KR20060102514A - 비대칭 방사 밀도 분포를 가지는 레이저에 의해 부서지기쉬운 물질을 절단하는 방법 - Google Patents

비대칭 방사 밀도 분포를 가지는 레이저에 의해 부서지기쉬운 물질을 절단하는 방법 Download PDF

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Publication number
KR20060102514A
KR20060102514A KR1020060026004A KR20060026004A KR20060102514A KR 20060102514 A KR20060102514 A KR 20060102514A KR 1020060026004 A KR1020060026004 A KR 1020060026004A KR 20060026004 A KR20060026004 A KR 20060026004A KR 20060102514 A KR20060102514 A KR 20060102514A
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KR
South Korea
Prior art keywords
laser
cut
cutting
density distribution
radiation density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020060026004A
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English (en)
Korean (ko)
Inventor
에베르하르트 가브리엘
주엘케 한스-울리히
바인지엘 우베
블라디미르 스테파노비치 콘드라텐코
Original Assignee
예놉틱 아우토마티지어룽스테히닉 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20060102514A publication Critical patent/KR20060102514A/ko
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F3/00—Sewer pipe-line systems
    • E03F3/06—Methods of, or installations for, laying sewer pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03F—SEWERS; CESSPOOLS
    • E03F3/00—Sewer pipe-line systems
    • E03F3/06—Methods of, or installations for, laying sewer pipes
    • E03F2003/065—Refurbishing of sewer pipes, e.g. by coating, lining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Water Supply & Treatment (AREA)
  • Public Health (AREA)
  • Hydrology & Water Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
  • Lasers (AREA)
KR1020060026004A 2005-03-22 2006-03-22 비대칭 방사 밀도 분포를 가지는 레이저에 의해 부서지기쉬운 물질을 절단하는 방법 Withdrawn KR20060102514A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005013783A DE102005013783B4 (de) 2005-03-22 2005-03-22 Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
DE102005013783.0 2005-03-22

Publications (1)

Publication Number Publication Date
KR20060102514A true KR20060102514A (ko) 2006-09-27

Family

ID=36973650

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060026004A Withdrawn KR20060102514A (ko) 2005-03-22 2006-03-22 비대칭 방사 밀도 분포를 가지는 레이저에 의해 부서지기쉬운 물질을 절단하는 방법

Country Status (5)

Country Link
US (1) US20060213883A1 (enExample)
JP (1) JP2006263819A (enExample)
KR (1) KR20060102514A (enExample)
DE (1) DE102005013783B4 (enExample)
TW (1) TW200642793A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
CA2560238A1 (en) * 2006-09-20 2008-03-20 Institut National D'optique Laser-based ablation method and optical system
CN101678510B (zh) * 2007-02-28 2013-10-30 陶瓷技术有限责任公司 用于在沿着分割-或额定断裂线应用非对称的能量输入的情况下制造工件的方法
TWI341242B (en) * 2007-07-31 2011-05-01 Nat Applied Res Laboratories Device for cutting brittle material
JP5314674B2 (ja) * 2008-04-14 2013-10-16 三星ダイヤモンド工業株式会社 脆性材料基板の加工方法
CN102883850A (zh) * 2010-05-14 2013-01-16 旭硝子株式会社 切割方法和切割装置
JPWO2011142401A1 (ja) * 2010-05-14 2013-07-22 古河電気工業株式会社 硬質ウエハ加工用粘着テープ及びそれを用いた研削方法
EP2593266A4 (en) 2010-07-12 2017-04-26 Rofin-Sinar Technologies, Inc. Method of material processing by laser filamentation
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
EP2980033B1 (en) * 2013-03-26 2021-01-20 AGC Inc. Glass sheet processing method and glass sheet processing apparatus
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
EP2953184B1 (de) * 2014-06-04 2018-08-01 Laser-Mikrotechnologie Dr. Kieburg GmbH Verfahren zum Laserschneiden von Elektrodenfolien und/oder Separatorenfolien
WO2016007572A1 (en) 2014-07-08 2016-01-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN107073642B (zh) 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
CN107922237B (zh) 2015-03-24 2022-04-01 康宁股份有限公司 显示器玻璃组合物的激光切割和加工
CN107835794A (zh) 2015-07-10 2018-03-23 康宁股份有限公司 在挠性基材板中连续制造孔的方法和与此相关的产品
LT6428B (lt) * 2015-10-02 2017-07-25 Uab "Altechna R&D" Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
JP7066701B2 (ja) 2016-10-24 2022-05-13 コーニング インコーポレイテッド シート状ガラス基体のレーザに基づく加工のための基体処理ステーション

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
WO1996020062A1 (en) * 1994-12-23 1996-07-04 Kondratenko Vladimir Stepanovi Method of cutting non-metallic materials and a device for carrying out said method
DE19715537C2 (de) * 1997-04-14 1999-08-05 Schott Glas Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
DE19833368C1 (de) * 1998-07-24 2000-02-17 Schott Glas Verfahren und Vorrichtung zur Bearbeitung von Bauteilen aus sprödbrüchigen Werkstoffen
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
EP1244346A4 (en) * 2000-01-04 2005-01-12 Ruiter Seeds C V Lp De CULTIVATED TOMATO PLANTS HAVING HIGHER BRIX VALUE AND PROCESS FOR PRODUCING SUCH PLANTS
WO2001085387A1 (en) * 2000-05-11 2001-11-15 Ptg Precision Technology Center Limited Llc System for cutting brittle materials
RU2206525C2 (ru) * 2001-07-25 2003-06-20 Кондратенко Владимир Степанович Способ резки хрупких неметаллических материалов
JP3992976B2 (ja) * 2001-12-21 2007-10-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
ATE516126T1 (de) * 2002-03-12 2011-07-15 Mitsuboshi Diamond Ind Co Ltd Verfahren und system zur maschinellen bearbeitung von brüchigem material

Also Published As

Publication number Publication date
DE102005013783A1 (de) 2006-09-28
DE102005013783B4 (de) 2007-08-16
TW200642793A (en) 2006-12-16
TWI323203B (enExample) 2010-04-11
JP2006263819A (ja) 2006-10-05
US20060213883A1 (en) 2006-09-28

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PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 20060322

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid