KR20070001174A - Ｃｏ2 존재하에서의 전기 도금 - Google Patents

Ｃｏ2 존재하에서의 전기 도금 Download PDF

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Publication number
KR20070001174A
KR20070001174A KR1020067018505A KR20067018505A KR20070001174A KR 20070001174 A KR20070001174 A KR 20070001174A KR 1020067018505 A KR1020067018505 A KR 1020067018505A KR 20067018505 A KR20067018505 A KR 20067018505A KR 20070001174 A KR20070001174 A KR 20070001174A
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KR
South Korea
Prior art keywords
group
fluorine
plating
affinity
compound
Prior art date
Application number
KR1020067018505A
Other languages
English (en)
Korean (ko)
Inventor
다까부미 나가이
가즈히사 후지이
히데아끼 아사이
Original Assignee
다이킨 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이킨 고교 가부시키가이샤 filed Critical 다이킨 고교 가부시키가이샤
Publication of KR20070001174A publication Critical patent/KR20070001174A/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020067018505A 2004-02-12 2005-02-14 Ｃｏ2 존재하에서의 전기 도금 KR20070001174A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00035281 2004-02-12
JP2004035281 2004-02-12
JP2004349651A JP4673612B2 (ja) 2004-02-12 2004-12-02 Ｃｏ２存在下での電気めっき
JPJP-P-2004-00349651 2004-12-02

Publications (1)

Publication Number Publication Date
KR20070001174A true KR20070001174A (ko) 2007-01-03

Family

ID=34863449

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067018505A KR20070001174A (ko) 2004-02-12 2005-02-14 Ｃｏ2 존재하에서의 전기 도금

Country Status (5)

Country Link
US (1) US20070175763A1 (fr)
EP (1) EP1722013A4 (fr)
JP (1) JP4673612B2 (fr)
KR (1) KR20070001174A (fr)
WO (1) WO2005078161A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063598A (ja) * 2005-08-30 2007-03-15 Tokyo Univ Of Agriculture & Technology 多孔性金属薄膜およびその製造方法
JP4919262B2 (ja) * 2006-06-02 2012-04-18 日立マクセル株式会社 貯蔵容器、樹脂の成形方法及びメッキ膜の形成方法
JP5324191B2 (ja) 2008-11-07 2013-10-23 ルネサスエレクトロニクス株式会社 半導体装置
US20120245019A1 (en) * 2011-03-23 2012-09-27 Brookhaven Science Associates, Llc Method and Electrochemical Cell for Synthesis of Electrocatalysts by Growing Metal Monolayers, or Bilayers and Treatment of Metal, Carbon, Oxide and Core-Shell Nanoparticles
CN104141161B (zh) * 2014-08-20 2016-08-17 江苏理工学院 基于移动阳极的超临界复合电镀加工钻头的方法
US10011918B2 (en) * 2014-12-23 2018-07-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and process of electro-chemical plating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6793793B2 (en) * 2000-08-24 2004-09-21 Hideo Yoshida Electrochemical treating method such as electroplating and electrochemical reaction device therefor

Also Published As

Publication number Publication date
EP1722013A4 (fr) 2007-08-08
EP1722013A1 (fr) 2006-11-15
JP2005256162A (ja) 2005-09-22
JP4673612B2 (ja) 2011-04-20
WO2005078161A1 (fr) 2005-08-25
US20070175763A1 (en) 2007-08-02

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E601 Decision to refuse application