200526094 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種電子模組之壓接連接；更加詳細地 =，關於一種具備可以呈定量地評價及管理例如藉由1(：或 軟性配線基板等和透職板之喊端子間之鱗接所造成 =連接狀態之構造之電子模組及搭載該電子難之電子機 器以及電子模組之熱壓接連接確認方法。 【先前技術】 資訊終端機（PDA)等之普及 圖像顯示功能並且實現薄型 由於行動電話機或可攜式 而要求可以具有更加高精細之 及低消耗電力的顯示面板。 板述要求之顯示面板係向來採驗晶顯示面 _=衣品’但是’近年來’具有麵自發光型發光元 在；下—世代之顯示面板而受到注目。 在刖述頌不面板，一般而古，ΤΓ 4、+ 板)或者是軟性配線基板和透: :子間係透過包含導電粒子之異方=)(:線 Amsotrc^ C〇nductlve 叫），藉由熱 進 干丽述ACF係在熱塑性或熱固性樹脂薄膜内分散^導 廷粒子，藉由在破壞前述導電粒子 輸在對崎之端子或電極“條 一方向之導電性，藉此而使得端子或電_呈電氣及機械 200526094 地進行連接。 電極間射地彻在總括地同時連接許多端子或 在第二圖，黯；灶， 板間之ϋ# 由AGF而進行誠接之1g和透明基 置透明ϊίΓ 構造。第二圖所示之連接端子部係設 端子λ抽和金屬配線8之透明基板2透過IC1之連接 才(凸塊i3及咖，以面向下，來進行壓接。 側，具敘述所構成之連接端子部，在壓接部之外 觀臾兮明之金屬配線8，因此，無法由外觀而直接地 邛，不各易藉由計測ACF7所包含之導電粒子數 、 法而確認是否確實地進行熱壓接。 接：揭示可以由玻璃基板之非壓 在第-圖，顯示相同於前述專利文獻i所揭示之液晶 二之r樣電子模組之連接端子部m在第一圖， 接部a之兩端部，設置2部位之虛擬端子（凸塊）5, 菩=位’為了取代金屬配線8而在虛擬端子5之設 置金屬膜6。 #:在第三圖，顯示第―圖之虛擬端子部之剖面圖。正如 弟—圖所示，在虛擬端子部，由比較於第二圖而得知：可 ^精由成為在透縣板2侧並無不透明之金屬配線8之狀 —由透明基板2之非壓接面，來透視熱壓接部，能夠直 接地觀祭及確認虛擬端子5上之ACF7之導電粒子之破壞狀 200526094 【專利文獻1】日本專利特開平u — 125837號公 但是，在前述顯示面板，液晶顯示面板之各個像素係 在基本h成為電壓驅動型，因此，透明基板側和軟性配 線基板％側之電_之連接電阻係不太被料是問題 句話說’在液晶顯示面板’前述兩電關之連接電阻、 使是變得職大，並且，即使是〇變得不均，也使 於圖像之顯示造成影響之程度變得比較少。 、 另-方面，在近年來受觀目之有機此顯示面板，其 顯不像素係電流驅動型，並且，具有幾乎比例於驅動電流 而也改變像素之發光亮度之電流依㈣性。㈣是在被動 驅動型EL顯示面板，不同於液晶，在各個元件，流動比較 大之電流，因此，大多是陰極側之配線電阻或連接電阻成 為問題之狀態。 因此，在前述熱壓接連接，要求電氣連接變得充分。 此外在近年來，在熱壓接Ic或軟性配線基板等和透 明基板時之連接端子係要求顯著之窄間距化以及更加確 之熱壓接連接。 、 =此’就連接端子部之連接壓接狀態而言，不僅是定 性之管理，也增大定量之評價及管理之必要性。 但疋’在則述專利文獻卜由於導電粒子之破壞狀態等 之所le成=[接狀⑫、之管理係僅限定在來自因為目視確認 所造成之定財面。也就是說，在前述引敎獻1，關於虚 擬^之面積，並餘何記載，料，即使是就關於破壞 之¥電粒子個數之管理基準^言，也並無任何揭示。 200526094 【發明内容】 本發明係著眼於前述課題而完成的；其解決課題係提 供一種在製造線等具備可以呈定量地評價及管理1C或軟性 ，線基板等和透明基板間之配線端子是否藉由熱壓接而確 實地進行連接之構造之電子模組及搭載該電子模組之電子 機為以及電子模組之壓接連接確認方法。 用以解決前述課題所完成之關於本發明之電子模組之 理想形態係在設置於各個透明基板和電子構件之複數個連 接端子之至少1組透過異方性導電膜而呈電氣地進行連接 之電子模組，在前述電子構件之至少丨個部位設置成為可 以由前述透明基板之非連接面而進行透視之虛擬端子^ 由壓接於丽述虛擬端子和透明基板間之前述異方性導電^ 之導電粒子數而進行選別之方面，具有特徵。 、 此外，用以解決前述課題所完成之關於本發明之電 模組之熱壓接連接確認方法之—觀想形祕歧置在 個透明基板和電子構狀餘個連接端子之至少1組透巧 異方性導電膜而呈電氣地進行連接之電子模組而t，在t 述電子構件之至少1個部位1置成為可以由前i透^ 板之非連接面而進行透視之虛擬端子，藉由壓接於二 擬端子和透明基板間之前述異方性導電膜之粒^ 確認壓接連接狀態。 ’ ^ 【實施方式】 200526094 以下，就本發明之理想形態，參考附件圖式而更加詳 細地進行說明。 本發明之電子模組之基本構造係相同於成為第一圖之 先月ίι技術所不者。也就是說，第一圖所示之電子模組係在 連接於透明基板2上之透明電極4以既定之圖案所設置之 金屬配線（並未圖示）和對應於前述金屬配線所設置之複 數個IC1之凸塊3日寺，在前述複數個凸塊3之兩端部，形 成為了取代前述金屬配線而設置金屬膜6之並無配線連接 之虛擬端子5。 接著，正如成為前述第一圖之虛擬端子部之剖面圖之 第三圖所不，在虛擬端子部，並無不透明之金屬配線8，因 此，可以由透明基板2之非連接面（非壓接面）來透視聰。 因此’在本發明之電子模組，能夠由外誠直接地觀 擬端子5和透明基板！間之壓接部，可以使用以透過二 之熱壓接之電氣性質作為基礎之統計方法而呈 壓接連接狀態。 it匕外 取代於軟性配線基板而成為相同 之構造，在本發明所提狀所謂電子構件係1C 性配線基板等之意義而進行使用。 人 因此，即使是在透明基板和軟性配線基板間之配線端 子間之壓接連接，也可以藉由成為相同於前述IC狀 樣構造而呈定量地管理壓接連接狀熊。 〜、之Π 在藉由ACF所xe成之連接，其連接狀態是 附於該ACF所包含之導電粒子中之有效導電粒子數。= 200526094 ί效，二粒子係也正如在前述引用文獻1所揭示的，可以 藉由觀察而確認破壞之導電粒子。 ^仁疋=在貫際上，由於配線端子間之壓接偏離、例如 第四圖所不之連接端子（凸塊）3和透明電極4間之壓接偏 離所1之有效壓接幅寬1之減少、ACF品質之不均、金屬 包極巾田見之不均、凸塊表面凹凸之不均等之各種要因而減 少其個數。 …Ϊ述導電粒子數之計測係相同於習知，可以藉由利用 成之觀祭而進行，並且，可以將使用CCD相機 寺而相自動化之料料以湘。 釣確切：抨：古頒不在良品之電子模組之虛擬端子部而能 =¾ ”之計測結果之分布曲線。該 mx長度〜m、透明子模組而凸塊成為幅寬卿 之某1子。 ⑦極成為幅寬 40//m之狀態下之資料 口J以忽視減少前逑 如設計值而以幾乎理想之狀^粒子數之各種要因，在 有效導電粒子數係料第五=進仃壓接之虛擬端子部 每1個凸塊之平岣29 θ (a)所不之分布曲線，成為 但是，在實際上，由扒：，標準偏差σ係2· 個。 少之狀態。 1述各種要㈣成為導電粒子數變 第五圖（b)及 _ 之分布曲線。在第五^ Ή二有效導電粒子數之實際值 子數係每1個凸^ π b)所7^之分布曲線’有效導電粒 〇塊之+均19·5 此外，在弟五圖（C) 10 200526094 2示之分布曲線，有交文導電粒子數係每1個凸塊之平均10」 在此’概算前述每1個凸塊之必要導電粒子數。 作為例子係在陽極需要最大大約18mA.之狀能下， 在製品規格之每1個導電粒子之最低電流值成為1GmI時， 可以在1對連接端子間，具有最低2個之有效導電粒子。 此外，例如可以由在8(rc、濕度8〇%之5〇〇小時之 速=等之㈣，來使得由於經年變㈣造叙導電料 之電值之惡化，成為最大大約1/2。 5 ^ 1 以滿足。 一有取低4個之有效導電粒子的話則可 Μ在五3 (〇之顯示分布曲線之虛擬端子部，（平 3:6:)值係每1個凸塊之“個，這個係超過成上: 此外Γ工 1&限度之有效導電粒子之4個之值。 卜’（平均值+6σ)值係每⑽凸塊之 有，粒子數成為〜二 有效導電粒子數之4個為^ 1對連接端子間之所需要之200526094 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a crimp connection of an electronic module; in more detail, regarding a device that can be quantitatively evaluated and managed, for example, by 1 (: or flexible wiring Caused by the scale connection between the base board and the shout terminal of the transmissive board = an electronic module with a connection state structure and a method for confirming the thermal compression connection of an electronic device equipped with the electronic difficulty and the electronic module. [Previous Technology] Information Terminal The popular image display function of mobile phones (PDAs), etc., and the realization of thin display panels that can have higher definition and lower power consumption due to mobile phones or portable devices. The display panels required for panel description have always been tested on crystal display surfaces. _ = Clothing products, but in recent years, it has a self-luminous light-emitting element; the next-generation display panel has attracted attention. It is said that the panel is not traditional (generally and anciently, TΓ 4, + board) or flexible wiring. Substrate and transparent:: The inter-substance is transmitted through the anisotropic containing conductive particles =) (: called the line Amsotrc ^ C〇nductlve), by the heat into the dry Li ACF system in thermoplastic or thermosetting The resin particles are dispersed in the resin film, and by destroying the conductivity of the conductive particles in one direction of the terminals or electrodes of the Saki, the terminals or electrical connections are electrically and mechanically connected in 200526094. Electrodes The indirect shot is connected to many terminals at the same time or in the second picture, dark; stove, board between the ## made by AGF and a transparent base transparent structure. The connection terminals shown in the second picture The transparent substrate 2 provided with the terminal λ and the metal wiring 8 is connected through the IC1 (the bump i3 and the coffee cup are crimped downward.) The connection terminal part is described, and the crimping part is The appearance of the metal wiring 8 is very bright. Therefore, it is impossible to directly determine the appearance of the metal wiring. It is not easy to confirm whether the thermocompression bonding is actually performed by measuring the number of conductive particles contained in the ACF7. The non-pressing of the substrate is shown in the first figure, and the connection terminal part m of the r-like electronic module of the liquid crystal two disclosed in the aforementioned patent document i is shown in the first figure, and two ends of the connection part a are provided with virtual parts. Terminal (bump) 5 In order to replace the metal wiring 8, a metal film 6 is provided on the virtual terminal 5. #: In the third figure, a cross-sectional view of the virtual terminal part of the first figure is shown. As shown in the figure, the virtual terminal Compared with the second figure, it can be seen that the shape of the metal crimping wire 8 is not opaque on the side of the transparent board 2-the non-crimping surface of the transparent substrate 2 is used to see through the thermal crimping part. It is possible to directly observe and confirm the destruction of conductive particles of ACF7 on the virtual terminal 5 200526094 [Patent Document 1] Japanese Patent Laid-Open Publication No. 125837. However, in the aforementioned display panel, each pixel of the liquid crystal display panel is basically h becomes a voltage-driven type. Therefore, the connection resistance of the electrical connection between the transparent substrate side and the flexible wiring substrate% side is not too expected. The problem is that the connection resistance between the two electrical switches in the LCD panel is changed to become In addition, even if the degree becomes uneven, the degree of influence on the display of the image is relatively small. On the other hand, in recent years, the organic display panel has attracted attention in recent years, and its display pixels are of a current-driven type, and have a current dependency that is almost proportional to the driving current and also changes the luminous brightness of the pixels. ㈣ is a passively driven EL display panel. Unlike liquid crystals, a relatively large current flows through each element. Therefore, the wiring resistance or connection resistance on the cathode side is often a problem. Therefore, in the aforementioned thermocompression bonding connection, it is required that the electrical connection be sufficient. In addition, in recent years, connection terminals for thermocompression bonding of Ic, flexible wiring substrates, and transparent substrates have been required to have a significantly narrower pitch and more accurate thermocompression connection. , = 'As far as the connection crimping state of the connection terminal part is concerned, it is not only qualitative management, but also the need for quantitative evaluation and management. However, in the patent document, due to the state of destruction of conductive particles, etc., the management system is limited to the fixed wealth caused by visual confirmation. That is to say, in the above-mentioned introduction 1, regarding the area of the virtual ^, and what else is recorded, it is expected that even if it is about the management criterion of the number of destroyed \ electron particles, there is no disclosure. 200526094 [Summary of the invention] The present invention is completed focusing on the aforementioned problems; its solution is to provide a production line with a quantitative evaluation and management of 1C or softness, whether the wiring terminals between the wire substrate and the transparent substrate are borrowed. An electronic module having a structure that is reliably connected by thermocompression bonding, an electronic machine equipped with the electronic module, and a method for confirming the crimp connection of the electronic module. The ideal form of the electronic module of the present invention completed to solve the aforementioned problems is that at least one group of a plurality of connection terminals provided on each transparent substrate and electronic component is electrically connected through an anisotropic conductive film. An electronic module is provided with at least one part of the aforementioned electronic component as a virtual terminal that can be seen through the non-connecting surface of the transparent substrate ^ The aforementioned anisotropic conduction is crimped between the Lishu virtual terminal and the transparent substrate ^ It has a feature of selecting the number of conductive particles. In addition, the method for confirming the thermo-compression connection of the electrical module of the present invention completed to solve the aforementioned problem is that at least one set of the transparent substrate and the remaining connection terminals of the electronic configuration is arranged in a transparent shape. A clever anisotropic conductive film is an electronic module that is electrically connected. At least one part of the electronic component t is placed as a virtual terminal that can be seen through the non-connecting surface of the front panel. The state of the crimp connection was confirmed by crimping the aforementioned anisotropic conductive film between the two pseudo terminals and the transparent substrate. ^ [Embodiment] 200526094 Hereinafter, the ideal form of the present invention will be described in more detail with reference to the attached drawings. The basic structure of the electronic module of the present invention is the same as that of the first-month technology of the first figure. That is, the electronic module shown in the first figure is a metal wiring (not shown) provided in a predetermined pattern on the transparent electrode 4 connected to the transparent substrate 2 and a plurality of corresponding metal wirings provided corresponding to the aforementioned metal wiring. Each of the bumps 3 of the IC1 temple has a dummy terminal 5 provided on the two ends of the plurality of bumps 3 and provided with a metal film 6 without a wiring connection in place of the metal wiring. Next, as shown in the third figure, which is a sectional view of the virtual terminal portion of the first figure, there is no opaque metal wiring 8 in the virtual terminal portion. Therefore, the non-connecting surface (non-crimping) of the transparent substrate 2 Face) to see Satoshi. Therefore, in the electronic module of the present invention, the terminal 5 and the transparent substrate can be directly visualized by Wai Cheng! The crimping section can be crimped using a statistical method based on the electrical properties of the thermal crimping through the two. It is replaced with a flexible wiring board and has the same structure, and is used in the sense of the so-called electronic component system 1C wiring board and the like mentioned in the present invention. Therefore, even if it is a crimp connection between wiring terminals between a transparent substrate and a flexible wiring substrate, the crimp connection-shaped bear can be managed quantitatively by having the same IC-like structure as described above. ~, Π is connected through xe by the ACF, and its connection state is the number of effective conductive particles attached to the conductive particles included in the ACF. = 200526094 The two-particle system is also disclosed in the above cited reference 1, and the damaged conductive particles can be confirmed by observation. ^ Ren 疋 = In terms of the effective crimping width 1 due to the deviation of the crimping between the wiring terminals, for example, the connection between the connecting terminal (bump) 3 and the transparent electrode 4 not shown in the fourth figure 1 The reduction of ACF quality, unevenness of metal-clad towels, unevenness of unevenness on the surface of bumps, etc., should reduce their number. … The measurement of the number of conductive particles is the same as the conventional one. It can be performed by using the sacrifice of observance, and it is possible to automate the materials that use the CCD camera. Exact fishing: Blast: The distribution curve of the measurement result that the ancient award was not available in the virtual terminal of the good electronic module = ¾ ”. The mx length ~ m, the transparent sub-module and the bump becomes a certain width The pole becomes the data port in the state of a width of 40 // m. In order to ignore the reduction of the design value, it is almost ideal. ^ The various factors of the number of particles. The distribution curve of 29 岣 θ (a) per bump of the crimped virtual terminal is different. However, in practice, the standard deviation σ is 2. ·. The state of less Various points become the distribution curve of the fifth figure (b) and _ of the number of conductive particles. The actual number of effective conductive particles in the fifth ^ Ή 2 is the distribution curve of 7 ^ per 1 convex ^ π b) 'Effective conductive particles 0 ++ 19.5 In addition, in the distribution curve shown in Figure 5 (C) 10 200526094 2, the number of conductive particles in the intersection is the average of 10 per one bump. " Required number of conductive particles per bump. As an example, when the anode requires a maximum energy of about 18 mA., When the minimum current value of each conductive particle of the product specification becomes 1 GmI, there can be a minimum of two effective conductive particles between a pair of connection terminals. In addition, the deterioration of the electrical value of the conductive material due to the change over time can be made to a maximum of about 1/2 by the speed of 5000 hours at 80 (rc, humidity 80% = etc.). 5 ^ 1 is satisfied. If there are 4 effective conductive particles that are lower, it can be displayed on the virtual terminal portion of the distribution curve at 5 3 (0, the value of (flat 3: 6 :) is "per 1" This is more than the above: In addition, the value of 4 effective conductive particles of the Γ1 and the limit is 4. The value of the average (+ 6σ) is per bump, and the number of particles becomes ~ 2 effective conductive particles. 4 of them are required between ^ 1 pair of connection terminals
電粒子之，低個數尺::=’。決定虛擬端子部之有效導 正如成面敛述，士 I 進行壓接之ACF之：^心㈣子和前述透明基板間而 16個)成為以該電=二粒子數之最低個數(前述狀態 子核_之同樣條件來進行壓接之連接 200526094 知子之有效¥琶粒子數之必要最低個數（前述狀態4個） 以上的話’職夠呈鱗且定量地評似管理 電子模組之ACF所造成之壓接連接 ^猎由 此外，前親狀料狀綠 之種類、壓接條件、基板之種類等而發生變動此，CF 效之導電粒子數係必須決定於每個機種。 有 端子係最好是每1列連接端子而 Γ 妓1個雜錢得有效導電粒子The lower number of electric particles :: = ’. The effective guidance for determining the virtual terminal part is as described in the above. The ACF of the crimp I: ^ the heart and the transparent substrate, and 16) becomes the lowest number with the electric = two particles (the aforementioned state) Sub-core _ under the same conditions for crimping connection 200526094 The effective minimum of the number of particles required by the child (the above state is 4) If the above number is sufficient, it is quantitatively evaluated as an ACF management electronic management module The crimping connection caused by this change, besides, the type of the former green material, the crimping conditions, the type of the substrate, etc. will change. The number of conductive particles of the CF effect must be determined for each model. Fortunately, for each row of connection terminals, Γ prostitutes 1 miscellaneous money to effectively conduct conductive particles.
===最健數之㈣下，配線端子間之連接壓接狀 悲係不充为，因此，判定該電子模組成為不良品。 該電子模組係再度也有回饋於壓接製程之狀態產生， 一直到成為滿足由於前料效導條子數所造^選美 準之狀態為止，重複地進行同樣之製程。 、土=== Under the most robust number, the crimping connection between the wiring terminals is not sufficient. Therefore, the electronic module is judged to be defective. The electronic module was once again fed back to the crimping process, and it continued to perform the same process repeatedly until it became a state that met the beauty selection criteria due to the number of pre-effect guides. ,earth
此外’前述虛擬端子係相同於連接端子之同樣面積（尺 寸）比較容易處理於制•計算上，即使是在評價、管理， 也具有良好之便利性、再現性。最好至少是 接端子之長度及幅寬之某一種。 引述連 此外，由連接端子之佈局等之限制而即使是在虛擬端 子之不同面積之狀態下，也可以料在計測時，預先求出 相關關係，藉由相同於前面敘述之同樣方法，來 之評價。k备 如果藉由本發明的話，則能夠提供—種可以藉由像前 面敘述來搭載確認配線端子間之連接壓接狀態之電子模組 而達到良品率之提升及可靠性之提升的顯示面板裝置等之 12 200526094 各種電子機器。 【圖式簡單說明】 第一圖係電子模組之連接端子部之背面圖。 第二圖係顯示藉由ACF而進行熱壓接之1C和透明基板間之 連接端子部之構造之剖面圖。 第三圖係第一圖之虛擬端子部之剖面圖。 第四圖係用以說明配線端子間之有效壓接幅寬之圖。 第五圖係顯示有效導電粒子數之計測結果之分布曲線。 【主要元件符號說明】In addition, the aforementioned virtual terminal has the same area (size) as the connection terminal, which is easier to handle in manufacturing and calculation. Even in evaluation and management, it has good convenience and reproducibility. Preferably, at least one of the length and width of the terminal is required. In addition, due to the limitation of the layout of the connection terminals, even in the state of different areas of the virtual terminals, it is expected that the correlation can be obtained in advance when measuring. By the same method as described above, Evaluation. If the present invention is adopted, it can provide a display panel device, etc., which can improve the yield and reliability by mounting an electronic module that confirms the connection and crimping state between the wiring terminals as described above. Of 12 200526094 various electronic machines. [Brief description of the drawings] The first figure is a rear view of a connection terminal portion of an electronic module. The second figure is a cross-sectional view showing a structure of a connection terminal portion between 1C and a transparent substrate which are thermocompression-bonded by ACF. The third figure is a cross-sectional view of the virtual terminal portion of the first figure. The fourth figure is a diagram for explaining the effective crimp width between the wiring terminals. The fifth graph is a distribution curve showing the measurement results of the number of effective conductive particles. [Description of main component symbols]
A〜熱壓接部 W〜有效壓接幅寬 1〜1C 2〜透明基板 3〜連接端子（凸塊） 4〜透明電極 5〜虛擬端子（凸塊）A ~ Thermal crimping part W ~ Effective crimping width 1 ~ 1C 2 ~ Transparent substrate 3 ~ Connection terminal (bump) 4 ~ Transparent electrode 5 ~ Virtual terminal (bump)
6〜金屬膜 7 〜ACF 8〜金屬配線。6 to metal film 7 to ACF 8 to metal wiring.