KR20060128811A - 드레서 - Google Patents
드레서 Download PDFInfo
- Publication number
- KR20060128811A KR20060128811A KR1020060117648A KR20060117648A KR20060128811A KR 20060128811 A KR20060128811 A KR 20060128811A KR 1020060117648 A KR1020060117648 A KR 1020060117648A KR 20060117648 A KR20060117648 A KR 20060117648A KR 20060128811 A KR20060128811 A KR 20060128811A
- Authority
- KR
- South Korea
- Prior art keywords
- dresser
- dressing
- polishing pad
- main body
- dress
- Prior art date
Links
- 230000009471 action Effects 0.000 claims description 82
- 239000006061 abrasive grain Substances 0.000 claims description 28
- 238000005299 abrasion Methods 0.000 abstract description 4
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 238000005498 polishing Methods 0.000 description 139
- 238000005520 cutting process Methods 0.000 description 42
- 239000000463 material Substances 0.000 description 21
- 229910003460 diamond Inorganic materials 0.000 description 20
- 239000010432 diamond Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 20
- 230000002093 peripheral effect Effects 0.000 description 10
- 239000002002 slurry Substances 0.000 description 10
- 238000004070 electrodeposition Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000004308 accommodation Effects 0.000 description 5
- 210000003128 head Anatomy 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000001788 irregular Effects 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 208000003464 asthenopia Diseases 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 241000135309 Processus Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- -1 on the base surface Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (2)
- 드레서 본체의 표면에 지립을 포함하는 지립층이 설치됨으로써 드레스 작용면이 형성되는 드레서에 있어서,상기 드레서 본체가, 상기 지립층이 설치되는 기초면과,상기 기초면보다도 상기 드레서 본체의 안쪽에 위치하여, 상기 기초면과 평행하게 형성되는 기준면을 구비하는 것을 특징으로 하는 드레서.
- 제1항에 있어서, 상기 기초면이 상기 드레서 본체의 회전 중심을 중심으로 하는 대략 원환 형상으로 형성되어 있고, 상기 기준면이, 상기 기초면보다도 상기 회전 중심측으로 상기 기초면과 동심으로 하여 설치되어 있는 것을 특징으로 하는 드레서.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22949599A JP2001054867A (ja) | 1999-08-13 | 1999-08-13 | 研磨砥石 |
JPJP-P-1999-00229495 | 1999-08-13 | ||
JP27117699A JP2001088010A (ja) | 1999-09-24 | 1999-09-24 | ドレッシング装置 |
JPJP-P-1999-00271176 | 1999-09-24 | ||
JPJP-P-2000-00131785 | 2000-04-28 | ||
JP2000131784A JP2001315053A (ja) | 2000-04-28 | 2000-04-28 | ドレッサー及びこれを用いたドレッシング装置 |
JPJP-P-2000-00131784 | 2000-04-28 | ||
JP2000131785A JP2001315054A (ja) | 2000-04-28 | 2000-04-28 | ドレッサー及びこれを用いたドレッシング装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A Division KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060128811A true KR20060128811A (ko) | 2006-12-14 |
KR100850399B1 KR100850399B1 (ko) | 2008-08-04 |
Family
ID=27477374
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
KR1020060117643A KR20060128809A (ko) | 1999-08-13 | 2006-11-27 | 드레서 및 드레싱 장치 |
KR1020060117644A KR100779804B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
KR1020060117648A KR100850399B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
KR1020060117643A KR20060128809A (ko) | 1999-08-13 | 2006-11-27 | 드레서 및 드레싱 장치 |
KR1020060117644A KR100779804B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1075898A3 (ko) |
KR (4) | KR100851440B1 (ko) |
TW (1) | TW527261B (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
KR20030053987A (ko) * | 2001-12-24 | 2003-07-02 | 주식회사 실트론 | 실리콘 웨이퍼의 폴리싱 패드 드레서 |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
WO2007082556A1 (en) | 2006-01-23 | 2007-07-26 | Freescale Semiconductor, Inc. | Method and apparatus for conditioning a cmp pad |
US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
CN101903131B (zh) * | 2007-11-13 | 2013-01-02 | 宋健民 | Cmp垫修整器 |
TWI388402B (en) | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
TWI473685B (zh) * | 2008-01-15 | 2015-02-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
CN106938437A (zh) * | 2017-05-12 | 2017-07-11 | 深圳市海德精密机械有限公司 | 一种亚微米级超镜面抛光设备 |
US20200130139A1 (en) * | 2018-10-31 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Device for conditioning chemical mechanical polishing |
CN109514434A (zh) * | 2018-12-25 | 2019-03-26 | 上海致领半导体科技发展有限公司 | 一种可调节抛光垫面型的抛光垫修整器 |
KR20240000877U (ko) | 2022-11-15 | 2024-05-22 | (주)나래에프에이씨 | 테이블 드레서 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184727A (ja) * | 1982-04-23 | 1983-10-28 | Disco Abrasive Sys Ltd | シリコンウェ−ハの面を研削する方法 |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
US5547417A (en) * | 1994-03-21 | 1996-08-20 | Intel Corporation | Method and apparatus for conditioning a semiconductor polishing pad |
KR100524510B1 (ko) * | 1996-06-25 | 2006-01-12 | 가부시키가이샤 에바라 세이사꾸쇼 | 연마포를드레싱하는방법과장치 |
KR100492987B1 (ko) * | 1997-10-13 | 2005-09-08 | 삼성전자주식회사 | 연마패드 콘디셔너 |
-
2000
- 2000-07-31 EP EP00116133A patent/EP1075898A3/en not_active Withdrawn
- 2000-08-02 TW TW089115475A patent/TW527261B/zh active
- 2000-08-12 KR KR1020000046741A patent/KR100851440B1/ko active IP Right Grant
-
2006
- 2006-11-27 KR KR1020060117643A patent/KR20060128809A/ko not_active Application Discontinuation
- 2006-11-27 KR KR1020060117644A patent/KR100779804B1/ko active IP Right Grant
- 2006-11-27 KR KR1020060117648A patent/KR100850399B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP1075898A2 (en) | 2001-02-14 |
KR100850399B1 (ko) | 2008-08-04 |
KR20060128810A (ko) | 2006-12-14 |
TW527261B (en) | 2003-04-11 |
KR20060128809A (ko) | 2006-12-14 |
KR20010050061A (ko) | 2001-06-15 |
KR100779804B1 (ko) | 2007-11-27 |
EP1075898A3 (en) | 2003-11-05 |
KR100851440B1 (ko) | 2008-08-08 |
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