JP7111266B2 - vapor chamber - Google Patents

Description

The present invention relates to vapor chambers.

In recent years, the amount of heat generated has been increasing due to the high integration and high performance of devices. In addition, as products become smaller, heat generation density increases, so heat dissipation measures have become important. This situation is particularly noticeable in the field of mobile terminals such as smartphones and tablets. A graphite sheet or the like is often used as a heat countermeasure member, but its heat transfer capacity is not sufficient, so the use of various heat countermeasure members has been investigated. Among them, the use of a vapor chamber, which is a planar heat pipe, is being studied because it can diffuse heat very effectively.

The vapor chamber has a structure in which a working medium and a wick that transports the working medium by capillary force are sealed inside a housing. The working medium absorbs heat from the heating element in the evaporating section that absorbs heat from the heating element, evaporates in the vapor chamber, moves to the condensing section, is cooled, and returns to the liquid phase. The working medium that has returned to the liquid phase moves again to the evaporating portion on the heating element side by the capillary force of the wick, and cools the heating element. By repeating this, the vapor chamber can operate independently without external power, and heat can be two-dimensionally diffused at high speed by utilizing the latent heat of vaporization and latent heat of condensation of the working medium.

For example, in Patent Document 1, a housing, a first pillar arranged in the internal space of the housing so as to support the housing from the inside, a working medium enclosed in the internal space of the housing, the above a wick arranged in an internal space of a housing, wherein one main surface of the wick has a portion supported by the first pillar and away from the housing, and the thickness of the wick is partially different. A vapor chamber is disclosed. Furthermore, Patent Document 1 describes that the vapor chamber may further include a second pillar that supports the other main surface of the wick. The second pillar supports the other main surface of the wick, and the height of the second pillar is lower than the height of the first pillar.

WO2019/065728

In the vapor chamber described in Patent Literature 1, the provision of the first pillar makes it possible to secure a vapor flow path through which the gaseous working medium moves. Moreover, the liquid working medium can be held between the second pillars by providing the second pillars. As a result, the transport capacity of both the gaseous and liquid working medium is increased, thereby improving the heat transport capacity of the vapor chamber.

Such first pillars and second pillars can be formed on the inner wall surface of the housing by a method such as etching or printing, for example. Here, the larger the contact area between the first pillar and the second pillar with the housing or the wick, the easier it is to maintain the structural strength of the vapor chamber. Since the permeation channel area becomes small, it becomes difficult to obtain a high heat transport capacity.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a vapor chamber having a high heat transport capacity. Another object of the present invention is to provide an electronic device including the vapor chamber.

The vapor chamber of the present invention comprises a housing, a working medium enclosed in the internal space of the housing, a wick arranged in the internal space of the housing, and a pillar arranged in the internal space of the housing. , wherein the pillar has a constriction that is narrower than the ends.

An electronic device of the present invention includes the vapor chamber of the present invention.

ADVANTAGE OF THE INVENTION According to this invention, the vapor chamber which has high heat-transport ability can be provided.

FIG. 1 is a cross-sectional view schematically showing an example of the vapor chamber according to the first embodiment of the invention. FIG. 2 is a cross-sectional view enlarging a part of the vapor chamber shown in FIG. FIG. 3 is a cross-sectional view schematically showing another example of the vapor chamber according to the first embodiment of the invention. FIG. 4 is a cross-sectional view schematically showing an example of the vapor chamber according to the second embodiment of the invention. FIG. 5 is a cross-sectional view schematically showing an example of a vapor chamber according to a third embodiment of the invention. FIG. 6 is a cross-sectional view schematically showing an example of a vapor chamber according to a fourth embodiment of the invention. FIG. 7 is a cross-sectional view schematically showing an example of a vapor chamber according to a fifth embodiment of the invention.

The vapor chamber of the present invention will be described below.
However, the present invention is not limited to the following configurations, and can be appropriately modified and applied without changing the gist of the present invention. It should be noted that a combination of two or more of the individual preferred configurations of the invention described below is also the invention.

Each embodiment shown below is an example, and it goes without saying that partial replacement or combination of configurations shown in different embodiments is possible. In the second and subsequent embodiments, descriptions of matters common to the first embodiment will be omitted, and only different points will be described. In particular, similar actions and effects due to similar configurations will not be mentioned sequentially for each embodiment.

In the following description, when each embodiment is not particularly distinguished, it is simply referred to as "the vapor chamber of the present invention".

[First embodiment]
In the vapor chamber according to the first embodiment of the present invention, the pillars include a first pillar and a second pillar, and both the first pillar and the second pillar have constrictions.

FIG. 1 is a cross-sectional view schematically showing an example of the vapor chamber according to the first embodiment of the invention. FIG. 2 is a cross-sectional view enlarging a part of the vapor chamber shown in FIG.
The vapor chamber 1 shown in FIGS. 1 and 2 includes a housing 10, a working medium 20, a wick 30, and first and second pillars 41 and 42 as pillars.

As shown in FIG. 1, the housing 10 has a pair of inner wall surfaces facing each other in the thickness direction (the vertical direction in FIG. 1). In FIG. 1, a housing 10 is composed of a first sheet 11 and a second sheet 12 facing each other and joined at their outer edges. The first sheet 11 and the second sheet 12 approach each other toward the outer edge and are in contact, joined and sealed at the outer edge.

The working medium 20 is enclosed in the internal space 50 of the housing 10 .

The wick 30 is arranged in the internal space 50 of the housing 10 . In FIG. 1 , neither one main surface nor the other main surface of wick 30 is in contact with housing 10 . That is, the wick 30 is arranged away from the housing 10 .

The first pillar 41 is arranged in the internal space 50 of the housing 10 and provided between the wick 30 and the housing 10 so as to support one main surface of the wick 30 . The first pillar 41 is preferably in contact with the housing 10 . In FIG. 1 , the first pillar 41 is provided between the first sheet 11 and the wick 30 . The space between the first sheet 11 and the wick 30 functions as a vapor channel through which the gaseous working medium moves.

The first pillar 41 has a constricted portion 41A between the end on the wick 30 side and the end on the housing 10 side that is narrower than both ends. The constricted portion 41A can maintain the gas (vapor) permeation flow channel area while maintaining the contact area with the housing 10 or the wick 30 . Furthermore, the constricted portion 41A can prevent the wick 30 from bending or denting even when an external force is applied to the vapor chamber 1 . As a result, the heat transport capacity can be increased.

The second pillar 42 is arranged in the internal space 50 of the housing 10 and provided between the wick 30 and the housing 10 so as to support the other main surface of the wick 30 . The height of the second pillar 42 is lower than the height of the first pillar 41 . The second pillar 42 is preferably in contact with the housing 10 . In FIG. 1 , the second pillar 42 is provided between the second sheet 12 and the wick 30 . The space between the second pillars 42 functions as a liquid flow path through which the liquid working medium moves. Furthermore, since the liquid working medium can be held between the second pillars 42, it becomes easy to increase the amount of the working medium in the vapor chamber. Here, the second pillar refers to a portion that is relatively higher than its surroundings, and in addition to the portion that protrudes from the main surface, such as a columnar portion, etc., the recess formed in the main surface, such as a groove, provides a relative height. It also includes the part where the height is relatively high.

The second pillar 42 has a constricted portion 42A between the end on the wick 30 side and the end on the housing 10 side that is narrower than both ends. The constricted portion 42A can maintain the liquid permeation flow channel area while maintaining the contact area with the housing 10 or the wick 30 . Furthermore, the constricted portion 42A can prevent the wick 30 from being bent or dented even when an external force is applied to the vapor chamber 1 . As a result, the heat transport capacity can be increased.

Materials forming the first pillar 41 and the second pillar 42 are not particularly limited, but examples include resins, metals, ceramics, or mixtures and laminates thereof. The material forming the first pillar 41 may be the same as or different from the material forming the second pillar 42 . Also, the material forming the first pillar 41 may be the same as or different from one or both of the housing 10 and the wick 30 . Similarly, the material forming second pillar 42 may be the same as or different from either or both housing 10 and wick 30 .

The thickness of the end of the first pillar 41 on the wick ₃₀ side (the length indicated by D11 in FIG. 2) and the thickness of the end of the first pillar 41 on the housing 10 side (the length indicated by D12 in FIG. ₂ ) 2) are both thicker than the thickness of the constricted portion 41A of the first pillar 41 (the length indicated by D13 _in FIG. 2).

The thickness D11 of the end of the first pillar 41 _on the wick 30 side is preferably thicker than the thickness D12 of the end of the first pillar 41 on the housing ₁₀ side, as shown in FIG. Thereby, the contact area with the wick 30 can be increased. The thickness D11 of the end of the first pillar 41 _on the wick 30 side may be thinner than the thickness D12 of the end of the first pillar 41 _on the housing 10 side. It may be the same as the thickness D12 of the end _on the housing 10 side.

The thickness of the end of the second pillar 42 on the wick 30 side ₍ the length indicated by D21 in FIG. 2) and the thickness of the end of the second pillar 42 on the housing 10 side ₍ the length indicated by D22 in FIG. 2) 2) are both thicker than the thickness of the constricted portion 42A of the second pillar 42 (the length indicated by _D23 in FIG. 2).

The thickness D21 of the end portion of the second pillar 42 on the wick ₃₀ side is preferably thicker than the thickness _D22 of the end portion of the second pillar 42 on the housing 10 side, as shown in FIG. Thereby, the contact area with the wick 30 can be increased. The thickness D21 of the end portion of the second pillar 42 on the wick ₃₀ side may be thinner than the thickness _D22 of the end portion of the second pillar 42 on the housing 10 side. It may be the same as the thickness _D22 of the end on the housing 10 side.

In this specification, the thickness of the first pillar and the second pillar means the circle equivalent diameter of the cross section perpendicular to the height direction of the first pillar and the second pillar.

As shown in FIG. 2, the constricted portion 41A of the first pillar 41 is preferably located closer to the housing 10 than the center between the end on the wick 30 side and the end on the housing 10 side. . In this case, the constricted portion 41A of at least one first pillar 41 may be positioned closer to the housing 10 than the center between the end on the wick 30 side and the end on the housing 10 side. It is preferable that the constricted portions 41A of all the first pillars 41 are positioned closer to the housing 10 than the center between the end on the wick 30 side and the end on the housing 10 side.

It is preferable that the constricted portion 42A of the second pillar 42 be located near the center between the end on the wick 30 side and the end on the housing 10 side. In this case, the constricted portion 42A of at least one second pillar 42 may be positioned near the center between the end on the wick 30 side and the end on the housing 10 side, but all the second pillars A constricted portion 42A of 42 is preferably located near the center between the end on the wick 30 side and the end on the housing 10 side.

Therefore, as shown in FIG. 2, in the height direction of the first pillar 41 and the second pillar 42, the distance from the constricted portion 41A of the first pillar 41 to the end on the wick 30 side is L _A1 , and the first pillar 41 L _B1 is the distance from the constricted portion 41A of the second pillar 42 to the end on the housing 10 side; L _A2 is the distance from the constricted portion 42A of the second pillar 42 to the end on the wick 30 side; It is preferable that L _B1 /(L _A1 +L _B1 )<L _B2 /(L _A2 +L _B2 ) holds, where L _B2 is the distance to the end on the housing 10 side.

Although not shown in FIGS. 1 and 2, the inner wall surface of housing 10 is preferably rougher than the outer wall surface of housing 10 . By roughening the inner wall surface of the housing 10, the mechanical strength is further increased by the anchor effect.

Moreover, it is preferable that the inner wall surface of the housing 10 on which the first pillars 41 are provided is rougher than the inner wall surface of the housing 10 on which the second pillars 42 are provided. Generally, since the interval between the first pillars 41 is larger than the interval between the second pillars 42, roughening the inner wall surface of the housing 10 on which the first pillars 41 are provided makes it difficult for the first pillars 41 to peel off. .

FIG. 3 is a cross-sectional view schematically showing another example of the vapor chamber according to the first embodiment of the invention.

As shown in FIG. 3 , a portion of first pillar 41 may enter gaps 31 A and 31 B within wick 30 . Similarly, a portion of second pillar 42 may enter voids 31A and 31B within wick 30 .

In FIG. 3, two types of voids 31A and 31B are shown for convenience of explanation, but the type, shape, depth, etc. of the voids in the wick 30 are not particularly limited.

If a part of the first pillar 41 or the second pillar 42 enters the gap in the wick 30, high adhesive strength can be obtained due to the anchor effect.

When a part of the first pillar 41 or the second pillar 42 enters the gaps in the wick 30 , it may enter all the gaps in the wick 30 or part of the gaps.

In FIG. 3 , both the first pillar 41 and the second pillar 42 enter the gap within the wick 30 , but either the first pillar 41 or the second pillar 42 enters the gap within the wick 30 . good too.

When part of the first pillar 41 enters the gap in the wick 30, the depth of the first pillar 41 entering the gap (the length indicated by d _41A in FIG. 3) is the depth of the gap. (The length indicated by _d31 in FIG. 3) is preferably 1% or more and 20% or less. When the first pillar 41 enters a plurality of gaps, it is sufficient that the ratio of the depth of the first pillar 41 entering at least one gap satisfies the above range.

When the first pillars 41 enter gaps of different sizes, the depths of the first pillars 41 entering the gaps may be the same or different. When the depth of the first pillar 41 entering the gap is different, the depth of the first pillar 41 entering the relatively large gap is greater than the depth of the first pillar 41 entering the relatively small gap. may be deep or shallow.

When part of the second pillar 42 enters the gap in the wick 30, the depth of the second pillar 42 entering the gap (the length indicated by d _42A in FIG. 3) is the depth of the gap. (The length indicated by _d31 in FIG. 3) is preferably 1% or more and 10% or less. When the second pillar 42 enters a plurality of gaps, the ratio of the depth of the second pillar 42 entering at least one gap should satisfy the above range.

When the second pillars 42 enter gaps of different sizes, the depths of the second pillars 42 entering the gaps may be the same or different. When the depth of the second pillar 42 entering the gap is different, the depth of the second pillar 42 entering the relatively large gap is greater than the depth of the second pillar 42 entering the relatively small gap. may be deep or shallow.

The shape of the first pillar 41 is not particularly limited as long as it can support the housing 10 (that is, the first sheet 11 and the second sheet 12), but it is preferably columnar. Examples of the shape of the cross section of the first pillar 41 perpendicular to the height direction include a polygon such as a rectangle, a circle, and an ellipse.

The height of the first pillar 41 is higher than the height of the second pillar 42 . The height of the first pillar 41 is preferably 1.1 times or more and 50 times or less, more preferably 1.3 times or more and 10 times or less, and still more preferably 1.5 times or more5 the height of the second pillar 42. less than double.

The height of the first pillar 41 can be appropriately set according to the thickness of the vapor chamber, preferably 20 μm or more and 500 μm or less, more preferably 30 μm or more and 300 μm or less, still more preferably 50 μm or more and 150 μm or less. Here, the height of the first pillar 41 means the height in the thickness direction of the vapor chamber.

The height of the first pillars 41 may be the same or different in one vapor chamber. For example, the height of the first pillars 41 in one region may be different from the height of the first pillars 41 in another region. By changing the height of some first pillars, the thickness of the vapor chamber can be partially changed.

The thickness of the first pillar 41 is not particularly limited as long as it provides strength capable of suppressing deformation of the housing of the vapor chamber. is, for example, 100 μm or more and 2000 μm or less, preferably 300 μm or more and 1000 μm or less. By increasing the equivalent circle diameter of the first pillar, deformation of the housing of the vapor chamber can be further suppressed. Further, by reducing the equivalent circle diameter of the first pillar, it is possible to secure a wider space for the vapor of the working medium to move.

Although the arrangement of the first pillars 41 is not particularly limited, it is preferable that the first pillars 41 are arranged evenly in a predetermined area, more preferably evenly over the entire area. be. By evenly arranging the first pillars, uniform strength can be ensured throughout the vapor chamber.

The number and spacing of the first pillars 41 are not particularly limited, but are preferably 0.125 or more and 0.5 or less, and more preferably 0.5 or more per 1 mm ² of the main surface area of one sheet that defines the interior space of the vapor chamber. is 0.2 or more and 0.3 or less. By increasing the number of first pillars, deformation of the vapor chamber or housing can be further suppressed. Further, by reducing the number of the first pillars, it is possible to secure a wider space for the vapor of the working medium to move.

Although the shape of the second pillar 42 is not particularly limited, it is columnar, for example. In this case, the cross-sectional shape of the second pillar 42 perpendicular to the height direction may be, for example, a polygon such as a rectangle, a circle, or an ellipse. Also, the shape of the second pillar 42 may be wall-like, that is, a shape in which a groove is formed between adjacent second pillars 42 .

The height of the second pillar 42 is not particularly limited, but is preferably 1 μm or more and 100 μm or less, more preferably 5 μm or more and 50 μm or less, and still more preferably 20 μm or more and 40 μm or less. By increasing the height of the second pillar, a greater amount of working medium can be retained. Further, by lowering the height of the second pillar, it is possible to secure a wider space (space on the first pillar side) for the vapor of the working medium to move. Therefore, by adjusting the height of the second pillar, the heat transport function and heat conductivity (or heat diffusion performance) of the vapor chamber can be adjusted. The height of the second pillars 42 may be the same or different in one vapor chamber.

The distance between the second pillars 42 is not particularly limited, but is preferably 1 μm or more and 1000 μm or less, more preferably 10 μm or more and 500 μm or less, and still more preferably 50 μm or more and 300 μm or less. By reducing the distance between the second pillars, the capillary force can be increased. Further, by increasing the distance between the second pillars, the transmittance can be further increased.

The vapor chamber 1 is planar as a whole. That is, the housing 10 is planar as a whole. Here, the term “planar shape” includes plate-like and sheet-like shapes, and has a shape whose length and width are considerably large relative to its height (thickness), for example, the length and width are 10 times the thickness. It means a shape that is 100 times or more, preferably 100 times or more.

The size of the vapor chamber 1, that is, the size of the housing 10 is not particularly limited. The length and width of the vapor chamber 1 can be appropriately set according to the intended use, and are, for example, 5 mm or more and 500 mm or less, 20 mm or more and 300 mm or less, or 50 mm or more and 200 mm or less.

The housing 10 preferably consists of a first sheet 11 and a second sheet 12 facing each other with their outer edges joined together. Materials for the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for use as a vapor chamber, such as thermal conductivity, strength, softness, and flexibility. The material that constitutes the first sheet 11 and the second sheet 12 is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing them as a main component. Copper is particularly preferable. is. The materials forming the first sheet 11 and the second sheet 12 may be the same or different, but are preferably the same.

The thickness of the first sheet 11 and the second sheet 12 is not particularly limited, but is preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, for example preferably 40 μm or more and 60 μm or less. The thickness of the first sheet 11 and the second sheet 12 may be the same or different. Further, the thickness of each sheet of the first sheet 11 and the second sheet 12 may be the same over the entire area, or may be thin in part.

The first sheet 11 and the second sheet 12 are joined together at their outer edges. The method of such bonding is not particularly limited, but for example, laser welding, resistance welding, diffusion bonding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic bonding or resin sealing can be used, preferably can use laser welding, resistance welding or brazing.

The wick 30 is not particularly limited as long as it has a capillary structure capable of moving the working medium by capillary force. The capillary structure of the wick 30 may be any known structure used in conventional vapor chambers. The capillary structure includes fine structures having unevenness such as pores, grooves, and projections, such as porous structures, fiber structures, groove structures, and network structures.

The material of the wick 30 is not particularly limited, and for example, metal porous membranes, meshes, non-woven fabrics, sintered bodies, porous bodies, etc. formed by etching or metal working are used. The mesh that is the material of the wick 30 may be composed of, for example, a metal mesh, a resin mesh, or a surface-coated mesh thereof, preferably a copper mesh, a stainless steel (SUS) mesh, or a polyester mesh. be. The sintered body that is the material of the wick 30 may be composed of, for example, a metal porous sintered body or a ceramic porous sintered body, preferably a porous sintered body of copper or nickel. be. The porous body that is the material of the wick 30 may be composed of, for example, a metal porous body, a ceramic porous body, or a resin porous body.

The wick 30 is preferably made of a porous material. The pore size of the porous body is preferably 10 μm or less. Note that the shape of the hole is not particularly limited.

Although the size and shape of the wick 30 are not particularly limited, for example, it is preferable that the wick 30 has a size and shape that allow it to be installed continuously from the evaporating section to the condensing section inside the housing 10 .

The thickness of the wick 30 is not particularly limited, but is, for example, 2 μm or more and 200 μm or less, preferably 5 μm or more and 100 μm or less, more preferably 10 μm or more and 40 μm or less. The thickness of the wick 30 may be partially different.

The working medium 20 is not particularly limited as long as it can cause a gas-liquid phase change in the environment inside the housing 10, and for example, water, alcohols, CFC alternatives, and the like can be used. For example, the working medium is an aqueous compound, preferably water.

[Second embodiment]
In the vapor chamber according to the second embodiment of the invention, the pillars include a first pillar and a second pillar, and only the first pillar has a constriction.

FIG. 4 is a cross-sectional view schematically showing an example of the vapor chamber according to the second embodiment of the invention.
The vapor chamber 2 shown in FIG. 4 has the same configuration as the vapor chamber 1 shown in FIG. 1 except that the second pillar 42 does not have the constricted portion 42A.

[Third Embodiment]
In the vapor chamber according to the third embodiment of the present invention, the pillars include the first pillar, and the first pillar has a constricted portion.

FIG. 5 is a cross-sectional view schematically showing an example of a vapor chamber according to a third embodiment of the invention.
The vapor chamber 3 shown in FIG. 5 has the same configuration as the vapor chamber 1 shown in FIG. 1 except that the second pillar 42 does not exist. In FIG. 5 , one main surface of wick 30 is not in contact with housing 10 , and the other main surface of wick 30 is in contact with housing 10 .

[Fourth Embodiment]
In the vapor chamber according to the fourth embodiment of the invention, the pillars include a first pillar and a second pillar, and only the second pillar has a constriction.

FIG. 6 is a cross-sectional view schematically showing an example of a vapor chamber according to a fourth embodiment of the invention.
The vapor chamber 4 shown in FIG. 6 has the same configuration as the vapor chamber 1 shown in FIG. 1 except that the first pillar 41 does not have the constricted portion 41A.

[Fifth embodiment]
In the vapor chamber according to the fifth embodiment of the present invention, a wick is provided so as to support the inner wall surface of the housing.

FIG. 7 is a cross-sectional view schematically showing an example of a vapor chamber according to a fifth embodiment of the invention.
The vapor chamber 5 shown in FIG. 7 includes a housing 10, a working medium 20, a wick 30, and first pillars 41 as pillars. The vapor chamber 5 shown in FIG. 7 has the same configuration as the vapor chamber 1 shown in FIG. 1 except that the shape and arrangement of the wick 30 are different.

The wick 30 is provided so as to support the inner wall surface of the housing 10 . The wick 30 extends along the back-front direction in FIG. By arranging the wick 30 that supports the inner wall surface of the housing 10 in the internal space of the housing 10 , the mechanical strength of the housing 10 can be ensured and the impact from the outside of the housing 10 can be absorbed.

In the example shown in FIG. 7, the wick 30 is in contact with the inner wall surface of the first sheet 11 and the inner wall surface of the second sheet 12 . That is, the wick 30 is in contact with both inner wall surfaces of the housing 10 . The wick 30 may be in contact with only one inner wall surface of the housing 10 or may not be in contact with both inner wall surfaces of the housing 10 .

As shown in FIG. 7, it is preferable that a plurality of wicks 30 be arranged at intervals in the direction perpendicular to the direction in which the wicks 30 extend. In this case, between the adjacent wicks 30, a steam flow path is formed through which the gaseous working medium flows.

Although not shown in FIG. 7, a gap may be provided inside the wick 30 along the direction in which the wick 30 extends. A gap provided inside the wick 30 can be used as a liquid flow path through which a liquid working medium flows. In particular, heat transport efficiency can be improved by alternately arranging liquid channels and vapor channels with adjacent wicks 30 interposed therebetween.

The first pillar 41 is provided so as to support the inner wall surface of the housing 10 . The first pillars 41 are arranged in the steam flow path, and the steam flow path is divided between the first pillars 41 .

In the example shown in FIG. 7 , the first pillar 41 is in contact with the inner wall surface of the first sheet 11 and the inner wall surface of the second sheet 12 . That is, the first pillar 41 is in contact with both inner wall surfaces of the housing 10 . The wick 30 may be in contact with only one inner wall surface of the housing 10 or may not be in contact with both inner wall surfaces of the housing 10 .

It is preferable that the first pillars 41 are arranged in all of the steam channels formed between the adjacent wicks 30, but there are some steam channels in which the first pillars 41 are not arranged. may exist.

The first pillar 41 has a constricted portion 41</b>A that is thinner than both ends between one end on the inner wall surface side of the housing 10 and the other end on the inner wall surface side of the housing 10 .

The thickness of the end portion of the first pillar 41 on the one inner wall surface side of the housing 10 may be thicker than the thickness of the end portion of the first pillar 41 on the other inner wall surface side of the housing 10 . The thickness of the end of the first pillar 41 on the other inner wall surface side of the housing 10 may be thinner than that of the end of the housing 10 , or the thickness of the end of the first pillar 41 on the other inner wall surface side of the housing 10 may be the same. good too.

The constricted portion 41A of the first pillar 41 may be located on either one end side of the first pillar 41, or may be located near the center between the both ends.

Although not shown in FIG. 7, the inner wall surface of housing 10 is preferably rougher than the outer wall surface of housing 10 . By roughening the inner wall surface of the housing 10, the mechanical strength is further increased by the anchor effect.

[Other embodiments]
The vapor chamber of the present invention is not limited to the above-described embodiments, and various applications and modifications can be made within the scope of the present invention regarding the configuration of the vapor chamber, manufacturing conditions, and the like.

In the vapor chamber of the present invention, each pillar may have one constriction or two or more constrictions. If the pillar has two or more constrictions, the thickness of the constrictions may be the same or different. In one vapor chamber, the number of pillar constrictions may be the same or different.

In the vapor chamber of the present invention, when the pillars include first pillars, each first pillar may have one constricted portion, or may have two or more constricted portions. When the first pillar has two or more constricted portions, the thickness of the constricted portions may be the same or different. In one vapor chamber, the number of constricted portions of the first pillar may be the same or different.

In the vapor chamber of the present invention, when the pillars include second pillars, each second pillar may have one constricted portion, or may have two or more constricted portions. When the second pillar has two or more constrictions, the thickness of the constrictions may be the same or different. In one vapor chamber, the number of constricted portions of the second pillar may be the same or different.

The planar shape of the vapor chamber of the present invention, that is, the planar shape of the housing is not limited to a rectangle, and may be, for example, a polygon such as a triangle or rectangle, a circle, an ellipse, or a combination thereof. The planar shape of the vapor chamber of the present invention may be L-shaped, C-shaped (U-shaped), or the like. Further, the planar shape of the vapor chamber of the present invention may have a through hole inside. The planar shape of the vapor chamber of the present invention may be a shape according to the intended use, the shape of the location where the vapor chamber is installed, and other parts present in the vicinity.

A method for manufacturing the vapor chamber of the present invention is not particularly limited as long as it is a method capable of obtaining the above configuration. For example, in the vapor chambers according to the first to fourth embodiments of the present invention, the first pillar and, if necessary, the second pillar are formed in advance on the wick, and the first sheet and the first sheet on which the wick is arranged and the second pillar are formed in advance. It can be obtained by stacking two sheets, joining them together while leaving an opening for enclosing the working medium, introducing the working medium into the housing through the opening, and then sealing the opening.

In the first to fourth embodiments of the present invention, the first pillar and the second pillar can be formed on the wick by a method such as printing, for example. At this time, by thermocompression bonding the wick to the first sheet and the second sheet, the constricted portions can be formed in the first pillar and the second pillar. Depending on the thermocompression bonding conditions, it is possible to adjust the shape of the constricted portions formed in the first pillar and the second pillar, the depth of the first pillar and the second pillar entering the gap in the wick, and the like.

The vapor chamber of the present invention can be mounted on electronic equipment for the purpose of heat dissipation. Therefore, an electronic device including the vapor chamber of the present invention is also one aspect of the present invention. Examples of the electronic device of the present invention include smart phones, tablet terminals, notebook computers, game machines, wearable devices, and the like. As described above, the vapor chamber of the present invention can operate independently without the need for external power, and utilize the latent heat of vaporization and latent heat of condensation of the working medium to diffuse heat two-dimensionally at high speed. Therefore, the electronic device including the vapor chamber of the present invention can effectively dissipate heat in a limited space inside the electronic device.

The vapor chamber of the present invention can be used for a wide range of applications in fields such as personal digital assistants. For example, it can be used to reduce the temperature of a heat source such as a CPU and extend the usage time of electronic devices, and can be used in smartphones, tablets, notebook PCs, and the like.

Reference Signs List 1, 2, 3, 4, 5 vapor chamber 10 housing 11 first sheet 12 second sheet 20 working medium 30 wick 31A, 31B void in wick 41 first pillar 41A first pillar constricted portion 42 second pillar 42A 2nd pillar constricted portion 50 Internal space D ₁₁ Thickness of the wick side end of the 1st pillar D ₁₂ Thickness of the housing side end of the 1st pillar D ₁₃ Thickness of the 1st pillar constricted portion D ₂₁ Thickness of the end of the second pillar on the wick side D ₂₂ Thickness of the end of the second pillar on the housing side D ₂₃ Thickness of the constricted portion of the second pillar L _A1 End of the wick side from the constricted portion of the first pillar L _B1 Distance from the constricted part of the 1st pillar to the end on the housing side L _A2 Distance from the constricted part of the 2nd pillar to the end on the wick side L _B2 Distance from the constricted part of the 2nd pillar to the housing side Distance to edge d depth of ₃₁ gap d depth of first pillar intruding into _41A gap d depth of second pillar intruding into _42A gap

Claims (11)

a housing;
a working medium enclosed in the internal space of the housing;
a wick arranged in the inner space of the housing;
and a pillar arranged in the internal space of the housing,
The pillar has a constriction narrower than both ends,
The pillar includes a first pillar provided between the wick and the housing so as to support one main surface of the wick,
The first pillar has the constricted portion between the wick-side end and the housing-side end ,
A vapor chamber , wherein a portion of the first pillar extends into a void within the wick . 2. The vapor chamber according to claim 1 , wherein the depth of said first pillar entering said void is 1% or more and 20% or less of the depth of said void. 3 . The vapor chamber according to claim 1 , wherein the constricted portion of the first pillar is located closer to the housing than a center between the end on the wick side and the end on the housing side. The pillar further includes a second pillar provided between the wick and the housing so as to support the other main surface of the wick,
The height of the second pillar is lower than the height of the first pillar,
The vapor chamber according to any one of claims 1 to 3 , wherein the second pillar has the constricted portion between the wick-side end and the housing-side end. In the height direction of the first pillar and the second pillar, L _A1 is the distance from the constricted portion of the first pillar to the end on the wick side, and the constricted portion of the first pillar to the end on the housing side. , the distance from the constriction of the second pillar to the end on the wick side is L _A2 , and the distance from the constriction of the second pillar to the end on the housing side is L _{B2 .} 5. The vapor chamber of claim 4 , wherein when L _B1 /(L _A1 +L _B1 )<L _B2 /(L _A2 +L _B2 ) holds. 6. A vapor chamber according to claim 4 or 5 , wherein a portion of said second pillar penetrates into voids within said wick. a housing;
a working medium enclosed in the internal space of the housing;
a wick arranged in the inner space of the housing;
and a pillar arranged in the internal space of the housing,
The pillar has a constriction narrower than both ends,
The pillar includes a first pillar provided between the wick and the housing so as to support one main surface of the wick, and a first pillar provided between the wick and the housing so as to support the other main surface of the wick. a second pillar between the body and
The height of the second pillar is lower than the height of the first pillar,
the second pillar has the constricted portion between the wick-side end and the housing-side end ;
A vapor chamber , wherein a portion of the second pillar extends into a void within the wick . 8. The vapor chamber according to claim 6 or 7 , wherein the depth of said second pillar entering said void is 1% or more and 10% or less of the depth of said void. The vapor chamber according to any one of claims 4 to 8 , wherein the inner wall surface of the housing on which the first pillars are provided is rougher than the inner wall surface of the housing on which the second pillars are provided. The vapor chamber according to any one of claims 1 to 9 , wherein the inner wall surface of the housing is rougher than the outer wall surface of the housing. An electronic device comprising the vapor chamber according to any one of claims 1 to 10 .

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