KR20080000162A - Flat type heat transfer device and its manufacturing method - Google Patents

Abstract

A flat type heat transfer device and a manufacturing method thereof are provided to simplify whole structure and assembly structure, and reduce a manufacturing cost by forming a mesh type single structure combining a linear member to a capillary wick, and increase flexibility and durability while securing a stable mechanical supporting strength at the inside of the flat type heat transfer device. A flat case frame(10) forms a sealed inner space. Coolant is injected into the case frame. A single weaving structure(20) is installed in the case frame, and includes the capillary wick(21) weaving horizontal/vertical wires to absorb the coolant, and the linear member(30) forming a space passing vaporized coolant by weaving to the capillary wick with a line diameter different from the wire of the capillary wick. The case frame forms an upper and lower side, and comprises a first and second plate forming the sealed inner space.

Description

Plate type heat transfer device and its manufacturing method

1 is a perspective view showing a conventional thin plate heat transfer device,

Figure 2 is an exploded perspective view showing a plate heat transfer apparatus of an embodiment according to the present invention,

Figure 3 is a perspective view of an embodiment showing a state in which the linear member is installed in the capillary wick in the present invention,

4 is a cross-sectional view taken along the line A-A of FIG. 3;

5 is a cross-sectional view showing a state in which the capacitive wick and the linear member of the embodiment are installed inside the case;

Figure 6 is a flow chart for explaining an embodiment of a method for combining the capillary wick and the linear member according to the present invention,

7 is a flow chart for explaining another embodiment of a method for combining a capacitive wick and a linear member according to the present invention;

8 through 10 are plan views illustrating various embodiments of a method of fitting a linear member to a captive wick,

Figure 11 is a perspective view of another embodiment showing a state in which the linear member is installed in the capillary wick in the present invention,

12 is a cross-sectional view taken along the line B-B in FIG. 11;

13 and 14 are views showing the configuration of another embodiment of the linear member used in the present invention,

15 is a view showing a configuration in which a single structure is arranged in multiple structures in a planar tube structure in the present invention;

FIG. 16 is a view showing a linear member installed in a capillary wick having a multiple structure in a planar tube structure in the present invention.

<Explanation of symbols for the main parts of the drawings>

10: case body 11: first plate

12: second plate 15: flat tube

20: unitary structure 21: capillary wick

22: horizontal line 23: vertical line

30: linear member C: cutout

P: Insertion pipe F: Pipe fixing panel

The present invention relates to a plate heat transfer apparatus that can be applied to electronic devices such as CPUs, IC chips, and printed circuit boards. In particular, the present invention relates to a simple structure using a mesh-type structure in which a linear member is coupled to a capacitive wick. It relates to a plate-shaped heat transfer device and a method for manufacturing the same.

Plate heat transfer devices, also commonly referred to as heat pipes, are cooling devices that transfer heat from a place where the exothermic density is high to a low place using latent heat necessary for the phase change process of the fluid.

As electronic products such as notebooks, PDAs, mobile phones, and flat panel display devices become ultra light and slim, development of heat transfer devices that allow thin plate-type heat transfer devices to be thin and light and have excellent cooling performance continues.

1 is a perspective view showing a heat pipe disclosed in Japanese Patent Laid-Open No. 2004-22603, which is one of the plate heat transfer devices. Referring to this, looking at the plate-shaped heat transfer device structure of the prior art as follows.

The thin plate heat transfer apparatus includes a container 1 formed by joining peripheral portions 4 of polymerized thin sheets 2 and 3 and a mesh that is housed in the container 1 in a movable state to generate capillary force ( 5) and a working fluid enclosed in the container 1.

In particular, the mesh 5 is formed such that the vertical lines 6 and the horizontal lines 7 have different diameters, and the drawing illustrates a configuration in which the diameter of the vertical lines 6 is increased.

The plate-type heat transfer device provided with the mesh 5 supports a space between the vertical stripes 6 having a relatively large diameter in the mesh 5 and forms a space therein, so that the gaseous refrigerant flows. It will form a passageway.

However, in the thin plate heat transfer device as described above, since the diameter of one of the horizontal lines 7 and the vertical lines 6, that is, the line diameter is large, the space between the horizontal lines 7 and the vertical lines 6 is not dense. Capillary force is greatly reduced, there is a problem that the flow of the liquid refrigerant is not smooth.

In addition, when the gap between the horizontal line 7 and the vertical line 6 is densely formed to increase the capillary force due to the above problems, a relatively large wire 6 is formed inside the container 1. Since it is in close contact with the upper and lower surfaces of the container 1 while occupying a considerable volume, the dense vertically arranged vertical line 6 prevents the flow of the gaseous refrigerant, there is a problem that the flow of the gaseous refrigerant is not smooth.

As described above, the conventional thin plate heat transfer device has a problem in that the cooling efficiency is lowered as a whole because the flow of the liquid refrigerant and the gaseous refrigerant is not smooth.

In addition, the conventional thin plate heat transfer device is manufactured by the method of weaving the horizontal line 7 and the vertical line 6 with different wire diameters, the manufacturing method is not only extremely limited, it is difficult to apply to a porous capital wick, etc. There is also a problem.

The present invention has been made to solve the above problems, by combining a linear member to the capacitive wick to form a single structure to simplify the overall structure and assembly structure, plate-type heat transfer device that can reduce the manufacturing cost and It is an object to provide a method for producing the same.

Another object of the present invention is to provide a plate heat transfer device and a method of manufacturing the same that ensure mechanically stable support rigidity within the plate heat transfer device and increase durability while increasing flexibility of the plate heat transfer device. .

In addition, the present invention, by forming a single weave structure by weaving a linear member that forms a space for the gaseous refrigerant passing through the capillary wick to form a single weave structure, the movement of the liquid refrigerant and the gaseous refrigerant can be made at the same time, thereby the overall thickness is thin Another object is to provide a plate heat transfer apparatus and a method of manufacturing the same, which can be made thin and ultra thin, and at the same time light weight.

Another object of the present invention is to provide a plate heat transfer apparatus and a method for manufacturing the same, which can improve the cooling efficiency by solving the problem of lowering capillary force as a whole.

Another object of the present invention is to provide a plate heat transfer apparatus and a method for manufacturing the same, which can further improve the cooling efficiency by sufficiently securing the moving passage of the gas phase refrigerant as well as the liquid phase refrigerant.

According to an aspect of the present invention, there is provided a plate heat transfer apparatus comprising: a case body having a planar structure forming a sealed inner space; A refrigerant injected into the case body; A capacitive wick formed inside the case body and formed by weaving a wire in a horizontal and vertical direction to absorb a liquid refrigerant, and formed to have a wire diameter different from that of the wire of the capacitive wick. Weaving is characterized in that it comprises a single woven structure consisting of a linear member that forms a space for the gaseous refrigerant to pass through.

The case body may be composed of a first plate and a second plate, which respectively constitute an upper surface and a lower surface, and form a sealed inner space.

The case body may also consist of a planar tube forming an outer cell.

The wire diameter of the linear member is preferably larger than the wire diameter of the wire constituting the capital wick.

Preferably, the plurality of linear members are installed in a structure woven in the capacitive wick, and in this case, the plurality of linear members is preferably disposed parallel to the capacitive wick.

In the case where the linear member is formed in plural, the adjacent linear member and the position exposed by being woven from the capacitive wick are installed to be opposite, or the other linear member and the position exposed from the capacitive wick are the same. Can be installed.

Alternatively, the linear member may be installed in a woven structure in a zigzag manner to the capacitive wick.

The linear member as described above is preferably formed of at least one of a metal material, a synthetic resin material, a glass material, a graphite material.

The linear member may be formed of a porous material, or the linear member may have a bundle structure in which a plurality of wires are collected.

In addition, a single structure in which a linear member is coupled to the capacitive wick may be arranged in a multi-structure in the case body, or the capillary wick may be arranged in a multi-structure, and the linear member may be inserted and coupled therebetween. have.

The capacitive wick and the linear member may be made of different materials.

In addition, the plate-shaped heat transfer apparatus according to the present invention for realizing the above object, the case body of the planar structure to form a sealed inner space; A refrigerant injected into the case body; A capacitive wick provided inside the case body and absorbing a liquid refrigerant; And a linear member installed to be coupled to the capacitive wick to form a space through which the gaseous refrigerant passes.

In this case, the capillary wick may be made of a porous sheet, or may be composed of any one of a groove sheet.

Method for manufacturing a single structure of the plate-shaped heat transfer apparatus according to the present invention for realizing the above object, to weave the linear member together in the process of weaving the horizontal line and vertical line to produce a single structure to enter the internal space of the case body It is characterized by.

In addition, the single structure manufacturing method of the plate-shaped heat transfer apparatus according to the present invention for realizing the above object, at least one cut portion to form a linear member at a predetermined distance to the capacitive wick, the cut formed cap A linear member is inserted into the wick to produce a unitary structure to enter the inner space of the case body.

It is preferable that the said cutting part is formed using a press die.

In addition, in the method for manufacturing a single structure of the plate heat transfer apparatus according to the present invention for realizing the above object, the capacitive wick is folded and arranged in a zigzag manner, and the linear member is inserted into the thus arranged capacitive wick. Unfold the capillary wick to produce a single structure that will enter the interior space of the plate heat transfer device.

Here, when inserting the linear member into the capacitive wick, it is preferable to insert the insertion pipe into the capacitive wick first, and then to insert the linear member into the insertion pipe.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

Figure 2 is an exploded perspective view showing a plate heat transfer apparatus according to the present invention, Figure 3 is a perspective view of an embodiment showing a linear member is installed in the capillary wick in the present invention, Figure 4 is a line AA of Figure 3 5 is a cross-sectional view showing a state in which the capacitive wick and the linear member of the embodiment are installed inside the case.

2 to 5, the plate heat transfer apparatus according to the present invention is provided with a first plate 11 constituting the upper surface, and a second plate 12 constituting the lower surface. The first plate 11 and the second plate 12 form a case body 10 constituting the appearance of the plate heat transfer device.

Here, the first plate 11 and the second plate 12 is composed of a plate having a rigid enough to protect the internal structure, such as aluminum (aluminum), titanium (titanium), plastic It may be made of plastic, metalized plastic, graphite or other metal materials, plastic combinations, or the like, and a copper plate, which is preferably a metal material having high heat transfer rate, may be used.

The first plate 11 and the second plate 12 as described above form a top plate and a bottom plate, and the edges of the two plates 11 and 12 are joined to each other to form a sealed structure so that the refrigerant does not flow out. The case body 10 is formed. And either plate is in close contact with the heat source side, such as a PCB board or IC chip is configured to cool.

For example, the first plate 11 may be formed in a planar structure such that the first plate 11 may be easily adhered to a PCB, an IC chip, or the like, and an adhesive layer may be formed on the plane.

In the inner space of the two plates 11 and 12, that is, the case body 10, the capacitive wick 21 is provided to absorb the liquid refrigerant by capillary action.

The capacitive wick 21 is preferably formed in a flat sheet-like structure, the material may be composed of a synthetic fiber material having a porous structure, or a woven fabric produced by weaving a wire.

In the present embodiment to be described below, a woven body manufactured by weaving wires in the horizontal and vertical directions will be described. For convenience, the horizontal wire is referred to as a horizontal line 22, and the vertical wire is referred to as a vertical line 23.

The capacitive wick 21 is coupled to the linear member 30 by a method such as weaving to form a single mesh weaving structure 20. The linear member 30 is disposed between the two plates 11 and 12. In addition, the inner space of the support is secured, and the gaseous refrigerant evaporated in the capacitive wick 21 is installed to secure a passage for moving.

This structure is made possible by the diameter of the linear member 30, that is, the diameter of the wire, being larger than the diameter of the horizontal line 22 and the vertical line 23 constituting the capacitive wick 21.

The linear member 30 is preferably formed of a wire structure in which one or more materials of metal, synthetic resin, glass, or graphite are mixed, but is not limited thereto. It can be configured to have, but the configuration of another modified embodiment will be described again later with reference to FIGS.

In addition, one or more linear members 30 are installed in the capacitive wick 21, and a plurality of the linear members 30 are installed in the capacitive wick 21 at regular intervals.

The structure for coupling the linear member 30 to the capacitive wick 21 can be configured by combining in various ways according to the implementation conditions, the coupling structure of one embodiment will be described with reference to FIGS.

As shown in FIG. 3, the capacitive wick 21 has a structure in which a horizontal line 22 and a vertical line 23 are woven, and in the same direction as the vertical line 23 in the capacitive wick 21 (a horizontal line ( 22) may be coupled to the upper and lower portions of the capacitive wick 21 so that the plurality of linear members 30 are alternately positioned.

At this time, the plurality of linear members 30 are arranged in parallel to each linear member 30, it is preferable that the spacing on each linear member 30 is arranged to be uniform.

In this way, the capillary wick 21 and the linear members 30 constitute a single meshed woven structure 20.

FIG. 5 is a cross-sectional view illustrating a plate heat transfer apparatus in which two structures 11 and 12 are provided with a structure in which a plurality of linear members 30 are fitted into a capacitive wick 21 of a woven fabric. According to the structure, the gaseous refrigerant moves between the two plates 11 and 12 while the capacitive wick 21 is in close contact with the two plates 11 and 12 by the linear member 30 having a relatively large wire diameter. The space K can be secured.

Therefore, in the plate heat transfer apparatus, the liquid refrigerant is evaporated into the gaseous refrigerant by heat transferred from at least one of the two plates 11 and 12 in a state where the liquid refrigerant is absorbed into the capillary wick 21 by a capillary phenomenon. The vaporized refrigerant evaporated in this way is transferred through the internal space (K) formed by the linear member 30 to transfer heat.

In particular, according to the present invention, since the linear member 30 is separately coupled to the wick wick 21 woven in the horizontal and vertical directions, the linear member (with the capillary force of the capacitive wick 21 sufficiently maintained) Since the space is secured by 30, the capillary effect is superior to the structure in which the wire diameters of the horizontal wires and the vertical wires of the capacitive wick 21 are different, and the cooling performance can be excellent.

In addition, since the capital wick 21 and the linear member 30 form a single mesh-like weaving structure 20, it is possible to easily install inside the case body 10 and maintain sufficient mechanical rigidity.

Hereinafter, a method of coupling the capillary wick 21 and the linear member 30 according to the present invention as described above with reference to FIGS. 6 and 7 will be described.

First, FIG. 6 is a flowchart illustrating an embodiment of a method of combining a capacitive wick and a linear member according to the present invention.

According to the embodiment shown in FIG. 6, a cut is formed at the place where the linear member 30 is to be inserted in the capacitive wick 21, that is, a plurality of cutouts C, and then each of the cutouts C is formed between the cutouts C. FIG. A single structure 20 to be inserted into the inner space of the plate heat transfer apparatus is manufactured by fitting the linear members 30.

The capacitive wick 21 is preferably composed of a woven body, but is not necessarily limited thereto, and may be variously adopted as long as it can generate capillary force such as a porous sheet.

And the method of forming the cutout (C) in the capacitive wick 21 may be a method in which the manufacturer directly forms the cutout (C) in the capacitive wick 21 with a tool such as a knife, more preferably The method of forming the cutout (C) by the press working method using a mold manufactured to form the cutout (C) in a predetermined arrangement is preferred.

Next, Figure 7 is a flow chart for explaining another embodiment of the method of coupling the capacitive wick 21 and the linear member 30 according to the present invention.

According to the embodiment shown in FIG. 7, the capacitive wick 21 is folded in a zigzag manner, and then a plurality of linear members 30 are inserted into the folded wick 21, and the capacitive wick 21 is inserted. ) To produce a single structure 20 to enter the inner space of the plate heat transfer device.

At this time, when inserting the linear member 30 in the folded capacitive wick 21, inserting the insertion pipe (P) in place to insert the linear member 30, and then in the insertion pipe (P) After inserting 30, the insertion pipe P may be removed and the capillary wick 21 may be unfolded while only the linear member 30 is left.

Here, the insertion pipe P is preferably used in a state where a plurality of fixing pipes F are fixed together, and if necessary, in advance in the portion where the linear member 30 is inserted in the capacitive wick 21. The method of forming the hole H and inserting the linear member 30 in this hole is also possible.

Next, various methods of fitting the linear member 30 to the capacitive wick 21 will be described with reference to FIGS. 8 to 10.

FIG. 8 is a plan view illustrating a structure in which the linear member 30 is inserted into the capacitive wick 21, similar to the embodiment of FIGS. 4 and 5, wherein the single structure 20A includes a plurality of linear members 30. The neighboring linear members 30 and the capacitive wick 21 are exposed to be opposite positions.

Specifically, in FIG. 8, the first linear member 30A and the second linear member 30B are fitted in parallel to the capacitive wick 21, but the first linear member 30A is capped in the capacitive wick 21. When raised to the top of the), the second linear member 30B is in the manner of being fitted to descend to the lower portion of the capacitive wick 21.

Such a structure has a characteristic that the space between the two plates 11 and 12 is easily secured and uniform.

Unlike the example of FIG. 8, the unitary structure 20B shown in FIG. 9 is installed in the capacitive wick 21 so that the positions where the plurality of linear members 30 are exposed to the neighboring linear members 30 are the same. will be.

In the single structure 20C illustrated in FIG. 10, one linear member 30 is zigzag inclined with respect to the horizontal direction of the capacitive wick 21 as shown in FIGS. 8 and 9. It is a figure which illustrates the structure installed by being fitted.

Of course, in FIG. 10, one linear member 30 is used, but a plurality of linear members 30 may be fitted in a zigzag manner as necessary.

Meanwhile, in the above, the structure in which the linear member 30 is fitted to the capacitive wick 21 has been described as an example. However, the linear member 30 may also be used when the capacitive wick 21 is manufactured by weaving. It is also possible to combine the weaving together.

The plate-shaped heat transfer apparatus of the present invention described above has a structure in which the linear member 30 is fitted to the capacitive wick 21, but with reference to FIGS. 11 and 12, another embodiment of the present invention to be described is a capillary When weaving the wick 21, a method of weaving together will be described.

FIG. 11 is a perspective view of another embodiment in which the linear member 30 is installed in the capacitive wick 21 in the present invention, and FIG. 12 is a sectional view taken along the line B-B of FIG.

Capillary wick 21 as shown therein is configured by weaving the horizontal line 22 and the vertical line 23, a relatively thick, i.e. linear to either wire of the horizontal line 22 or vertical line (23) The coarse linear member 30 is formed by adding or replacing the weave.

In the drawing of the present embodiment has been illustrated a configuration in which the linear member 30 having a larger line diameter than the other vertical line 23 at every predetermined interval of the vertical line 23 is added, it is also possible to configure the same in the horizontal line 22 direction, of course. .

Here, the linear member 30 may be made of the same material as the vertical line 23 or the horizontal line 22 for weaving the capacitive wick 21 or may be made of another material. However, the linear member 30 may be formed to have a thickness that can secure a sufficient space in the plate heat transfer device.

On the other hand, the portion where the linear member 30 is woven in the capacitive wick 21, it is preferable to weave in a sex muscle structure than other parts.

That is, it is also possible to increase the spacing between the vertical lines 23 in which the linear member 30 is located, and to make the spacing between the vertical lines 23 and the vertical lines 23 relatively narrow.

Such another embodiment of the present invention is to weave together the linear member 30 of different thickness when weaving the capacitive wick 21, the linear member 30 to the capacitive wick 21 according to the present invention The coupling structure is facilitated, and in some cases, the linear member 30 may also contribute to increase the cooling efficiency by serving as an auxiliary function for generating capillary force together with the capillary wick 21.

13 and 14 are views showing the configuration of another embodiment of the linear member used in the present invention.

FIG. 13 is a structure in which the linear member 30 is foamed so that the linear member 30 itself has a capillary force.

That is, the foamed linear member 30 has a space in which the liquid refrigerant can flow as the inside thereof is formed in a porous structure, and thus the capillary force is improved along with the capillary wick 21 to increase the cooling efficiency. To contribute.

Here, the foamed linear member 30 is configured to improve the cooling efficiency while reducing the weight of the plate-shaped heat transfer device as a whole, and the method in which the capillary wick 21 is combined may be various methods as in the above-described embodiments. It is possible to combine.

14 is a view illustrating a structure in which the linear member 30 is formed in a bundle structure, which can also improve capillary force.

That is, one linear member 30 is made of a structure in which a plurality of wires (W) having a small wire diameter is made into one bundle and coupled to the capacitive wick 21. For example, the linear member 30 may have a structure such as a nanotube.

In this case, as the linear member 30 is bundled, the capillary force can be improved by enlarging the surface area through the respective wires w.

Next, FIGS. 15 and 16 are diagrams of embodiments showing a configuration in which a single structure is arranged in multiple structures in a planar tube structure.

Unlike the above-described embodiment, the plate-shaped heat transfer device of the present embodiment does not constitute a case body 10 by joining the first plate 11 and the second plate 12, but constitutes one flat tube that forms the outer cell. It consists of 15, in which the unitary structure 20 in which the cape wick 21 and the linear member 30 were combined is provided.

Here, the flat tube 15 is formed by pressing a cylindrical tube having a predetermined length into a plate-like structure, inserting a single structure 20 and a refrigerant therein, and then sealing both openings.

Hereinafter, the single structure shown in FIGS. 15 and 16 will be described. For reference, in the present exemplary embodiment, the single structure 20 is illustrated in the planar tube 15. However, the present invention is not limited thereto, and the case body composed of the first plate 11 and the second plate 12 is not limited thereto. Of course, it is also applicable to (10).

15 shows a configuration in which a single structure 20 having a linear member 30 coupled to a capacitive wick 21 is arranged in a multi-structure (double structure in the drawing) in a planar tube.

FIG. 16 shows a configuration in which the capacitive wick 21 is arranged in multiple structures in a planar tube, and a single structure 20 is disposed by combining the linear members 30 therein.

Meanwhile, in the present invention, the capillary wick 21 may use a synthetic fiber material having a porous structure in addition to the woven body, such a structure is formed to have a planar shape and a porous structure to generate a capillary phenomenon. to be. Capillary wick 21 composed of such a porous synthetic fiber material may be composed of a foam sheet, a mesh formed with a plurality of holes, and the like.

In addition, the capillary wick may be composed of a groove sheet in which a plurality of grooves or holes are formed in addition to the porous synthetic fiber.

In addition, if the capacitive wick 21 having a known sheet structure used in the plate heat transfer device, as described above, it can be applied by combining the linear member 30 having a relatively large wire diameter.

The plate heat transfer apparatus and its manufacturing method according to the present invention configured and acted as described above have the following effects as the capillary wick and the linear member are combined to form a single structure.

First, in the present invention, since the capillary wick and the linear member are formed in a single structure, there is no need to assemble separately when assembling the plate heat transfer apparatus, and the assembly structure can be simplified at a time, so that the assembly structure can be simplified and the costs associated with the assembly can be achieved. It is reduced to have the advantage of reducing the overall manufacturing cost of the plate heat transfer device.

Next, since the present invention is coupled to the captive wick as if the linear member is fitted, it is possible to secure a sufficient and stable mechanical support rigidity inside the plate heat transfer device, thereby increasing the flexibility of the plate heat transfer device while increasing durability You will have the advantage of strengthening.

Next, the present invention, since the capillary wick and the linear member is formed as a single structure, the overall thickness is thinner than the conventional plate heat transfer device that used a separate support structure, the ultra-thin configuration is possible, as well as the material of the linear member Therefore, there is an advantage that weight can be realized.

Next, the present invention has the advantage of easy production of a unitary structure when weaving linear members together when weaving a capillary wick.

In addition, the present invention also has the advantage that a simple structure can be manufactured by simply inserting the linear member in the capillary wick when the linear member is inserted by folding the capillary wick.

In particular, the present invention solves the problem that the capillary force is lowered as a whole because the unitary structure is formed by combining the linear members without changing the structure of the capillary wick, and the linear member is configured to have the capillary force. The capillary force as a whole has an advantage to improve the cooling efficiency.

In addition, since it is configured in such a way that the linear member is coupled to the upper and lower capillary wick, it is possible to ensure a sufficient flow passage of the gas phase refrigerant as well as the liquid refrigerant, the refrigerant flow can be made more smoothly, accordingly It also has the advantage of further improving the cooling efficiency of the heat medium.

Claims (22)

A case body of a planar structure forming a sealed inner space; A refrigerant injected into the case body; And A capacitive wick formed inside the case body and formed by weaving a wire in a horizontal and vertical direction to absorb a liquid refrigerant; A plate-shaped heat transfer device comprising a single weave structure consisting of a linear member that is woven to form a space through which a gaseous refrigerant passes. The method according to claim 1, The case body comprises a first plate and a second plate constituting the upper surface and the lower surface, respectively, and forming a sealed inner space. The method according to claim 1, The case body is a plate-shaped heat transfer device, characterized in that consisting of a flat tube forming an outer cell. The method according to claim 1, The wire diameter of the linear member is formed larger than the wire diameter of the wire constituting the capital wick. The method according to claim 1, The linear member is a plate heat transfer device, characterized in that a plurality of the woven installed in the wick wick. The method according to claim 5, And said plurality of linear members are disposed parallel to said capillary wick. The method according to claim 5, The plurality of linear members are plate heat transfer apparatus, characterized in that the installed position is opposite to the other linear member and the woven and exposed in the capital wick. The method according to claim 5, The plurality of linear members are plate heat transfer apparatus, characterized in that installed in the same position as the other linear member and the neighboring linear weave in the wick. The method according to claim 1, The linear member is a plate-shaped heat transfer device, characterized in that installed in a zigzag woven structure on the capillary wick. The method according to any one of claims 1 to 9, The linear member is a plate-shaped heat transfer device, characterized in that formed of at least one material of a metal material, synthetic resin material, glass material, graphite material. The method according to any one of claims 1 to 9, The linear member is a plate heat transfer device, characterized in that formed of a porous material. The method according to any one of claims 1 to 9, The linear member is a plate heat transfer device, characterized in that consisting of a bundle structure of a plurality of wires aggregated. The method according to claim 1, The plate heat transfer device, characterized in that a single structure in which the linear member is coupled to the capillary wick is arranged in a multiple structure in the case body. The method according to claim 1, The capillary wick is arranged in a multiple structure, the linear member is inserted between the plate-shaped heat transfer device, characterized in that coupled. A case body of a planar structure forming a sealed inner space; A refrigerant injected into the case body; A capacitive wick provided inside the case body and absorbing a liquid refrigerant; And And a linear member installed to be coupled to the capacitive wick to form a space through which the gaseous refrigerant passes. The method according to claim 15, The capillary wick is a plate-shaped heat transfer device, characterized in that consisting of a porous sheet. The method according to claim 15, The capillary wick is plate-shaped heat transfer device, characterized in that consisting of a groove (groove) sheet having a plurality of grooves or holes. In the method for producing a plate-shaped heat transfer device of any one of claims 1 to 9, In the process of weaving the horizontal line and the vertical line, the linear member is also woven together to produce a unitary structure of the plate-shaped heat transfer apparatus, characterized in that for producing a single structure to enter the inner space of the case body. In the method for producing a plate-shaped heat transfer device of any one of claims 1 to 9, Forming at least one cut portion to fit the linear member at a predetermined distance to the capital wick, Method of manufacturing a single structure of the plate-shaped heat transfer device, characterized in that for manufacturing a single structure to be inserted into the inner space of the case body by inserting a linear member in the capped wick formed cut. The method according to claim 19, The cut portion is formed using a press die, characterized in that the unitary structure manufacturing method of the plate heat transfer device. In the method for producing a plate-shaped heat transfer device of any one of claims 1 to 9, Folding and placing the capillary wick in a zigzag manner, inserting a linear member into the capillary wick thus arranged, and then expanding the capillary wick to produce a single structure to enter the inner space of the plate heat transfer apparatus. Method of manufacturing a single structure of a plate heat transfer device. The method according to claim 21, When the linear member is inserted into the capillary wick, the insertion pipe is first inserted into the capillary wick, and then the linear member is inserted into the insertion pipe, thereby manufacturing a single structure of the plate heat transfer device.

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