KR20070007124A - 회로 기판의 검사장치 및 회로 기판의 검사방법 - Google Patents

회로 기판의 검사장치 및 회로 기판의 검사방법 Download PDF

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Publication number
KR20070007124A
KR20070007124A KR1020067020445A KR20067020445A KR20070007124A KR 20070007124 A KR20070007124 A KR 20070007124A KR 1020067020445 A KR1020067020445 A KR 1020067020445A KR 20067020445 A KR20067020445 A KR 20067020445A KR 20070007124 A KR20070007124 A KR 20070007124A
Authority
KR
South Korea
Prior art keywords
circuit board
inspection
holding plate
electrode
conductive sheet
Prior art date
Application number
KR1020067020445A
Other languages
English (en)
Korean (ko)
Inventor
기요시 기무라
스기로 시모다
사또시 스즈끼
Original Assignee
제이에스알 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004110144A external-priority patent/JP3705366B1/ja
Priority claimed from JP2004138955A external-priority patent/JP2005321280A/ja
Application filed by 제이에스알 가부시끼가이샤 filed Critical 제이에스알 가부시끼가이샤
Publication of KR20070007124A publication Critical patent/KR20070007124A/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
    • G01R1/07335—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
KR1020067020445A 2004-03-02 2005-03-02 회로 기판의 검사장치 및 회로 기판의 검사방법 KR20070007124A (ko)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00058282 2004-03-02
JP2004058282 2004-03-02
JP2004110144A JP3705366B1 (ja) 2004-04-02 2004-04-02 回路基板の検査装置
JPJP-P-2004-00110144 2004-04-02
JPJP-P-2004-00131386 2004-04-27
JP2004131386 2004-04-27
JPJP-P-2004-00138955 2004-05-07
JP2004138955A JP2005321280A (ja) 2004-05-07 2004-05-07 回路基板の検査装置および回路基板の検査方法
JP2004185441 2004-06-23
JPJP-P-2004-00185441 2004-06-23
JPJP-P-2004-00194035 2004-06-30
JP2004194035 2004-06-30

Publications (1)

Publication Number Publication Date
KR20070007124A true KR20070007124A (ko) 2007-01-12

Family

ID=34916629

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067020445A KR20070007124A (ko) 2004-03-02 2005-03-02 회로 기판의 검사장치 및 회로 기판의 검사방법

Country Status (4)

Country Link
KR (1) KR20070007124A (zh)
CN (1) CN1926437B (zh)
TW (1) TW200530602A (zh)
WO (1) WO2005083453A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397373B1 (ko) * 2013-03-27 2014-05-20 삼성전기주식회사 전기검사용 지그
KR20190080686A (ko) * 2017-12-28 2019-07-08 주식회사 새한마이크로텍 이방 전도성 시트

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101344569B (zh) * 2008-08-06 2010-12-22 广东生益科技股份有限公司 一种覆铜板层间耐电压性能的测试装置及方法
JP2012174417A (ja) * 2011-02-18 2012-09-10 Jsr Corp 異方導電性シート、電子部材の接続方法および電子部品
CN102928724A (zh) * 2011-08-08 2013-02-13 深圳麦逊电子有限公司 多测试夹具的pcb板格栅测试系统及其测试方法
CN104676368B (zh) * 2013-12-02 2017-04-12 苏州璨宇光学有限公司 背光模组及测试方法
CN103698644B (zh) * 2013-12-18 2016-06-01 马震远 基于霍尔传感器列阵的pcb短路检测方法及检测装置
JP6611251B2 (ja) * 2016-03-22 2019-11-27 ヤマハファインテック株式会社 検査治具、検査装置及び検査方法
CN108020770A (zh) * 2017-10-31 2018-05-11 东莞华贝电子科技有限公司 电路板组件的测试系统及方法
JP7010143B2 (ja) * 2018-05-24 2022-02-10 三菱電機株式会社 絶縁基板の検査方法、検査装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11344521A (ja) * 1998-06-01 1999-12-14 Jsr Corp 積層型コネクター装置および回路基板の検査装置
JP2000074965A (ja) * 1998-09-01 2000-03-14 Jsr Corp 電気抵抗測定装置
US6501278B1 (en) * 2001-06-29 2002-12-31 Intel Corporation Test structure apparatus and method
JP3928389B2 (ja) * 2001-08-31 2007-06-13 Ｊｓｒ株式会社 異方導電性シートおよびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101397373B1 (ko) * 2013-03-27 2014-05-20 삼성전기주식회사 전기검사용 지그
KR20190080686A (ko) * 2017-12-28 2019-07-08 주식회사 새한마이크로텍 이방 전도성 시트

Also Published As

Publication number Publication date
CN1926437B (zh) 2010-05-05
CN1926437A (zh) 2007-03-07
TW200530602A (en) 2005-09-16
WO2005083453A1 (ja) 2005-09-09

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