JP4673612B2 - Co2存在下での電気めっき - Google Patents
Co2存在下での電気めっき Download PDFInfo
- Publication number
- JP4673612B2 JP4673612B2 JP2004349651A JP2004349651A JP4673612B2 JP 4673612 B2 JP4673612 B2 JP 4673612B2 JP 2004349651 A JP2004349651 A JP 2004349651A JP 2004349651 A JP2004349651 A JP 2004349651A JP 4673612 B2 JP4673612 B2 JP 4673612B2
- Authority
- JP
- Japan
- Prior art keywords
- ocf
- plating
- group
- nonionic compound
- aqueous solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/003—Electroplating using gases, e.g. pressure influence
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004349651A JP4673612B2 (ja) | 2004-02-12 | 2004-12-02 | Co2存在下での電気めっき |
US10/589,263 US20070175763A1 (en) | 2004-02-12 | 2005-02-14 | Electroplating in presence of co2 |
EP05710181A EP1722013A4 (fr) | 2004-02-12 | 2005-02-14 | Galvanoplastie en presence de co2 |
PCT/JP2005/002179 WO2005078161A1 (fr) | 2004-02-12 | 2005-02-14 | Galvanoplastie en présence de co2 |
KR1020067018505A KR20070001174A (ko) | 2004-02-12 | 2005-02-14 | Co2 존재하에서의 전기 도금 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004035281 | 2004-02-12 | ||
JP2004349651A JP4673612B2 (ja) | 2004-02-12 | 2004-12-02 | Co2存在下での電気めっき |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005256162A JP2005256162A (ja) | 2005-09-22 |
JP4673612B2 true JP4673612B2 (ja) | 2011-04-20 |
Family
ID=34863449
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004349651A Expired - Fee Related JP4673612B2 (ja) | 2004-02-12 | 2004-12-02 | Co2存在下での電気めっき |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070175763A1 (fr) |
EP (1) | EP1722013A4 (fr) |
JP (1) | JP4673612B2 (fr) |
KR (1) | KR20070001174A (fr) |
WO (1) | WO2005078161A1 (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007063598A (ja) * | 2005-08-30 | 2007-03-15 | Tokyo Univ Of Agriculture & Technology | 多孔性金属薄膜およびその製造方法 |
JP4919262B2 (ja) | 2006-06-02 | 2012-04-18 | 日立マクセル株式会社 | 貯蔵容器、樹脂の成形方法及びメッキ膜の形成方法 |
JP5324191B2 (ja) * | 2008-11-07 | 2013-10-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US20120245019A1 (en) * | 2011-03-23 | 2012-09-27 | Brookhaven Science Associates, Llc | Method and Electrochemical Cell for Synthesis of Electrocatalysts by Growing Metal Monolayers, or Bilayers and Treatment of Metal, Carbon, Oxide and Core-Shell Nanoparticles |
CN106087008B (zh) * | 2014-08-20 | 2017-11-21 | 江苏理工学院 | 效果较好的基于移动阳极的超临界复合电镀加工钻头方法 |
US10011918B2 (en) * | 2014-12-23 | 2018-07-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and process of electro-chemical plating |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6793793B2 (en) * | 2000-08-24 | 2004-09-21 | Hideo Yoshida | Electrochemical treating method such as electroplating and electrochemical reaction device therefor |
-
2004
- 2004-12-02 JP JP2004349651A patent/JP4673612B2/ja not_active Expired - Fee Related
-
2005
- 2005-02-14 KR KR1020067018505A patent/KR20070001174A/ko not_active Application Discontinuation
- 2005-02-14 EP EP05710181A patent/EP1722013A4/fr not_active Withdrawn
- 2005-02-14 US US10/589,263 patent/US20070175763A1/en not_active Abandoned
- 2005-02-14 WO PCT/JP2005/002179 patent/WO2005078161A1/fr not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1722013A4 (fr) | 2007-08-08 |
KR20070001174A (ko) | 2007-01-03 |
US20070175763A1 (en) | 2007-08-02 |
EP1722013A1 (fr) | 2006-11-15 |
WO2005078161A1 (fr) | 2005-08-25 |
JP2005256162A (ja) | 2005-09-22 |
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