KR20060109464A - 적층 세라믹 전자 부품의 전극층용 도전체 페이스트 및적층 세라믹 전자 부품용 적층체 유닛의 제조 방법 - Google Patents
적층 세라믹 전자 부품의 전극층용 도전체 페이스트 및적층 세라믹 전자 부품용 적층체 유닛의 제조 방법 Download PDFInfo
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- KR20060109464A KR20060109464A KR1020067009190A KR20067009190A KR20060109464A KR 20060109464 A KR20060109464 A KR 20060109464A KR 1020067009190 A KR1020067009190 A KR 1020067009190A KR 20067009190 A KR20067009190 A KR 20067009190A KR 20060109464 A KR20060109464 A KR 20060109464A
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- acetate
- electrode layer
- ceramic green
- green sheet
- binder
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims (10)
- 아크릴계 수지를 바인더로서 포함하고, 리모넨, α-터피닐아세테이트, I-디하이드로카빌아세테이트, I-멘톤, I-페릴릴아세테이트, I-카빌아세테이트 및 d-디하이드로카빌아세테이트로 이루어지는 군으로부터 선택되는 적어도 1종의 용제를 포함하는 것을 특징으로 하는 도전체 페이스트.
- 제 1 항에 있어서,상기 아크릴계 수지의 중량 평균 분자량이 45만 이상 90만 이하인 것을 특징으로 하는 도전체 페이스트.
- 제 1 항 또는 제 2 항에 있어서,상기 아크릴계 수지의 산가가 5mgKOH/g 이상 25mgKOH/g 이하인 것을 특징으로 하는 도전체 페이스트.
- 바인더로서 부티랄계 수지를 포함하는 세라믹 그린 시트 상에 아크릴계 수지를 바인더로서 포함하고, 리모넨, α-터피닐아세테이트, I-디하이드로카빌아세테이트, I-멘톤, I-페릴릴아세테이트, I-카빌아세테이트 및 d-디하이드로카빌아세테이트로 이루어지는 군으로부터 선택되는 적어도 1종의 용제를 포함하는 도전체 페이스트를 소정의 패턴으로 인쇄하여 전극층을 형성하는 것을 특징으로 하는 적층 세 라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항에 있어서,전극층의 건조 후, 상기 세라믹 그린 시트 상에 아크릴계 수지를 바인더로서 포함하고, 리모넨, α-터피닐아세테이트, I-디하이드로카빌아세테이트, I-멘톤, I-페릴릴아세테이트, I-카빌아세테이트 및 d-디하이드로카빌아세테이트로 이루어지는 군으로부터 선택되는 적어도 1종의 용제를 포함하는 유전체 페이스트를 상기 전극층의 패턴과 상보적인 패턴으로 인쇄하여 스페이서층을 더 형성하는 것을 특징으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항에 있어서,상기 전극층의 형성에 앞서, 상기 세라믹 그린 시트 상에 아크릴계 수지를 바인더로서 포함하고, 리모넨, α-터피닐아세테이트, I-디하이드로카빌아세테이트, I-멘톤, I-페릴릴아세테이트, I-카빌아세테이트 및 d-디하이드로카빌아세테이트로 이루어지는 군으로부터 선택되는 적어도 1종의 용제를 포함하는 유전체 페이스트를 형성되어야 할 상기 전극층의 패턴과 상보적인 패턴으로 인쇄하여 스페이서층을 형성하는 것을 특징으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항 내지 제 6 항 중 어느 한 항에 있어서,상기 아크릴계 수지의 중량 평균 분자량이 45만 이상 90만 이하인 것을 특징 으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항 내지 제 7 항 중 어느 한 항에 있어서,상기 아크릴계 수지의 산가가 5mgKOH/g 이상 25mgKOH/g 이하인 것을 특징으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항 내지 제 8 항 중 어느 한 항에 있어서,상기 부티랄계 수지의 중합도가 1000 이상인 것을 특징으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
- 제 4 항 내지 제 9 항 중 어느 한 항에 있어서,상기 부티랄계 수지의 부티랄화도가 64몰% 이상 78몰% 이하인 것을 특징으로 하는 적층 세라믹 전자 부품용 적층체 유닛의 제조 방법.
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