KR20070047097A - Thin film transistor array substrate and method for testing the same - Google Patents

Abstract

According to the present invention, when the number of odd channels is grouped into one pad part, the pad part borders adjacent to the pad part when the last channel of any pad part ends in the odd number and the first channel of the adjacent pad part starts in the odd number. The present invention relates to a thin film transistor array substrate and a method of manufacturing the same, wherein the thin film transistor array substrate according to the present invention is defined by a gate wiring and a data wiring crossing vertically and horizontally. A gate pad including an odd shorting bar and an even shorting bar formed in a pixel, and having an odd shorting bar and an even shorting bar connected to an odd number of the gate lines or data wires to form a plurality of pad parts, and selectively connected to ends of the wires of the respective pad parts. Or a data pad unit and the gate pad Or it characterized in that the data of the pad portion, connected to any of the first pad portion and thus the last second wiring, the first wiring portion to the second pad adjacent connecting bar or different shorting same bar Ibn shorting.

Poor vertical line, shorting bar, pad

Description

Thin Film Transistor Array Substrate And Method For Testing The Same

1 is a plan view of a thin film transistor array substrate according to the prior art.

2 is a design diagram of data wirings for explaining problems in the prior art;

3 is a photograph showing a vertical line defect of a thin film transistor array substrate according to the prior art.

4 is a plan view of a thin film transistor array substrate according to a first embodiment of the present invention.

5 is a cross-sectional view taken along line II ′ of FIG. 4.

6 is a cross-sectional view taken along line II-II ′ of FIG. 4.

7 is a plan view of a thin film transistor array substrate according to a second embodiment of the present invention.

FIG. 8 is a cross-sectional view taken along line III-III ′ of FIG. 7;

9 is a plan view of a thin film transistor array substrate according to a third embodiment of the present invention.

FIG. 10 is a cross-sectional view taken along line IV-IV ′ of FIG. 9.

11 is a plan view of a thin film transistor array substrate according to a fourth embodiment of the present invention.

FIG. 12 is a cross-sectional view taken along line VV ′ of FIG. 11;

13A to 13C are process plan views of a thin film transistor array substrate according to the present invention;

* Explanation of symbols on the main parts of the drawings

161: gate wiring 162a: odd data wiring

162b: Even-numbered data line 170: Pixel electrode

172: data pad 183: contact hole

182a: data odd shorting bar 182b: data even shorting bar

500: transparent conductive film

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal display device (LCD) and a method of manufacturing the same, and in particular, due to poor vertical lines generated during open / short testing of wiring using an even shorting bar and an odd shorting bar, poor wiring and thin film transistors. The present invention relates to a thin film transistor array substrate and a method of manufacturing the same, which can accurately detect pixel defects without being confused with line defects and point defects caused by defects.

BACKGROUND ART Liquid crystal display devices, which have recently been spotlighted as flat panel display devices, have been actively researched due to their high contrast ratio, suitable for gradation display or moving picture display, and low power consumption.

In particular, it can be manufactured with a thin thickness so that it can be used as an ultra-thin display device such as a wall-mounted TV in the future, and is light in weight and consumes significantly less power than a CRT CRT. It is being used as a next generation display device.

Such liquid crystal display devices generally include a thin film transistor array substrate having a thin film transistor and a pixel electrode formed in each pixel region defined by a gate wiring and a data wiring, a color filter array substrate having a color filter layer and a common electrode, and the two substrates. It is composed of a liquid crystal layer interposed therebetween, by applying a voltage to the electrode to rearrange the liquid crystal molecules of the liquid crystal layer to adjust the amount of light transmitted to display an image.

In order to manufacture the liquid crystal display device as described above, a step of forming various patterns including transistors on a thin film transistor array substrate, a step of forming various patterns including a color filter layer on a color filter array substrate, and the thin film transistor The liquid crystal cell process of bonding the array substrate and the color filter array substrate to each other and injecting the liquid crystal therebetween, and the module process of connecting the external driving circuit to the edge of the thin film transistor array substrate should be performed.

In particular, the thin film transistor array substrate undergoes a signal inspection process for detecting wiring defects such as short circuits, disconnections, and the like of the thin film transistors after the manufacturing process. An od shorting bar and an even shorting bar are connected to each of the gate lines and the data lines on the thin film transistor array substrate for the signal inspection process. That is, the gate odd shorting bar commonly connected to the odd gate wiring and the gate even shorting bar commonly connected to the even gate wiring are used for the signal inspection of the gate wiring, and the data order commonly connected to the odd data wiring for the signal inspection of the data wiring. An even data shorting bar commonly connected to the shorting bar and the even data wiring is used.

In this case, a gate pad portion and a data pad portion to which a signal is input are connected to one end of the gate wiring and the data wiring, respectively, and the gate shorting bar is connected to the gate wiring via the gate pad part, and the data shorting bar is the data shorting. It is connected to the data wiring via the pad portion.

Here, a signal is applied to the gate shorting bar and the data shorting bar to detect a wiring defect and a defect of the thin film transistor. After the inspection, the substrate is cut to a panel size, and the cutting is performed between the gate pad part and the gate shorting bar. The gate shorting bar and the data shorting bar are removed by cutting between the data pad part and the data shorting bar.

Hereinafter, with reference to the accompanying drawings in detail.

1 is a plan view of a thin film transistor array substrate according to the prior art, FIG. 2 is a design diagram of a data line for explaining a problem according to the prior art, and FIG. 3 is a photograph showing a vertical line defect of the thin film transistor array substrate according to the prior art. It is also.

In detail, as illustrated in FIG. 1, the thin film transistor array substrate 11 includes a plurality of gate lines 61 and data lines 62 vertically intersecting to define a unit pixel. A thin film transistor (TFT) is formed at a portion where the 61 and the data line 62 cross each other, and a pixel electrode 70 connected to the thin film transistor is formed at each unit pixel to form each thin film transistor. The image is displayed by switching.

In addition, a gate pad (not shown) and a data pad 72 are extended at one ends of the gate wiring 61 and the data wiring 62. An external driving circuit is formed through the gate drive IC and the data drive IC. Each is connected to the furnace to receive various control signals and video signals. In this case, when the thin film transistor connected to the gate line receiving the scan signal from the gate pad is turned on, the data signal applied from the data pad is transferred to each pixel electrode to display an image.

In addition, a gate shorting bar and a data shorting bar are connected to the ends of the gate pad and the data pad 72, respectively. A gate odd shorting bar is commonly connected to the odd gate wiring, and a gate even shorting bar is commonly connected to the even gate wiring. The gate odd shorting bar and the gate even shorting bar are formed in parallel to each other. Similarly, the data odd shorting bar 82a is commonly connected to the odd data wiring 62a, and the data even shorting bar 82b is commonly connected to the even data wiring 62b. ) And the data even shorting bar 82b are formed in parallel with each other.

Here, a plurality of gate wirings and data wirings are linked to form a group (pad portion), and a drive IC is connected to each pad portion. Therefore, in order to connect the drive ICs to the respective pad portions with a constant size, data wires formed at rather wide intervals in the active region are linked at narrow intervals in the pad portions.

In each of the pad units configured as described above, since the data odd shorting bar is connected to the odd data lines including the first data line constituting each pad unit, the odd signal is normally input to the odd data lines including the first data line.

However, the thin film transistor array substrate and its manufacturing method according to the prior art have the following problems.

That is, when there are an odd number of data wires constituting each pad part, an odd signal flows through the first data wire and the last data wire, and the last data wire of the adjacent first pad part P1 and the second pad part P2 are used. When the odd signal flows through all of the first data wires, a vertical line defect A occurs between the two data wires (see FIGS. 1 and 3).

Accordingly, due to the vertical line defects, the line defects and the point defects caused by the wiring defects and the defects of the thin film transistors are confused, and thus, accurate defects cannot be detected.

For example, as illustrated in FIG. 2, in a liquid crystal display device including 1280 data wires, the data wires are separated into six data pad parts and linked. The 1280 data wires are uniformly arranged on six data pad parts. In order to link properly, 645 data wires are linked to one data pad unit. However, in order to link 645 data wires to each of the six data pad parts, 30 data wires are formed, so that 630 data wires are linked to the third pad part P1 and the sixth pad part P6. . That is, 645 data wires are linked to the first, second, fourth, and fifth pad parts P1, P2, P4, and P5, and 630 data wires are connected to the third and sixth pad parts P3 and P6. Link

At this time, since the data odd shorting bar is connected to the odd-numbered data wires including the first data wire in each pad part and the odd signal is input, the last of the pad parts P1, P2, P4, and P5 including 645 data wires is input. The odd signal is also input to the data wiring. That is, the 1st, 645th data wire of the first pad part P1, the 646, 1290th data wire of the second pad part P2, the 1291th data wire of the third pad part P3, and the fourth An odd signal (+) is input to the 1921, 2564 th data wiring of the pad portion P4, the 2565 and 3209 th data wiring of the fifth pad portion P5, and the 3210 th data wiring of the sixth pad portion P6. do. Since the third pad portion P3 and the fifth pad portion P5 are configured with an even number of data wires, an even signal (−) is input to the 1920 and 3840 data lines, which are the last data wires in each pad part. .

However, an odd signal (+) flows through both the 645th data line of the adjacent first pad portion P1 and the 646th data line of the second pad portion P2, so that a vertical line defect occurs at the boundary between the two data lines. There was a problem that (A) occurs. This vertical line defect is caused between the second pad portion P2 and the third pad portion P3, between the fourth pad portion P4 and the fifth pad portion P5, and the fifth pad portion P5 and the sixth pad portion. It also occurred between the pad portions P6.

The present invention has been made to solve the above problems, the odd number of channels (wiring) to form a group of one pad portion, the last wiring of any pad portion ends in an odd number, the first wiring of the adjacent pad portion is odd In the case of starting the second time, by applying different signals to the last wiring of an arbitrary pad part and the first wiring of the pad part adjacent thereto, or evenly applying an even signal to prevent vertical line defects, An object of the present invention is to provide a thin film transistor array substrate and a method of fabricating the same, which can accurately detect pixel defects during open / short test.

The thin film transistor array substrate according to the present invention for achieving the above object is a thin film transistor and a pixel electrode formed in each pixel defined by the gate wiring and data wiring intersecting longitudinally and horizontally, and the odd number of the gate wiring or data wiring A gate pad portion or a data pad portion having an odd shorting bar and an even shorting bar, which are linked to form a plurality of pad portions and are selectively connected to ends of the wirings of the respective pad portions, and any one of the gate pad portion or the data pad portion, The first wiring of the first pad portion and the first wiring of the second pad portion adjacent thereto are connected to different shorting bars or to the even shorting bars in the same manner.

Meanwhile, a method of manufacturing a thin film transistor array substrate for achieving another object of the present invention includes forming a gate wiring and a gate electrode, and forming first and second shortings in a gate pad part formed by linking the gate wirings in an odd number. Forming a bar to connect the last gate wiring of the first gate pad portion and the first gate wiring of the second gate pad portion adjacent thereto to different shorting bars or to the same shorting bar through which an even signal flows; Forming a gate insulating film on the entire surface including the wiring, forming a semiconductor layer on the gate insulating film on the gate electrode, forming a data wire and a source / drain electrode on the gate insulating film, and First and second parts of the data pad formed by linking an odd number of wirings Forming a setting bar to connect the last data wire of the first data pad part and the first data wire of the second data pad part adjacent thereto to different shorting bars or to the same shorting bar through which an even signal flows; And forming a passivation layer on the entire surface including the data line, and forming a pixel electrode contacting the drain electrode on the passivation layer.

That is, according to the present invention, when the odd number of channels (wirings) form a group with one pad part, the last wiring of an arbitrary pad part ends in an odd number and the first wiring of an adjacent pad part starts in an odd number, The first signal is applied to the first wiring to prevent the generation of vertical pre-defects at the pad portion bordering with the pad portion. The different wiring is applied to the last wiring of the pad portion and the first wiring of the pad portion adjacent thereto. Or by applying the even signal in the same manner.

Hereinafter, a thin film transistor array substrate and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

4 is a plan view of a thin film transistor array substrate according to the present invention.

As illustrated in FIGS. 4 and 5, the thin film transistor array substrate according to the present invention is divided into an active region in which an image is displayed and a pad region in an outer portion of the active region, wherein unit pixels are defined in the active region. To this end, a plurality of gate lines 161 and data lines 162 are vertically intersected, and a thin film transistor (TFT) is formed at a portion where the gate lines 161 and data lines 162 intersect. The pixel electrode 170 connected to the thin film transistor is formed in each unit pixel so that an image is displayed by switching the thin film transistors.

The thin film transistor includes a gate electrode 161a branched from the gate wiring 161, a gate insulating film 173 formed on the entire surface including the gate electrode, an active layer 164 formed on the gate insulating film on the gate electrode, And source / drain electrodes 262a and 262b formed at both ends of the active layer and branched from the data line 162, and the pixel electrode 170 is connected to the drain electrode 262b through the contact hole 163. )

In addition, a gate pad (not shown) and a data pad 172 extending from the gate wiring 161 and the data wiring 162 are formed in the pad region, and the gate pad and the data pad are grouped in plural and at least. One or more gate pad portions and a data pad portion are formed. At this time, the drive IC is contacted on the grouped gate pad and the data pad, and various control signals and video signals generated from an external driving circuit are provided to the active area via the drive IC.

However, in order to test defects such as line defects and point defects with respect to the liquid crystal panel before connecting the external driving circuit, a shorting bar is connected to the ends of the gate pad and the data pad. The shorting bar according to the present invention is composed of an odd shorting bar and an even shorting bar in order to enable open / short test of the wiring, and checks the normal operation of the TFT by applying a predetermined voltage to each shorting bar to obtain a value of the output voltage. Done. A negative signal (−) may be applied to the even shorting bar, and a positive signal (odd) may be applied to the odd shorting bar.

At this time, when the odd number of wirings form a group of one pad portion, and the last wiring of any pad portion ends in an odd number and the first wiring of an adjacent pad portion starts in an odd number, the last wiring of an arbitrary pad portion and this Ensure that the first wires of adjacent pads are connected to different shorting bars or equally to even shorting bars. Therefore, different signals are applied to the last wiring of an arbitrary pad portion and the first wiring of the pad portion adjacent thereto, or even signals are applied in the same manner to prevent vertical line defects.

Specifically, the gate wiring and the data wiring are connected to the gate shorting bar and the data shorting bar in the pad portion area via the gate pad and the data pad, respectively, and each data pad portion has an odd data line 162a in the data odd show. The setting bar 182a is connected, and the data even shorting bar 182b is connected to the even-numbered data line 162b.

However, the last data line of an arbitrary data pad portion and the first data line adjacent to the data pad portion are connected to different shorting bars or to the data even shorting bars in the same manner.

That is, as shown in FIG. 6, the last data line 362a of the first pad part P1 is connected to the data odd shorting bar 182a through which the odd signal (+) flows, and the second pad part P2 is provided. The first data line 362b of is connected to the data even shorting bar 182b through which an even signal (−) flows. Therefore, an even signal is applied to the last wiring of the first pad part P1, and an odd signal is applied to the first wiring of the second pad part P2 adjacent thereto, thereby preventing vertical line defects.

The present invention is not limited to the above embodiment, but is described below.

7 is a plan view of a thin film transistor array substrate according to a second embodiment of the present invention, FIG. 8 is a cross-sectional view taken along line III-III 'of FIG. 7, and FIG. 9 is a thin film transistor according to a third embodiment of the present invention. 10 is a plan view of the array substrate, and FIG. 10 is a cross-sectional view taken along line IV-IV 'of FIG. 9. 11 is a plan view of a thin film transistor array substrate according to a fourth embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along line VV ′ of FIG. 11.

First, as shown in FIGS. 7 and 8, the last data line 362a of the first pad part P1 is connected to the data even shorting bar 182b through which the even signal (−) flows, and the second pad part is connected to the second pad part. The first data line 362b of (P2) may be connected to the data odd shorting bar 182a through which the odd signal (+) flows through the gate insulating film 173. −) Is applied and an even signal (+) is applied to the first wiring of the second pad portion adjacent to the second pad portion, thereby preventing vertical line defects. In this case, the plurality of data wires in the first pad part P1 and the second pad part P2 are alternately connected to the data even shorting bar and the data odd shorting bar.

9 and 10, both the first data line 362a of the first pad portion P1 and the first data line 362b of the second pad portion P2 have an even signal (−). Is connected to the data even shorting bar 182b through which an even signal (-) is applied to the last wiring of the first pad portion, and an even signal (-) is applied to the first wiring of the second pad portion adjacent thereto. Vertical line defects are prevented. In this case, the plurality of data wires in the first pad part P1 and the second pad part P2 are alternately connected to the data even shorting bar and the data odd shorting bar.

On the other hand, as in the first, second, and third embodiments described above, a plurality of data wires inside the first pad portion P1 and the second pad portion P2 are alternated between the data even shorting bar and the data odd shorting bar. Without connecting, as in the following fourth embodiment, a plurality of data wires inside the first pad portion P1 are equally connected to either the data even shorting bar or the data odd shorting bar, and then adjacent to each other. A signal opposite to a signal flowing through the data line of the first pad portion may flow in the plurality of data lines inside the pad portion P2.

That is, as shown in FIGS. 11 and 12, all data lines 162 in the first pad part P1 pass through the gate insulating layer 173 to the data odd shorting bar 182a and the second pad. All of the data wires 162 in the part P2 may be connected to the data even shorting bar 182b, and an odd signal (+) is applied to all data wires of the first pad part, and all of the second pad parts adjacent to the second pad part are connected to the data even shorting bar 182b. An even signal (-) is applied to the data line. As a result, the odd signal (+) is applied to the last wiring of the first pad portion, and the even signal (−) of the opposite signal is applied to the first wiring of the second pad portion adjacent thereto, thereby preventing vertical line defects.

At this time, all the data wires inside the first pad part are connected to the data even shorting bar so that the even signal (-) flows, and all the data wires inside the second pad part are connected to the data odd shorting bar through the gate insulating film to connect the odd signal. Even if (+) flows, the same result can be obtained that the vertical line defect between the first pad portion and the second pad portion is eliminated.

Here, the data odd shorting bar 182a and the data even shorting bar 182b are formed in parallel with each other with the gate insulating layer 173 interposed therebetween. In general, the data wiring layer is formed using molybdenum (Mo) of 0.15? / 占 퐉 and the gate wiring layer is formed using AlNd of 0.05? / 占 퐉.

For reference, reference numeral 500 denotes a transparent conductive film that covers an area where the data pad 172 is exposed to the outside and protects the data pad that is easily oxidized in the air, and is indium tin oxide (ITO) and indium zinc (IZO). Oxide) is formed on the same layer as the pixel electrode 170. The data pad and the transparent conductive layer are electrically connected to each other through a contact hole.

In the above embodiment, the data shorting bar to which the odd signal (+) is applied is formed on the same layer as the gate wiring to be provided inside the data even shorting bar, but the present invention is not limited thereto. The data odd shorting bar to which the is applied may be provided outside the data even shorting bar, and may be integrally formed on the same layer as the data wiring. In this case, the data even shorting bar to which the even signal (-) is applied is formed inside the data odd shorting bar and formed on the same layer as the gate wiring, and is connected to the data wiring through the gate insulating film.

The technical features of the present invention are applicable not only to the data pad portion but also to the gate pad portion. Specifically, the gate odd shorting bar is commonly connected to the odd-numbered gate wirings, and the gate even shorting bar is commonly connected to the even-numbered gate wirings. However, the last gate line of an arbitrary gate pad portion and the first gate line adjacent to the gate pad portion are connected to different shorting bars or to the gate even shorting bars in the same manner.

In this case, the gate odd shorting bar is integrally connected to the gate wiring in the same layer, and the gate even shorting bar is provided in the same layer as the data wiring and connected to the gate wiring through a contact hole formed by removing the gate insulating layer. Alternatively, the gate odd shorting bar may be provided on the same layer as the data line and connected to the gate line through a contact hole formed by removing the gate insulating layer, and the gate even shorting bar may be integrally connected to the gate line.

In the thin film transistor array substrate provided as described above, a constant voltage is applied to the gate shorting bar and the data shorting bar to detect the presence of a short circuit between the gate wiring and the data wiring. That is, after applying a constant voltage to the shorting bar connected to the even-numbered wiring and the shorting bar connected to the odd-numbered wiring, the resistance value of each wiring is measured to check whether the wiring is shorted or short-circuited.

Here, an area where the gate shorting bar and the data shorting bar are formed is an area that is removed after the TFT array substrate and the color filter array substrate are opposed to each other and may be scribed and ground outside the area where the gate test terminal and the data test terminal are formed. Can be.

Subsequently, a manufacturing method of the TFT array substrate according to the present invention will be described.

13A to 13C are process plan views of a thin film transistor array substrate according to the present invention.

First, as shown in FIG. 13A, a low-resistance metal material such as copper (Cu), aluminum (Al), aluminum alloy (AlNd), molybdenum (Mo), and chromium (Cr) is deposited on a substrate. Patterning is performed by an etching technique to simultaneously form a plurality of gate wirings 161, gate electrodes 161a, gate pads 194, a first gate shorting bar 192a, and a first data shorting bar 182a.

The first gate shorting bar is formed in the gate pad part, and the first data shorting bar 182a is formed in the data pad part. The first gate shorting bar 192a is integrally formed at an end of the odd-numbered gate wiring 161, and a gate pad 194 is provided between the first gate shorting bar and the gate wiring.

Thereafter, an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx) is deposited on the entire surface including the gate wiring 161 at a high temperature to form a gate insulating film (not shown), and the gate insulating film is selectively Patterning is performed to form first and second contact holes 193 and 183. The first contact hole 193 is formed at the end of the gate line not connected to the first gate shorting bar 192a, and the second contact hole 183 is formed at a predetermined portion of the first data shorting bar 182a. .

Subsequently, amorphous silicon is deposited on the gate insulating layer, and patterned by photolithography using a second mask to form an island-shaped semiconductor layer on the gate insulating layer to overlap the gate electrode 161a (not shown). To form.

Subsequently, as shown in FIG. 13B, a low-resistance metal material such as copper (Cu), aluminum (Al), aluminum alloy (AlNd), molybdenum (Mo), chromium (Cr), or the like is formed on the entire surface including the semiconductor layer. Depositing and patterning by photolithography to form data lines 162, source / drain electrodes 262a and 262b, data pads 172, second gate shorting bars 192b, and second data shorting bars 182b. .

The data line 162 crosses the gate line 161 to define a unit pixel area, and a stacked layer of the gate electrode 161a, the gate insulating layer, the semiconductor layer, and the source / drain electrodes 262a and 262b is formed in the gate line. A thin film transistor is formed at the intersection of the wiring and the data wiring to control the on / off of the voltage applied to the unit pixel.

The second gate shorting bar 192b is formed in the gate pad part, and is formed to be parallel to each other inside the first gate shorting bar 192a, and the second data shorting bar 182b is formed in the data pad part. And parallel to each other outside the first data shorting bar. The second data shorting bar 192b is integrally formed at an end of the even-numbered data wire 162b, and a gate pad 194 is provided between the first data shorting bar and the data wire.

Therefore, unlike the first gate shorting bar 192a formed at the same time as the gate wiring layer, the second gate shorting bar 192b is formed at the same time as the data wiring layer, and thus, the gate wiring and the gate wiring are integrally connected with the second gate shorting bar. In addition, unlike the second data shorting bar 192b formed at the same time as the data wiring layer, the first data shorting bar 192a is formed at the same time as the gate wiring layer, so that the first data shorting bar 192a is not shorted with the data wiring integrally connected to the second data shorting bar.

As a result, in the gate pad part, the first gate shorting bar 192a is integrally formed with the odd-numbered gate wiring, and the second gate shorting bar 192b is formed with the even-numbered gate wiring through the first contact hole 193. A contact signal is applied to one of the first and second gate shorting bars, and an even signal (−) is applied to the other. However, a plurality of gate pad portions are formed by linking the gate wirings 161 in an odd number, and the first gate wiring of an arbitrary first gate pad portion and the first gate wiring adjacent to the second gate pad portion are connected to different shorting bars. By connecting or connecting to the same shorting bar through which the even signal flows, image defects occurring between the first and second gate pad portions are eliminated.

Meanwhile, in the data pad part, the first data shorting bar 182a is in contact with the odd-numbered data line 162a through the second contact hole 183, and the second data shorting bar 182b is in the even-numbered data line. And an odd signal (+) to one of the first and second data shorting bars and an even signal (−) to the other. However, a plurality of data pad units are formed by linking the data wires 162 in an odd number, and the first data wire of an arbitrary first data pad unit and the first data wire adjacent to the second data pad unit are connected to different shorting bars. By connecting or connecting to the same shorting bar through which the even signal flows, the vertical line defect occurring between the first and second data pad units is eliminated.

At this time, as described above, except for the method of connecting the first shorting bar to odd-numbered wires in each pad part and the second shorting bar to even-numbered wires, all the wires in the first pad part may be connected to the first shorting bar. In this case, all wirings in the second pad portion adjacent to the first pad portion may be connected to the second shorting bar.

Next, as shown in FIG. 13B, a protective film (not shown) is formed by coating an organic insulating material such as BCB or an inorganic insulating material of SiNx on the entire surface including the source / drain electrodes 262a and 262b. In addition, a portion of the passivation layer may be removed using a photolithography technique to expose the third contact hole 163 exposing the drain electrode 262b, the first pad open region 196 exposing the gate pad 194, and the data. A second pad open area 197 is formed to expose the pad 172.

Finally, a transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO), is deposited on the entire surface including the passivation layer, and the pixel electrode 170 and the first and second transparent conductive layers (eg, the photolithography technique) are deposited. 198,500). In this case, the pixel electrode 170 is electrically connected to the drain electrode 115b through the third contact hole 163, and the first transparent conductive layer 198 opens the first pad open region 196. The gate pad 194 may be covered to prevent oxidation, and the second transparent conductive film 500 may cover the data pad 172 through the second pad open region 197 to prevent oxidation.

This completes the TFT array substrate.

On the other hand, the present invention described above is not limited to the above-described embodiment and the accompanying drawings, it is possible that various substitutions, modifications and changes within the scope without departing from the technical spirit of the present invention. It will be apparent to those of ordinary skill in Esau.

That is, the number of gate lines and data lines constituting one pad unit is not limited to the above embodiment, and various substitutions, modifications, and changes may be made without departing from the technical spirit of the present invention. However, the present invention will be usefully applied when the number of wirings forming one pad part is odd.

The thin film transistor array substrate of the present invention as described above and a method of manufacturing the same have the following effects.

That is, in forming an odd number of wires into a single pad part and connecting the wires in each group to the odd shorting bar or even shorting bar, different signals are applied to the last wire of an arbitrary pad part and the first wire of an adjacent pad part. By applying or equally applying the even signal, it is possible to prevent the occurrence of a vertical line defect at the boundary between an arbitrary pad portion and an adjacent pad portion.

Therefore, when the open / short test of the wiring using the even shorting bar and the odd shorting bar, the line defect and the point defect caused by the wiring defect and the defect of the thin film transistor due to the vertical line defect are caused. The pixel defects can be accurately detected without being confused.

Claims (23)

A thin film transistor and a pixel electrode formed in each pixel defined by the gate wiring and the data wiring crossing vertically and horizontally; A gate pad portion or a data pad portion having an odd shorting bar and an even shorting bar selectively connected to end portions of the wirings of the plurality of pads by linking the gate wires or data wires in odd numbers; The thin film, characterized in that the first wiring of the first pad portion and the first wiring of the second pad portion adjacent to the first pad portion of the gate pad portion or the data pad portion are connected to different shorting bars or equally connected to the even shorting bars. Transistor array substrate. The method of claim 1, The gate pad portion, the thin film transistor array substrate, characterized in that the gate pad is further provided between the gate wiring and the gate shorting bar. The method of claim 1, The data pad unit, the thin film transistor array substrate, characterized in that the data pad is further provided between the data line and the data shorting bar. The method of claim 1, And the odd-numbered wires are connected to the odd shorting bar, and the even-numbered wires are connected to the even shorting bar in each pad part. The method of claim 4, wherein A gate odd shorting bar is connected to the odd-numbered gate wirings of each gate pad part, and a gate even shorting bar is connected to the even-numbered gate wirings. A thin film transistor array substrate, characterized in that the last gate wiring of an arbitrary gate pad portion and the first gate wiring adjacent to the gate pad portion are connected to different shorting bars or to the gate even shorting bars. The method of claim 5, The gate odd shorting bar is integrally connected with the gate wiring, The gate even shorting bar is provided on the same layer as the data line and is connected to the gate line through the contact hole. The method of claim 5, The gate odd shorting bar is provided on the same layer as the data line and is connected to the gate line through a contact hole. The gate even shorting bar is a thin film transistor array substrate, characterized in that integrally connected with the gate wiring. The method of claim 4, wherein A data odd shorting bar is connected to the odd-numbered data wires of the data pad unit, and a data even shorting bar is connected to the even-numbered data wires. A thin film transistor array substrate, wherein the last data line of an arbitrary data pad portion and the first data line adjacent to the data pad portion are connected to different shorting bars or to the data even shorting bars. The method of claim 8, The data odd shorting bar is provided on the same layer as the gate wiring and connected to the data wiring through a contact hole. The data even shorting bar is a thin film transistor array substrate, characterized in that integrally connected with the data line. The method of claim 8, The data even shorting bar is integrally connected with the data line, The data odd shorting bar is provided on the same layer as the data line and is connected to the data line through a contact hole. The method of claim 1, Wherein all wires in the first pad portion are connected to the odd shorting bar, and all wires in the second pad portion adjacent to the first pad portion are connected to the even shorting bar. The method of claim 1, Wherein all wires in the first pad part are connected to the even shorting bar, and all wires in the second pad part adjacent to the first pad part are connected to the odd shorting bar. The method of claim 1, A thin film transistor array substrate, wherein an even signal having a negative polarity (−) is applied to the even shorting bar, and an odd signal having a positive polarity is applied to the odd shorting bar. Forming a gate wiring and a gate electrode on the substrate; The first and second shorting bars are formed in the gate pad part formed by linking the gate wirings in an odd number, so that the last gate wiring of the arbitrary first gate pad portion and the first gate wiring adjacent to the second gate pad portion are different from each other. Connecting to a shorting bar or to the same shorting bar with an even signal; Forming a gate insulating film on the entire surface including the gate wiring; Forming a semiconductor layer on the gate insulating film on the gate electrode; Forming a data line and a source / drain electrode on the gate insulating film; The first and second shorting bars are formed in the data pad part formed by linking the data wires in odd numbers so that the last data wire of the first data pad part and the first data wire adjacent to the second data pad part are different from each other. Connecting to a shorting bar or to the same shorting bar with an even signal; Forming a protective film on the entire surface including the data line; Forming a pixel electrode contacting the drain electrode on the passivation layer. The method of claim 14, The first shorting bar of the gate pad portion may be integrally formed with the gate wiring, And the second shorting bar of the gate pad part is formed at the same time as the data line to penetrate the gate insulating layer to be in contact with the gate line. The method of claim 15, The first shorting bar is formed on the outside of the second shorting bar to be parallel to each other manufacturing method of the thin film transistor array substrate. The method of claim 14, The first shorting bar of the data pad portion is formed integrally with the data line at the same time. And the second shorting bar of the data pad part is formed at the same time as the gate line and penetrates through the gate insulating layer to contact the data line. The method of claim 17, The first shorting bar is formed on the outside of the second shorting bar to be parallel to each other manufacturing method of the thin film transistor array substrate. The method of claim 14, And forming a gate pad between the gate line and the first and second shorting bars in the gate pad part. The method of claim 14, The data pad unit may further include a data pad between the data line and the first and second shorting bars. The method of claim 14, In each of the gate pad portion or the data pad portion, the odd-numbered wiring is connected to the odd shorting bar, and the even-numbered wiring is connected to the even shorting bar. The method of claim 14, In each of the gate pad portions or the data pad portions, all the wirings in any first pad portion are connected to the first shorting bar, and all the wirings in the second pad portion adjacent to the first pad portion are connected to the second shorting bar. Method of manufacturing a thin film transistor array substrate, characterized in that. The method of claim 14, At the intersection of the gate wiring and the data wiring, And laminating the gate electrode, the gate insulating film, the semiconductor layer, and the source / drain electrodes to complete a thin film transistor.

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