KR20080074140A - 구조화된 열전달 용품 - Google Patents

구조화된 열전달 용품 Download PDF

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Publication number
KR20080074140A
KR20080074140A KR1020087012617A KR20087012617A KR20080074140A KR 20080074140 A KR20080074140 A KR 20080074140A KR 1020087012617 A KR1020087012617 A KR 1020087012617A KR 20087012617 A KR20087012617 A KR 20087012617A KR 20080074140 A KR20080074140 A KR 20080074140A
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KR
South Korea
Prior art keywords
metal
heat transfer
transfer article
structured heat
structured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020087012617A
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English (en)
Korean (ko)
Inventor
필립 이. 투마
게리 엠. 팜그렌
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20080074140A publication Critical patent/KR20080074140A/ko
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
KR1020087012617A 2005-11-07 2006-10-23 구조화된 열전달 용품 Withdrawn KR20080074140A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/268,139 US7360581B2 (en) 2005-11-07 2005-11-07 Structured thermal transfer article
US11/268,139 2005-11-07

Publications (1)

Publication Number Publication Date
KR20080074140A true KR20080074140A (ko) 2008-08-12

Family

ID=38002567

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087012617A Withdrawn KR20080074140A (ko) 2005-11-07 2006-10-23 구조화된 열전달 용품

Country Status (7)

Country Link
US (2) US7360581B2 (https=)
EP (1) EP1946032A4 (https=)
JP (1) JP2009515362A (https=)
KR (1) KR20080074140A (https=)
CN (1) CN101305256B (https=)
TW (1) TW200732167A (https=)
WO (1) WO2007055895A1 (https=)

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CN112625657B (zh) * 2019-09-24 2022-01-14 华为技术有限公司 导热体、导热材料和半导体器件的封装结构
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Also Published As

Publication number Publication date
JP2009515362A (ja) 2009-04-09
US20070102140A1 (en) 2007-05-10
EP1946032A4 (en) 2010-10-06
EP1946032A1 (en) 2008-07-23
US7360581B2 (en) 2008-04-22
WO2007055895A1 (en) 2007-05-18
US20080148570A1 (en) 2008-06-26
CN101305256A (zh) 2008-11-12
CN101305256B (zh) 2010-10-06
TW200732167A (en) 2007-09-01

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20080527

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid