KR20080040598A - Manufacturing device for liquid crystal display panel and manufacturing method of the same - Google Patents

Abstract

An apparatus and a method for manufacturing an LC panel are provided to suppress radiation of UV rays of a wavelength area giving effects on performance or the like of an LC panel, thereby improving a yield with high performance. A processing chamber(50) processes a processed substrate(10) injected with LC material including photo-reactive material. Plural lamp(52) are disposed within the processing chamber and radiates UV(Ultra Violet) rays to the processed substrate so as to make the photo-reactive material react. The lamp forms an alignment part within the processed substrate. A filter(53) faces the lamp and suppresses transmission of UV ray of a wavelength area of 320~360nm.

Description

Liquid crystal panel manufacturing apparatus and manufacturing method of liquid crystal panel {MANUFACTURING DEVICE FOR LIQUID CRYSTAL DISPLAY PANEL AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a liquid crystal panel manufacturing apparatus and a method for producing a liquid crystal panel using the same.

Liquid crystal panels are used for various applications because of their high display quality, thinness, low power consumption, and the like. In particular, in recent years, demand for large-scale liquid crystal devices such as liquid crystal televisions has been increasing, and high performance has also been demanded.

In order to obtain a high-performance liquid crystal panel, the alignment control of the alignment film for orienting a liquid crystal body in a predetermined direction is important. Conventionally, the "rubbing method" etc. which rub an alignment film with cloth have been generally used. However, when the rubbing method is used, there is a problem that dirt is dropped and dirt adheres, or a semiconductor element is damaged by static electricity or the like. Recently, a technique called "optical alignment method" has attracted attention.

The "photo-alignment method" refers to a technique of forming a polymer having photoreactivity on a substrate and irradiating ultraviolet rays or the like to chemically react the polymer to give an alignment function. As a discharge lamp which can be used for the photo-alignment method, the metal vapor discharge lamp which added thallium and bismuth, etc. are known, for example (refer patent document 1).

However, depending on the irradiation conditions of ultraviolet rays, a wavelength range, etc., it affects the performance, the yield, etc. of the liquid crystal panel after manufacture. In particular, in manufacture of the liquid crystal panel using the photo-alignment method, when much ultraviolet light below a fixed wavelength range is irradiated, it will become the cause which greatly reduces the performance, the yield, etc. of the liquid crystal panel after manufacture.

[Patent Document 1] Japanese Patent Application Laid-Open No. 6-275234

This invention can suppress the ultraviolet irradiation of the wavelength range which affects the performance of a liquid crystal panel, etc., and provides the liquid crystal panel manufacturing apparatus which can manufacture the liquid crystal panel which improved the yield in high performance, and the manufacturing method of the liquid crystal panel using the same.

According to the aspect of this invention, the processing chamber which processes the to-be-processed board | substrate which enclosed the liquid crystal body containing a photoreactive substance inside, and it is arrange | positioned in a process chamber and irradiates a to-be-processed board | substrate with ultraviolet-rays, and reacts a to-be-processed substrate There is provided a liquid crystal panel manufacturing apparatus including a plurality of lamps for forming an alignment portion inside the filter, and a filter facing the lamp and suppressing transmission of ultraviolet light in a wavelength region of at least wavelengths of 320 to 360 nm.

According to another aspect of the present invention, ultraviolet rays are irradiated to a substrate to be enclosed with a liquid crystal body containing a photoreactive substance through a filter that suppresses transmission of ultraviolet rays in a wavelength range of at least 320 to 360 nm. And the process of reacting a photoreactive substance and forming an orientation part in the inside of a to-be-processed substrate is provided.

According to the present invention, a liquid crystal panel manufacturing apparatus capable of producing a liquid crystal panel capable of suppressing ultraviolet irradiation in a wavelength region affecting the performance of a liquid crystal panel and the like and improving the yield at high performance and a method of manufacturing a liquid crystal panel using the same can be provided. Can be.

Next, embodiments of the present invention will be described with reference to the drawings. In description of the following drawings, the same or similar code | symbol is attached | subjected to the same or similar part. Embodiment shown below illustrates the apparatus and method for incorporating the technical idea of this invention, and the technical idea of this invention does not specify to what follows the structure, arrangement | positioning, etc. of a component.

(Substrates)

The to-be-processed substrate 10 which can be processed using the liquid crystal panel manufacturing apparatus which concerns on embodiment of this invention is demonstrated. As illustrated in FIG. 1, the to-be-processed substrate 10 includes a liquid crystal body 17 having azimuthality by applying a voltage between the first substrate 12 and the second substrate 14, such as glass, and light. The photoreactive substance (polymer body) 18 which has reactivity is at least enclosed.

As the liquid crystal body 17, the base material of ester type, a biphenyl type, a phenyl cyclohexane (PCH) type, a cyclohexane type | system | group, a phenylpyridinine type, and a dioxane type is used, for example. It is preferable that a base material is blended according to a use. As a liquid crystal material which can make driving voltage small, P-ester type, P-biphenyl type material, etc. are suitable. As a liquid crystal material which can endure high temperature and can operate stably, the base material of a tricyclic system and a tetracyclic system is suitable. As a liquid crystal material which improves responsiveness and is suitable for displaying a moving image or the like, a PCH-based or biphenyl-based material is suitable.

As the polymer body 18, for example, a polymer material having an azo compound (azo benzene) as shown in Fig. 2 is used. The polymeric material which has an azo compound superposes | polymerizes by irradiating an ultraviolet-ray, especially the ultraviolet-ray of 300-400 nm of wavelength ranges, and forms a crosslinked structure. As shown in FIG. 1, the sealing part 19 is joined between the 1st board | substrate 12 and the 2nd board | substrate 14. As shown in FIG.

On the surface of the first substrate 12, a plurality of semiconductor elements 11 such as thin film transistors (TFTs) are arranged. The first transparent electrode 15 is formed on the array of the plurality of semiconductor elements 11. On the other hand, the color filter 13 is arrange | positioned at the surface of the 2nd board | substrate 14. The second transparent electrode 16 is formed on the surface of the color filter 13.

An example of the processing intermediate (liquid crystal panel) 20 after irradiating an ultraviolet-ray to the to-be-processed substrate 10 of FIG. 1 is shown in FIG. For example, the first transparent electrode 15 and the second transparent electrode 16 are irradiated with ultraviolet rays when a voltage is applied to the substrate 10 of FIG. 1 using a liquid crystal panel manufacturing apparatus described later. On the surface of the projection-shaped alignment portions 21, 22 are formed, respectively.

The alignment portions 21 and 22 are crosslinked structures obtained by polymerizing the polymer body 18 of FIG. 1 by light irradiation, and as shown in FIG. 4, respectively, parallel to the predetermined direction of the first substrate 12. Are arranged side by side. As shown in FIG. 5, the angle θ of the vertical rise of the alignment portion 21 seen from the upper surface of the first transparent electrode 15 is, for example, a voltage applied to the substrate 10 to be processed. It can be changed by controlling.

By arrange | positioning the orientation parts 21 and 22 on the surface of the 1st transparent electrode 15 and the 2nd transparent electrode 16, as shown to FIG. 6 and FIG. 7, the orientation parts 21 and 22, respectively. The liquid crystal body 17 enters into a gap (concave portion) of the (). Therefore, compared with the case where the alignment parts 21 and 22 are not formed inside the liquid crystal panel 20, the alignment control force of the liquid crystal body 17 becomes high, and liquid crystal panels, such as a response speed, a transmittance | permeability, contrast, and a polarization characteristic, etc. Various performance and characteristics of the can be improved.

(Liquid crystal panel manufacturing apparatus)

(Overall configuration)

As shown in FIG. 8, the liquid crystal panel manufacturing apparatus according to the embodiment includes a carrying part 2 capable of accommodating a plurality of processed substrates 10, and a processed substrate 10 accommodated in the carrying part 2. An inverting section 3 for inverting the upper and lower sides of the insulator, an inspecting section 4 for inspecting characteristics of the to-be-processed substrate 10 conveyed from the inverting section 3, and a processed substrate 10 conveyed from the inspecting section 4. An ultraviolet irradiation part (UV irradiation part) 5 which irradiates an ultraviolet-ray with respect to it, and the inversion part 6 which inverts the to-be-processed substrate 10 after irradiating the ultraviolet-ray conveyed from the UV irradiation part 5 are provided.

The conveyance robot 25 is arrange | positioned inside the carrying-in part 2. As shown in FIG. The transfer robot 25 is managed by a computer system (not shown) arranged under a table for placing the substrate 10 to be processed, and inverts the substrate 10 to be processed. It returns to (3).

The inspection unit 4 includes a first inspection device 4a and a second inspection device 4b. The 1st inspection apparatus 4a and the 2nd inspection apparatus 4b apply a voltage to the to-be-processed board | substrate 10, and test the orientation state of a liquid crystal body, and the to-be-processed board | substrate 10 has predetermined quality. Check whether the criteria are met. In FIG. 8, although two test apparatuses (1st test apparatus 4a and 2nd test apparatus 4b) were illustrated, the number of test | inspection apparatuses may be set in accordance with the processing capability of the liquid crystal panel manufacturing apparatus shown in FIG. You may have a dog.

The UV irradiation part 5 includes the 1st UV irradiation apparatus 5a and the 2nd UV irradiation apparatus 5b. The 1st UV irradiation apparatus 5a and the 2nd UV irradiation apparatus 5b irradiate an ultraviolet-ray to the to-be-processed substrate 10. FIG. The number of UV irradiation apparatuses may be sufficient.

The transfer of the substrate 10 to be processed from the inversion unit 3 to the inspection unit 4, the UV irradiation unit, and the inversion unit 6 is performed by a transfer robot provided in a path between the inversion unit 3 and the inversion unit 6 ( 62). The transfer robot 62 is managed by a computer system (not shown) provided under the path of the transfer robot 62.

The display device 61 is disposed on the outer surface of the device. By the display apparatus 61, alignment of the mounting position of the to-be-processed board | substrate 10 conveyed to the test | inspection part 4 and the UV irradiation part 5 is possible, for example. Moreover, the ionizer 63 for removing static electricity etc. may be attached to the inner surface of the liquid crystal panel manufacturing apparatus.

(Processing order)

When performing the process using the liquid crystal panel manufacturing apparatus shown in FIG. 8, as shown in the flowchart of FIG. 9, in step S1, the processing target board 10 is stored in the carrying-in part 2, and FIG. 8 The substrate 10 to be processed is transferred from the carrying in portion 2 to the inverting portion 3 by the transfer robot 25.

In Step S2 of FIG. 9, the substrate 10 shown in FIG. 1 is inverted up and down, and the first substrate 12 on the side where the semiconductor element 11 is formed is upward, and the color filter 13 is formed. The second substrate 14 on the side is made downward. By inverting, since the lamp light is irradiated from the side of the first substrate 12 on the side where the semiconductor element 11 is formed in the UV irradiation part 5, damage to the color filter can be suppressed. In addition, when the 1st board | substrate 12 is upper, it is not necessary to reverse.

In step S3 of FIG. 9, the transfer robot 62 transfers the substrate 10 to be processed from the inversion unit 3 to the inspection unit 4. In the inspection unit 4, the processing target substrate 10 is positioned by the display device 61 or the like, the liquid crystal body 17 inside the processing target substrate 10 is oriented by applying a voltage, and the processing target substrate is processed. It is determined whether or not (10). The to-be-processed board | substrate 10 determined as "defect" in the inspection of step S3 is conveyed to the exterior of the apparatus from the inspection part 4 by the conveyance robot 62 of FIG. The to-be-processed substrate 10 evaluated as "good" in the inspection of step S3 is conveyed from the inspection part 4 to the UV irradiation part 5 by the transfer robot 62.

In step S4, the UV irradiation part 5 WHEREIN: The lamp light which light-emitted the ultraviolet-ray of wavelength range 340-400 nm relatively compared with the ultraviolet-ray of wavelength range 340 nm or less, for example, the to-be-processed substrate 10 Check). As a result, the polymer body encapsulated in the substrate 10 is photoreacted (polymerized), and as shown in FIG. 3, the alignment section 21 is formed inside the processing intermediate (liquid crystal panel) 20. 22). The liquid crystal panel 20 is conveyed from the UV irradiation part 5 to the inversion part 6, and is inverted up and down as needed in the inversion part 6 in step S5. In step S6, the liquid crystal panel 20 is conveyed from the inversion part 6 to the outside of the liquid crystal panel manufacturing apparatus.

(Inverted part)

A schematic diagram showing an example of the inverting section 3 is shown in FIG. The inversion part 3 has the 1st adsorption part 31, the 2nd adsorption part 32, and the 3rd adsorption part 33 for vacuum adsorption of the to-be-processed substrate 10. FIG. The 1st adsorption part 31 is arrange | positioned under the process chamber 30, and is moved up and down by the 1st movable part 34 connected to the 1st adsorption part 31. As shown in FIG. The 2nd adsorption part 32 is being fixed to the rotating part 35 arrange | positioned above the 1st adsorption part 31. As shown in FIG. The 3rd adsorption part 33 is arrange | positioned at the upper part of a process chamber, and is moved up and down by the 2nd movable part 36 connected to the 3rd adsorption part 33. As shown in FIG.

When the substrate 10 to be processed is inverted, as shown in FIG. 11A, first, the substrate 10 is loaded on the first adsorption portion 31. And the 1st adsorption part 31 is lifted up by the 1st movable part 34 shown in FIG. 10 (not shown in FIG. 11A), and the to-be-processed board | substrate 10 is a 2nd adsorption part. Get closer to (32). As shown in Fig. 11B, the first adsorption part 31 and the second adsorption part 32 are brought closer to each other, and the substrate 10 to be processed is transferred to the second adsorption part 32. As shown in FIG. 11C, the rotating part 35 is rotated to arrange the substrate 10 to be disposed above the second adsorption part 32. Thereafter, as shown in Fig. 11D, the third adsorption part 33 is lifted down by the second movable part 36 shown in Fig. 10 (not shown in Fig. 11D). As shown in FIG. 11E, the substrate 10 to be processed is adsorbed below the third adsorption portion 33.

(Inspection department)

As an example of the inspection part 4, the schematic diagram which showed the 1st inspection apparatus 4a is shown in FIG. In the processing chamber 40, the mounting table 41 for arranging the substrate 10 to be processed is disposed, and the CCD camera 43 for inspecting the state of the substrate 10 to be disposed above the mounting table 41. ) Is arranged. The backlight irradiation part 42 is arrange | positioned under the mounting stand 41. FIG.

In the case of inspecting the substrate 10 to be processed using the first inspection device 4a, as shown in FIG. 13 (a), the substrate 10 is mounted on the mounting table by the transfer robot 62. 41, the position adjustment (alignment) of the to-be-processed substrate 10 is performed using the CCD camera 43 shown in FIG. 12, confirming with the display apparatus 61 of FIG. Thereafter, as shown in Fig. 13B, the application connector 44 is connected to the substrate 10 to be processed. As shown in Fig. 13C, the backlight irradiator 42 irradiates light from below the substrate 10 to be processed. As shown in Fig. 13D, the voltage applying unit 45 is connected to the applying connector 44, and a constant voltage is applied from the voltage applying unit. By the application of voltage, the liquid crystal inside the substrate 10 is oriented in a constant direction. Thereafter, as shown in Fig. 13E, the measurement area in the substrate 10 is appropriately selected, the arrangement state of the liquid crystal in the measurement area is confirmed by the CCD camera 43, and the processing is performed. Good or bad of the board | substrate 10 is determined.

(UV irradiation department)

(Overall configuration)

As an example of the UV irradiation part 5, the schematic diagram which shows the 1st UV irradiation apparatus 5a is shown in FIG. The 1st UV irradiation apparatus 5a is arrange | positioned in the processing chamber 50 which processes the to-be-processed board | substrate 10, and the process chamber 50, irradiates an ultraviolet-ray to the to-be-processed board | substrate 10, and to-be-processed board | substrate 10 ), A plurality of lamps 52 for forming the alignment portions 21 and 22 (see FIG. 3), and a filter that opposes the lamps 52 and suppresses the transmission of ultraviolet rays in the wavelength range of 340 nm or less. 53 is provided. In FIG. 14, although the some lamp 52 is located above the process chamber 50, you may change suitably the position of the lamp 52 according to the position of the to-be-processed board | substrate 10. FIG.

Above the plurality of lamps 52, reflecting mirrors 57 for uniformizing the irradiation light from the lamps 52 are disposed, respectively. As shown in FIG. 15, a plurality of auxiliary reflecting plates 58 may be disposed between the lamp 52 and the filter 53. In the example of Fig. 15, a sensor for detecting illuminance is disposed inside the auxiliary reflecting plate 58, and the angle of the auxiliary reflecting plate 58 may be freely changed depending on the detection result of the sensor. In addition, the arrangement | positioning interval of several lamp | ramp 52 makes outer diameter of a lamp | ramp D, and when D is 25 mm or less, when the space | interval (lamp pitch) between the centers of several lamp | ramp 52 is 5D-6D, Thereby, ultraviolet irradiation with little nonuniformity of illumination intensity with respect to the to-be-processed substrate 10 is possible. In addition, when D is 20-33 mm, lamp pitch can also be 3D-6D.

In the 1st UV irradiation apparatus 5a which concerns on embodiment illustrated in FIG. 14, even if the lamp pitch when the lamp outline D is 27.5 mm is 7D-8D, a fixed objective can be achieved. In addition, when the external shape D 'of the cooling pipe 100 mentioned later (refer FIG. 25) is set to 70 mm, even when the lamp pitch is 4D, the uniform ultraviolet irradiation is possible.

As shown in Fig. 17, the first illuminometer 55 and the first illuminometer 55 for measuring the illuminance of the lamp 52 in the vicinity of the central portion of the lamp 52 when viewed in the longitudinal direction (axial direction) of the lamp 52 are formed. 2 illuminometers 56 are arranged. As shown in Fig. 14, the first illuminometer 55 and the second illuminometer 56 can be arranged one above each of the plurality of lamps 52, respectively. The first illuminometer 55 and the second illuminometer 56 are connected to the lamp control device 7, and according to the illuminance values detected by the first illuminometer 55 and the second illuminometer 56, the lamp 52 ) Can be controlled. In addition, only one type of illuminometer may be disposed above the lamp 52.

As the first illuminometer 55, for example, an illuminometer having a peak sensitivity between the wavelength ranges 340 to 370 nm can be used. Thereby, the emission peak in wavelength 365nm of the lamp 52 mentioned later can be detected more accurately, and the superposition | polymerization of the polymer body 18 of the to-be-processed substrate 10 of FIG. The irradiation value of the wavelength range suitable for suppressing the quality deterioration of (10) can be detected with higher accuracy. 18 shows an example (UV-35) of the spectral sensitivity of an illuminometer suitable as the first illuminometer 55. As shown in FIG.

As the second illuminometer 56, an illuminometer having a peak sensitivity between a wavelength region different from the first illuminometer 55, for example, the wavelength region 305 to 320 nm can be used. As a result, the emission peak at a wavelength, for example, 313 nm, which may inhibit the polymerization of the polymer body of the substrate 10 of FIG. 1 and degrade the quality of the substrate 10, can be more accurately. Can be detected by road. Fig. 19 shows an example (UV-31) of spectroscopic sensitivity of an illuminometer suitable as a second illuminometer 56. Figs.

In the processing chamber 50 shown in Fig. 14, a stage 51 for arranging the substrate 10 to be processed is provided. On the stage 51, the cooling plate 54 which cools the to-be-processed board | substrate 10 may be arrange | positioned. Moreover, in order to control the cooling plate 54 and to control the temperature rise of the to-be-processed substrate 10 by light irradiation from the lamp 52, the board | substrate temperature control apparatus 8 may be arrange | positioned. The movement control apparatus 9 for moving the stage 51 to the longitudinal direction of the to-be-processed substrate 10 may be arrange | positioned. In addition, a voltage is applied to the processing target substrate 10 in the processing chamber 50 to promote or control the formation of the alignment portions 21 and 22 (see FIG. 3) formed in the processing target substrate 10. The voltage application control device 64 is connected.

Although it becomes clear by the detailed structure mentioned later, according to the 1st UV irradiation apparatus 5a shown in FIG. 14, ultraviolet irradiation of the wavelength range which affects the performance of the liquid crystal panel after manufacture, etc. can be suppressed, and a yield is high performance. The liquid crystal panel which improved this can be manufactured.

(lamp)

As the lamp 52 shown in Fig. 17, for example, an outer diameter of 27.5 mm in which electrodes 521 and 522 made of tungsten (W) and the like are disposed in a quartz hermetic container 520 having ultraviolet ray permeability, An ultraviolet lamp with a thickness of 1.5 mm, a light emission length L of 1000 mm, a lamp voltage of 1275 V, and a lamp voltage value of 13.5 A can be used. A rare gas such as argon (Ar) gas is enclosed in the airtight container 520.

As such an ultraviolet lamp, the lamp in which the metal enclosure which has mercury (Hg) and at least 1 light emission other than the spectrum of mercury in the wavelength region 300-400 nm is enclosed in the airtight container 520 is suitable. For example, a high-brightness mercury lamp in which mercury and a small amount of rare gas are enclosed in the hermetic container 520, or a high-brightness discharge lamp such as a metal halide lamp in which mercury and a halogenated metal are enclosed in the hermetic container 520. This is available.

In particular, as the lamp 52 suitable for processing the substrate 10 shown in Fig. 1, a thallium-based metal halide lamp in which mercury and thallium halide is sealed in the hermetic container 520 can be used. For example, in the case of using a thallium-based metal halide lamp encapsulated with mercury 1.6 mg / dl, thallium iodide (TlI) 0.1 mg / dl, and argon 1.33 dl, as shown in Fig. 20, the wavelength is 352 nm, 365 nm, It has a large emission peak around 378 nm, and the electrical characteristics at that time show about 1250 V and about 14.0 A.

Thallium (Tl) has a strong bright spectrum in the wavelength region of 352 nm and 378 nm, and has the effect of reducing the luminescence intensity of mercury. Therefore, for example, the mercury emission of 313 nm can be suppressed, and the ultraviolet-ray which made the light emission of the wavelength region of 340-400 nm relatively large can be emitted. Therefore, by using the lamp 52 containing thallium in the liquid crystal panel manufacturing apparatus of FIG. 14, irradiation of ultraviolet rays having a wavelength region of 340 nm or less, which greatly affects the characteristics of the liquid crystal panel 20 of FIG. 3, can be reduced. Can be.

In the case where the inner diameter D of the lamp is ≤ 30 mm, the amount of encapsulation of thallium halide is preferably set to an amount selected from 0.01 mg / dl? M? 0.3 mg / dl. More preferably, when the inner diameter D of the lamp is D ≦ 30 mm and the emission length L is 500 mm ≦ L ≦ 2500 mm, the loading amount of mercury (Hg) is 0.9 mg / dl ≦ Hg It is preferable to make the loading amount M of <2.0 mg / dl and thallium halide into the quantity chosen from 0.012 mg / dl <M <0.1 mg / dl.

Uniform illumination of the axial direction of the lamp 52 is obtained by setting the amount M of encapsulation of thallium halide to M ≦ 0.3 mg / dl, so that uniform irradiation of ultraviolet rays to the substrate 10 to be processed is performed. Can be realized. 20, the peak value of the illuminance of wavelength 313 nm which affects the characteristic of the to-be-processed substrate 10 can be reduced to 5% or less compared with the peak value of the illuminance of wavelength 365 nm. Therefore, the characteristic of the liquid crystal panel after ultraviolet irradiation can be improved more. On the other hand, when the encapsulation amount of thallium halide is 0.3 mg / dl or more, the thallium encapsulated in the hermetic container 520 is unevenly dispersed in the longitudinal direction of the lamp 52, resulting in luminescence separation and deterioration in lamp performance. .

As the lamp 52, an iron-based metal halide lamp having a spectrum as shown in FIG. 21 can also be used. For example, an iron-based metal halide lamp in which a discharge medium of mercury 1.2 mg / dl, iron 0.027 mg / dl and mercury iodide 0.1 mm / dl was sealed in an airtight container, as can be seen from FIG. 21, a wavelength 365 nm. Has the largest luminescence peak in.

As shown in Fig. 22, when the iron-based metal halide lamp and the thallium-based metal halide lamp are compared, the wavelength of illuminance having a wavelength of 340 nm or less that affects the characteristics after manufacture of the substrate 10 to be processed in FIG. Integrating and comparing, it turned out that the iron type metal halide lamp has more than twice the value compared with the thallium type metal halide lamp.

Therefore, in the case where it is desired to suppress the light emission itself in the wavelength range of 340 nm or less from the lamp 52, it is preferable to use a thallium-based metal halide lamp rather than an iron-based metal halide lamp. In addition, since ultraviolet ray of 340 nm or less of wavelength range can suppress transmission by the filter 53 mentioned later, when using the lamp which emits ultraviolet-ray which has a comparatively large wavelength range which can be irradiated, thallium type metal It is preferable to use an iron metal halide lamp rather than a halide lamp.

23 shows a comparative example of the spectral distribution of the iron-based metal halide lamp according to the embodiment and the mercury lamp as a comparative example. The mercury lamp has a large emission peak in the wavelength region of 365 nm, 313 nm, and 303 nm. When attention is paid to the 365 nm ambient illuminance, the iron-based metal halide lamp exhibits an illuminance of about 45% lower than that of the mercury lamp, but in 340 to 380 nm, which is a wavelength region suitable for irradiation to the substrate 10 to be processed, as a whole, High illuminance

Since the mercury lamp has a high emission peak in the wavelength region of 340 nm or less that changes the characteristics of the substrate 10, in view of improving the performance of the substrate 10, the mercury lamp is more than an iron-based metal halide lamp. It is preferable to use.

As shown in the example of Fig. 24, when illuminance is measured using an iron-based metal halide lamp having a light emission length L of 1800 nm, since roughness is substantially uniform with respect to the axial direction of the lamp 52, The iron metal halide lamp is suitable for increasing the size of the substrate 10 to be processed. In addition, when applied to the 1st UV irradiation apparatus 5a shown in FIG. 14, also when using the iron type metal hydride lamp whose light emission length L is 2500 mm, the effect similar to FIG. 24 is the same. Obtained.

(Lamp water cooling structure)

25 is a schematic diagram showing the periphery of the lamp 52 shown in FIG. The lamp 52 is surrounded by a cooling tube 100 having a double tube structure of an inner tube 101 and an outer tube 102. Between the inner tube 101 and the exterior 102, water (pure water) for cooling the lamp 52 is accommodated. Moreover, between the inner tube 101 and the exterior 102, it has a spectral characteristic, and the heat absorption filter 103 for absorbing the infrared rays from the lamp 52 is arrange | positioned so that the lamp 52 may be enclosed. .

As the heat absorption filter 103, a heat absorption filter having a spectral characteristic capable of absorbing infrared rays and selectively transmitting ultraviolet rays in a wavelength range of about 300 to 400 nm is preferable. For example, as shown in Fig. 26, a heat absorption filter having a peak of spectral transmittance in a wavelength region of 260 to 400 nm can be used. By arranging the heat absorption filter 103 having the spectral characteristics as shown in FIG. 26, it is possible to transmit ultraviolet rays in the wavelength region for efficiently reacting the polymer body 18 inside the substrate 10 to be processed. At the same time, since irradiation of infrared rays which causes heating of the substrate 10 to be processed is suppressed, deterioration of characteristics of the substrate 10 to be processed is further suppressed, and the yield and performance of the liquid crystal panel after manufacture are improved.

(filter)

As the filter 53 shown in Fig. 14, an absorption type optical filter in which an absorbent is added in quartz or a glass substrate, or a multilayer film filter in which a plurality of layers of thin films are deposited on the upper surface of a plate made of quartz or glass as a substrate. Is available. As a characteristic of the filter 53, a low pass filter having a short wavelength cutoff wavelength within a wavelength range of at least 320 to 360 nm is preferable. In addition, in the filter 53 which concerns on embodiment, a "cut off wavelength" points out the cut-off wavelength defined by the wavelength at the time of perpendicular incidence (incidence angle 0 degree). In particular, in a multilayer film filter, when the incident angle of ultraviolet rays increases, the cut-off wavelength moves to the short wavelength side. For example, in the case of a multilayer film filter having a cutoff wavelength at 340 nm, the cutoff wavelength is shifted to the short wavelength side near 330 nm and 310 nm by setting the angle of incidence to 30 ° and 60 °, and thus the cutoff wavelength with respect to the angle of incidence. The range of change becomes larger. As another example of the filter, in any absorption type filter having a cutoff wavelength of 320 nm, the cutoff wavelength is 320 nm even if the incident angle of ultraviolet rays changes, and the transmittance of 365 nm is 50 °, 60 °, and 70 nm. It becomes the characteristic to fall to 95%, 85%, 70% at °.

In order to accelerate the polymerization of the polymer 18 inside the substrate 10 to form the alignment portions 21 and 22 and to reduce the characteristic change of the liquid crystal panel 20 after manufacture, a filter for controlling ultraviolet irradiation. The change (N) of the cutoff wavelength when the cutoff wavelength is 320 to 360 nm, preferably 330 to 350 nm as (53) and the incident angle of ultraviolet rays is 0 to 60 ° is -15. A multilayer film filter in the range of nm < N < 15 nm or an absorption filter having a cutoff wavelength of 320 nm to 340 nm can be used.

(Lamp control unit)

As shown in FIG. 29, the lamp control device 7 shown in FIG. 14 includes a lamp power control unit 71, an illuminance determination unit 72, an integrated light amount determination unit 73, and a uniformity determination unit 74. do. The lamp control device 7 may be provided with a storage device 75 for storing various data such as setting values of illuminance values suitable for the processing of the processing target substrate 10.

The lamp power control unit 71 controls the power of the lamp based on the determination results of the illuminance determination unit 72, the accumulated light amount determination unit 73, and the uniformity determination unit 74. The illuminance determination unit 72 reads setting data of the illuminance value stored in the storage device 75, and whether the illuminance value detected by the first illuminometer 55 or the second illuminometer 56 is within a predetermined range. Can be determined.

Fig. 30 shows the illuminance value, irradiation time, and orientation state (polymerization effect), deterioration, and production of the alignment portions 21 and 22 shown in Fig. 3 when the substrate 10 to be processed shown in Fig. 1 is processed. The relationship of efficiency is shown. The "illuminance value" is the 1st illuminometer 55, and has shown the value detected by the illuminometer which has the spectral sensitivity shown in FIG. In addition, "irradiation time" below shows the time which actually irradiates the to-be-processed substrate 10 of FIG. 1 from the lamp 52. FIG.

As shown in FIG. 30, when the roughness value detected by the first illuminometer 55 is 25 mW / cm 2 or less, the polymerization effect of the polymer body 18 of FIG. 1 is obtained, but deteriorates in the liquid crystal panel 20 after manufacture. And production efficiency is lowered. When the roughness value is 40 mW / cm 2 or more, the polymerization proceeds satisfactorily and the production efficiency is improved. However, when the roughness value is higher than 100 mW / cm 2, the damage to the polymer body increases, so that the polymerization effect is also obtained by suppressing it at 75 mW / cm 2. Further, deterioration of the liquid crystal panel 20 after production can also be made less likely.

Therefore, when the illuminance determination unit 72 processes the substrate 10 of FIG. 1, the illuminance value of the first illuminometer 55 is, for example, 25 Pa / cm 2 or more, preferably, 25 It is judged whether it exists in the range of -100 mW / cm <2>, More preferably, it is in the range of 40-75 mW / cm <2>, and the voltage of the lamp 52 by the lamp power control part 71 is based on a determination result. Alternatively, it is desirable to control the current.

In general, the lamp 52 tends to decrease gradually as the life approaches the end of life. Therefore, the illuminance value detected by the first illuminometer 55 or the like also decreases with time. In order to irradiate ultraviolet rays with a light quantity equal to each of the plurality of substrates 10 to be processed, the lamp 52 deteriorates as the lighting time is prolonged, and when the illuminance is lowered, the illuminance is raised by a voltage or a current higher than a certain level. It is preferable to keep it.

In the liquid crystal panel manufacturing apparatus shown in FIG. 14, the illuminance determination unit 72 detects the illuminance value of the first illuminometer 55 or the second illuminometer 56, and the first illuminance value for the lighting time of the lamp 52. When the amount of change in the illuminance value of the illuminometer 55 or the second illuminometer 56 is about 10% or less, the voltage or current of the lamp can be controlled to return the illuminance value to a predetermined value. In addition, "lighting time" shows the integrated value of the time which actually lit the lamp 52. FIG.

The accumulated light amount determining unit 73 determines whether or not the "accumulated light amount" becomes a predetermined value or more. The "accumulated light quantity" is represented by the product of the illuminance value detected by the first illuminometer 55 and the irradiation time of the lamp 52. For example, when processing the to-be-processed substrate 10 of FIG. 1, the accumulated light amount determination part 73 can determine whether the accumulated light amount becomes 2000 mJ / cm <2> or more. By setting the accumulated light amount to 2000 mJ / cm 2 or more, the polymerization effect of the polymer body 18 inside the substrate 10 to be processed is obtained, and the deterioration of characteristics of the liquid crystal panel of FIG. 3 hardly occurs. On the other hand, by setting it as 2000 mJ / cm <2> or less, since the formation of the orientation part 21, 22 in the inside of the liquid crystal panel of FIG. 3 is not fully performed, performance falls.

The homogeneity determination unit 74 determines whether the "evenness system" calculated from the maximum illuminance value and the minimum illuminance value detected by the first illuminometer 55 or the second illuminometer is greater than or equal to a predetermined value. As shown in FIG. 31, "evenness" means the first illuminometer 55 (or the second illuminometer) when attention is paid to the relationship between the longitudinal direction and the roughness of the substrate 10 to be processed. 56)] using the maximum illuminance value MAX and the minimum illuminance value MIN of the illuminance value detected by the

Uniformity (%) = [1-(MAX-MIN) / (MAX + MIN)] × 100

The ratio of the uniformity of roughness represented by

As shown in FIG. 32, when processing the to-be-processed substrate 10 shown in FIG. 1, the uniformity at the time of using the illuminometer which has peak sensitivity between wavelength ranges 340-370 nm shall be 75% or more. By doing so, various performances such as response speed, transmittance, contrast, and polarization (light) characteristics of the liquid crystal panel 20 shown in FIG. 3 are improved. Therefore, when processing the to-be-processed board | substrate 10 shown in FIG. 1, the uniformity determination part 74 judges whether the uniformity in the case of calculating by the 1st illuminometer 55 is 75% or more, and the Based on the determination result, it is preferable that the lamp power control unit 71 control the voltage or current of the lamp.

(Substrate temperature control mechanism)

33 is a schematic view of the cooling plate 54 shown in FIG. 14 as viewed from the top. The cooling plate 54 is made of metal, such as aluminum, for example, and has the cooling water flow path 541 for circulating cooling water inside. The flow rate of the cooling water may be controlled by the substrate temperature control device shown in FIG. 14, or may be a constant speed.

As shown in Fig. 14, the temperature can be basically controlled only by the cooling plate 54, but as shown in Fig. 34, a cold air nozzle 542 is provided inside the processing chamber 50, and cooling is performed by combining cold air. You may also In the example shown in FIG. 34, the cold air nozzle 542 is arrange | positioned along the longitudinal direction of the to-be-processed substrate 10, and the cold air of 5-15 degreeC is sent from the cold air nozzle 542, for example. . Thereby, the substrate temperature of the to-be-processed substrate 10 is controlled to 70 degrees C or less, Preferably it is 20-50 degreeC. In addition, instead of the cold wind nozzle 542, the fan which sends cold air may be provided.

Since the polymer body 18 and the liquid crystal body 17 encapsulated inside the substrate 10 are thermoplastic, they may cause deterioration of properties when exposed to high temperatures. In particular, when the ultraviolet-ray of wavelength 340nm or more is irradiated to the to-be-processed substrate 10, the board | substrate temperature of the to-be-processed substrate 10 may reach 200 degreeC, and the characteristic deterioration may become remarkable.

According to the 1st UV irradiation apparatus 5a shown in FIG. 34, by providing the cold air nozzle 542 and the cooling plate 54, the temperature of the to-be-processed substrate 10 can be controlled to below a fixed temperature. Therefore, deterioration of the polymer body 18 and the liquid crystal body 17 is reduced, and various characteristics such as response speed, transmittance, contrast, and polarization (optical) characteristics of the liquid crystal panel after manufacture can be improved.

In addition, the driving of the cold air nozzle 542 and the cooling plate 54 can be selected according to the size of the substrate 10 to be processed. For example, when processing the to-be-processed board | substrate 10 of 550 mm x 650 mm, it is also possible to cool only using the cold air nozzle 542, For example, to-be-processed substrate of 1500 mm x 1800 mm ( When processing a relatively large substrate, such as 10), the cold air nozzle 542 and the cooling plate 54 may be used together.

On the other hand, when fluctuation | variation arises in the surface temperature of the to-be-processed substrate 10 by blowing cold wind, it is preferable to drive only the cooling plate 54 only. As shown in FIG. 34, in the process chamber 50, the temperature sensor 543 which measures a board | substrate temperature is provided, and according to the detection value of the temperature sensor 543, the board | substrate temperature control apparatus 8 is equipped with a cooling plate ( 54 and the cold wind nozzle 542 may be selectively controlled.

(Substrate movement control mechanism)

Depending on the distance between the lamp 52 and the substrate 10 and the reflection state of the light on the reflecting plate, the amount of light irradiated onto the surface of the substrate 10 may be locally nonuniform. Therefore, in FIG. 35, at the position shown by the solid line, after irradiating ultraviolet rays for a predetermined time, the movement control device 9 moves the stage 51 by the distance W of the feature substrate 10 first. You may make it move to a longitudinal direction. Thereby, the light irradiated to the to-be-processed board | substrate 10 can be made more uniform compared with the case of processing without moving the stage 51. FIG.

The distance W can be changed within an effective irradiation range in which the illuminance from the lamp 52 becomes a certain value or more, but considering the characteristics of the lamp 52, the distance W should be moved by about 1/2 of the lamp pitch. desirable. For example, when the lamp 52 is equipped with five lamps having a light tube outer diameter of 27.5 mm and a light emitting length of 1000 mm, five lamps are mounted and the substrate 10 to be processed shown in FIG. 1 of 550 mm × 650 mm is processed. Illuminates the illuminance value of the illuminometer (the first illuminometer 55) having a peak sensitivity between the wavelength ranges of 340 to 370 nm for 75 seconds / cm &lt; 2 &gt; for 25 seconds, after which the substrate 10 to be treated is subjected to the length of the substrate. Direction W = 125 mm, and it irradiates for 25 second at 75 dl / cm <2>. Thereby, reaction nonuniformity which arises in the liquid crystal panel 20 can be suppressed, and production of the liquid crystal panel 20 with high performance can be implement | achieved.

(Manufacturing method of liquid crystal panel using an ultraviolet irradiation device)

As shown in step S11 of FIG. 36, when processing the to-be-processed substrate 10 shown in FIG. 1 using the 1st UV irradiation apparatus 5a shown in FIG. 14, a setup is first performed. As the setup, for example, various setting data for driving the lamp control device 7, the substrate temperature control device 8, the movement control device 9, and the voltage application control device 64 are stored (not shown). ) Can be entered.

Furthermore, after arranging the test target substrate 10 on the stage 51 and setting the inside of the processing chamber 50 to the processing conditions, the surface roughness of the target substrate 10 and its roughness The relationship between the illuminance values of the first illuminometer 55 and the second illuminometer 56 is derived. Thereby, the relationship with the actual illuminance value of the surface of the to-be-processed substrate 10 is calculated based on the illuminance value of the 1st illuminometer 55 and the 2nd illuminometer 56. FIG.

After the setup is finished, the transfer robot 62 shown in Fig. 8 arranges the substrate 10 to be processed on the cooling plate 54 of Fig. 14, and in step S12, the substrate to be processed ( Start cooling of 10). The cooling method may be air-cooled by 5-15 degreeC cold air based on the magnitude | size of the to-be-processed board | substrate 10, and as shown in FIG. 34, the board | substrate temperature is detected by the temperature sensor 543, and a board | substrate The cooling plate 54 or the cold air nozzle 542 may be controlled by the substrate temperature control device 8 so that the temperature is controlled to 70 ° C. or lower, for example.

Subsequently, in step S13, a predetermined voltage (for example, 0 to 30 V) is applied to the substrate 10 to be processed. In step S14, in the state which applied the voltage to the to-be-processed board | substrate 10, lamp light is irradiated for 25 second on the conditions which the illuminance value of the 1st illuminometer 55 is 75 mW / cm <2>, for example. Then, in step S15, the stage 51 is moved to the longitudinal direction of the to-be-processed board | substrate 10, and in step S16, the voltage is applied to the to-be-processed board | substrate 10, for example, 1 The lamp light is irradiated for 25 seconds under the condition that the illuminance value of the illuminometer 55 is 75 mW / cm 2.

In the lamp control device 7 of Fig. 14, when the lamp 52 has an illuminance value of 40 mW / cm 2 or more, the product of the illuminance value of the first illuminometer 55 and the irradiation time of the lamp is 2000 mJ. The ultraviolet-ray is irradiated to the to-be-processed substrate 10 so that it may become / cm <2> or more. In addition, when the amount of change in the illuminance value of the first illuminometer 55 with respect to the irradiation time of the lamp becomes 10% or less, the power of the lamp is controlled. The uniformity is calculated and the power of the lamp is controlled so that the uniformity is at least 75%. The substrate 10 to be processed is carried out from the processing chamber 50 of FIG. 14 in step S17, and is transferred to the inverting unit 6 by the transfer robot 62 of FIG. 8.

According to the UV irradiation part 5 (1st UV irradiation apparatus 5a) which concerns on embodiment shown in FIG. 8, ultraviolet irradiation of 340 nm or less of wavelength range which affects the performance etc. of the liquid crystal panel after manufacture can be suppressed. Therefore, the liquid crystal panel which improved the yield at high performance can be manufactured.

(Other Embodiments)

Although this invention was described by the above-mentioned embodiment, the description and drawings which form a part of this indication should not be understood as limiting this invention. Various alternative embodiments, examples and operational techniques will become apparent to those skilled in the art from this disclosure.

(Harmful wavelength illuminance judgment mechanism)

In the above-described embodiment, the illuminance determination unit 72 shown in FIG. 29 determines the illuminance based on the illuminance value of the first illuminometer 55 and controls the lamp power based on the determination result. Explained. However, the illuminance determination unit 72 shown in FIG. 29 may determine the illuminance of the wavelength (harmful wavelength) affecting the characteristics of the liquid crystal panel based on the illuminance value of the second illuminometer 56.

As shown in Fig. 37A, when the substrate 10 shown in Fig. 1 is processed, an ultraviolet ray having a wavelength of 340 nm or 320 nm or less, particularly a wavelength of 313 nm showing an emission peak of mercury is shown. When light is irradiated to the diagonal part of the to-be-processed board | substrate 10, as shown to FIG. 37 (b), white nonuniformity remains in the liquid crystal panel 20 after irradiation. FIG. 38 shows a relationship between the influence of panel degradation affected by ultraviolet rays having a wavelength of 313 nm when the second illuminometer 56 detecting ultraviolet rays having a wavelength of 313 nm is used.

As shown in Fig. 38, when the illuminance value is 1 dB / cm 2 or less, panel degradation as shown in Fig. 37 (b) is unlikely to occur, but when the illuminance value is 1 dB / cm 2 or more, Fig. 37 (b) The rate at which panel deterioration occurs as shown in FIG. Therefore, when the illuminance value of the second illuminometer 56 becomes 1 mW / cm 2 or more, the illuminance determination unit 72 shown in Fig. 29 provides the user with, for example, a display device not shown in the drawings. Warning, or a mechanism (not shown) for adjusting the angle of the reflector 57 or the auxiliary reflector 58 shown in Fig. 15 may be controlled.

As such, the present invention obviously includes various embodiments and the like which are not described herein. Therefore, the technical scope of this invention is determined only by the invention specific matter which concerns on an appropriate claim from said description.

1 is a cross-sectional view showing an example of a substrate to be processed according to the embodiment of the present invention.

FIG. 2 shows a specific example of the polymer body 18 of FIG.

3 is a cross-sectional view showing an example of a liquid crystal panel after irradiating ultraviolet rays to the substrate 10 of FIG.

4 is a perspective view illustrating an alignment state of the alignment portion 21 of FIG.

Fig. 5 is a schematic diagram showing the vertical elevation angle θ of the alignment portion 21 of Fig. 3.

FIG. 6 is a cross-sectional view showing a state (when no voltage is applied) of the liquid crystal body of the liquid crystal panel of FIG.

FIG. 7 is a cross-sectional view showing a state (when voltage is applied) of the liquid crystal body of the liquid crystal panel of FIG.

8 is a plan view showing an example of an entire configuration of a liquid crystal panel manufacturing apparatus according to an embodiment of the present invention.

Fig. 9 is a flowchart showing the operation of the liquid crystal panel manufacturing apparatus of Fig. 8;

Fig. 10 is a schematic diagram showing details of the inversion section in Fig. 8;

FIG. 11 is a schematic diagram showing an example of a specific operation of the inverting portion of FIG. 10; FIG.

12 is a schematic view showing details of the inspection unit of FIG. 8;

FIG. 13 is a schematic view showing an example of a specific operation of the inspection unit in FIG. 12; FIG.

14 is a schematic view showing details of the UV irradiation part of FIG. 8;

Fig. 15 is a schematic diagram showing an example of the peripheral configuration of the lamp of Fig. 14;

Fig. 16 is a schematic diagram showing an example of the peripheral configuration of the lamp of Fig. 14;

FIG. 17 is a schematic view of the lamp of FIG. 14 viewed in the longitudinal direction (axial direction). FIG.

18 is a graph showing the spectral sensitivity of an irradiation system suitable for the first irradiation system of FIG.

19 is a graph showing the spectral sensitivity of an irradiation system suitable for the second irradiation system of FIG.

20 is a graph showing the spectral distribution of a thallium-based metal halide lamp.

21 is a graph showing the spectral distribution of an iron-based metal halide lamp.

Fig. 22 is a graph showing a comparison of spectral distributions of an iron-based metal halide lamp and a thallium-based metal halide lamp.

Fig. 23 is a graph showing a comparison of spectral distributions of an iron-based metal halide lamp and a mercury lamp.

24 is a graph showing the illuminance distribution in the axial direction of the iron-based metal halide lamp.

FIG. 25 is a sectional view of a peripheral portion of the lamp shown in FIG. 14; FIG.

Fig. 26 is a graph showing the spectral transmittance distribution of the heat ray absorption filter shown in Fig. 25;

FIG. 27 is a first graph showing the relationship between the incident angle and the transmittance of the filter shown in FIG.

FIG. 28 is a second graph showing the relationship between the incident angle and the transmittance of the filter shown in FIG.

Fig. 29 is a block diagram showing a specific example of the lamp control device shown in Fig. 14;

30 is a diagram showing a relationship between an illuminance value, an irradiation time, a polymerization effect, deterioration, and a production efficiency when the substrate to be processed shown in FIG. 1 is processed;

Fig. 31 is a graph for explaining the calculation method of the leveling system according to the embodiment of the present invention.

32 is a table showing a relationship between a leveling agent and panel performance.

33 is a plan view of a cooling plate according to the embodiment of the present invention.

34 is a schematic diagram illustrating a substrate temperature control mechanism according to the embodiment of the present invention.

35 is a schematic diagram illustrating a substrate movement control mechanism according to an embodiment of the present invention.

36 is a flowchart for explaining an example of a liquid crystal panel manufacturing method according to the embodiment of the present invention.

FIG. 37 shows the effect of the hazardous wavelength region (313 nm) on the characteristics of the substrate to be treated, FIG. 37 (a) shows the substrate to be treated during irradiation, and FIG. 37 (b) shows the liquid crystal panel after irradiation. Floor plan.

Fig. 38 is a table showing a relationship between illuminance values and panel deterioration;

<Explanation of symbols for the main parts of the drawings>

2: Import part

3, 6: inverting part

4: Inspection unit

4a: first inspection device

4b: second inspection device

5: UV irradiation part

5a: 1st UV irradiation apparatus

5b: 2nd UV irradiation apparatus

7: lamp control device

8: substrate temperature control device

9: movement control device

10: substrate to be processed

11: semiconductor device

12, 14: substrate

13: color filter

15, 16: transparent electrode

17: liquid crystal

18: polymer

19: sealing part

20: liquid crystal panel

21, 22: alignment part

25: carrier robot

30, 40, 50: treatment chamber

31: first adsorption unit

32: second adsorption unit

33: third adsorption unit

34, 36: movable part

35: rotating part

41: mounting table

42: backlight irradiation unit

43: CCD camera

44: authorized connector

45: voltage applying unit

51: stage

52: lamp

53: filter

54: cold plate

55: first illuminometer

56: second illuminometer

57: reflector

58: auxiliary reflector

61: display device

62: transport robot

63: ionizer

64: voltage application control device

71: lamp power control unit

72: illuminance determination unit

73: accumulated light amount determination unit

74: uniformity determination unit

75: storage device

100: cooling tube

101: inner tube

102: appearance

103: heat absorption filter

520: airtight container

521, 522: electrode

541 coolant flow path

542 cold air nozzle

543: temperature sensor

Claims (10)

A processing chamber for processing a substrate to be processed containing a liquid crystal body containing a photoreactive substance therein; A plurality of lamps disposed in the processing chamber to irradiate the target substrate with ultraviolet rays to react the photoreactive substance to form an alignment portion in the target substrate; And a filter that opposes the lamp and suppresses the transmission of ultraviolet light in a wavelength region of at least wavelength 320 to 360 nm. The apparatus of claim 1, wherein the photoreactive material is a polymer. The liquid crystal panel manufacturing apparatus according to claim 1, wherein the photoreactive substance is an azo compound. The cutoff according to claim 1, wherein the filter has a cutoff wavelength N defined in the case of vertical incidence in the range of 320 to 360 nm, and the angle of incidence of ultraviolet rays with respect to the filter is 0 ° to 60 °. The liquid crystal panel manufacturing apparatus characterized by the change of a wavelength including the filter in the range of -15 nm <N <+15 nm. A first illuminometer having a peak sensitivity between a wavelength region of 340 to 370 nm, disposed above the lamp; And a lamp control device for controlling the electric power of the lamp so that the illuminance value of the first illuminometer becomes 25 to 100 mW / cm 2. A first illuminometer having a peak sensitivity between a wavelength region of 340 to 370 nm, disposed above the lamp; And a lamp control device for controlling the electric power of the lamp so that the illuminance value of the first illuminometer becomes 40 to 75 mW / cm 2. The said lamp is irradiated with the ultraviolet-ray to the said to-be-processed board | substrate so that the product of the illuminance value of the said 1st illuminometer and the irradiation time of the said lamp may be 2000 mJ / cm <2> or more. Liquid crystal panel manufacturing device. The liquid crystal panel manufacturing apparatus according to claim 5 or 6, wherein the lamp control device controls the power of the lamp so that the amount of change in the illuminance value of the first illuminometer with respect to the lighting time of the lamp is 10% or less. . The liquid crystal panel manufacturing apparatus according to any one of claims 1 to 6, further comprising a voltage applying device for applying a voltage to the substrate to be processed. Irradiating ultraviolet rays through a filter that suppresses the transmission of ultraviolet rays in a wavelength region of at least 320 to 360 nm to a substrate to be processed containing a liquid crystal body containing a photoreactive substance therein and reacting the photoreactive substance. And a step of forming an alignment portion in the inside of the substrate to be processed.

Images