KR100850399B1 - 드레서 - Google Patents
드레서 Download PDFInfo
- Publication number
- KR100850399B1 KR100850399B1 KR1020060117648A KR20060117648A KR100850399B1 KR 100850399 B1 KR100850399 B1 KR 100850399B1 KR 1020060117648 A KR1020060117648 A KR 1020060117648A KR 20060117648 A KR20060117648 A KR 20060117648A KR 100850399 B1 KR100850399 B1 KR 100850399B1
- Authority
- KR
- South Korea
- Prior art keywords
- dresser
- dressing
- polishing pad
- main body
- polishing
- Prior art date
Links
- 238000005498 polishing Methods 0.000 claims abstract description 140
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 description 46
- 239000006061 abrasive grain Substances 0.000 description 23
- 229910003460 diamond Inorganic materials 0.000 description 20
- 239000010432 diamond Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 11
- 239000002002 slurry Substances 0.000 description 11
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 210000003128 head Anatomy 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 206010027339 Menstruation irregular Diseases 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
Claims (3)
- 피연마재를 연마하는 연마 패드의 드레싱에 이용되는 드레서에 있어서,드레서 본체와,상기 드레서 본체와는 별개로 하여 설치되고 핀 형상의 부재로 이루어지는 드레스 작용부와,상기 드레스 작용부를 상기 드레서 본체에 착탈 가능하게 유지하는 유지 수단을 포함하고,상기 유지 수단은,상기 드레서 본체의 하면에 형성되어 상기 드레스 작용부를 수용하는 수용 구멍과,상기 드레서 본체의 외주면에서 상기 수용 구멍의 중간 위치로 통하는 나사 구멍과,상기 나사 구멍을 통해 상기 수용 구멍 내로 진퇴 가능하게 설치되며, 상기 수용 구멍 내에 수용되는 상기 드레스 작용부의 측면을 가압하여 상기 수용 구멍의 내벽면에 가압함으로써 상기 드레스 작용부를 상기 수용 구멍 내에 고정하고, 가압을 해제함으로써 상기 드레스 작용부의 고정을 해제하는 클램프 나사를 포함하는 것을 특징으로 하는 드레서.
- 삭제
- 삭제
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22949599A JP2001054867A (ja) | 1999-08-13 | 1999-08-13 | 研磨砥石 |
JPJP-P-1999-00229495 | 1999-08-13 | ||
JPJP-P-1999-00271176 | 1999-09-24 | ||
JP27117699A JP2001088010A (ja) | 1999-09-24 | 1999-09-24 | ドレッシング装置 |
JPJP-P-2000-00131785 | 2000-04-28 | ||
JP2000131785A JP2001315054A (ja) | 2000-04-28 | 2000-04-28 | ドレッサー及びこれを用いたドレッシング装置 |
JP2000131784A JP2001315053A (ja) | 2000-04-28 | 2000-04-28 | ドレッサー及びこれを用いたドレッシング装置 |
JPJP-P-2000-00131784 | 2000-04-28 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A Division KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060128811A KR20060128811A (ko) | 2006-12-14 |
KR100850399B1 true KR100850399B1 (ko) | 2008-08-04 |
Family
ID=27477374
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
KR1020060117644A KR100779804B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
KR1020060117648A KR100850399B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
KR1020060117643A KR20060128809A (ko) | 1999-08-13 | 2006-11-27 | 드레서 및 드레싱 장치 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000046741A KR100851440B1 (ko) | 1999-08-13 | 2000-08-12 | 드레서 및 드레싱 장치 |
KR1020060117644A KR100779804B1 (ko) | 1999-08-13 | 2006-11-27 | 드레서 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060117643A KR20060128809A (ko) | 1999-08-13 | 2006-11-27 | 드레서 및 드레싱 장치 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1075898A3 (ko) |
KR (4) | KR100851440B1 (ko) |
TW (1) | TW527261B (ko) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
KR20030053987A (ko) * | 2001-12-24 | 2003-07-02 | 주식회사 실트론 | 실리콘 웨이퍼의 폴리싱 패드 드레서 |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8251776B2 (en) | 2006-01-23 | 2012-08-28 | Freescale Semiconductor, Inc. | Method and apparatus for conditioning a CMP pad |
US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
TW200940258A (en) * | 2007-11-13 | 2009-10-01 | Chien-Min Sung | CMP pad dressers |
US9011563B2 (en) | 2007-12-06 | 2015-04-21 | Chien-Min Sung | Methods for orienting superabrasive particles on a surface and associated tools |
TWI473685B (zh) * | 2008-01-15 | 2015-02-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
CN106938437A (zh) * | 2017-05-12 | 2017-07-11 | 深圳市海德精密机械有限公司 | 一种亚微米级超镜面抛光设备 |
US20200130139A1 (en) * | 2018-10-31 | 2020-04-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Device for conditioning chemical mechanical polishing |
CN109514434A (zh) * | 2018-12-25 | 2019-03-26 | 上海致领半导体科技发展有限公司 | 一种可调节抛光垫面型的抛光垫修整器 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980005776A (ko) * | 1996-06-25 | 1998-03-30 | 마에다 시게루 | 연마포를 드레싱하는 방법과 장치 |
KR19990031565A (ko) * | 1997-10-13 | 1999-05-06 | 윤종용 | 연마패드 콘디셔닝용 디스크 및 연마패드 콘디셔너 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184727A (ja) * | 1982-04-23 | 1983-10-28 | Disco Abrasive Sys Ltd | シリコンウェ−ハの面を研削する方法 |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5486131A (en) * | 1994-01-04 | 1996-01-23 | Speedfam Corporation | Device for conditioning polishing pads |
JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
US5547417A (en) * | 1994-03-21 | 1996-08-20 | Intel Corporation | Method and apparatus for conditioning a semiconductor polishing pad |
-
2000
- 2000-07-31 EP EP00116133A patent/EP1075898A3/en not_active Withdrawn
- 2000-08-02 TW TW089115475A patent/TW527261B/zh active
- 2000-08-12 KR KR1020000046741A patent/KR100851440B1/ko active IP Right Grant
-
2006
- 2006-11-27 KR KR1020060117644A patent/KR100779804B1/ko active IP Right Grant
- 2006-11-27 KR KR1020060117648A patent/KR100850399B1/ko active IP Right Grant
- 2006-11-27 KR KR1020060117643A patent/KR20060128809A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980005776A (ko) * | 1996-06-25 | 1998-03-30 | 마에다 시게루 | 연마포를 드레싱하는 방법과 장치 |
KR19990031565A (ko) * | 1997-10-13 | 1999-05-06 | 윤종용 | 연마패드 콘디셔닝용 디스크 및 연마패드 콘디셔너 |
Also Published As
Publication number | Publication date |
---|---|
KR20010050061A (ko) | 2001-06-15 |
EP1075898A3 (en) | 2003-11-05 |
KR100851440B1 (ko) | 2008-08-08 |
KR100779804B1 (ko) | 2007-11-27 |
KR20060128811A (ko) | 2006-12-14 |
TW527261B (en) | 2003-04-11 |
KR20060128810A (ko) | 2006-12-14 |
KR20060128809A (ko) | 2006-12-14 |
EP1075898A2 (en) | 2001-02-14 |
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