B2 (en) * 2017-08-29 2024-04-02 Welcon Inc. Heat sink
JP7002384B2 (ja) * 2018-03-22 2022-01-20 三菱重工業株式会社 冷却装置及びそれを備える電気機器
JP2020150170A (ja) * 2019-03-14 2020-09-17 富士通株式会社 冷却プレート、冷却装置及び電子機器
CN113437031B (zh) * 2021-06-17 2024-06-07 西北工业大学 一种基于液态金属的嵌入式微通道散热装置
DE102021119213B4 (de) 2021-07-25 2023-02-09 Fachhochschule Kiel, Körperschaft des öffentlichen Rechts Helix-Kanal-Kühler-Einheit
DE202021103958U1 (de) 2021-07-25 2021-08-03 Fachhochschule Kiel Helix-Kanal-Kühler-Einheit

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07114250B2 (ja) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション 熱伝達システム
DE19536115C2 (de) 1995-09-28 2001-03-08 Behr Gmbh & Co Mehrfluid-Wärmeübertrager mit Plattenstapelaufbau
MY115676A (en) * 1996-08-06 2003-08-30 Advantest Corp Printed circuit board with electronic devices mounted thereon
AU2681600A (en) * 1999-03-27 2000-10-16 Chart Heat Exchangers Limited Heat exchanger
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6301109B1 (en) * 2000-02-11 2001-10-09 International Business Machines Corporation Isothermal heat sink with cross-flow openings between channels
US6459581B1 (en) * 2000-12-19 2002-10-01 Harris Corporation Electronic device using evaporative micro-cooling and associated methods
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
US6986382B2 (en) * 2002-11-01 2006-01-17 Cooligy Inc. Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
US7017654B2 (en) 2003-03-17 2006-03-28 Cooligy, Inc. Apparatus and method of forming channels in a heat-exchanging device
DE10324190B4 (de) * 2003-05-28 2009-07-23 M.Pore Gmbh Wärmetauscher
JP2005166752A (ja) * 2003-11-28 2005-06-23 Ngk Spark Plug Co Ltd 半導体部品の冷却装置及び冷却装置付き半導体部品
US7201217B2 (en) * 2005-05-24 2007-04-10 Raytheon Company Cold plate assembly

Also Published As

Publication number Publication date
JP2009518615A (ja) 2009-05-07
DE102005058780A1 (de) 2007-06-14
KR20080075078A (ko) 2008-08-14
US20080173435A1 (en) 2008-07-24
US8047273B2 (en) 2011-11-01
EP1958254A1 (de) 2008-08-20
WO2007065705A1 (de) 2007-06-14
EP1958254B1 (de) 2019-05-15

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