KR20050076689A - 전자모듈 및 이 전자모듈을 탑재한 전자기기와 전자모듈에있어서의 압착접속 확인방법 - Google Patents

전자모듈 및 이 전자모듈을 탑재한 전자기기와 전자모듈에있어서의 압착접속 확인방법 Download PDF

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Publication number
KR20050076689A
KR20050076689A KR1020050005310A KR20050005310A KR20050076689A KR 20050076689 A KR20050076689 A KR 20050076689A KR 1020050005310 A KR1020050005310 A KR 1020050005310A KR 20050005310 A KR20050005310 A KR 20050005310A KR 20050076689 A KR20050076689 A KR 20050076689A
Authority
KR
South Korea
Prior art keywords
electronic module
transparent substrate
electronic
conductive particles
connection
Prior art date
Application number
KR1020050005310A
Other languages
English (en)
Korean (ko)
Inventor
오하자마히데타카
Original Assignee
도호꾸 파이오니어 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도호꾸 파이오니어 가부시끼가이샤 filed Critical 도호꾸 파이오니어 가부시끼가이샤
Publication of KR20050076689A publication Critical patent/KR20050076689A/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020050005310A 2004-01-21 2005-01-20 전자모듈 및 이 전자모듈을 탑재한 전자기기와 전자모듈에있어서의 압착접속 확인방법 KR20050076689A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004012759A JP2005209767A (ja) 2004-01-21 2004-01-21 電子モジュールおよびこの電子モジュールを搭載した電子機器ならびに電子モジュールにおける圧着接続確認方法
JPJP-P-2004-00012759 2004-01-21

Publications (1)

Publication Number Publication Date
KR20050076689A true KR20050076689A (ko) 2005-07-26

Family

ID=34878996

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050005310A KR20050076689A (ko) 2004-01-21 2005-01-20 전자모듈 및 이 전자모듈을 탑재한 전자기기와 전자모듈에있어서의 압착접속 확인방법

Country Status (4)

Country Link
JP (1) JP2005209767A (ja)
KR (1) KR20050076689A (ja)
CN (1) CN1645985A (ja)
TW (1) TW200526094A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4925405B2 (ja) * 2005-10-03 2012-04-25 旭化成イーマテリアルズ株式会社 接続構造体の製造方法
CN101713875B (zh) * 2008-10-07 2011-10-12 元太科技工业股份有限公司 软性显示面板
JP5370694B2 (ja) * 2011-03-11 2013-12-18 デクセリアルズ株式会社 接続構造体
CN104200767B (zh) * 2014-09-18 2017-10-31 南京中电熊猫液晶显示科技有限公司 阵列基板、显示装置及其检测方法
CN105161048B (zh) * 2015-10-27 2018-01-09 京东方科技集团股份有限公司 一种电路板和显示装置
WO2019120583A1 (en) * 2017-12-22 2019-06-27 Huawei Technologies Co., Ltd. Flex on board anisotropic conductive adhesive interconnection
JP2019179695A (ja) * 2018-03-30 2019-10-17 株式会社ジャパンディスプレイ 有機ｅｌ表示装置および有機ｅｌ表示装置の製造方法
CN108598014B (zh) * 2018-05-30 2019-05-24 英特尔产品（成都）有限公司 用于失效类型识别的方法和装置

Also Published As

Publication number Publication date
JP2005209767A (ja) 2005-08-04
CN1645985A (zh) 2005-07-27
TW200526094A (en) 2005-08-01

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