KR20070023958A - 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법 - Google Patents

액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법 Download PDF

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Publication number
KR20070023958A
KR20070023958A KR1020050078345A KR20050078345A KR20070023958A KR 20070023958 A KR20070023958 A KR 20070023958A KR 1020050078345 A KR1020050078345 A KR 1020050078345A KR 20050078345 A KR20050078345 A KR 20050078345A KR 20070023958 A KR20070023958 A KR 20070023958A
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KR
South Korea
Prior art keywords
substrate
sub
substrates
cutting
liquid crystal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020050078345A
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English (en)
Korean (ko)
Inventor
강호민
최원우
복승룡
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020050078345A priority Critical patent/KR20070023958A/ko
Priority to JP2006195960A priority patent/JP2007058185A/ja
Priority to US11/510,020 priority patent/US20070044606A1/en
Priority to TW95131128A priority patent/TW200712637A/zh
Priority to CNA2006101322883A priority patent/CN1920632A/zh
Publication of KR20070023958A publication Critical patent/KR20070023958A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mathematical Physics (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
KR1020050078345A 2005-08-25 2005-08-25 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법 Withdrawn KR20070023958A (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020050078345A KR20070023958A (ko) 2005-08-25 2005-08-25 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법
JP2006195960A JP2007058185A (ja) 2005-08-25 2006-07-18 液晶表示装置用の基板切断システム及び該システムを利用した液晶表示装置用の基板切断方法
US11/510,020 US20070044606A1 (en) 2005-08-25 2006-08-24 System and method for cutting liquid crystal display substrate
TW95131128A TW200712637A (enExample) 2005-08-25 2006-08-24
CNA2006101322883A CN1920632A (zh) 2005-08-25 2006-08-25 液晶显示器基板切割系统和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050078345A KR20070023958A (ko) 2005-08-25 2005-08-25 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법

Publications (1)

Publication Number Publication Date
KR20070023958A true KR20070023958A (ko) 2007-03-02

Family

ID=37778386

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050078345A Withdrawn KR20070023958A (ko) 2005-08-25 2005-08-25 액정 표시 장치용 기판 절단 시스템 및 상기 시스템을이용한 액정 표시 장치용 기판 절단 방법

Country Status (5)

Country Link
US (1) US20070044606A1 (enExample)
JP (1) JP2007058185A (enExample)
KR (1) KR20070023958A (enExample)
CN (1) CN1920632A (enExample)
TW (1) TW200712637A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857060B1 (ko) * 2007-04-23 2008-09-05 주식회사 디엠에스 기판 이송용 무빙 유닛
KR102021033B1 (ko) * 2019-03-25 2019-09-11 (주)제이스텍 디스플레이 패널의 모서리 정렬에 의한 cf필름 또는 tft필름 절단용 디스플레이 패널의 정렬 회전 절단장치

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100955375B1 (ko) * 2005-12-29 2010-04-29 엘지디스플레이 주식회사 액정패널의 이송장치
JP2011095698A (ja) * 2009-10-30 2011-05-12 Sun Yueh Way 液晶セルマザー基板の切断方法およびその自動化切断システム
CN102390923A (zh) * 2011-08-05 2012-03-28 深圳市华星光电技术有限公司 面板基板切割方法及基板切割装置
US8978528B2 (en) * 2011-08-05 2015-03-17 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for cutting panel substrate and substrate cutting apparatus
JP5731942B2 (ja) * 2011-10-04 2015-06-10 三星ダイヤモンド工業株式会社 マザー基板の分断方法
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN104037177B (zh) * 2014-05-29 2016-09-21 深圳市华星光电技术有限公司 一种显示基板的制造装置
KR102445217B1 (ko) 2014-07-08 2022-09-20 코닝 인코포레이티드 재료를 레이저 가공하는 방법 및 장치
TWI659793B (zh) 2014-07-14 2019-05-21 美商康寧公司 用於使用可調整雷射束焦線來處理透明材料的系統及方法
JP2015164895A (ja) * 2015-03-23 2015-09-17 三星ダイヤモンド工業株式会社 分断装置
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
CN109803786B (zh) 2016-09-30 2021-05-07 康宁股份有限公司 使用非轴对称束斑对透明工件进行激光加工的设备和方法
JP7066701B2 (ja) * 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション
CN106773159B (zh) * 2016-12-12 2018-04-10 惠科股份有限公司 一种残材去除装置
CN107182169B (zh) * 2017-05-23 2023-12-19 安徽达胜电子有限公司 一种电路板切割系统
CN107186793B (zh) * 2017-05-23 2022-12-16 安徽达胜电子有限公司 一种包括夹持装置的电路板切割系统
CN107263600A (zh) * 2017-07-03 2017-10-20 武汉日新科技股份有限公司 薄膜电池切割装置、薄膜电池切割系统及其方法
JP2019107779A (ja) * 2017-12-15 2019-07-04 三星ダイヤモンド工業株式会社 ピックアップユニット

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100656906B1 (ko) * 2000-04-20 2006-12-15 삼성전자주식회사 액정 표시 장치용 패널의 제조 방법, 이를 위한 제조장치, 이를 포함하는 인라인 시스템 및 이를 이용한 액정표시 장치의 제조 방법
US7102726B2 (en) * 2002-03-15 2006-09-05 Lg. Philips Lcd Co., Ltd. System for fabricating liquid crystal display and method of fabricating liquid crystal display using the same
US7295279B2 (en) * 2002-06-28 2007-11-13 Lg.Philips Lcd Co., Ltd. System and method for manufacturing liquid crystal display devices
KR100867726B1 (ko) * 2002-11-21 2008-11-10 삼성전자주식회사 액정표시장치의 제조 방법
EP1690660A1 (en) * 2003-12-04 2006-08-16 Mitsuboshi Diamond Industrial Co., Ltd. Substrate machining method, substrate machining device, substrate carrying method, and substrate carrying mechanism

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100857060B1 (ko) * 2007-04-23 2008-09-05 주식회사 디엠에스 기판 이송용 무빙 유닛
KR102021033B1 (ko) * 2019-03-25 2019-09-11 (주)제이스텍 디스플레이 패널의 모서리 정렬에 의한 cf필름 또는 tft필름 절단용 디스플레이 패널의 정렬 회전 절단장치

Also Published As

Publication number Publication date
JP2007058185A (ja) 2007-03-08
TW200712637A (enExample) 2007-04-01
US20070044606A1 (en) 2007-03-01
CN1920632A (zh) 2007-02-28

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20050825

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid