JP2009515362A - 構造化熱伝達物品 - Google Patents

構造化熱伝達物品 Download PDF

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Publication number
JP2009515362A
JP2009515362A JP2008540037A JP2008540037A JP2009515362A JP 2009515362 A JP2009515362 A JP 2009515362A JP 2008540037 A JP2008540037 A JP 2008540037A JP 2008540037 A JP2008540037 A JP 2008540037A JP 2009515362 A JP2009515362 A JP 2009515362A
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JP
Japan
Prior art keywords
metal
heat transfer
transfer article
structured heat
structured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008540037A
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English (en)
Japanese (ja)
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JP2009515362A5 (https=
Inventor
イー． トゥマ，フィリップ
エム． パルムグレン，ゲイリー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009515362A publication Critical patent/JP2009515362A/ja
Publication of JP2009515362A5 publication Critical patent/JP2009515362A5/ja
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
JP2008540037A 2005-11-07 2006-10-23 構造化熱伝達物品 Withdrawn JP2009515362A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/268,139 US7360581B2 (en) 2005-11-07 2005-11-07 Structured thermal transfer article
PCT/US2006/041322 WO2007055895A1 (en) 2005-11-07 2006-10-23 Structured thermal transfer article

Publications (2)

Publication Number Publication Date
JP2009515362A true JP2009515362A (ja) 2009-04-09
JP2009515362A5 JP2009515362A5 (https=) 2009-12-10

Family

ID=38002567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008540037A Withdrawn JP2009515362A (ja) 2005-11-07 2006-10-23 構造化熱伝達物品

Country Status (7)

Country Link
US (2) US7360581B2 (https=)
EP (1) EP1946032A4 (https=)
JP (1) JP2009515362A (https=)
KR (1) KR20080074140A (https=)
CN (1) CN101305256B (https=)
TW (1) TW200732167A (https=)
WO (1) WO2007055895A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8160252B2 (en) 2006-02-27 2012-04-17 Samsung Electronics Co., Ltd Method and system for protecting broadcast service/content in a mobile broadcast system, and method for generating short term key message therefor
JP2012249308A (ja) * 2006-02-27 2012-12-13 Samsung Electronics Co Ltd 携帯放送システムにおける放送サービス／コンテンツ保護方法及びシステム、並びに、このための短期キーメッセージの生成方法
US9385253B2 (en) 2012-10-04 2016-07-05 Shin-Etsu Chemical Co., Ltd. Method of manufacturing solar cell module
US9520522B2 (en) 2012-10-04 2016-12-13 Shin-Etsu Chemical Co., Ltd. Method of manufacturing solar cell module
JP2022549311A (ja) * 2019-09-24 2022-11-24 華為技術有限公司 熱伝導体、熱伝導性材料、及び半導体デバイスのパッケージ構造

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US7695808B2 (en) * 2005-11-07 2010-04-13 3M Innovative Properties Company Thermal transfer coating
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US8356658B2 (en) * 2006-07-27 2013-01-22 General Electric Company Heat transfer enhancing system and method for fabricating heat transfer device
US7694719B2 (en) * 2007-01-04 2010-04-13 International Business Machines Corporation Patterned metal thermal interface
WO2008131105A1 (en) * 2007-04-17 2008-10-30 University Of Virginia Patent Foundation Heat-managing composite structures
US7907410B2 (en) * 2007-11-08 2011-03-15 International Business Machines Corporation Universal patterned metal thermal interface
US20090176148A1 (en) * 2008-01-04 2009-07-09 3M Innovative Properties Company Thermal management of electrochemical cells
US20090269521A1 (en) * 2008-04-24 2009-10-29 3M Innovative Properties Company Porous structured thermal transfer article
US8579018B1 (en) 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
US8453717B1 (en) * 2009-07-20 2013-06-04 Hrl Laboratories, Llc Micro-architected materials for heat sink applications
US8573289B1 (en) 2009-07-20 2013-11-05 Hrl Laboratories, Llc Micro-architected materials for heat exchanger applications
US8323524B2 (en) 2009-10-01 2012-12-04 3M Innovative Properties Company Apparatus including hydrofluoroether with high temperature stability and uses thereof
US9546826B1 (en) 2010-01-21 2017-01-17 Hrl Laboratories, Llc Microtruss based thermal heat spreading structures
US8921702B1 (en) 2010-01-21 2014-12-30 Hrl Laboratories, Llc Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments
US8535559B2 (en) * 2010-03-26 2013-09-17 3M Innovative Properties Company Nitrogen-containing fluoroketones for high temperature heat transfer
US8857182B1 (en) 2010-05-19 2014-10-14 Hrl Laboratories, Llc Power generation through artificial transpiration
US8771330B1 (en) 2010-05-19 2014-07-08 Hrl Laboratories, Llc Personal artificial transpiration cooling system
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
DE102012016442A1 (de) * 2012-08-18 2014-02-20 Audi Ag Wärmetauscher
US9405067B2 (en) 2013-03-13 2016-08-02 Hrl Laboratories, Llc Micro-truss materials having in-plane material property variations
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TWI573976B (zh) * 2014-03-27 2017-03-11 玉晶光電股份有限公司 散熱裝置及其製造方法
CN104955311A (zh) * 2014-03-27 2015-09-30 玉晶光电股份有限公司 散热装置及其制造方法
US10695872B2 (en) * 2015-03-11 2020-06-30 Lockheed Martin Corporation Heat spreaders fabricated from metal nanoparticles
MX2018005817A (es) * 2015-11-09 2018-09-17 Franke Technology & Trademark Intercambiador de calor.
CN105466268A (zh) * 2015-12-18 2016-04-06 华南理工大学 一种基于3d打印的多孔内凹强化传热结构及其制备方法
RU174676U1 (ru) * 2017-02-20 2017-10-25 Федеральное государственное бюджетное учреждение науки Институт физики твердого тела Российской академии наук (ИФТТ РАН) Теплопроводящая прокладка для охлаждения изделий электроники
US10493693B1 (en) * 2017-07-25 2019-12-03 National Technology & Engineering Solutions Of Sandia, Llc 3D-printed apparatus for efficient fluid-solid contact
KR102541316B1 (ko) * 2019-01-30 2023-06-13 교세라 가부시키가이샤 방열 부재 및 이것을 구비하는 전자 장치
CN112776003B (zh) 2019-11-07 2022-05-06 台达电子工业股份有限公司 散热装置及其适用的机器人
WO2022061100A1 (en) * 2020-09-18 2022-03-24 Arris Enterprises Llc Method and system for small scale structures to improve thermal efficiency
TWD213820S (zh) * 2021-03-23 2021-09-01 芝奇國際實業股份有限公司 記憶體散熱片
US20230280115A1 (en) * 2022-03-04 2023-09-07 Drexel University Amphiphilic Minichannel Surface Structures to Enhance Heat Transfer Coefficient
TWI872652B (zh) * 2023-08-18 2025-02-11 佳必琪國際股份有限公司 散熱裝置

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8160252B2 (en) 2006-02-27 2012-04-17 Samsung Electronics Co., Ltd Method and system for protecting broadcast service/content in a mobile broadcast system, and method for generating short term key message therefor
JP2012249308A (ja) * 2006-02-27 2012-12-13 Samsung Electronics Co Ltd 携帯放送システムにおける放送サービス／コンテンツ保護方法及びシステム、並びに、このための短期キーメッセージの生成方法
US9356718B2 (en) 2006-02-27 2016-05-31 Samsung Electronics Co., Ltd Method and system for protecting broadcast service/content in a mobile broadcast system, and method for generating short term key message therefor
US9800358B2 (en) 2006-02-27 2017-10-24 Samsung Electronics Co., Ltd Method and system for protecting broadcast service/content in a mobile broadcast system, and method for generating short term key message threfor
US9385253B2 (en) 2012-10-04 2016-07-05 Shin-Etsu Chemical Co., Ltd. Method of manufacturing solar cell module
US9520522B2 (en) 2012-10-04 2016-12-13 Shin-Etsu Chemical Co., Ltd. Method of manufacturing solar cell module
JP2022549311A (ja) * 2019-09-24 2022-11-24 華為技術有限公司 熱伝導体、熱伝導性材料、及び半導体デバイスのパッケージ構造
JP7373061B2 (ja) 2019-09-24 2023-11-01 華為技術有限公司 熱伝導体、熱伝導性材料、及び半導体デバイスのパッケージ構造

Also Published As

Publication number Publication date
US20070102140A1 (en) 2007-05-10
EP1946032A4 (en) 2010-10-06
EP1946032A1 (en) 2008-07-23
KR20080074140A (ko) 2008-08-12
US7360581B2 (en) 2008-04-22
WO2007055895A1 (en) 2007-05-18
US20080148570A1 (en) 2008-06-26
CN101305256A (zh) 2008-11-12
CN101305256B (zh) 2010-10-06
TW200732167A (en) 2007-09-01

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