KR20060048980A - 표면 실장 수정 진동자 - Google Patents
표면 실장 수정 진동자 Download PDFInfo
- Publication number
- KR20060048980A KR20060048980A KR1020050069936A KR20050069936A KR20060048980A KR 20060048980 A KR20060048980 A KR 20060048980A KR 1020050069936 A KR1020050069936 A KR 1020050069936A KR 20050069936 A KR20050069936 A KR 20050069936A KR 20060048980 A KR20060048980 A KR 20060048980A
- Authority
- KR
- South Korea
- Prior art keywords
- lead terminal
- base
- casing wall
- glass
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000013078 crystal Substances 0.000 title claims abstract description 67
- 239000011521 glass Substances 0.000 claims abstract description 46
- 239000005394 sealing glass Substances 0.000 claims abstract description 35
- 239000010453 quartz Substances 0.000 claims description 24
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 24
- 230000005284 excitation Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 20
- 230000004048 modification Effects 0.000 abstract description 4
- 238000012986 modification Methods 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 description 23
- 230000000149 penetrating effect Effects 0.000 description 20
- 239000006060 molten glass Substances 0.000 description 13
- 229910000679 solder Inorganic materials 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/19—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0504—Holders or supports for bulk acoustic wave devices
- H03H9/0514—Holders or supports for bulk acoustic wave devices consisting of mounting pads or bumps
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004223152 | 2004-07-30 | ||
| JPJP-P-2004-00223152 | 2004-07-30 | ||
| JPJP-P-2005-00010135 | 2005-01-18 | ||
| JP2005010135A JP3837429B2 (ja) | 2004-07-30 | 2005-01-18 | 振動子用表面実装ベース及びこれを用いた水晶振動子 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060048980A true KR20060048980A (ko) | 2006-05-18 |
Family
ID=35149397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020050069936A Withdrawn KR20060048980A (ko) | 2004-07-30 | 2005-07-29 | 표면 실장 수정 진동자 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7190235B2 (enExample) |
| EP (1) | EP1622263A1 (enExample) |
| JP (1) | JP3837429B2 (enExample) |
| KR (1) | KR20060048980A (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006270944A (ja) * | 2005-02-25 | 2006-10-05 | Kyocera Corp | 圧電部品 |
| USD646236S1 (en) * | 2009-11-05 | 2011-10-04 | Seiko Instruments Inc. | Quartz crystal |
| USD643383S1 (en) * | 2009-11-06 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD643385S1 (en) * | 2009-11-06 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD653631S1 (en) * | 2009-11-06 | 2012-02-07 | Seiko Instruments Inc. | Quartz crystal |
| USD643382S1 (en) * | 2009-11-06 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD634287S1 (en) * | 2009-11-06 | 2011-03-15 | Seiko Instruments Inc. | Quartz crystal |
| USD643387S1 (en) * | 2010-03-29 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD653632S1 (en) * | 2010-03-29 | 2012-02-07 | Seiko Instruments Inc. | Quartz crystal |
| USD643384S1 (en) * | 2010-03-29 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD646237S1 (en) * | 2010-03-29 | 2011-10-04 | Seiko Instruments Inc. | Quartz crystal |
| USD634288S1 (en) * | 2010-03-29 | 2011-03-15 | Seiko Instruments Inc. | Quartz crystal |
| USD643386S1 (en) * | 2010-03-29 | 2011-08-16 | Seiko Instruments Inc. | Quartz crystal |
| USD648288S1 (en) * | 2010-06-16 | 2011-11-08 | Seiko Instruments Inc. | Quartz crystal |
| USD646656S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD647071S1 (en) * | 2010-06-16 | 2011-10-18 | Seiko Instruments Inc. | Quartz crystal |
| USD646652S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646655S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646651S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646649S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD637982S1 (en) * | 2010-06-16 | 2011-05-17 | Seiko Instruments Inc. | Quartz crystal |
| USD646654S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646650S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646648S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| USD646653S1 (en) * | 2010-06-16 | 2011-10-11 | Seiko Instruments Inc. | Quartz crystal |
| EP2806772A4 (en) * | 2012-01-24 | 2015-09-09 | Bunn O Matic Corp | brewing |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08279725A (ja) | 1995-04-05 | 1996-10-22 | Nec Kansai Ltd | 表面実装型セラミックパッケージ |
| JPH1131939A (ja) | 1997-07-14 | 1999-02-02 | Matsushita Electric Ind Co Ltd | 表面実装型水晶振動子およびその製造方法 |
| JP3926002B2 (ja) | 1997-09-26 | 2007-06-06 | シチズン電子株式会社 | 圧電振動子とその製造方法 |
| JP2000286661A (ja) | 1999-03-31 | 2000-10-13 | Kinseki Ltd | 表面実装型電子部品 |
| JP2003297453A (ja) | 2002-03-29 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 表面実装型気密端子とそれを用いた水晶振動子 |
| JP3980954B2 (ja) * | 2002-07-15 | 2007-09-26 | 日本電波工業株式会社 | 表面実装水晶発振器 |
| US7076870B2 (en) * | 2004-08-16 | 2006-07-18 | Pericom Semiconductor Corp. | Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank |
-
2005
- 2005-01-18 JP JP2005010135A patent/JP3837429B2/ja not_active Expired - Fee Related
- 2005-07-25 US US11/188,414 patent/US7190235B2/en not_active Expired - Fee Related
- 2005-07-28 EP EP05254717A patent/EP1622263A1/en not_active Withdrawn
- 2005-07-29 KR KR1020050069936A patent/KR20060048980A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US7190235B2 (en) | 2007-03-13 |
| US20060022557A1 (en) | 2006-02-02 |
| EP1622263A1 (en) | 2006-02-01 |
| JP3837429B2 (ja) | 2006-10-25 |
| JP2006066377A (ja) | 2006-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20050729 |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20100507 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20050729 Comment text: Patent Application |
|
| PC1202 | Submission of document of withdrawal before decision of registration |
Comment text: [Withdrawal of Procedure relating to Patent, etc.] Withdrawal (Abandonment) Patent event code: PC12021R01D Patent event date: 20110628 |
|
| WITB | Written withdrawal of application |