TW200732167A - Structured thermal transfer article - Google Patents

Structured thermal transfer article

Info

Publication number
TW200732167A
TW200732167A TW095140978A TW95140978A TW200732167A TW 200732167 A TW200732167 A TW 200732167A TW 095140978 A TW095140978 A TW 095140978A TW 95140978 A TW95140978 A TW 95140978A TW 200732167 A TW200732167 A TW 200732167A
Authority
TW
Taiwan
Prior art keywords
thermal transfer
transfer article
metal
structured thermal
structured
Prior art date
Application number
TW095140978A
Other languages
English (en)
Chinese (zh)
Inventor
Phillip Eric Tuma
Gary Marven Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200732167A publication Critical patent/TW200732167A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
TW095140978A 2005-11-07 2006-11-06 Structured thermal transfer article TW200732167A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/268,139 US7360581B2 (en) 2005-11-07 2005-11-07 Structured thermal transfer article

Publications (1)

Publication Number Publication Date
TW200732167A true TW200732167A (en) 2007-09-01

Family

ID=38002567

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140978A TW200732167A (en) 2005-11-07 2006-11-06 Structured thermal transfer article

Country Status (7)

Country Link
US (2) US7360581B2 (https=)
EP (1) EP1946032A4 (https=)
JP (1) JP2009515362A (https=)
KR (1) KR20080074140A (https=)
CN (1) CN101305256B (https=)
TW (1) TW200732167A (https=)
WO (1) WO2007055895A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11504863B2 (en) 2019-11-07 2022-11-22 Delta Electronics, Inc. Heat dissipation device and robot using same

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11504863B2 (en) 2019-11-07 2022-11-22 Delta Electronics, Inc. Heat dissipation device and robot using same

Also Published As

Publication number Publication date
JP2009515362A (ja) 2009-04-09
US20070102140A1 (en) 2007-05-10
EP1946032A4 (en) 2010-10-06
EP1946032A1 (en) 2008-07-23
KR20080074140A (ko) 2008-08-12
US7360581B2 (en) 2008-04-22
WO2007055895A1 (en) 2007-05-18
US20080148570A1 (en) 2008-06-26
CN101305256A (zh) 2008-11-12
CN101305256B (zh) 2010-10-06

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