WO2006093315A1 - Anisotropic conductive adhesive and method of electrode connection therewith - Google Patents

Anisotropic conductive adhesive and method of electrode connection therewith Download PDF

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Publication number
WO2006093315A1
WO2006093315A1 PCT/JP2006/304278 JP2006304278W WO2006093315A1 WO 2006093315 A1 WO2006093315 A1 WO 2006093315A1 JP 2006304278 W JP2006304278 W JP 2006304278W WO 2006093315 A1 WO2006093315 A1 WO 2006093315A1
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WO
WIPO (PCT)
Prior art keywords
anisotropic conductive
conductive adhesive
component
adhesive film
foaming component
Prior art date
Application number
PCT/JP2006/304278
Other languages
French (fr)
Japanese (ja)
Inventor
Misao Konishi
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to KR1020077020124A priority Critical patent/KR101298829B1/en
Priority to CN200680007085XA priority patent/CN101146885B/en
Priority to JP2007506049A priority patent/JP4891895B2/en
Publication of WO2006093315A1 publication Critical patent/WO2006093315A1/en
Priority to HK08107013.0A priority patent/HK1116511A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/08—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
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    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape

Definitions

  • the present invention relates to an anisotropic conductive adhesive used for electrical connection between a display device and a circuit board, for example, and an electrode connection method using the same.
  • anisotropic conductive adhesives have been used as means for electrically connecting a liquid crystal display device and an integrated circuit substrate.
  • This anisotropic conductive adhesive connects, for example, terminals of a flexible printed circuit board (FPC) or an IC chip and terminals of an ITO (Indium Tin Oxide) electrode formed on the glass substrate of the LCD panel. It is used when various terminals are bonded and electrically connected to each other.
  • FPC flexible printed circuit board
  • ITO Indium Tin Oxide
  • connection failure may occur due to the warping of the substrate during thermocompression bonding, a short circuit may occur in the connection part due to the narrow edge of the liquid crystal display device, etc., and the conductive particles can be captured by the miniaturization of the connection bumps. There are problems such as lowering.
  • Patent Document 1 JP-A-11 60899
  • the present invention has been made in order to solve the above-described problems of the conventional technology, and an anisotropic conductive adhesive capable of reliably connecting to a fine pitch connection terminal and the same are used. It aims at providing the connection method of an electrode.
  • a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component! It is an anisotropic conductive adhesive.
  • the present invention is an anisotropic conductive adhesive film in which a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component and formed into a film shape.
  • the foaming component is dispersed in the insulating adhesive component so that a foamed portion in an independent state is formed.
  • the foaming component contains fine particles in which an organic solvent is enclosed in a thermoplastic microforce capsule.
  • This invention is the anisotropic conductive adhesive film in which the insulating adhesive film is laminated
  • This invention is the anisotropic conductive adhesive film in which the anisotropic conductive adhesive film which does not contain the said foaming component and the insulating adhesive film containing the said foaming component are laminated
  • the electrode connecting method includes a step of bonding the connecting members to each other and electrically connecting the electrodes to each other, wherein the anisotropic conductive adhesive is heated in an insulating adhesive component.
  • a foaming component that develops foaming properties and conductive particles are dispersed and used.
  • the present invention uses an anisotropic conductive adhesive in which the foaming component is dispersed so that an independent foam portion is formed in the insulating adhesive component in the invention.
  • This invention uses the anisotropic conductive adhesive in which the said foaming component contains the microparticles
  • the present invention uses an anisotropic conductive adhesive film formed in a film shape as the anisotropic conductive adhesive in the invention.
  • the anisotropic conductive adhesive is a laminate in which an insulating adhesive film is laminated on the anisotropic conductive adhesive film.
  • an anisotropic conductive adhesive film not containing the foaming component and an insulating adhesive film containing the foaming component are used as the anisotropic conductive adhesive. It uses what is stacked.
  • an anisotropic conductive adhesive having a thickness smaller than the height of the electrode can be filled between the connecting members, and the force can be transmitted between the adjacent electrodes. Since the inflow of particles is prevented, the insulation between adjacent electrodes of fine pitch can be improved.
  • the resin component in the adhesive is relatively small as compared with the prior art, the linear expansion coefficient and the elastic modulus can be reduced, thereby reducing the warping of the connecting member during thermocompression bonding. It can be reduced.
  • the anisotropic conductive adhesive of the present invention is formed by laminating an insulating adhesive film, the number of conductive particles can be reduced without being involved in electrical connection. Therefore, it is possible to effectively use the conductive particles.
  • the conductive particles can be effectively used.
  • the layer containing the foaming component can be made thin, so that the possibility of sandwiching the foaming component between the electrodes of the opposing connection member is reduced, and as a result, the degree of freedom in thermocompression bonding conditions is reduced. Can be expanded.
  • FIG. 1 (a) to (c): Schematic diagrams showing an embodiment of an electrode connection method using the present invention.
  • FIG. 2 (a) and (b) are schematic views showing the state of the anisotropic conductive adhesive of the present invention during thermocompression bonding.
  • FIG. 3 (a) and (b) are schematic views showing a method of connecting electrodes using another embodiment of the present invention.
  • FIG. 4 (a) and (b) are schematic views showing a method for connecting electrodes using still another embodiment of the present invention.
  • the present invention can be applied to any paste-like or film-like anisotropic conductive adhesive.
  • FIGS. 1 (a) to 1 (c) are schematic views showing an embodiment of an electrode connecting method using the present invention
  • FIGS. 2 (a) and 2 (b) are diagrams of the present invention at the time of thermocompression bonding.
  • FIG. 3 is a schematic view showing a state of an anisotropic conductive adhesive.
  • the anisotropic conductive adhesive film 1 of the present invention is, for example, Used for electrical connection between the electrode 3 on the circuit board (connection member) 2 and the bump (electrode) 5 on the IC chip (connection member) 4. Conductive particles in the film-like insulating adhesive resin 6 7 is distributed.
  • various conventionally known conductive particles 7 can be used.
  • the insulating adhesive resin 6 is not particularly limited, but the viewpoint power for improving the connection reliability is also a composition comprising epoxy resin, phenoxy resin, and curing agent power.
  • the foaming component 8 that expands by heating and develops foaming properties is dispersed in the insulating adhesive resin 6.
  • thermoplastic microcapsules those containing fine particles obtained by encapsulating an organic solvent in thermoplastic microcapsules can be suitably used.
  • the blending amount of the foaming component 8 that develops foamability by heating is not particularly limited, but the viewpoint power that does not decrease the adhesive strength while sufficiently exhibiting the effects of the present invention can be obtained. It is preferable to contain 2 to 20% by weight of foaming component 8 that exhibits foamability by heating in the adhesive adhesive 6 and it is more preferably 5 to 20% by weight.
  • thermocompression bonding head 10 is used to press the IC chip 4 against the circuit board 2 for temporary pressure bonding.
  • a temperature for example, 40 to 70 ° C.
  • the insulating adhesive resin 6 is softened to some extent, for example, during the temporary pressing step.
  • thermocompression bonding head 10 As shown in FIG. 2 (a), at this time, no change has occurred in the foaming component 8 described above. And, using the thermocompression bonding head 10, the insulating adhesive resin 6 is moved to a predetermined temperature (for example 90-1 The main pressure bonding is performed by heating at 80 ° C.
  • thermocompression bonding head 10 Thereafter, as shown in FIG. 1 (c), by releasing the pressure applied by the thermocompression bonding head 10,
  • the foaming component 8 other than the vicinity of the electrode 3 and the bump 5 expands and foams, and bubbles 9 are generated in the insulating adhesive resin 6 independently of each other.
  • An anisotropic conductive adhesive film 1 is filled between the IC chip 4 and the IC chip 4 is completely bonded to the circuit board 2.
  • the anisotropic conductive adhesive film 1 expands and its volume increases during thermocompression bonding, so that the conductive particles 7 between the adjacent electrodes 3 and bumps 5 are increased. As a result, the insulating properties can be improved.
  • the anisotropic conductive adhesive film 1 is thinner than the height of the bump 5, it can be filled between the circuit board 2 and the IC chip 4, and the force is adjacent. Since the flow of the conductive particles 7 between the electrodes 3 and the bumps 5 is prevented, the insulation between the adjacent electrodes 3 and the bumps 5 can be improved.
  • the resin component in the insulating adhesive resin 6 is relatively small compared to the prior art, the coefficient of linear expansion and the elastic modulus can be reduced. The warping of the circuit board 2 can be reduced.
  • the foamed component is dispersed so as to form an independent foam portion using fine particles obtained by encapsulating an organic solvent in a thermoplastic microcapsule, adhesion is achieved. It is possible to provide an anisotropic conductive adhesive film 1 which has high strength and does not enter moisture and has high conduction reliability.
  • FIGS. 3 (a) and 3 (b) are schematic diagrams showing an electrode connection method using another embodiment of the present invention.
  • FIGS. 4 (a) and 4 (b) are schematic diagrams showing an electrode connection method using still another embodiment of the present invention.
  • a layer in which the foaming component 8 is dispersed in an insulating adhesive resin 6 It is also possible to laminate a cocoon layer in which the foaming component 8 is not dispersed in the insulating adhesive resin 6.
  • the same reference numerals are given to portions common to the above-described embodiment, and detailed description thereof is omitted.
  • the anisotropic conductive adhesive film 1A shown in FIGS. The anisotropic conductive adhesive film 10 containing the foaming component 8 and the insulating adhesive film 11 not containing the foaming component 8 are laminated.
  • the anisotropic conductive adhesive film 1 A is preferably disposed on the circuit board 2 so that the insulating adhesive film 11 faces the IC chip 4.
  • the number of conductive particles 7 not particularly involved in the electrical connection on the IC chip 4 side, that is, the pressing side can be reduced. Can be used effectively.
  • the anisotropic conductive adhesive film IB shown in FIGS. 4 (a) and 4 (b) has an anisotropic conductive adhesive film 12 that does not contain the foaming component 8, and an insulating property that contains the foaming component 8.
  • Adhesive film 13 is laminated.
  • the anisotropic conductive adhesive film 1B is preferably disposed on the circuit board 2 so that the insulating adhesive film 13 containing the foaming component 8 faces the IC chip 4.
  • the conductive particle 7 can be effectively used in the same manner as in the above-described embodiment, and the layer containing the foaming component 8 can be thinned. Therefore, the possibility of sandwiching the foamed component 8 between the bump 5 of the IC chip 4 and the electrode 3 of the circuit board 2 is reduced, and as a result, the degree of freedom in thermocompression bonding conditions can be expanded.
  • liquid epoxy resin (YP50 manufactured by Toto Kasei Co., Ltd.) as insulating adhesive resin 30 parts by weight of epoxy resin (EP828 manufactured by Japan Epoxy Resin Co., Ltd.), 20 parts by weight of conductive particles (4 m diameter, NiZAu-plated resin particles), microcapsule type epoxy curing agent (HX3941HP manufactured by Asahi Kasei Co., Ltd.), foamed by heating Foaming agent A (Matsumoto Yushi Co., Ltd., F30VSD expansion start temperature: about 80 ° C) 4 parts by weight were dissolved and mixed in a mixer using 20 parts by weight of toluene and 20 parts by weight of ethyl acetate as a solvent.
  • the foaming agent used was classified by passing through a 10 m diameter sieve and passed.
  • the above-mentioned paste is applied on the PET film subjected to the peeling treatment, heated in an electric oven set at 65 ° C for 4 minutes, and an anisotropic conductive adhesive film having a dry film thickness of 10 m is formed. A sample was created.
  • a sample was prepared in the same manner as in Example 1 except that foaming agent B (F80GSD manufactured by Matsumoto Yushi Co., Ltd.) having an expansion start temperature of about 150 ° C. was used as the foaming agent.
  • foaming agent B F80GSD manufactured by Matsumoto Yushi Co., Ltd.
  • a sample was prepared in the same manner as in Example 1 except that foaming agent C (F80VSD manufactured by Matsumoto Yushi Co., Ltd.) having an expansion start temperature of about 150 ° C. was used as the foaming agent.
  • foaming agent C F80VSD manufactured by Matsumoto Yushi Co., Ltd.
  • a sample was prepared by the same method as in Example 3 except that the dry film thickness was adjusted to 15 m.
  • a sample was prepared in the same manner as in Example 1 except that no blowing agent was added.
  • a sample was prepared in the same manner as in Comparative Example 1 except that the dry film thickness was adjusted to 30 / zm.
  • IC chip is thermo-compressed on glass substrate and anisotropic
  • the conductive adhesive film was cured (temperature 190 ° C, time 20 seconds).
  • the bump size of the IC chip is 30 mX 85 m, and the space between the bumps is 2
  • the height was 0 m and the bump height was 22 ⁇ m.
  • the anisotropic conductive adhesive films of Examples 1 to 4 had good filling properties and also had a strong clogging of conductive particles between the bumps.
  • the anisotropic conductive adhesive films of Examples 1 to 4 when the blending amount of the foaming agent was 12 parts by weight, almost the same results were obtained. It was.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Adhesive Tapes (AREA)

Abstract

An anisotropic conductive adhesive that realizes secure connection to joining terminals of fine pitch; and a method of electrode connection with the use of the same. There is provided anisotropic conductive adhesive (1) comprising insulating adhesive resin (6) and, dispersed therein, foam component (8) capable of foaming upon heating and conductive particles (7). The foam component (8) is dispersed in the insulating adhesive resin (6) so as to be able to form independent foams. As the foam component (8), use is made of those containing microparticles having an organic solvent sealed in thermoplastic microcapsules.

Description

明 細 書  Specification
異方導電性接着剤及びこれを用いた電極の接続方法  Anisotropic conductive adhesive and electrode connection method using the same
技術分野  Technical field
[0001] 本発明は、例えば表示装置と回路基板間の電気的な接続に用いられる異方導電 性接着剤及びこれを用いた電極の接続方法に関する。  The present invention relates to an anisotropic conductive adhesive used for electrical connection between a display device and a circuit board, for example, and an electrode connection method using the same.
背景技術  Background art
[0002] 従来より、例えば、液晶表示装置と集積回路基板等を電気的に接続する手段とし て、異方性導電接着剤が用いられている。  Conventionally, for example, anisotropic conductive adhesives have been used as means for electrically connecting a liquid crystal display device and an integrated circuit substrate.
[0003] この異方性導電接着剤は、例えば、フレキシブルプリント基板 (FPC)や ICチップの 端子と、 LCDパネルのガラス基板上に形成された ITO (Indium Tin Oxide)電極 の端子とを接続する場合を始めとして、種々の端子同士を接着するとともに電気的に 接続する場合に用いられて 、る。 [0003] This anisotropic conductive adhesive connects, for example, terminals of a flexible printed circuit board (FPC) or an IC chip and terminals of an ITO (Indium Tin Oxide) electrode formed on the glass substrate of the LCD panel. It is used when various terminals are bonded and electrically connected to each other.
[0004] このような異方導電性接着フィルムにお ヽては、近年、接続端子のファインピッチ化 に伴い、種々の問題が生じている。 [0004] In such an anisotropic conductive adhesive film, in recent years, various problems have arisen with the finer pitch of connection terminals.
例えば、熱圧着時における基板の反りによって接続不良が生じたり、液晶表示装置 の狭縁ィ匕等によって接続部分においてショートが発生したり、また、接続用バンプの 微小化によって導電粒子の捕捉性が低下する等の問題がある。  For example, a connection failure may occur due to the warping of the substrate during thermocompression bonding, a short circuit may occur in the connection part due to the narrow edge of the liquid crystal display device, etc., and the conductive particles can be captured by the miniaturization of the connection bumps. There are problems such as lowering.
特許文献 1 :特開平 11 60899号  Patent Document 1: JP-A-11 60899
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0005] 本発明は、このような従来の技術の課題を解決するためになされたもので、ファイン ピッチの接続端子に対して確実な接続が可能な異方導電性接着剤及びこれを用い た電極の接続方法を提供することを目的とする。 [0005] The present invention has been made in order to solve the above-described problems of the conventional technology, and an anisotropic conductive adhesive capable of reliably connecting to a fine pitch connection terminal and the same are used. It aims at providing the connection method of an electrode.
課題を解決するための手段  Means for solving the problem
[0006] 上記目的を達成するためになされた本発明は、絶縁性接着剤成分中に、加熱によ り発泡性が発現する発泡成分と、導電粒子とが分散されて！ヽる異方導電性接着剤で ある。 本発明は、絶縁性接着剤成分中に、加熱により発泡性が発現する発泡成分と、導 電粒子とが分散され、フィルム状に形成されて ヽる異方導電性接着フィルムである。 本発明は、前記発明において、前記絶縁性接着剤成分中に、独立した状態の泡 部が形成されるように発泡成分が分散されて ヽるものである。 [0006] In order to achieve the above object, according to the present invention, a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component! It is an anisotropic conductive adhesive. The present invention is an anisotropic conductive adhesive film in which a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component and formed into a film shape. According to the present invention, in the above invention, the foaming component is dispersed in the insulating adhesive component so that a foamed portion in an independent state is formed.
本発明は、前記発明において、前記発泡成分が、有機溶剤を熱可塑性マイクロ力 プセルに封入した微粒子を含有するものである。  According to the present invention, in the above invention, the foaming component contains fine particles in which an organic solvent is enclosed in a thermoplastic microforce capsule.
本発明は、前記発明において、絶縁性接着フィルムが積層されている異方導電性 接着フィルムである。  This invention is the anisotropic conductive adhesive film in which the insulating adhesive film is laminated | stacked in the said invention.
本発明は、前記発明において、前記発泡成分を含有しない異方導電性接着フィル ムと前記発泡成分を含有する絶縁性接着フィルムが積層されている異方導電性接着 フィルムである。  This invention is the anisotropic conductive adhesive film in which the anisotropic conductive adhesive film which does not contain the said foaming component and the insulating adhesive film containing the said foaming component are laminated | stacked in the said invention.
本発明は、接続用の電極を有する複数の接続部材を前記電極同士を相対向させ て配置し、前記複数の接続部材の間に異方導電性接着剤を配置して加熱及び加圧 を行うことにより、前記接続部材同士を接着するとともに前記電極同士を電気的に接 続する工程を有する電極の接続方法であって、前記異方導電性接着剤として、絶縁 性接着剤成分中に加熱により発泡性が発現する発泡成分と導電粒子とが分散され て!、るものを用いるものである。  In the present invention, a plurality of connection members having electrodes for connection are arranged with the electrodes facing each other, and an anisotropic conductive adhesive is arranged between the plurality of connection members to perform heating and pressurization. Thus, the electrode connecting method includes a step of bonding the connecting members to each other and electrically connecting the electrodes to each other, wherein the anisotropic conductive adhesive is heated in an insulating adhesive component. A foaming component that develops foaming properties and conductive particles are dispersed and used.
本発明は、前記発明において、前記絶縁性接着剤成分中に独立した状態の泡部 が形成されるように前記発泡成分が分散されて!ヽる異方導電性接着剤を用いるもの である。  The present invention uses an anisotropic conductive adhesive in which the foaming component is dispersed so that an independent foam portion is formed in the insulating adhesive component in the invention.
本発明は、前記発明において、前記発泡成分が有機溶剤を熱可塑性マイクロカブ セルに封入した微粒子を含有する異方導電性接着剤を用いるものである。  This invention uses the anisotropic conductive adhesive in which the said foaming component contains the microparticles | fine-particles which enclosed the organic solvent in the thermoplastic microcapsule in the said invention.
本発明は、前記発明において、前記異方導電性接着剤として、フィルム状に形成さ れた異方導電性接着フィルムを用いるものである。  The present invention uses an anisotropic conductive adhesive film formed in a film shape as the anisotropic conductive adhesive in the invention.
本発明は、前記発明において、前記異方導電性接着剤として、前記異方導電性接 着フィルムに絶縁性接着フィルムが積層されているものを用いるものである。  According to the present invention, in the above invention, the anisotropic conductive adhesive is a laminate in which an insulating adhesive film is laminated on the anisotropic conductive adhesive film.
本発明は、前記発明において、前記異方導電性接着剤として、前記発泡成分を含 有しない異方導電性接着フィルムと前記発泡成分を含有する絶縁性接着フィルムが 積層されて ヽるものを用いるものである。 According to the present invention, in the above invention, an anisotropic conductive adhesive film not containing the foaming component and an insulating adhesive film containing the foaming component are used as the anisotropic conductive adhesive. It uses what is stacked.
[0007] 本発明では、このような異方導電性接着剤を電極の間に配置し、加熱及び加圧す ると、発泡成分の発泡性が発現し、異方導電性接着剤が膨張してその体積が増加す る。  [0007] In the present invention, when such an anisotropic conductive adhesive is disposed between electrodes, and heated and pressurized, the foaming property of the foaming component is developed, and the anisotropic conductive adhesive expands. Its volume increases.
その結果、隣接する電極間における導電粒子の密度が低下し、これにより絶縁特 性が向上する。  As a result, the density of the conductive particles between the adjacent electrodes is lowered, thereby improving the insulation characteristics.
[0008] 特に、本発明によれば、電極の高さより小さな厚さの異方導電性接着剤であっても 接続部材の間に充填することができ、し力も、隣接する電極間への導電粒子の流れ 込みが阻止されるので、ファインピッチの隣接電極間の絶縁性を向上させることがで きる。  [0008] In particular, according to the present invention, even an anisotropic conductive adhesive having a thickness smaller than the height of the electrode can be filled between the connecting members, and the force can be transmitted between the adjacent electrodes. Since the inflow of particles is prevented, the insulation between adjacent electrodes of fine pitch can be improved.
[0009] さらに、従来技術に比べて接着剤中の榭脂成分が相対的に少ないので、線膨張係 数及び弾性率を低下させることができ、これにより熱圧着の際の接続部材の反りを軽 減することができる。  [0009] Further, since the resin component in the adhesive is relatively small as compared with the prior art, the linear expansion coefficient and the elastic modulus can be reduced, thereby reducing the warping of the connecting member during thermocompression bonding. It can be reduced.
[0010] 一方、本発明にお 、て、例えば有機溶剤を熱可塑性マイクロカプセルに封入した 微粒子を用い、独立した状態の泡部が形成されるように発泡成分が分散されて 、る 場合には、接続部材同士の接着力が高ぐしかも水分等の浸入がなく導通信頼性の 高 ヽ異方導電性接着剤を提供することができる。  [0010] On the other hand, in the present invention, for example, when fine particles in which an organic solvent is enclosed in a thermoplastic microcapsule are used, and the foaming component is dispersed so as to form an independent foam portion, In addition, it is possible to provide a highly anisotropic anisotropic conductive adhesive that has a high adhesive force between connecting members and does not enter moisture and has high conduction reliability.
[0011] さらに、異方導電性接着剤として、本発明の異方導電性接着フィルムに絶縁性接 着フィルムを積層したものを用いれば、電気的接続に関与しな 、導電粒子の数を減 らすことができるので、導電粒子の有効利用を図ることが可能になる。  [0011] Furthermore, if the anisotropic conductive adhesive of the present invention is formed by laminating an insulating adhesive film, the number of conductive particles can be reduced without being involved in electrical connection. Therefore, it is possible to effectively use the conductive particles.
[0012] さらにまた、異方導電性接着剤として、発泡成分を含有しない異方導電性接着フィ ルムと発泡成分を含有する絶縁性接着フィルムを積層したものを用いれば、導電粒 子の有効利用が図れることに加えて、発泡成分を含有する層を薄くすることができる ため、対向する接続部材の電極間に発泡成分を挟み込む可能性が低下し、その結 果、熱圧着条件における自由度を拡げることができる。  [0012] Furthermore, if an anisotropic conductive adhesive layered with an anisotropic conductive adhesive film containing no foaming component and an insulating adhesive film containing a foaming component is used, the conductive particles can be effectively used. In addition, the layer containing the foaming component can be made thin, so that the possibility of sandwiching the foaming component between the electrodes of the opposing connection member is reduced, and as a result, the degree of freedom in thermocompression bonding conditions is reduced. Can be expanded.
発明の効果  The invention's effect
[0013] 本発明によれば、ファインピッチの接続端子に対して確実な接続が可能な異方導 電性接着剤及びこれを用いた電極の接続方法を提供することができる。 図面の簡単な説明 [0013] According to the present invention, it is possible to provide an anisotropic conductive adhesive that can be securely connected to a fine-pitch connection terminal, and an electrode connection method using the same. Brief Description of Drawings
[0014] [図 l] (a)〜(c)：本発明を用いた電極の接続方法の実施の形態を示す概略図である  [FIG. 1] (a) to (c): Schematic diagrams showing an embodiment of an electrode connection method using the present invention.
[図 2] (a) (b)：熱圧着の際の本発明の異方導電性接着剤の状態を示す概略図であ る。 [FIG. 2] (a) and (b) are schematic views showing the state of the anisotropic conductive adhesive of the present invention during thermocompression bonding.
[図 3] (a) (b)：本発明の他の実施の形態を用いた電極の接続方法を示す概略図であ る。  [FIG. 3] (a) and (b) are schematic views showing a method of connecting electrodes using another embodiment of the present invention.
[図 4] (a) (b)：本発明のさらに他の実施の形態を用いた電極の接続方法を示す概略 図である。  [FIG. 4] (a) and (b) are schematic views showing a method for connecting electrodes using still another embodiment of the present invention.
符号の説明  Explanation of symbols
1 異方導電性接着フィルム  1 Anisotropic conductive adhesive film
2 回路基板  2 Circuit board
3 電極  3 electrodes
4 ICチップ  4 IC chip
5 バンプ（電極）  5 Bump (electrode)
6 絶縁性接着剤樹脂  6 Insulating adhesive resin
7 導電粒子  7 Conductive particles
8 発泡成分  8 Foaming component
9 気泡  9 Bubble
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0016] 以下、本発明に係る異方導電性接着剤及びこれを用いた電極の接続方法の好ま しい実施の形態を図面を参照して詳細に説明する。  Hereinafter, preferred embodiments of an anisotropic conductive adhesive and an electrode connecting method using the same according to the present invention will be described in detail with reference to the drawings.
なお、本発明は、ペースト状又はフィルム状の異方導電性接着剤のいずれにも適 用することができるものである。  The present invention can be applied to any paste-like or film-like anisotropic conductive adhesive.
[0017] 図 1 (a)〜 (c)は、本発明を用いた電極の接続方法の実施の形態を示す概略図、 図 2 (a) (b)は、熱圧着の際の本発明の異方導電性接着剤の状態を示す概略図であ る。 1 (a) to 1 (c) are schematic views showing an embodiment of an electrode connecting method using the present invention, and FIGS. 2 (a) and 2 (b) are diagrams of the present invention at the time of thermocompression bonding. FIG. 3 is a schematic view showing a state of an anisotropic conductive adhesive.
[0018] 図 1 (a)及び図 2 (a)に示すように、本発明の異方導電性接着フィルム 1は、例えば 回路基板 (接続部材） 2の電極 3と、 ICチップ (接続部材) 4のバンプ (電極） 5の電気 的な接続に用いられるもので、フィルム状の絶縁性接着剤榭脂 6中に導電粒子 7が 分散されている。 [0018] As shown in FIG. 1 (a) and FIG. 2 (a), the anisotropic conductive adhesive film 1 of the present invention is, for example, Used for electrical connection between the electrode 3 on the circuit board (connection member) 2 and the bump (electrode) 5 on the IC chip (connection member) 4. Conductive particles in the film-like insulating adhesive resin 6 7 is distributed.
本発明の場合、導電粒子 7としては、従来公知の種々のものを使用することができ る。  In the present invention, various conventionally known conductive particles 7 can be used.
[0019] 一方、絶縁性接着剤榭脂 6については特に限定されることはないが、接続信頼性を 向上させる観点力もは、エポキシ榭脂とフヱノキシ榭脂と硬化剤力もなる組成物、（メ タ）アクリルモノマーと開始剤力もなる組成物を好適に用いることができる。  [0019] On the other hand, the insulating adhesive resin 6 is not particularly limited, but the viewpoint power for improving the connection reliability is also a composition comprising epoxy resin, phenoxy resin, and curing agent power. T) A composition having an acrylic monomer and an initiator power can be preferably used.
そして、本発明の異方導電性接着フィルム 1は、絶縁性接着剤榭脂 6中に、加熱に より膨張して発泡性が発現する発泡成分 8が分散されている。  In the anisotropic conductive adhesive film 1 of the present invention, the foaming component 8 that expands by heating and develops foaming properties is dispersed in the insulating adhesive resin 6.
[0020] 本発明においては、導通信頼性を向上させる観点から、独立した状態の泡部が形 成されるように発泡成分 8を分散させることが好ま 、。  [0020] In the present invention, from the viewpoint of improving conduction reliability, it is preferable to disperse the foaming component 8 so as to form an independent foam portion.
この観点から、本発明においては、有機溶剤を熱可塑性マイクロカプセルに封入し た微粒子を含有するものを好適に用いることができる。  From this viewpoint, in the present invention, those containing fine particles obtained by encapsulating an organic solvent in thermoplastic microcapsules can be suitably used.
[0021] また、加熱により発泡性が発現する発泡成分 8の配合量は特に限定されることはな いが、本発明の効果を十分に発揮させる一方で接着強度を低下させない観点力 は 、絶縁性接着剤榭脂 6中に、加熱により発泡性が発現する発泡成分 8を、 2〜20重 量％含有させることが好ましぐより好ましい含有量は、 5〜20重量％である。  [0021] Further, the blending amount of the foaming component 8 that develops foamability by heating is not particularly limited, but the viewpoint power that does not decrease the adhesive strength while sufficiently exhibiting the effects of the present invention can be obtained. It is preferable to contain 2 to 20% by weight of foaming component 8 that exhibits foamability by heating in the adhesive adhesive 6 and it is more preferably 5 to 20% by weight.
[0022] 本実施の形態の異方導電性接着フィルム 1を用 ヽて回路基板 2の電極 3と ICチップ 4のバンプ 5の接続を行うには、図 1 (a)に示すように、回路基板 2の電極 3と ICチップ 4のバンプ 5を相対向させて配置し、これらの間に異方導電性接着フィルム 1を配置 する。そして、図 1 (b)に示すように、熱圧着ヘッド 10を用い、回路基板 2に対して IC チップ 4を押圧して仮圧着を行う。  In order to connect the electrode 3 of the circuit board 2 and the bump 5 of the IC chip 4 using the anisotropic conductive adhesive film 1 of the present embodiment, as shown in FIG. The electrode 3 of the substrate 2 and the bump 5 of the IC chip 4 are arranged opposite to each other, and the anisotropic conductive adhesive film 1 is arranged between them. Then, as shown in FIG. 1 (b), the thermocompression bonding head 10 is used to press the IC chip 4 against the circuit board 2 for temporary pressure bonding.
この仮圧着工程にぉ ヽては、例えば絶縁性接着剤榭脂 6がある程度軟ィ匕するよう な温度 (例えば 40〜70°C)で加熱を行うことが好ま 、。  It is preferable to perform heating at a temperature (for example, 40 to 70 ° C.) at which the insulating adhesive resin 6 is softened to some extent, for example, during the temporary pressing step.
[0023] 図 2 (a)に示すように、この時点では、上述した発泡成分 8には変化が生じていない そして、熱圧着ヘッド 10を用い、絶縁性接着剤榭脂 6を所定の温度 (例えば 90〜1 80°C)で加熱することにより本圧着を行う。 [0023] As shown in FIG. 2 (a), at this time, no change has occurred in the foaming component 8 described above. And, using the thermocompression bonding head 10, the insulating adhesive resin 6 is moved to a predetermined temperature ( For example 90-1 The main pressure bonding is performed by heating at 80 ° C.
[0024] この場合、 ICチップ 4のバンプ 5と回路基板 2の電極 3近傍の絶縁性接着剤榭脂 6 が硬化し、電極 3及びバンプ 5が電気的に接続され確実に接着されるまで、熱圧着へ ッド 10による加圧及び加熱を行う。 In this case, until the bump 5 of the IC chip 4 and the insulating adhesive resin 6 in the vicinity of the electrode 3 of the circuit board 2 are cured, the electrode 3 and the bump 5 are electrically connected and securely bonded. Apply pressure and heat with thermocompression head 10.
[0025] その後、図 1 (c)に示すように、熱圧着ヘッド 10による加圧を解除することにより、図[0025] Thereafter, as shown in FIG. 1 (c), by releasing the pressure applied by the thermocompression bonding head 10,
2 (b)に示すように、電極 3及びバンプ 5近傍以外の発泡成分 8が膨張発泡し、絶縁 性接着剤榭脂 6中に、それぞれ独立した状態の気泡 9が発生する。 2 As shown in (b), the foaming component 8 other than the vicinity of the electrode 3 and the bump 5 expands and foams, and bubbles 9 are generated in the insulating adhesive resin 6 independently of each other.
[0026] そして、この気泡 9の発生により絶縁性接着剤榭脂 6の体積が増加し、回路基板 2と[0026] Then, the generation of the bubbles 9 increases the volume of the insulating adhesive resin 6, and the circuit board 2 and
ICチップ 4との間に異方導電性接着フィルム 1が充填され、これにより ICチップ 4が回 路基板 2に完全に接着される。 An anisotropic conductive adhesive film 1 is filled between the IC chip 4 and the IC chip 4 is completely bonded to the circuit board 2.
[0027] 以上説明した本実施の形態によれば、熱圧着の際に異方導電性接着フィルム 1が 膨張してその体積が増加するため、隣接する電極 3及びバンプ 5間における導電粒 子 7の密度が低下し、これにより絶縁特性を向上させることができる。 [0027] According to the present embodiment described above, the anisotropic conductive adhesive film 1 expands and its volume increases during thermocompression bonding, so that the conductive particles 7 between the adjacent electrodes 3 and bumps 5 are increased. As a result, the insulating properties can be improved.
[0028] また、本実施の形態によれば、バンプ 5の高さより薄い異方導電性接着フィルム 1で あっても回路基板 2及び ICチップ 4間に充填することができ、し力も、隣接する電極 3 及びバンプ 5間への導電粒子 7の流れ込みが阻止されるので、隣接する電極 3及び バンプ 5間の絶縁性を向上させることができる。 [0028] According to the present embodiment, even if the anisotropic conductive adhesive film 1 is thinner than the height of the bump 5, it can be filled between the circuit board 2 and the IC chip 4, and the force is adjacent. Since the flow of the conductive particles 7 between the electrodes 3 and the bumps 5 is prevented, the insulation between the adjacent electrodes 3 and the bumps 5 can be improved.
[0029] さらに、従来技術に比べて絶縁性接着剤榭脂 6中の榭脂成分が相対的に少ないの で、線膨張係数及び弾性率を低下させることができ、これにより熱圧着の際の回路基 板 2の反りを軽減することができる。 [0029] Furthermore, since the resin component in the insulating adhesive resin 6 is relatively small compared to the prior art, the coefficient of linear expansion and the elastic modulus can be reduced. The warping of the circuit board 2 can be reduced.
[0030] さらにまた、本実施の形態では、有機溶剤を熱可塑性マイクロカプセルに封入した 微粒子を用い、独立した状態の泡部が形成されるように発泡成分が分散されて 、る ことから、接着力が高ぐしかも水分等の浸入がなく導通信頼性の高い異方導電性接 着フィルム 1を提供することができる。 [0030] Furthermore, in the present embodiment, since the foamed component is dispersed so as to form an independent foam portion using fine particles obtained by encapsulating an organic solvent in a thermoplastic microcapsule, adhesion is achieved. It is possible to provide an anisotropic conductive adhesive film 1 which has high strength and does not enter moisture and has high conduction reliability.
[0031] 図 3 (a) (b)は、本発明の他の実施の形態を用いた電極の接続方法を示す概略図FIGS. 3 (a) and 3 (b) are schematic diagrams showing an electrode connection method using another embodiment of the present invention.
、図 4 (a) (b)は、本発明のさらに他の実施の形態を用いた電極の接続方法を示す概 略図である。 FIGS. 4 (a) and 4 (b) are schematic diagrams showing an electrode connection method using still another embodiment of the present invention.
[0032] 本発明にお ヽては、絶縁性接着剤榭脂 6中に上記発泡成分 8が分散された層と、 絶縁性接着剤榭脂 6中に上記発泡成分 8が分散されな ヽ層を積層することも可能で ある。 [0032] In the present invention, a layer in which the foaming component 8 is dispersed in an insulating adhesive resin 6; It is also possible to laminate a cocoon layer in which the foaming component 8 is not dispersed in the insulating adhesive resin 6.
[0033] 以下、上記実施の形態と共通する部分については同一の符号を付しその詳細な説 明を省略すると、例えば、図 3 (a) (b)に示す異方導電性接着フィルム 1Aは、上記発 泡成分 8を含有する異方導電性接着フィルム 10と、上記発泡成分 8を含有しな ヽ絶 縁性接着剤フィルム 11を積層したものである。  [0033] Hereinafter, the same reference numerals are given to portions common to the above-described embodiment, and detailed description thereof is omitted. For example, the anisotropic conductive adhesive film 1A shown in FIGS. The anisotropic conductive adhesive film 10 containing the foaming component 8 and the insulating adhesive film 11 not containing the foaming component 8 are laminated.
この場合、絶縁性接着剤フィルム 11が ICチップ 4と対向するように異方導電性接着 フィルム 1 Aを回路基板 2上に配置することが好ましい。  In this case, the anisotropic conductive adhesive film 1 A is preferably disposed on the circuit board 2 so that the insulating adhesive film 11 faces the IC chip 4.
[0034] このような構成を有する本実施の形態によれば、特に ICチップ 4側、すなわち、押 圧側の電気的接続に関与しない導電粒子 7の数を減らすことができるので、導電粒 子 7の有効利用を図ることが可能になる。 [0034] According to the present embodiment having such a configuration, the number of conductive particles 7 not particularly involved in the electrical connection on the IC chip 4 side, that is, the pressing side can be reduced. Can be used effectively.
[0035] 一方、図 4 (a) (b)に示す異方導電性接着フィルム IBは、上記発泡成分 8を含有し ない異方導電性接着フィルム 12と、上記発泡成分 8を含有する絶縁性接着剤フィル ム 13を積層したものである。 On the other hand, the anisotropic conductive adhesive film IB shown in FIGS. 4 (a) and 4 (b) has an anisotropic conductive adhesive film 12 that does not contain the foaming component 8, and an insulating property that contains the foaming component 8. Adhesive film 13 is laminated.
この場合、発泡成分 8を含有する絶縁性接着剤フィルム 13が ICチップ 4と対向する ように異方導電性接着フィルム 1Bを回路基板 2上に配置することが好ましい。  In this case, the anisotropic conductive adhesive film 1B is preferably disposed on the circuit board 2 so that the insulating adhesive film 13 containing the foaming component 8 faces the IC chip 4.
[0036] このような構成を有する本実施の形態によれば、上記実施の形態と同様に導電粒 子 7の有効利用が図れることに加えて、発泡成分 8を含有する層を薄くすることができ るため、 ICチップ 4のバンプ 5と回路基板 2の電極 3の間に発泡成分 8を挟み込む可 能性が低下し、その結果、熱圧着条件における自由度を拡げることができる。 [0036] According to the present embodiment having such a configuration, the conductive particle 7 can be effectively used in the same manner as in the above-described embodiment, and the layer containing the foaming component 8 can be thinned. Therefore, the possibility of sandwiching the foamed component 8 between the bump 5 of the IC chip 4 and the electrode 3 of the circuit board 2 is reduced, and as a result, the degree of freedom in thermocompression bonding conditions can be expanded.
[0037] さらに、本発明においては、上述した 2層構造のみならず、 3層以上の積層構造を 採用することも可能である。 [0037] Further, in the present invention, not only the above-described two-layer structure but also a stacked structure of three or more layers can be adopted.
その他の構成及び作用効果については上述の実施の形態と同一であるのでその 詳細な説明を省略する。  Since other configurations and operational effects are the same as those of the above-described embodiment, detailed description thereof is omitted.
実施例  Example
[0038] 以下、本発明の実施例を比較例とともに詳細に説明する。  Hereinafter, examples of the present invention will be described in detail together with comparative examples.
<実施例 1 >  <Example 1>
絶縁性接着剤榭脂としてフ ノキシ榭脂 (東都化成社製 YP50) 40重量部、液状 エポキシ榭脂（ジャパンエポキシレジン社製 EP828) 30重量部、導電粒子（4 m 径、 NiZAuめっき榭脂粒子） 20重量部、マイクロカプセル型エポキシ硬化剤 (旭化 成社製 HX3941HP)、加熱により発泡性が発現する発泡成分として発泡剤 A (松 本油脂社製 F30VSD 膨張開始温度:約 80°C この温度は、仮圧着工程で僅か に発泡することによってその後の本圧着工程において発泡が促進される温度である 。）4重量部を、溶剤としてトルエン 20重量部、酢酸ェチル 20重量部を用いてミキサ 一で溶解混合させた。 40 parts by weight of liquid epoxy resin (YP50 manufactured by Toto Kasei Co., Ltd.) as insulating adhesive resin 30 parts by weight of epoxy resin (EP828 manufactured by Japan Epoxy Resin Co., Ltd.), 20 parts by weight of conductive particles (4 m diameter, NiZAu-plated resin particles), microcapsule type epoxy curing agent (HX3941HP manufactured by Asahi Kasei Co., Ltd.), foamed by heating Foaming agent A (Matsumoto Yushi Co., Ltd., F30VSD expansion start temperature: about 80 ° C) 4 parts by weight were dissolved and mixed in a mixer using 20 parts by weight of toluene and 20 parts by weight of ethyl acetate as a solvent.
なお、発泡剤は、 10 m径の孔のフルイによって分級し合格したものを用いた。  The foaming agent used was classified by passing through a 10 m diameter sieve and passed.
[0039] そして、剥離処理を施した PETフィルム上に上述したペーストを塗布し、 65°Cに設 定した電気オーブンで 4分間加熱し、乾燥膜厚が 10 mの異方導電性接着フィルム のサンプルを作成した。 [0039] Then, the above-mentioned paste is applied on the PET film subjected to the peeling treatment, heated in an electric oven set at 65 ° C for 4 minutes, and an anisotropic conductive adhesive film having a dry film thickness of 10 m is formed. A sample was created.
[0040] <実施例 2> <Example 2>
発泡剤として、膨張開始温度が約 150°Cの発泡剤 B (松本油脂社製 F80GSD)を 用いた以外は実施例 1と同一の方法によってサンプルを作成した。  A sample was prepared in the same manner as in Example 1 except that foaming agent B (F80GSD manufactured by Matsumoto Yushi Co., Ltd.) having an expansion start temperature of about 150 ° C. was used as the foaming agent.
[0041] <実施例 3 > [0041] <Example 3>
発泡剤として、膨張開始温度が約 150°Cの発泡剤 C (松本油脂社製 F80VSD)を 用いた以外は実施例 1と同一の方法によってサンプルを作成した。  A sample was prepared in the same manner as in Example 1 except that foaming agent C (F80VSD manufactured by Matsumoto Yushi Co., Ltd.) having an expansion start temperature of about 150 ° C. was used as the foaming agent.
[0042] <実施例 4> <Example 4>
乾燥膜厚が 15 mとなるように調整した以外は実施例 3と同一の方法によってサン プルを作成した。  A sample was prepared by the same method as in Example 3 except that the dry film thickness was adjusted to 15 m.
[0043] <比較例 1 > [0043] <Comparative Example 1>
発泡剤を添加せず、それ以外は実施例 1と同一の方法によってサンプルを作成し た。  A sample was prepared in the same manner as in Example 1 except that no blowing agent was added.
[0044] <比較例 2>  [0044] <Comparative Example 2>
乾燥膜厚が 30 /z mとなるように調整した以外は比較例 1と同一の方法によってサン プルを作成した。  A sample was prepared in the same manner as in Comparative Example 1 except that the dry film thickness was adjusted to 30 / zm.
[0045] <評価 > [0045] <Evaluation>
実施例及び比較例のサンプルを用い、 ICチップをガラス基板上に熱圧着して異方 導電性接着フィルムを硬化させた (温度 190°C、時間 20秒)。 Using the sample of Example and Comparative Example, IC chip is thermo-compressed on glass substrate and anisotropic The conductive adhesive film was cured (temperature 190 ° C, time 20 seconds).
[0046] この場合、 ICチップのバンプのサイズは 30 mX 85 m、バンプ間のスペースは 2[0046] In this case, the bump size of the IC chip is 30 mX 85 m, and the space between the bumps is 2
0 m、バンプ高さは 22 μ mとした。 The height was 0 m and the bump height was 22 μm.
[0047] そして、異方導電性接着フィルムの充填性、バンプ上に捕捉された導電粒子数、バ ンプ間に詰まった導電粒子の状態を、それぞれガラス基板側から目視によって確認 及びカウントした。その結果を表 1に示す。 [0047] Then, the filling property of the anisotropic conductive adhesive film, the number of conductive particles trapped on the bumps, and the state of the conductive particles clogged between the bumps were confirmed and counted visually from the glass substrate side. The results are shown in Table 1.
[0048] [表 1] [0048] [Table 1]
表 1 . 実施例及び比較例の評価結果 Table 1. Evaluation results of Examples and Comparative Examples
Figure imgf000011_0001
Figure imgf000011_0001
〔充填性〕 〇：十分に充填されている X：未充填部分あり [Fillability] ○: Fully filled X: Unfilled part
〔バンプ間粒子詰まり〕 〇：詰まりはない △：詰まりはないが [Particle clogging between bumps] ○: No clogging △: No clogging
X：詰まりがある 粒子が多く存在  X: There are many particles
[0049] 〔評価結果〕 [0049] [Evaluation results]
表 1に示すように、実施例 1〜4の異方導電性接着フィルムは、充填性が良ぐまた バンプ間における導電粒子詰まりもな力つた。なお、実施例 1〜4の異方導電性接着 フィルムについて、発泡剤の配合量を 12重量部としたところ、ほぼ同様の結果が得ら れた。 As shown in Table 1, the anisotropic conductive adhesive films of Examples 1 to 4 had good filling properties and also had a strong clogging of conductive particles between the bumps. For the anisotropic conductive adhesive films of Examples 1 to 4, when the blending amount of the foaming agent was 12 parts by weight, almost the same results were obtained. It was.
[0050] 一方、発泡剤を添加しな!、比較例 1の異方導電性接着フィルムの場合は、充填さ れない部分が生じ、またバンプ間に導電粒子が多く存在した。  [0050] On the other hand, no foaming agent was added! In the case of the anisotropic conductive adhesive film of Comparative Example 1, there was an unfilled portion, and many conductive particles were present between the bumps.
[0051] さらに、発泡剤を添加せず乾燥膜厚を 30 μ mとした比較例 2の異方導電性接着フ イルムにあっては、バンプ間に導電粒子の詰まりが生じた。  [0051] Further, in the anisotropic conductive adhesive film of Comparative Example 2 in which the foaming agent was not added and the dry film thickness was 30 μm, the conductive particles were clogged between the bumps.

Claims

請求の範囲 The scope of the claims
[I] 絶縁性接着剤成分中に、加熱により発泡性が発現する発泡成分と、導電粒子とが 分散されて!ゝる異方導電性接着剤。  [I] An anisotropic conductive adhesive in which a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component.
[2] 請求項 1にお 、て、前記絶縁性接着剤成分中に、独立した状態の泡部が形成され るように前記発泡成分が分散されて ヽる異方導電性接着剤。  [2] The anisotropic conductive adhesive according to claim 1, wherein the foaming component is dispersed in the insulating adhesive component so that an independent foam portion is formed.
[3] 請求項 1にお ヽて、前記発泡成分が、有機溶剤を熱可塑性マイクロカプセルに封 入した微粒子を含有する異方導電性接着剤。 [3] The anisotropic conductive adhesive according to claim 1, wherein the foaming component contains fine particles in which an organic solvent is sealed in a thermoplastic microcapsule.
[4] 絶縁性接着剤成分中に、加熱により発泡性が発現する発泡成分と、導電粒子とが 分散され、フィルム状に形成されて ヽる異方導電性接着フィルム。 [4] An anisotropic conductive adhesive film in which a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component to form a film.
[5] 請求項 4にお 、て、前記絶縁性接着剤成分中に、独立した状態の泡部が形成され るように前記発泡成分が分散されて ヽる異方導電性接着フィルム。 [5] The anisotropic conductive adhesive film according to claim 4, wherein the foamed component is dispersed in the insulating adhesive component so that an independent foam portion is formed.
[6] 請求項 4にお ヽて、前記発泡成分が、有機溶剤を熱可塑性マイクロカプセルに封 入した微粒子を含有する異方導電性接着フィルム。 [6] The anisotropic conductive adhesive film according to claim 4, wherein the foaming component contains fine particles in which an organic solvent is sealed in a thermoplastic microcapsule.
[7] 請求項 4にお 、て、絶縁性接着フィルムが積層されて!ヽる異方導電性接着フィルム [7] The anisotropic conductive adhesive film according to claim 4, wherein the insulating adhesive film is laminated!
[8] 請求項 4にお ヽて、前記発泡成分を含有しな！ヽ異方導電性接着フィルムと前記発 泡成分を含有する絶縁性接着フィルムが積層されている異方導電性接着フィルム。 [8] According to claim 4, the foaming component is not included!異 An anisotropic conductive adhesive film in which an anisotropic conductive adhesive film and an insulating adhesive film containing the foaming component are laminated.
[9] 接続用の電極を有する複数の接続部材を前記電極同士を相対向させて配置し、 前記複数の接続部材の間に異方導電性接着剤を配置して加熱及び加圧を行うこと により、前記接続部材同士を接着するとともに前記電極同士を電気的に接続するェ 程を有する電極の接続方法であって、  [9] A plurality of connection members having electrodes for connection are disposed with the electrodes facing each other, and an anisotropic conductive adhesive is disposed between the plurality of connection members to perform heating and pressurization. The electrode connecting method has a step of bonding the connecting members together and electrically connecting the electrodes,
前記異方導電性接着剤として、絶縁性接着剤成分中に加熱により発泡性が発現 する発泡成分と導電粒子とが分散されているものを用いる電極の接続方法。  An electrode connection method using an anisotropic conductive adhesive in which a foaming component that develops foamability by heating and conductive particles are dispersed in an insulating adhesive component.
[10] 請求項 9において、前記絶縁性接着剤成分中に独立した状態の泡部が形成される ように前記発泡成分が分散されて!ヽる異方導電性接着剤を用いる電極の接続方法。  10. The electrode connecting method according to claim 9, wherein the foamed component is dispersed so that an independent foam portion is formed in the insulating adhesive component. .
[II] 請求項 9において、前記発泡成分が有機溶剤を熱可塑性マイクロカプセルに封入 した微粒子を含有する異方導電性接着剤を用いる電極の接続方法。  [II] The electrode connection method according to claim 9, wherein the foaming component uses an anisotropic conductive adhesive containing fine particles obtained by encapsulating an organic solvent in a thermoplastic microcapsule.
[12] 請求項 9にお ヽて、前記異方導電性接着剤として、フィルム状に形成された異方導 電性接着フィルムを用いる電極の接続方法。 [12] In claim 9, the anisotropic conductive adhesive formed in a film shape as the anisotropic conductive adhesive An electrode connection method using an electrically conductive adhesive film.
[13] 請求項 12において、前記異方導電性接着剤として、前記異方導電性接着フィルム に絶縁性接着フィルムが積層されて 、るものを用いる電極の接続方法。  [13] The electrode connection method according to claim 12, wherein an insulating adhesive film is laminated on the anisotropic conductive adhesive film as the anisotropic conductive adhesive.
[14] 請求項 12において、前記異方導電性接着剤として、前記発泡成分を含有しない異 方導電性接着フィルムと前記発泡成分を含有する絶縁性接着フィルムが積層されて V、るものを用いる電極の接続方法。  [14] In claim 12, the anisotropic conductive adhesive is V, in which an anisotropic conductive adhesive film containing no foaming component and an insulating adhesive film containing the foaming component are laminated. How to connect the electrodes.
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