KR20070116808A - Anisotropic conductive adhesive and method of electrode connection therewith - Google Patents

Anisotropic conductive adhesive and method of electrode connection therewith Download PDF

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Publication number
KR20070116808A
KR20070116808A KR1020077020124A KR20077020124A KR20070116808A KR 20070116808 A KR20070116808 A KR 20070116808A KR 1020077020124 A KR1020077020124 A KR 1020077020124A KR 20077020124 A KR20077020124 A KR 20077020124A KR 20070116808 A KR20070116808 A KR 20070116808A
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South Korea
Prior art keywords
conductive adhesive
adhesive film
anisotropically conductive
component
foaming component
Prior art date
Application number
KR1020077020124A
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Korean (ko)
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KR101298829B1 (en
Inventor
미사오 고니시
Original Assignee
소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
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Publication of KR20070116808A publication Critical patent/KR20070116808A/en
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Publication of KR101298829B1 publication Critical patent/KR101298829B1/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H01L2924/01033—Arsenic [As]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/01049—Indium [In]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01078—Platinum [Pt]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Abstract

An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules.

Description

이방 도전성 접착제 및 이것을 이용한 전극의 접속 방법 {ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH}Anisotropic conductive adhesive and connection method of electrode using the same {ANISOTROPIC CONDUCTIVE ADHESIVE AND METHOD OF ELECTRODE CONNECTION THEREWITH}

본 발명은 예를 들어 표시 장치와 회로 기판간의 전기적인 접속에 사용되는 이방 도전성 접착제 및 이것을 이용한 전극의 접속 방법에 관한 것이다.TECHNICAL FIELD This invention relates to the anisotropically conductive adhesive used for the electrical connection between a display apparatus and a circuit board, for example, and the connection method of the electrode using the same.

종래부터, 예를 들어 액정 표시 장치와 집적 회로 기판 등을 전기적으로 접속하는 수단으로서, 이방 도전성 접착제가 이용되고 있다.Conventionally, an anisotropic conductive adhesive is used as a means for electrically connecting a liquid crystal display device, an integrated circuit board, etc., for example.

이 이방 도전성 접착제는, 예를 들어 플렉시블 프린트 기판 (FPC) 이나 IC 칩의 단자와, LCD 패널의 유리 기판 상에 형성된 ITO (Indium Tin Oxide) 전극의 단자를 접속하는 경우를 비롯하여, 여러 단자끼리를 접착함과 함께 전기적으로 접속하는 경우에 이용되고 있다.This anisotropic conductive adhesive is used to connect various terminals, for example, when connecting a terminal of a flexible printed circuit board (FPC) or an IC chip and a terminal of an indium tin oxide (ITO) electrode formed on a glass substrate of an LCD panel. It is used in the case of electrically connecting together with bonding.

이러한 이방 도전성 접착 필름에 있어서는, 최근 접속 단자의 파인 피치화에 수반하여, 여러 가지 문제가 발생하고 있다.In such an anisotropically conductive adhesive film, various problems arise with the fine pitch of a connection terminal in recent years.

예를 들어, 열압착시에 있어서의 기판의 휨에 의해 접속 불량이 생기거나, 액정 표시 장치 가장자리의 협소화 등에 의해 접속 부분에 있어서 쇼트가 발생하거나, 또한 접속용 범프의 미소화에 의해 도전 입자의 포착성이 저하되는 등의 문제가 있다.For example, connection failure may occur due to the warpage of the substrate at the time of thermocompression bonding, short may occur at the connection portion due to narrowing of the edge of the liquid crystal display device, or micronization of the bumps for connection may be performed. There is a problem such as deterioration in the trapping ability.

특허 문헌 1: 일본 공개특허공보 평11-60899호Patent Document 1: Japanese Patent Application Laid-Open No. 11-60899

본 발명은 이러한 종래의 기술의 과제를 해결하기 위하여 이루어진 것으로서, 파인 핏치의 접속 단자에 대하여 확실한 접속이 가능한 이방 도전성 접착제 및 이것을 이용한 전극의 접속 방법을 제공하는 것을 목적으로 한다.This invention is made | formed in order to solve such a subject of the prior art, and an object of this invention is to provide the anisotropically conductive adhesive which can be reliably connected to the connection terminal of fine pitch, and the connection method of the electrode using the same.

상기 목적을 달성하기 위하여 이루어진 본 발명은 절연성 접착제 성분 중에 가열에 의해 발포성이 발현되는 발포 성분과, 도전 입자가 분산되어 있는 이방 도전성 접착제이다.The present invention made to achieve the above object is an anisotropic conductive adhesive in which a foaming component in which foamability is expressed by heating in an insulating adhesive component and conductive particles are dispersed.

본 발명은 절연성 접착제 성분 중에 가열에 의해 발포성이 발현되는 발포 성분과, 도전 입자가 분산되어 필름 형상으로 형성되어 있는 이방 도전성 접착 필름이다.This invention is an anisotropically conductive adhesive film in which the foaming component which expresses foamability by heating in an insulating adhesive component, and electroconductive particle are disperse | distributed and formed in the film form.

본 발명은 상기 발명에 있어서, 상기 절연성 접착제 성분 중에 독립된 상태의 기포부가 형성되도록 발포 성분이 분산되어 있는 것이다.In the present invention, the foaming component is dispersed so that the bubble portion in an independent state is formed in the insulating adhesive component.

본 발명은 상기 발명에 있어서, 상기 발포 성분이 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 것이다.This invention WHEREIN: The said foaming component contains the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule.

본 발명은 상기 발명에 있어서, 절연성 접착 필름이 적층되어 있는 이방 도전성 접착 필름이다.This invention is an anisotropically conductive adhesive film in which the insulating adhesive film is laminated | stacked in the said invention.

본 발명은 상기 발명에 있어서, 상기 발포 성분을 함유하지 않는 이방 도전성 접착 필름과 상기 발포 성분을 함유하는 절연성 접착 필름이 적층되어 있는 이방 도전성 접착 필름이다.This invention is an anisotropically conductive adhesive film in which the anisotropically conductive adhesive film which does not contain the said foaming component, and the insulating adhesive film containing the said foaming component are laminated | stacked in the said invention.

본 발명은 접속용 전극을 갖는 복수의 접속 부재를 상기 전극끼리를 서로 대향시켜 배치하고, 상기 복수의 접속 부재간에 이방 도전성 접착제를 배치하여 가열 및 가압을 실시함으로써, 상기 접속 부재끼리를 접착함과 함께 상기 전극끼리를 전기적으로 접속하는 공정을 갖는 전극의 접속 방법으로서, 상기 이방 도전성 접착제로서, 절연성 접착제 성분 중에 가열에 의해 발포성이 발현되는 발포 성분과 도전 입자가 분산되어 있는 것을 이용하는 것이다.According to the present invention, a plurality of connecting members having a connecting electrode are disposed so that the electrodes face each other, an anisotropic conductive adhesive is disposed between the plurality of connecting members, and the heating and pressing are performed to bond the connecting members to each other. As an electrode connecting method which has a process of electrically connecting the said electrodes together, the thing in which the foaming component which expresses foamability by heating in the insulating adhesive component, and electroconductive particle are disperse | distributed as said anisotropic conductive adhesive agent.

본 발명은 상기 발명에 있어서, 상기 절연성 접착제 성분 중에 독립된 상태의 기포부가 형성되도록 상기 발포 성분이 분산되어 있는 이방 도전성 접착제를 이용하는 것이다.This invention uses the anisotropic conductive adhesive in which the said foaming component is disperse | distributed so that the bubble part of an independent state may be formed in the said insulating adhesive component.

본 발명은 상기 발명에 있어서, 상기 발포 성분이 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 이방 도전성 접착제를 이용하는 것이다.In this invention, the said foaming component uses the anisotropic conductive adhesive containing the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule.

본 발명은 상기 발명에 있어서, 상기 이방 도전성 접착제로서, 필름 형상으로 형성된 이방 도전성 접착 필름을 이용하는 것이다.This invention uses the anisotropically conductive adhesive film formed in the film form as said anisotropically conductive adhesive agent in the said invention.

본 발명은 상기 발명에 있어서, 상기 이방 도전성 접착제로서, 상기 이방 도전성 접착 필름에 절연성 접착 필름이 적층되어 있는 것을 이용하는 것이다.This invention uses the thing in which the insulating adhesive film is laminated | stacked on the said anisotropically conductive adhesive film as said anisotropically conductive adhesive agent in the said invention.

본 발명은 상기 발명에 있어서, 상기 이방 도전성 접착제로서, 상기 발포 성분을 함유하지 않는 이방 도전성 접착 필름과 상기 발포 성분을 함유하는 절연성 접착 필름이 적층되어 있는 것을 이용하는 것이다.This invention uses the thing in which the anisotropically conductive adhesive film which does not contain the said foaming component, and the insulating adhesive film containing the said foaming component are laminated | stacked as said anisotropically conductive adhesive agent in the said invention.

본 발명에서는 이러한 이방 도전성 접착제를 전극간에 배치하고, 가열 및 가압하면, 발포 성분의 발포성이 발현되고, 이방 도전성 접착제가 팽창하여 그 체적이 증가한다.In this invention, when such an anisotropically conductive adhesive agent is arrange | positioned between electrodes, and it heats and pressurizes, the foamability of a foaming component will express, an anisotropically conductive adhesive will expand and its volume will increase.

그 결과, 인접하는 전극간에 있어서의 도전 입자의 밀도가 저하되고, 이로써 절연 특성이 향상된다.As a result, the density of the electroconductive particle between adjacent electrodes falls, and, thereby, an insulation characteristic improves.

특히, 본 발명에 의하면, 전극의 높이보다 작은 두께의 이방 도전성 접착제라도 접속 부재간에 충전할 수 있고, 게다가 인접하는 전극 사이로의 도전 입자의 유입이 저지되므로, 파인 피치의 인접 전극간의 절연성을 향상시킬 수 있다.Particularly, according to the present invention, even if the anisotropic conductive adhesive having a thickness smaller than the height of the electrode can be filled between the connecting members, and the inflow of conductive particles between adjacent electrodes is prevented, the insulation between adjacent electrodes of fine pitch can be improved. Can be.

또한, 종래 기술에 비해 접착제 중의 수지 성분이 상대적으로 적기 때문에, 선팽창 계수 및 탄성률을 저하시킬 수 있고, 이로써 열압착시의 접속 부재의 휨을 경감시킬 수 있다.Moreover, since the resin component in an adhesive agent is comparatively few compared with the prior art, a linear expansion coefficient and an elasticity modulus can be reduced and thereby the curvature of the connection member at the time of thermocompression bonding can be reduced.

한편, 본 발명에 있어서, 예를 들어 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 이용하여, 독립된 상태의 기포부가 형성되도록 발포 성분이 분산되어 있는 경우에는, 접속 부재끼리의 접착력이 높고, 게다가 수분 등의 침입이 없어 도통 신뢰성이 높은 이방 도전성 접착제를 제공할 수 있다.On the other hand, in this invention, when foaming components are disperse | distributed so that the bubble part of an independent state may be formed using the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule, for example, the adhesive force of connection members is high, and also moisture It is possible to provide an anisotropic conductive adhesive having high conduction reliability without the intrusion of the back.

또한, 이방 도전성 접착제로서, 본 발명의 이방 도전성 접착 필름에 절연성 접착 필름을 적층한 것을 이용하면, 전기적 접속에 관여하지 않는 도전 입자의 수를 줄일 수 있으므로, 도전 입자의 유효 이용을 도모하는 것이 가능하게 된다.In addition, when an anisotropically conductive adhesive is obtained by laminating an insulating adhesive film on the anisotropically conductive adhesive film of the present invention, the number of conductive particles not involved in electrical connection can be reduced, so that effective use of the conductive particles can be achieved. Done.

또한, 이방 도전성 접착제로서, 발포 성분을 함유하지 않는 이방 도전성 접착 필름과 발포 성분을 함유하는 절연성 접착 필름을 적층한 것을 이용하면, 도전 입자의 유효 이용을 도모할 수 있는데 더하여, 발포 성분을 함유하는 층을 얇게 할 수 있기 때문에, 대향하는 접속 부재의 전극간에 발포 성분을 협지할 가능성이 저하되고, 그 결과, 열압착 조건에 있어서의 자유도를 넓힐 수 있다.Moreover, when the anisotropically conductive adhesive which laminated | stacked the anisotropically conductive adhesive film which does not contain a foaming component, and the insulating adhesive film containing a foaming component can be used as an anisotropically conductive adhesive agent, the effective use of electroconductive particle can be aimed at, and it contains a foaming component Since the layer can be made thin, the possibility of sandwiching the foam component between the electrodes of the opposing connecting members is reduced, and as a result, the degree of freedom in the thermocompression bonding conditions can be increased.

본 발명에 의하면, 파인 피치의 접속 단자에 대하여 확실한 접속이 가능한 이방 도전성 접착제 및 이것을 이용한 전극의 접속 방법을 제공할 수 있다.According to this invention, the anisotropically conductive adhesive which can be reliably connected to the fine pitch connection terminal, and the connection method of the electrode using the same can be provided.

도 1 의 (a)∼(c): 본 발명을 이용한 전극의 접속 방법의 실시형태를 나타내는 개략도이다.Fig.1 (a)-(c): It is schematic which shows embodiment of the electrode connection method using this invention.

도 2 의 (a), (b): 열압착시의 본 발명의 이방 도전성 접착제의 상태를 나타내는 개략도이다.(A), (b): It is schematic which shows the state of the anisotropically conductive adhesive agent of this invention at the time of thermocompression bonding.

도 3 의 (a), (b): 본 발명의 다른 실시형태를 이용한 전극의 접속방법을 나타내는 개략도이다.3 (a) and 3 (b): Schematic diagrams showing a method for connecting electrodes using another embodiment of the present invention.

도 4 의 (a), (b): 본 발명의 또 다른 실시형태를 이용한 전극의 접속 방법을 나타내는 개략도이다.Fig.4 (a), (b): It is schematic which shows the connection method of the electrode using another embodiment of this invention.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1: 이방 도전성 접착 필름 2: 회로 기판1: anisotropic conductive adhesive film 2: circuit board

3: 전극 4: IC 칩3: electrode 4: IC chip

5: 범프 (전극) 6: 절연성 접착제 수지5: bump (electrode) 6: insulating adhesive resin

7: 도전 입자 8: 발포 성분7: conductive particle 8: foaming component

9: 기포9: bubble

이하, 본 발명과 관련되는 이방 도전성 접착제 및 이것을 이용한 전극의 접 속 방법의 바람직한 실시형태를 도면을 참조하여 상세하게 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of the anisotropically conductive adhesive agent which concerns on this invention, and the electrode connection method using the same is described in detail with reference to drawings.

또한, 본 발명은 페이스트 형상 또는 필름 형상의 이방 도전성 접착제 중 어느 것에도 적용할 수 있는 것이다.Moreover, this invention is applicable to any of anisotropically conductive adhesives of a paste form or a film form.

도 1 의 (a)∼(c) 는 본 발명을 이용한 전극의 접속 방법의 실시형태를 나타내는 개략도, 도 2 의 (a)(b) 는 열압착시의 본 발명의 이방 도전성 접착제의 상태를 나타내는 개략도이다.Fig.1 (a)-(c) is schematic which shows embodiment of the connection method of the electrode using this invention, and Fig.2 (a) (b) shows the state of the anisotropic conductive adhesive of this invention at the time of thermocompression bonding. Schematic diagram.

도 1 의 (a) 및 도 2 의 (a) 에 나타내는 바와 같이, 본 발명의 이방 도전성 접착 필름 (1) 은 예를 들어 회로 기판 (접속 부재)(2) 의 전극 (3) 과, IC 칩 (접속 부재)(4) 의 범프 (전극)(5) 의 전기적인 접속에 이용되는 것으로서, 필름 형상의 절연성 접착제 수지 (6) 중에 도전 입자 (7) 가 분산되어 있다.As shown to Fig.1 (a) and FIG.2 (a), the anisotropically conductive adhesive film 1 of this invention is the electrode 3 of the circuit board (connection member) 2, for example, and an IC chip. It is used for the electrical connection of the bump (electrode) 5 of the (connection member) 4, and the electroconductive particle 7 is disperse | distributed in the film-shaped insulating adhesive resin 6.

본 발명의 경우, 도전 입자 (7) 로서는 종래 공지된 여러 가지의 것을 사용할 수 있다.In the present invention, as the conductive particles 7, various conventionally known ones can be used.

한편, 절연성 접착제 수지 (6) 에 대해서는 특별히 한정되는 것은 아니지만, 접속 신뢰성을 향상시키는 관점에서는, 에폭시 수지와 페녹시 수지와 경화제로 이루어지는 조성물, (메트)아크릴 모노머와 개시제로 이루어지는 조성물을 바람직하게 이용할 수 있다.On the other hand, it is not specifically limited about the insulating adhesive resin 6, From a viewpoint of improving connection reliability, the composition which consists of an epoxy resin, a phenoxy resin, a hardening | curing agent, and the composition which consists of a (meth) acryl monomer and an initiator are used preferably. Can be.

그리고, 본 발명의 이방 도전성 접착 필름 (1) 은 절연성 접착제 수지 (6) 중에 가열에 의해 팽창하여 발포성이 발현되는 발포 성분 (8) 이 분산되어 있다.And the anisotropically conductive adhesive film 1 of this invention disperse | distributes the foaming component 8 which expands by heating and expresses foamability in the insulating adhesive resin 6 is disperse | distributed.

본 발명에 있어서는, 도통 신뢰성을 향상시키는 관점에서, 독립된 상태의 기포부가 형성되도록 발포 성분 (8) 을 분산시키는 것이 바람직하다.In this invention, it is preferable to disperse | distribute the foaming component 8 so that the bubble part of an independent state may be formed from a viewpoint of improving conduction reliability.

이 관점에서, 본 발명에 있어서는, 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 것을 바람직하게 이용할 수 있다.From this viewpoint, what contains the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule can be used preferably.

또한, 가열에 의해 발포성이 발현되는 발포 성분 (8) 의 배합량은 특별히 한정되는 것은 아니지만, 본 발명의 효과를 충분히 발휘시키는 한편 접착 강도를 저하시키지 않는 관점에서는, 절연성 접착제 수지 (6) 중에 가열에 의해 발포성이 발현되는 발포 성분 (8) 을 2∼20중량% 함유시키는 것이 바람직하고, 보다 바람직한 함유량은 5∼20중량% 이다.In addition, the compounding quantity of the foaming component (8) which expresses foamability by heating is not specifically limited, From a viewpoint which fully exhibits the effect of this invention and does not lower adhesive strength, it is suitable for heating in insulating adhesive resin (6). It is preferable to contain 2-20 weight% of foaming components (8) which express foamability, and more preferable content is 5-20 weight%.

본 실시형태의 이방 도전성 접착 필름 (1) 을 이용하여 회로 기판 (2) 의 전극 (3) 과 IC 칩 (4) 의 범프 (5) 의 접속을 실시하려면, 도 1 의 (a) 에 나타내는 바와 같이, 회로 기판 (2) 의 전극 (3) 과 IC 칩 (4) 의 범프 (5) 를 서로 대향시켜 배치하고, 이들 사이에 이방 도전성 접착 필름 (1) 을 배치한다. 그리고, 도 1 의 (b) 에 나타내는 바와 같이, 열압착 헤드 (10) 를 이용하여 회로 기판 (2) 에 대하여 IC 칩 (4) 를 눌러 예비 압착을 실시한다.In order to connect the electrode 3 of the circuit board 2 and the bump 5 of the IC chip 4 using the anisotropically conductive adhesive film 1 of this embodiment, as shown in FIG. Similarly, the electrodes 3 of the circuit board 2 and the bumps 5 of the IC chip 4 are disposed to face each other, and the anisotropic conductive adhesive film 1 is disposed therebetween. And as shown in FIG.1 (b), the IC chip 4 is pressed against the circuit board 2 using the thermocompression-bonding head 10, and preliminary crimping | bonding is performed.

이 예비 압착 공정에 있어서는, 예를 들어 절연성 접착제 수지 (6) 가 어느 정도 연화되는 온도 (예를 들어 40∼70℃) 에서 가열을 실시하는 것이 바람직하다.In this preliminary crimping | bonding process, it is preferable to heat, for example at the temperature (for example, 40-70 degreeC) in which the insulating adhesive resin 6 softens to some extent.

도 2 의 (a) 에 나타내는 바와 같이, 이 시점에서는, 상기 서술한 발포 성분 (8) 에는 변화가 생기지 않는다.As shown to Fig.2 (a), at this time, a change does not occur in the foaming component 8 mentioned above.

그리고, 열압착 헤드 (10) 를 이용하여 절연성 접착제 수지 (6) 를 소정의 온도 (예를 들어 90∼180℃) 에서 가열함으로써 본압착을 실시한다.And main compression is performed by heating the insulating adhesive resin 6 at predetermined temperature (for example, 90-180 degreeC) using the thermocompression-bonding head 10. FIG.

이 경우, IC 칩 (4) 의 범프 (5) 와 회로 기판 (2) 의 전극 (3) 근방의 절연 성 접착제 수지 (6) 가 경화되고, 전극 (3) 및 범프 (5) 가 전기적으로 접속되어 확실히 접착될 때까지, 열압착 헤드 (10) 에 의한 가압 및 가열을 실시한다.In this case, the bump 5 of the IC chip 4 and the insulating adhesive resin 6 in the vicinity of the electrode 3 of the circuit board 2 are cured, and the electrodes 3 and the bumps 5 are electrically connected. Pressurization and heating by the thermocompression head 10 are performed until they are reliably bonded.

그 후, 도 1 의 (c) 에 나타내는 바와 같이, 열압착 헤드 (10) 에 의한 가압을 해제함으로써, 도 2 의 (b) 에 나타내는 바와 같이, 전극 (3) 및 범프 (5) 근방 이외의 발포 성분 (8) 이 팽창 발포하여, 절연성 접착제 수지 (6) 중에 각각 독립된 상태의 기포 (9) 가 발생한다.Thereafter, as shown in FIG. 1C, by releasing the pressurization by the thermocompression head 10, as shown in FIG. 2B, the electrode 3 and the bumps 5 are not in the vicinity. The foaming component 8 expands and foams, and the bubble 9 of the independent state in the insulating adhesive resin 6 generate | occur | produces, respectively.

그리고, 이 기포 (9) 의 발생에 의해 절연성 접착제 수지 (6) 의 체적이 증가하고, 회로 기판 (2) 과 IC 칩 (4) 사이에 이방 도전성 접착 필름 (1) 이 충전되고, 이로써 IC 칩 (4) 이 회로 기판 (2) 에 완전히 접착된다.The volume of the insulating adhesive resin 6 increases due to the generation of the bubbles 9, and the anisotropic conductive adhesive film 1 is filled between the circuit board 2 and the IC chip 4, thereby forming an IC chip. (4) This is completely adhered to the circuit board 2.

이상 설명한 본 실시형태에 의하면, 열압착시에 이방 도전성 접착 필름 (1) 이 팽창하여 그 체적이 증가하기 때문에, 인접하는 전극 (3) 및 범프 (5) 간에 있어서의 도전 입자 (7) 의 밀도가 저하되고, 이로써 절연 특성을 향상시킬 수 있다.According to this embodiment described above, since the anisotropic conductive adhesive film 1 expands during thermocompression bonding and its volume increases, the density of the conductive particles 7 between the adjacent electrodes 3 and the bumps 5 is increased. Is lowered, whereby the insulating properties can be improved.

또한, 본 실시형태에 의하면, 범프 (5) 의 높이보다 얇은 이방 도전성 접착 필름 (1) 이라도 회로 기판 (2) 및 IC 칩 (4) 간에 충전할 수 있고, 게다가 인접하는 전극 (3) 및 범프 (5) 사이로의 도전 입자 (7) 의 유입이 저지되므로, 인접하는 전극 (3) 및 범프 (5) 간의 절연성을 향상시킬 수 있다.Moreover, according to this embodiment, even the anisotropic conductive adhesive film 1 thinner than the height of the bump 5 can be filled between the circuit board 2 and the IC chip 4, and also the adjacent electrode 3 and bump Since the inflow of the electroconductive particle 7 between (5) is prevented, the insulation between the adjacent electrode 3 and the bump 5 can be improved.

나아가, 종래 기술에 비해 절연성 접착제 수지 (6) 중의 수지 성분이 상대적으로 적기 때문에, 선팽창 계수 및 탄성률을 저하시킬 수 있고, 이로써 열압착시의 회로 기판 (2) 의 휨을 경감시킬 수 있다.Furthermore, since the resin component in the insulating adhesive resin 6 is relatively small compared with the prior art, the linear expansion coefficient and the elastic modulus can be reduced, thereby reducing the warpage of the circuit board 2 at the time of thermocompression bonding.

또한, 본 실시형태에서는, 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미 립자를 이용하여 독립된 상태의 기포부가 형성되도록 발포 성분이 분산되어 있는 점에서, 접착력이 높고, 게다가 수분 등의 침입이 없어 도통 신뢰성이 높은 이방 도전성 접착 필름 (1) 을 제공할 수 있다.Moreover, in this embodiment, since foaming components are disperse | distributed so that the bubble part of an independent state may be formed using the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule, adhesiveness is high and there is no penetration | invasion of moisture etc., and it is reliable in conduction. This high anisotropic conductive adhesive film 1 can be provided.

도 3 의 (a), (b) 는 본 발명의 다른 실시형태를 이용한 전극의 접속 방법을 나타내는 개략도, 도 4 의 (a), (b) 는 본 발명의 또 다른 실시형태를 이용한 전극의 접속 방법을 나타내는 개략도이다.(A), (b) is a schematic diagram which shows the connection method of the electrode using the other embodiment of this invention, and FIG. 4 (a), (b) is the connection of the electrode using the other embodiment of this invention. A schematic diagram illustrating the method.

본 발명에 있어서는, 절연성 접착제 수지 (6) 중에 상기 발포 성분 (8) 이 분산된 층과, 절연성 접착제 수지 (6) 중에 상기 발포 성분 (8) 이 분산되지 않는 층을 적층하는 것도 가능하다.In this invention, it is also possible to laminate | stack the layer which the said foaming component 8 disperse | distributed in the insulating adhesive resin 6, and the layer which is not disperse | distributed in the insulating adhesive resin 6.

이하, 상기 실시형태와 공통되는 부분에 대해서는 동일한 부호를 부여하고 그 상세한 설명을 생략하면, 예를 들어 도 3 의 (a), (b) 에 나타내는 이방 도전성 접착 필름 (1A) 은 상기 발포 성분 (8) 을 함유하는 이방 도전성 접착 필름 (10) 과, 상기 발포 성분 (8) 을 함유하지 않는 절연성 접착제 필름 (11) 을 적층한 것이다.Hereinafter, the same code | symbol is attached | subjected about the part which is common to the said embodiment, and the detailed description is abbreviate | omitted, For example, the anisotropically conductive adhesive film 1A shown to FIG. The anisotropically conductive adhesive film 10 containing 8) and the insulating adhesive film 11 which does not contain the said foaming component 8 are laminated | stacked.

이 경우, 절연성 접착제 필름 (11) 이 IC 칩 (4) 과 대향하도록 이방 도전성 접착 필름 (1A) 을 회로 기판 (2) 상에 배치하는 것이 바람직하다.In this case, it is preferable to arrange | position the anisotropically conductive adhesive film 1A on the circuit board 2 so that the insulating adhesive film 11 may oppose the IC chip 4.

이러한 구성을 갖는 본 실시형태에 의하면, 특히 IC 칩 (4) 측, 즉 가압측의 전기적 접속에 관여하지 않는 도전 입자 (7) 의 수를 줄일 수 있으므로, 도전 입자 (7) 의 유효 이용을 도모하는 것이 가능하게 된다.According to this embodiment which has such a structure, since the number of the electrically-conductive particle 7 which does not participate in the electrical connection of the IC chip 4 side, ie, a pressurization side especially can be reduced, the effective use of the electrically-conductive particle 7 is aimed at. It becomes possible.

한편, 도 4 의 (a), (b) 에 나타내는 이방 도전성 접착 필름 (1B) 은 상기 발포 성분 (8) 을 함유하지 않는 이방 도전성 접착 필름 (12) 과, 상기 발포 성분 (8) 을 함유하는 절연성 접착제 필름 (13) 을 적층한 것이다.On the other hand, the anisotropically conductive adhesive film 1B shown to Fig.4 (a), (b) contains the anisotropically conductive adhesive film 12 which does not contain the said foaming component 8, and the said foaming component 8 The insulating adhesive film 13 is laminated | stacked.

이 경우, 발포 성분 (8) 을 함유하는 절연성 접착제 필름 (13) 이 IC 칩 (4) 과 대향하도록 이방 도전성 접착 필름 (1B) 을 회로 기판 (2) 상에 배치하는 것이 바람직하다.In this case, it is preferable to arrange | position the anisotropically conductive adhesive film 1B on the circuit board 2 so that the insulating adhesive film 13 containing the foaming component 8 may oppose the IC chip 4.

이러한 구성을 갖는 본 실시형태에 의하면, 상기 실시형태와 마찬가지로 도전 입자 (7) 의 유효 이용을 도모할 수 있는 데 더하여, 발포 성분 (8) 을 함유하는 층을 얇게 할 수 있기 때문에, IC 칩 (4) 의 범프 (5) 와 회로 기판 (2) 의 전극 (3) 간에 발포 성분 (8) 을 협지할 가능성이 저하되고, 그 결과, 열압착 조건에 있어서의 자유도를 넓힐 수 있다.According to this embodiment which has such a structure, since the effective use of the electrically-conductive particle 7 can be aimed up similarly to the said embodiment, since the layer containing the foaming component 8 can be made thin, an IC chip ( The possibility of clamping the foaming component 8 between the bump 5 of 4) and the electrode 3 of the circuit board 2 falls, and as a result, the freedom degree in thermocompression bonding conditions can be expanded.

또한, 본 발명에 있어서는, 상기 서술한 2층 구조뿐만 아니라, 3층 이상의 적층 구조를 채용하는 것도 가능하다.In addition, in this invention, it is also possible to employ | adopt not only the two-layer structure mentioned above but a laminated structure of three or more layers.

그 밖의 구성 및 작용 효과에 대해서는 상기 서술한 실시형태와 동일하므로 그 상세한 설명을 생략한다.Since the other structure and effect are the same as that of embodiment mentioned above, the detailed description is abbreviate | omitted.

이하, 본 발명의 실시예를 비교예와 함께 상세하게 설명한다.Hereinafter, the Example of this invention is described in detail with a comparative example.

<실시예 1><Example 1>

절연성 접착제 수지로서 페녹시 수지 (토토 화성사 제조 YP50) 40중량부, 액상 에폭시 수지 (재팬 에폭시 레진사 제조 EP828) 30중량부, 도전 입자 (4㎛ 직경, Ni/Au 도금 수지 입자) 20중량부, 마이크로 캡슐형 에폭시 경화제 (아사히 화성사 제조 HX3941HP), 가열에 의해 발포성이 발현되는 발포 성분으로서 발포제 A (마츠 모토 유지사 제조 F30VSD 팽창 개시 온도: 약 80℃, 이 온도는 예비 압착 공정에서 약간 발포함으로써 그 후의 본압착 공정에 있어서 발포가 촉진되는 온도이다.) 4중량부를, 용제로서 톨루엔 20중량부, 아세트산에틸 20중량부를 이용하여 믹서로 용해 혼합시켰다.40 parts by weight of a phenoxy resin (YP50 manufactured by Toto Chemical Co., Ltd.), 30 parts by weight of a liquid epoxy resin (EP828 manufactured by Japan Epoxy Resin Co., Ltd.), and 20 parts by weight of conductive particles (4 μm in diameter, Ni / Au plated resin particles) as the insulating adhesive resin. , Microcapsule type epoxy curing agent (HX3941HP manufactured by Asahi Chemical Co., Ltd.), foaming agent A (F30VSD, manufactured by Matsumoto Yuji Co., Ltd.) This is the temperature at which foaming is promoted in the subsequent main compression step.) 4 parts by weight were dissolved and mixed with a mixer using 20 parts by weight of toluene and 20 parts by weight of ethyl acetate.

또한, 발포제는 10㎛ 직경의 구멍을 갖는 체에 의해 분급하여 합격한 것을 이용하였다.In addition, the foaming agent used what classified and passed with the sieve which has a hole of 10 micrometers diameter was used.

그리고, 박리 처리를 실시한 PET 필름 상에 상기 서술한 페이스트를 도포하고, 65℃ 로 설정한 전기 오븐에서 4분간 가열하여, 건조 막두께가 10㎛ 인 이방 도전성 접착 필름의 샘플을 제작하였다.And the paste mentioned above was apply | coated on the PET film which performed the peeling process, it heated for 4 minutes in the electric oven set to 65 degreeC, and the sample of the anisotropic conductive adhesive film whose dry film thickness is 10 micrometers was produced.

<실시예 2><Example 2>

발포제로서 팽창 개시 온도가 약 150℃ 인 발포제 B (마츠모토 유지사 제조 F80GSD) 를 이용한 것 이외에는 실시예 1 과 동일한 방법에 의해 샘플을 제작하였다.The sample was produced by the method similar to Example 1 except having used the foaming agent B (F80GSD by Matsumoto Oil Corporation) whose expansion start temperature is about 150 degreeC as a foaming agent.

<실시예 3><Example 3>

발포제로서 팽창 개시 온도가 약 150℃ 인 발포제 C (마츠모토 유지사 제조 F80VSD) 를 이용한 것 이외에는 실시예 1 과 동일한 방법에 의해 샘플을 제작하였다.The sample was produced by the method similar to Example 1 except having used the foaming agent C (F80VSD by Matsumoto Oil Corporation) whose expansion start temperature is about 150 degreeC as a foaming agent.

<실시예 4><Example 4>

건조 막두께가 15㎛ 가 되도록 조정한 것 이외에는 실시예 3 과 동일한 방법에 의해 샘플을 제작하였다.The sample was produced by the method similar to Example 3 except having adjusted so that dry film thickness might be set to 15 micrometers.

<비교예 1>Comparative Example 1

발포제를 첨가하지 않고, 그 이외는 실시예 1 과 동일한 방법에 의해 샘플을 제작하였다.The sample was produced by the method similar to Example 1 except not adding a blowing agent.

<비교예 2>Comparative Example 2

건조 막두께가 30㎛ 가 되도록 조정한 것 이외에는 비교예 1 과 동일한 방법에 의해 샘플을 제작하였다.The sample was produced by the method similar to the comparative example 1 except having adjusted so that dry film thickness might be set to 30 micrometers.

<평가><Evaluation>

실시예 및 비교예의 샘플을 이용하여 IC 칩을 유리 기판 상에 열압착하여 이방 도전성 접착 필름을 경화시켰다 (온도 190℃, 시간 20초).The IC chip was thermocompression-bonded on the glass substrate using the sample of the Example and the comparative example, and the anisotropic conductive adhesive film was hardened (temperature 190 degreeC, time 20 second).

이 경우, IC 칩의 범프의 사이즈는 30㎛×85㎛, 범프간의 스페이스는 20㎛, 범프 높이는 22㎛ 로 하였다.In this case, the bump size of the IC chip was 30 μm × 85 μm, the space between the bumps was 20 μm, and the bump height was 22 μm.

그리고, 이방 도전성 접착 필름의 충전성, 범프 상에 포착된 도전 입자수, 범프간에 막힌 도전 입자의 상태를 각각 유리 기판측으로부터 육안에 의해 확인 및 카운트하였다. 그 결과를 표 1 에 나타낸다.And the filling property of the anisotropically conductive adhesive film, the number of electroconductive particles captured on the bump, and the state of the electroconductive particle clogged between bumps were confirmed and counted visually from the glass substrate side, respectively. The results are shown in Table 1.

실시예 및 비교예의 평가 결과Evaluation result of an Example and a comparative example 발포제blowing agent 건조 막두께 (㎛)Dry film thickness (㎛) 충전성Filling 입자 포착수 평균치 (개/범프)Particle Capture Averages (dog / bump) 범프간 입자 막힘Bump Particle Bump 실시예1Example 1 AA 1010 ○○ 1919 ○○ 실시예2Example 2 BB 1010 ○○ 19.519.5 ○○ 실시예3Example 3 CC 1010 △△ 2020 ○○ 실시예4Example 4 CC 1515 ○○ 1919 ○○ 비교예1Comparative Example 1 없음none 1010 ×× 19.519.5 △△ 비교예2Comparative Example 2 없음none 3030 ○○ 16.516.5 ××

〔충전성〕○: 충분히 충전되어 있다 ×: 미충전 부분 있음[Chargeability] ○: Fully charged ×: Unfilled part

〔범프간 입자 막힘〕○: 막힘은 없다 △: 막힘은 없지만 입자가 많이 존재[Bump clogging between bumps] ○: No clogging Δ: No clogging but many particles present

×: 막힘이 있다                    X: There is a blockage

〔평가 결과〕〔Evaluation results〕

표 1 에 나타내는 바와 같이, 실시예 1∼4 의 이방 도전성 접착 필름은 충전성이 좋고, 또한 범프간에 있어서의 도전 입자 막힘도 없었다. 또한, 실시예 1∼4 의 이방 도전성 접착 필름에 대하여, 발포제의 배합량을 12중량부로 한 결과, 거의 동일한 결과가 얻어졌다.As shown in Table 1, the anisotropically conductive adhesive films of Examples 1-4 were good in filling property, and also there was no clogging of the electrically conductive particle in between bumps. Moreover, about the anisotropically conductive adhesive film of Examples 1-4, when the compounding quantity of the foaming agent was 12 weight part, the substantially same result was obtained.

한편, 발포제를 첨가하지 않은 비교예 1 의 이방 도전성 접착 필름의 경우에는 충전되지 않은 부분이 생기고, 또한 범프간에 도전 입자가 많이 존재하였다.On the other hand, in the case of the anisotropically conductive adhesive film of the comparative example 1 which did not add a foaming agent, the unfilled part generate | occur | produced and there existed many conductive particles between bumps.

또한, 발포제를 첨가하지 않고 건조 막두께를 30㎛ 로 한 비교예 2 의 이방 도전성 접착 필름에 있어서는, 범프간에 도전 입자의 막힘이 발생하였다.In addition, in the anisotropic conductive adhesive film of Comparative Example 2 having a dry film thickness of 30 μm without adding a blowing agent, clogging of the conductive particles occurred between the bumps.

Claims (14)

절연성 접착제 성분 중에, 가열에 의해 발포성이 발현되는 발포 성분과, 도전 입자가 분산되어 있는 이방 도전성 접착제.The anisotropically conductive adhesive agent which the foaming component which foamability expresses by heating, and electroconductive particle are disperse | distributed in an insulating adhesive component. 제 1 항에 있어서,The method of claim 1, 상기 절연성 접착제 성분 중에, 독립된 상태의 기포부가 형성되도록 상기 발포 성분이 분산되어 있는 이방 도전성 접착제.The anisotropically conductive adhesive agent in which the said foaming component is disperse | distributed so that the bubble part of an independent state may be formed in the said insulating adhesive component. 제 1 항에 있어서,The method of claim 1, 상기 발포 성분이 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 이방 도전성 접착제.The anisotropic conductive adhesive containing the microparticles | fine-particles which the said foaming component enclosed the organic solvent in the thermoplastic microcapsule. 절연성 접착제 성분 중에 가열에 의해 발포성이 발현되는 발포 성분과, 도전 입자가 분산되어 필름 형상으로 형성되어 있는 이방 도전성 접착 필름.The anisotropically conductive adhesive film in which the foaming component which foamability expresses by heating in an insulating adhesive component, and electroconductive particle are disperse | distributed and formed in the film form. 제 4 항에 있어서,The method of claim 4, wherein 상기 절연성 접착제 성분 중에, 독립된 상태의 기포부가 형성되도록 상기 발포 성분이 분산되어 있는 이방 도전성 접착 필름.The anisotropically conductive adhesive film in which the said foaming component is disperse | distributed so that the bubble part of an independent state may be formed in the said insulating adhesive component. 제 4 항에 있어서,The method of claim 4, wherein 상기 발포 성분이 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 이방 도전성 접착 필름.The anisotropically conductive adhesive film containing the microparticles | fine-particles which the said foaming component enclosed the organic solvent in the thermoplastic microcapsule. 제 4 항에 있어서,The method of claim 4, wherein 절연성 접착 필름이 적층되어 있는 이방 도전성 접착 필름.An anisotropically conductive adhesive film in which an insulating adhesive film is laminated. 제 4 항에 있어서,The method of claim 4, wherein 상기 발포 성분을 함유하지 않은 이방 도전성 접착 필름과 상기 발포 성분을 함유하는 절연성 접착 필름이 적층되어 있는 이방 도전성 접착 필름.The anisotropically conductive adhesive film in which the anisotropically conductive adhesive film which does not contain the said foaming component, and the insulating adhesive film containing the said foaming component are laminated | stacked. 접속용 전극을 갖는 복수의 접속 부재를 상기 전극끼리를 서로 대향시켜 배치하고, 상기 복수의 접속 부재간에 이방 도전성 접착제를 배치하여 가열 및 가압을 실시함으로써, 상기 접속 부재끼리를 접착함과 함께 상기 전극끼리를 전기적으로 접속하는 공정을 갖는 전극의 접속 방법으로서, The plurality of connection members having the electrodes for connection are disposed so that the electrodes face each other, an anisotropic conductive adhesive is disposed between the plurality of connection members, and the heating and pressurization are performed, thereby adhering the connection members and the electrodes. As a connection method of the electrode which has a process of electrically connecting mutually, 상기 이방 도전성 접착제로서, 절연성 접착제 성분 중에 가열에 의해 발포성이 발현되는 발포 성분과 도전 입자가 분산되어 있는 것을 이용하는 전극의 접속 방법.The connection method of the electrode using the said anisotropic conductive adhesive which disperse | distributes the foaming component which expresses foamability by heating, and electroconductive particle in an insulating adhesive component. 제 9 항에 있어서,The method of claim 9, 상기 절연성 접착제 성분 중에 독립된 상태의 기포부가 형성되도록 상기 발포 성분이 분산되어 있는 이방 도전성 접착제를 이용하는 전극의 접속 방법.The electrode connection method using the anisotropically conductive adhesive in which the said foaming component is disperse | distributed so that the bubble part of an independent state may be formed in the said insulating adhesive component. 제 9 항에 있어서,The method of claim 9, 상기 발포 성분이 유기 용제를 열가소성 마이크로 캡슐에 봉입한 미립자를 함유하는 이방 도전성 접착제를 이용하는 전극의 접속 방법.The connection method of the electrode using the anisotropic conductive adhesive containing the microparticles | fine-particles which the said foaming component enclosed the organic solvent in the thermoplastic microcapsule. 제 9 항에 있어서,The method of claim 9, 상기 이방 도전성 접착제로서, 필름 형상으로 형성된 이방 도전성 접착 필름을 이용하는 전극의 접속 방법.The connection method of the electrode using the anisotropically conductive adhesive film formed in the film form as said anisotropically conductive adhesive agent. 제 12 항에 있어서,The method of claim 12, 상기 이방 도전성 접착제로서, 상기 이방 도전성 접착 필름에 절연성 접착 필름이 적층되어 있는 것을 이용하는 전극의 접속 방법.A method for connecting an electrode using the anisotropic conductive adhesive, wherein an insulating adhesive film is laminated on the anisotropic conductive adhesive film. 제 12 항에 있어서,The method of claim 12, 상기 이방 도전성 접착제로서, 상기 발포 성분을 함유하지 않는 이방 도전성 접착 필름과 상기 발포 성분을 함유하는 절연성 접착 필름이 적층되어 있는 것을 이용하는 전극의 접속 방법.The connection method of the electrode using the said anisotropically conductive adhesive which laminates the anisotropically conductive adhesive film which does not contain the said foaming component, and the insulating adhesive film containing the said foaming component.
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KR20180020454A (en) * 2016-08-18 2018-02-28 주식회사 엘지화학 Method for manufacturing conductor with network structure

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CN101146885B (en) 2012-09-05
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JPWO2006093315A1 (en) 2008-08-07
KR101298829B1 (en) 2013-08-23
TWI347348B (en) 2011-08-21
HK1116511A1 (en) 2008-12-24
CN101146885A (en) 2008-03-19
JP4891895B2 (en) 2012-03-07
TW200632068A (en) 2006-09-16

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