JP2001107019A - Expandable paste, electronic component mounted body and process for stripping off electronic component - Google Patents

Expandable paste, electronic component mounted body and process for stripping off electronic component

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Publication number
JP2001107019A
JP2001107019A JP28664299A JP28664299A JP2001107019A JP 2001107019 A JP2001107019 A JP 2001107019A JP 28664299 A JP28664299 A JP 28664299A JP 28664299 A JP28664299 A JP 28664299A JP 2001107019 A JP2001107019 A JP 2001107019A
Authority
JP
Japan
Prior art keywords
electronic component
paste
foamable
foaming
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28664299A
Other languages
Japanese (ja)
Inventor
Emiko Igaki
Yukihiro Ishimaru
Takashi Kitae
Tsutomu Mitani
Hiroteru Takezawa
Masakazu Tanahashi
力 三谷
井垣恵美子
孝史 北江
正和 棚橋
幸宏 石丸
弘輝 竹沢
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP28664299A priority Critical patent/JP2001107019A/en
Publication of JP2001107019A publication Critical patent/JP2001107019A/en
Pending legal-status Critical Current

Links

Abstract

(57) [Problem] When a conventional conductive paste is used, it is difficult to peel off the electronic component after connection to repair the electronic component. SOLUTION: In order to solve the above-mentioned problem, a foamable paste 3 is used which contains a foamable material which foams when heated and / or irradiated with electromagnetic waves. When the paste 3 has such a configuration, for example, when the foamable material is foamed by heating or applying an electromagnetic wave or both, a large number of pores are formed in the resin in the paste 3, resulting in a brittle structure and an electronic component. Can be easily peeled off.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a foaming paste for use in joining an electronic component to a circuit board instead of solder in the field of electronic component mounting, an electronic component connection method, an electronic component package, And an electronic component peeling method.

[0002]

2. Description of the Related Art Recently, awareness of environmental issues has increased,
In the field of electronics mounting, regulations on lead in solder alloys are about to be enforced, and there is an urgent need to establish a joining technology that does not use lead for mounting electronic components. Lead-free mounting techniques mainly include lead-free solder and conductive paste. However, conductive paste, which is expected to have advantages such as flexibility of a bonding portion and lower mounting temperature, has received more attention.

A conventional conductive paste generally has a conductive filler dispersed in a resin-based adhesive component. After connecting the connection terminals of the electronic component and the connection terminals of the circuit board with the paste interposed therebetween, The resin is cured, and the electrical connection of the connection portion is secured by the contact between the conductive fillers in the paste. Therefore, since the connection portion is bonded with a resin, it has a merit that it flexibly responds to deformation due to heat or external force, and that the connection portion is less likely to crack as compared with solder in which the connection portion is an alloy. From doing
It is expected as a substitute for solder.

[0004]

However, when a conventional conductive paste is used, it has been difficult to peel off the electronic component for repair (to replace it) after connection. Generally, thermosetting resin is often used as the resin in the conductive paste. However, once the thermosetting resin is cured, it is difficult to remove the electronic component so that the resin can be repaired. It is. In some cases, a thermoplastic resin is used as the resin in the conductive paste. However, it is necessary to peel off the component while the temperature is raised, and there is a difficulty in workability.

[0005] Therefore, the present invention provides a foamable paste for use in joining an electronic component to a circuit board for connecting using a paste and for repairing the electronic component.
It is an object to provide an electronic component connection method, an electronic component mounted body, and an electronic component peeling method.

[0006]

In order to solve the above-mentioned problems, a first aspect of the present invention (corresponding to claim 1) is to heat, irradiate an electromagnetic wave, and reduce the pressure. , A foamable paste characterized by containing a foamable material that is foamed by performing all or part of the process.

A second aspect of the present invention (corresponding to claim 2) is the foamable paste according to the first aspect, wherein the foamable paste contains an inorganic powder that absorbs electromagnetic waves.

According to a third aspect of the present invention (corresponding to claim 3), the inorganic powder is a powder that absorbs the electromagnetic waves and generates heat, and when the powder generates heat, the expandable material foams. The foamable paste according to the second aspect of the present invention, which is characterized in that:

A fourth aspect of the present invention (corresponding to claim 4) is that, when heated, when irradiated with an electromagnetic wave, or when heated and irradiated with an electromagnetic wave, the viscosity of the resin in the foamable paste is increased. The foamable paste according to any one of the first to third aspects of the present invention, wherein the foamable material foams.

A fifth invention (corresponding to claim 5) is characterized in that the glass transition temperature of the resin in the foamable paste is lower than the foaming temperature of the foamable material. A foamable paste according to any of the present inventions.

In a sixth aspect of the present invention (corresponding to claim 6), the resin in the foamable paste is a thermoplastic resin. It is a foaming paste.

According to a seventh aspect of the present invention (corresponding to claim 7), the foaming material according to any one of the first to sixth aspects of the present invention comprises a conductive filler exhibiting conductivity. Paste.

[0013] The heating, the irradiation of the electromagnetic wave, and the lowering of the pressure are all or partially performed, so that the foamable material in the paste foams. As a result, a large number of pores are formed in the paste, resulting in a brittle structure, and the electronic component can be easily separated. As a result, the electronic component can be easily repaired.

When heated, the resin in the paste softens and the foamable material foams. In order to have sufficient strength at room temperature, the resin maintains an appropriate hardness.However, the resin softens when heated, and the resin is pushed away by the pressure of foaming, and the pores have enough volume to repair after foaming. Is obtained.

[0015] The foaming material which is fired by irradiation of electromagnetic waves may be one which foams itself by absorbing the electromagnetic waves, or one which contains an inorganic material which absorbs the electromagnetic waves in the paste, and the inorganic material absorbs the electromagnetic waves. It generates heat and generates heat, and the heat expands the foamable material, or the electromagnetic waves cause the resin in the paste to soften and expand.

When the glass transition temperature of the resin in the foamable paste is lower than the foaming temperature of the foamable material, the foamable material foams after the resin is softened, so that a sufficient volume of pores can be obtained. The resin includes a foamable paste that is a thermoplastic resin.

The foamable paste of the present invention also includes a foamable paste characterized by containing a conductive filler exhibiting conductivity.

An eighth aspect of the present invention (corresponding to claim 8) is a connection method for electrically joining a connection terminal of an electronic component to a connection terminal of a circuit board. An electronic component connection method, wherein the foamable paste according to the present invention is used for the bonding.

According to a ninth aspect of the present invention (corresponding to claim 9), the foamable paste is provided between the electronic component and the circuit board and perpendicularly to a laminating direction of the electronic component and the circuit board. As the layer and the layer of the conductive paste containing no foamable material are formed in a layer, using the foamable paste and the conductive paste containing no foamable material,
An electronic component connection method according to an eighth aspect of the present invention, wherein the connection terminal of the electronic component and the connection terminal of the circuit board are electrically joined.

A tenth aspect of the present invention (corresponding to claim 10) is:
The electronic component connection method according to the ninth aspect of the present invention, wherein the conductive paste containing no foamable material is a thermosetting resin.

By using a method as shown in FIG. 1 using the foamable paste as the electronic component connection method, a repairable electronic component connection method can be obtained. As an electronic component connection method, as shown in FIG.
And an electronic component connection method in which the layer 3 containing the foamable material and the layer 6 not containing the foamable material are formed in a layer perpendicular to the laminating direction of the circuit board 5. Thus, by providing the layer 3 containing the foamable material and the layer 6 not containing the foamable material, a repairable and low-resistance electronic component connection method can be obtained.

According to the invention of the present application, an electronic component is electrically connected to a circuit board by using the electronic component connection method according to any one of the eighth to tenth aspects of the present invention. Includes component mounts. It is possible to obtain an electronic component mounted body capable of repairing the electronic component and having low-resistance electrical connection.

The eleventh invention (corresponding to claim 11) provides:
An electronic device comprising: an electronic component; a circuit board; and a layer of the foamable paste according to any one of the first to seventh aspects of the present invention connecting the electronic component and the circuit board. It is a component mount.

According to a twelfth aspect of the present invention (corresponding to claim 12),
Comprising a layer of a conductive paste containing no foaming material, between the electronic component and the circuit board, and perpendicular to the stacking direction of the electronic component and the circuit board, the foaming paste layer, The electronic component package according to the eleventh aspect of the present invention, wherein the conductive paste layer containing no foaming material is formed in a layer shape.

A thirteenth aspect of the present invention (corresponding to claim 13) is:
The electronic component package according to the twelfth aspect, wherein the conductive paste containing no foamable material is a thermosetting resin.

The fourteenth invention (corresponding to claim 14) is:
In the electronic component package according to any one of the eleventh to thirteenth aspects, the foamable paste may be entirely or partially heated, irradiated with an electromagnetic wave, and reduced in pressure. An electronic component peeling method characterized by foaming a foamable material inside and peeling an electronic component from a circuit board of the electronic component mounted body.

As described above, by performing all or a part of the heating, the irradiation of the electromagnetic wave, and the low pressure, the foamable material in the foamable paste foams, and the electronic component mounted body is foamed. The electronic component can be peeled off from the circuit board, and the electronic component can be easily repaired.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

In the embodiment of the present invention, the foamable paste is obtained by dispersing a foamable material in a thermosetting type or thermoplastic type resin. When conductivity is required, it is obtained by dispersing a foamable material and a conductive filler having conductivity in the resin.

As the thermosetting resin, phenol-based, epoxy-based, acrylate-based, amide-based, rubber-based, vinyl-based resins, etc., can be used as long as they are generally used in thermosetting pastes. Is not limited.

The type of the thermoplastic type resin is not limited as long as it is a resin generally used for a thermoplastic type paste, such as a polypropylene type, a polybutylene terephthalate type, a polyamide type, and a polyphenylene sulfide type.

The type of the conductive particles is not particularly limited as long as they are metal particles used in a general conductive paste, but particles of at least one selected from gold particles, silver particles, copper particles, nickel particles and solder particles. It is preferred that When the solder particles are used in a heat-curing type, the interface between the particles is melted at the time of heating to form a metal bond, which is advantageous for lowering the resistance. On the other hand, carbon particles can also be preferably used because of their non-corrosiveness.
Further, particles obtained by coating the above-mentioned metal, that is, gold, silver, copper, nickel or solder on the surface of resin particles, the surface of other metal particles, or the surface of ceramic particles can also be preferably used.

The foamable paste according to the embodiment of the present invention comprises:
The paste is obtained by adding an expandable resin powder that expands when heated or irradiated with electromagnetic waves in the above-mentioned paste. Foamable resin is
As shown in FIG. 3, a microparticle containing a substance that expands when heated, such as a low-boiling hydrocarbon 9, or a substance that absorbs and expands a specific electromagnetic wave, such as water 9, is contained in the shell wall 8 of the hollow resin particles 7. It is preferably a capsule. The expansion includes decomposition and vaporization. When foaming at the time of heating, the constituent resin is not particularly limited as long as it is softened by low-temperature heating, but vinylidene chloride or an acrylic resin is preferable. This facilitates expansion at low temperatures and facilitates handling. Further, a resin such as polyethylene having softness that can be deformed at room temperature may be used.

When, for example, an electrode terminal on a substrate is connected to an electrode terminal of an electronic component using the foamable paste of the embodiment of the present invention, it is necessary to peel the component for repair due to a defective component or the like. Then, the connection terminal portion of the component is locally heated or irradiated with electromagnetic waves. Thereby,
The foamable material in the foamable paste foams, and many pores are generated in the paste portion, so that the paste can be easily peeled off. On this occasion,
Before foaming, the structure 10 as shown in FIG.
Is foamed to form a structure 13 having a large number of pores 12 therein as shown in FIG.

Here, it is preferable that the content of the foaming material 11 contained in the foaming paste be a volume ratio of 0.5 or less in terms of the volume before foaming to the resin amount 1 in the paste. . If it exceeds 0.5, the amount of the resin in the foamable paste is drastically reduced, the network is not sufficiently formed, and the strength of the cured paste is not sufficiently obtained. In the case of the foamable conductive paste containing the conductive filler, for the conductive filler 1,
It is preferable to set the volume ratio to 0.5 or less. If it exceeds 0.5, the number of conductive filler particles per unit volume in the foaming paste is drastically reduced, so that the resistance characteristic is significantly reduced.

Further, in order to achieve both good strength and easy peeling, it is necessary to disperse the foamable material as much as possible. Therefore, the resin particle diameter of the foamable material before foaming is
It is preferably 1 micron or more and 50 micron or less, which can be easily formed into a paint and can be easily produced. 50
If it exceeds micron, the strength of the paste after curing is not sufficiently obtained.

The volume expansion coefficient of the foamable material due to foaming is preferably at least twice. If less than twice,
In order to facilitate peeling, it is necessary to increase the content of the foamable material, and the strength of the cured paste cannot be sufficiently obtained.

In the above embodiment, a foamable resin is used as the foamable material, but the foamable material is not limited to the foamable resin. In short, the foamable material only needs to be foamable at the time of heating or irradiation of electromagnetic waves, such as powder, particles, or liquid.

In the above-described embodiment, a low-boiling hydrocarbon or water 9 is used as a substance that expands when heated or irradiated with an electromagnetic wave. However, as described above, in this specification, decomposition or decomposition occurs when expanded. Since it is assumed that vaporization is included, a hydrate of an inorganic compound such as a hydrate of copper chloride can also be used as a substance that expands when heated or irradiated with electromagnetic waves. Also, for example, sodium hydrogen carbonate can be used. In addition, as organic matter,
Camphor can also be used.

According to the present invention, there is provided a foamable paste containing an inorganic powder that absorbs electromagnetic waves,
The invention of the present application also includes a method of irradiating an electromagnetic wave to generate heat from the inorganic powder to foam a foamable material. As inorganic powder, aluminum sodium silicate clay, sodium metasilicate, kaolin, carbide, nitrogen,
Ceramic compositions composed of borides and mixtures thereof, carbon powders, and metal powders such as aluminum, nickel, zinc or copper can be used.

Further, according to the electronic component connection method of the present invention, the electrical connection is performed using the foamable conductive paste having the above-described configuration, so that the electrode of the electronic component and the electrode of the substrate can be repaired and the resistance can be reduced. It is intended to obtain an excellent electrical connection.

According to the electronic component connection method of the present invention, a layer containing a foamable material and a layer not containing a foamable material are formed in layers perpendicular to the laminating direction of the electronic component and the circuit board. An electronic component connection method characterized in that it is also included. As shown in FIG. 2, not only a structure having a two-layer structure but also a three-layer structure as shown in FIGS. At that time, the resin of the conductive paste of the layer not containing the foaming material is preferably a thermosetting resin. By using the thermosetting resin, the conductive fillers in the paste are brought into strong contact with each other due to the compressive force at the time of curing of the resin, and low resistance is obtained.

The invention of the present application also includes an electronic component mounted body characterized in that the electronic component is electrically connected to a circuit board by using the electronic component connection method according to any one of claims 8 to 10.

Further, in the electronic component mounting body, a foaming material in a foamable conductive paste is foamed by heating or irradiating an electromagnetic wave, and the electronic component is separated from the circuit board. Is also included. When it is necessary to peel off only specific components and electrical connection terminals in an electronic component connection method using a heat-foaming type paste, by heating locally using hot air or an infrared heating device, etc. Only a part can be peeled off.

When an electromagnetic wave irradiation type paste is used and only a specific portion needs to be peeled similarly, the electromagnetic wave is locally irradiated or the other portion is covered with an electromagnetic wave shielding sheet or the like. By exposing the entire surface to electromagnetic waves, only a desired portion can be peeled off. Further, even when the components are mixed with the components connected by soldering, it is possible to selectively peel off only the portions connected by the foaming paste by irradiating electromagnetic waves.

In the above-described embodiment, the foaming material in the foamable conductive paste is assumed to be a material which foams when heated or irradiated with an electromagnetic wave. It may be a material that is foamed by being heated, or a material that is foamed by being heated or radiated by electromagnetic waves, and being reduced in pressure, in whole or in part. Good.

When the electronic component and the circuit board are connected to each other by using a foamable conductive paste containing a foaming material that foams when the pressure is reduced and then the electronic component and the circuit board are to be peeled off, the pressure is reduced. As a result, the foam material is foamed, and the electronic component is separated from the circuit board.

The connection between the electronic component and the circuit board contains a foamed material that is foamed by performing two or more of heating, irradiation of electromagnetic waves, and pressure reduction. When using the foamable conductive paste, and then trying to peel off the electronic component and the circuit board, by performing two or more of heating, irradiating electromagnetic waves, and lowering the pressure The foamed material is foamed, and the electronic component is separated from the circuit board.

[0049]

Embodiments of the present invention will be described below.

Example 1 A commercially available one-part epoxy resin was prepared as a resin for the foaming paste. Further, microcapsules having a structure in which a low boiling point hydrocarbon 9 was filled in hollow resin particles 7 as shown in FIG. 3 and which foamed at about 200 ° C. and having an average particle diameter of about 20 μm as an expandable material were prepared.

As the foaming paste containing no conductive filler, a paste obtained by kneading the epoxy resin and the foaming material was prepared. Foamable material is 0.0-
It was blended to be 0.6.

Using the foaming paste prepared as described above, as shown in FIG.
Curing was performed at 50 ° C.

Thereafter, in order to peel the parts, the temperature was set to 210 ° C.
And foamed.

Before and after foaming, the electronic component is pressed from the side.
Table 1 shows the results of the shear strength test. As shown in the comparative example, when the foamable material contains 0.6 by volume, the strength of the component before foaming is significantly reduced. Those containing no foaming material had a high shear strength after foaming and were difficult to peel off, and peeled pieces remained on the substrate, making it difficult to remove the peeled pieces. Within the range of the examples, the strength before foaming is sufficient, and the electronic component can be easily peeled off after foaming,
Also, the peeled pieces remaining on the substrate could be easily removed.

[0055]

[Table 1] (Example 2) As in Example 1, a commercially available one-pack epoxy resin was prepared as a resin for the foaming paste, and a low-boiling carbon was added to the hollow resin particles 7 as shown in FIG. Microcapsules having a structure filled with hydrogen 9 and foaming at around 200 ° C. and having an average particle size of about 20 μm were prepared. In addition, silver particles having an average particle size of 5 microns were prepared as conductive fillers.

A foamed conductive paste was prepared by kneading the epoxy resin, foamable material, and conductive filler (80 wt%). The foamable material was blended so as to have a volume ratio of 0.1 to 0.6 with respect to the conductive filler.

Using the foaming paste prepared as described above, as shown in FIG.
Curing was performed at 50 ° C. For the experiment, a short chip having electrodes short-circuited inside was used as an electronic component.

Thereafter, in order to peel off the parts,
And foamed.

Before foaming, the connection resistance value between the substrate electrode terminal and the electrode terminal of the electronic component was measured. Table 2 shows the results of a shear strength test in which the electronic component was pressed from the side before and after foaming. As shown in the comparative example, when the foamable material was contained at a volume ratio of 0.6, the connection resistance value was significantly increased.

[0060]

[Table 2] (Example 3) As in Example 2, a thermoplastic resin was prepared as the resin of the foaming paste. As the foamable material, microcapsules having a structure in which water 9 was filled in hollow resin particles 7 as shown in FIG. 3 and foaming at around 100 ° C. and having an average particle diameter of about 20 μm were prepared. In addition, silver particles having an average particle size of 5 microns were prepared as conductive fillers.

A foamed conductive paste was prepared by kneading the epoxy resin, the foamable material and the conductive filler (80 wt%). The foamable material was blended so as to have a volume ratio of 0.1 to 0.6 with respect to the conductive filler.

Using the foaming paste prepared as described above, as shown in FIG.
Dried at 0 ° C. For the experiment, a short chip having electrodes short-circuited inside was used as an electronic component.

Thereafter, an electromagnetic wave was applied to peel off the component.

Before foaming, the connection resistance between the substrate electrode terminal and the electrode terminal of the electronic component was measured. Table 3 shows the results of a shear strength test in which the electronic component was pressed from the side before and after foaming. As shown in the comparative example, when the foamable material was contained at a volume ratio of 0.6, the connection resistance value was significantly increased.

[0065]

[Table 3] (Example 4) As in Example 1, a commercially available one-part epoxy resin was prepared as a resin for the foaming paste, and a low-boiling carbon was added to the hollow resin particles 7 as shown in FIG. Microcapsules having a structure filled with hydrogen 9 and foaming at around 200 ° C. and having an average particle size of about 20 μm were prepared. In addition, silver particles having an average particle size of 5 microns were prepared as conductive fillers.

A foamed conductive paste was prepared by kneading the epoxy resin, the foamable material, and the conductive filler (80 wt%). The foamable material was blended with the conductive filler in a volume ratio of 0.1 to 0.5.

As an inorganic powder that absorbs electromagnetic waves and generates heat, 5 parts by weight of carbon powder was blended.

Using the foaming paste prepared as described above, as shown in FIG.
Curing was performed at 50 ° C. For the experiment, a short chip having electrodes short-circuited inside was used as an electronic component.

Thereafter, an electromagnetic wave was applied to peel off the component.

Before foaming, the connection resistance value between the substrate electrode terminal and the electrode terminal of the electronic component was measured. Table 4 shows the results of a shear strength test in which the electronic component was pressed from the side before and after foaming.

The same good results as in Example 2 were obtained.

[0072]

[Table 4] (Example 5) As in Example 1, a commercially available one-pack epoxy resin was prepared as the resin of the foaming paste, and a low-boiling-point carbonized powder was formed in the hollow resin particles 7 as shown in FIG. Microcapsules having a structure filled with hydrogen 9 and foaming at around 200 ° C. and having an average particle size of about 20 μm were prepared. In addition, silver particles having an average particle size of 5 microns were prepared as conductive fillers.

A foamed conductive paste was prepared by kneading the epoxy resin, the foamable material and the conductive filler (80 wt%). The foamable material was blended with the conductive filler in a volume ratio of 0.1 to 0.5.

Further, a paste containing no foaming material was prepared by kneading the above resin and a conductive filler.

Using the foamable paste prepared as described above, as shown in FIG. 2, the layer containing the foamable material and the layer containing the foamable material were perpendicular to the lamination direction of the electronic component and the circuit board. Glue so that the layer not to be formed is a layer,
Curing was performed at 150 ° C. For the experiment, a short chip having electrodes short-circuited inside was used as an electronic component.

Thereafter, in order to peel off the parts,
And foamed.

Before foaming, the connection resistance value between the substrate electrode terminal and the electrode terminal of the electronic component was measured. Table 5 shows the results of a shear strength test in which the electronic component was pressed from the side before and after foaming. By providing a connection part with and without a foamable material, low resistance, high strength,
Easy peeling was achieved.

[0078]

[Table 5]

[0079]

As is apparent from the above description, the present invention is applied to a circuit board of an electronic component for making connection by using a paste to enable low-resistance electrical connection and repair of the electronic component. The present invention can provide a foaming paste, an electronic component connecting method, an electronic component mounted body, and an electronic component peeling method for use in bonding of electronic components.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a structure of a mounting form of an electronic component according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a structure of a paste when an electronic component is mounted according to one embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a structure of an expandable resin powder according to one embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a structural form of a foamable paste before foaming in one embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a structural form of a foamable paste after foaming in one embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a structure of a paste when an electronic component is mounted according to one embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a structure of a paste when an electronic component is mounted according to an embodiment of the present invention.

FIG. 8 is a sectional view showing a structure of a mounting form of an electronic component according to an embodiment of the present invention.

[Explanation of symbols]

 1. Electronic components 2. 2. Electronic component connection terminal Foamable paste 4. 4. Board connection terminal Substrate 6. 6. Paste without foaming material 7. hollow resin particles Shell wall 9. 9. Low boiling hydrocarbons or water, etc. Foamable paste structure before foaming 11. Foamable material 12. Pores 13. Foamable paste structure after foaming

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) H01B 1/22 H01B 1/22 A H05K 3/32 H05K 3/32 B // C08J 9/04 CER C08J 9 / 04 CER CEZ CEZ 102 102 (72) Inventor Takashi Kitae 1006 Odakadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Masakazu Tanahashi 1006 Odakadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Emiko Igaki 1006 Kadoma, Kazuma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. AA48 AA59 AA64 AA66 AA71 AA87 BA34 BA35 CA21 CC04Y CC34Y CC54 CC55 DA47 DA54 4J002 AC001 BB111 BC041 BC 051 BC061 BD101 CC031 CD001 CF071 CL001 CN011 DA016 DA017 DA076 DA077 DA086 DA087 DA097 DA107 DB017 DC006 DF017 DJ007 DJ037 DK007 DM006 DM007 FD116 GQ00 GQ02 4J040 CA001 DA022 DA101 DC072 DF002 DF041 EB021 03001 001 001 001 001 AB05 BB11 BB12 CC61 CD57 5G301 DA03 DA32 DA42 DA57 DD01 DD03

Claims (14)

[Claims]
1. Foaming characterized by containing a foamable material which foams when heated, irradiated with electromagnetic waves, and reduced in pressure, in whole or in part. Paste.
2. The foamable paste according to claim 1, further comprising an inorganic powder that absorbs electromagnetic waves.
3. The foamable paste according to claim 2, wherein the inorganic powder is a powder that generates heat by absorbing the electromagnetic wave, and the foamable material foams when the powder generates heat. .
4. When heated, when irradiated with an electromagnetic wave, or when heated and irradiated with an electromagnetic wave, the viscosity of the resin in the foamable paste decreases, and the foamable material foams. The foamable paste according to any one of claims 1 to 3, characterized in that:
5. The foamable paste according to claim 1, wherein a glass transition temperature of a resin in the foamable paste is lower than a foaming temperature of the foamable material.
6. The foaming paste according to claim 1, wherein the resin in the foaming paste is a thermoplastic resin.
7. The foamable paste according to claim 1, further comprising a conductive filler exhibiting conductivity.
8. A connection method for electrically connecting a connection terminal of an electronic component and a connection terminal of a circuit board, wherein the foamable paste according to claim 1 is used for the connection. An electronic component connection method, characterized in that:
9. The foaming paste layer and the conductive paste containing no foaming material, between the electronic component and the circuit board, and perpendicular to the stacking direction of the electronic component and the circuit board. The connection terminal of the electronic component and the connection terminal of the circuit board are electrically joined using the foaming paste and the conductive paste not containing the foaming material so that the layers are formed in a layer shape. 9. The method for connecting electronic components according to claim 8, wherein:
10. The electronic component connection method according to claim 9, wherein the conductive paste containing no foamable material is a thermosetting resin.
11. An electronic component, a circuit board, and a layer of the foaming paste according to claim 1, which connects the electronic component and the circuit board. Electronic component mounting body.
12. An electronic device comprising a conductive paste layer containing no foaming material, wherein said foaming layer is formed between said electronic component and said circuit board and perpendicularly to a laminating direction of said electronic component and said circuit board. The electronic component package according to claim 11, wherein the paste layer and the conductive paste layer that does not contain the foamable material are formed in layers.
13. The electronic component package according to claim 12, wherein the conductive paste containing no foaming material is a thermosetting resin.
14. The electronic component mounted body according to claim 11, wherein the foaming is performed by performing all or a part of heating, irradiating an electromagnetic wave, and reducing the pressure. An electronic component peeling method comprising foaming a foamable material in a conductive paste and peeling an electronic component from a circuit board of the electronic component package.
JP28664299A 1999-10-07 1999-10-07 Expandable paste, electronic component mounted body and process for stripping off electronic component Pending JP2001107019A (en)

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Cited By (7)

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EP1198162A3 (en) * 2000-10-10 2004-01-21 Matsushita Electric Industrial Co., Ltd. Electronic component mounted member and repair method thereof
WO2005071035A1 (en) * 2004-01-26 2005-08-04 Miike Iron Works, Co., Ltd. Bonded member and method of separating the same
WO2006093315A1 (en) * 2005-03-04 2006-09-08 Sony Chemical & Information Device Corporation Anisotropic conductive adhesive and method of electrode connection therewith
JP2007198794A (en) * 2006-01-24 2007-08-09 Aloka Co Ltd Interface detecting device and method, and volume measuring instrument and method
JP2008517085A (en) * 2004-10-18 2008-05-22 テサ・アクチエンゲゼルシヤフト How to recycle electronic components
US7969028B2 (en) 2007-06-15 2011-06-28 Panasonic Corporation Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
US7993984B2 (en) 2007-07-13 2011-08-09 Panasonic Corporation Electronic device and manufacturing method

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1198162A3 (en) * 2000-10-10 2004-01-21 Matsushita Electric Industrial Co., Ltd. Electronic component mounted member and repair method thereof
WO2005071035A1 (en) * 2004-01-26 2005-08-04 Miike Iron Works, Co., Ltd. Bonded member and method of separating the same
JP2008517085A (en) * 2004-10-18 2008-05-22 テサ・アクチエンゲゼルシヤフト How to recycle electronic components
WO2006093315A1 (en) * 2005-03-04 2006-09-08 Sony Chemical & Information Device Corporation Anisotropic conductive adhesive and method of electrode connection therewith
JP4891895B2 (en) * 2005-03-04 2012-03-07 ソニーケミカル&インフォメーションデバイス株式会社 Anisotropic conductive adhesive and electrode connection method using the same
KR101298829B1 (en) * 2005-03-04 2013-08-23 데쿠세리아루즈 가부시키가이샤 Anisotropic conductive adhesive and method of electrode connection therewith
JP2007198794A (en) * 2006-01-24 2007-08-09 Aloka Co Ltd Interface detecting device and method, and volume measuring instrument and method
US7969028B2 (en) 2007-06-15 2011-06-28 Panasonic Corporation Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device
US7993984B2 (en) 2007-07-13 2011-08-09 Panasonic Corporation Electronic device and manufacturing method

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