KR20050029215A - 시험 장치를 피시험체에 연결하기 위한 조립체 - Google Patents
시험 장치를 피시험체에 연결하기 위한 조립체 Download PDFInfo
- Publication number
- KR20050029215A KR20050029215A KR1020057000799A KR20057000799A KR20050029215A KR 20050029215 A KR20050029215 A KR 20050029215A KR 1020057000799 A KR1020057000799 A KR 1020057000799A KR 20057000799 A KR20057000799 A KR 20057000799A KR 20050029215 A KR20050029215 A KR 20050029215A
- Authority
- KR
- South Korea
- Prior art keywords
- electrical
- contactor
- assembly
- inclusion
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 79
- 239000000523 sample Substances 0.000 claims abstract description 32
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims description 51
- 239000004020 conductor Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 230000000295 complement effect Effects 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 229910000760 Hardened steel Inorganic materials 0.000 claims 1
- 229920002379 silicone rubber Polymers 0.000 claims 1
- 239000004945 silicone rubber Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/197,104 US6867608B2 (en) | 2002-07-16 | 2002-07-16 | Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component |
| US10/197,133 | 2002-07-16 | ||
| US10/197,104 | 2002-07-16 | ||
| US10/197,133 US6853209B1 (en) | 2002-07-16 | 2002-07-16 | Contactor assembly for testing electrical circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20050029215A true KR20050029215A (ko) | 2005-03-24 |
Family
ID=30117843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057000799A Ceased KR20050029215A (ko) | 2002-07-16 | 2003-07-15 | 시험 장치를 피시험체에 연결하기 위한 조립체 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1523685A2 (enExample) |
| JP (1) | JP2005533254A (enExample) |
| KR (1) | KR20050029215A (enExample) |
| CN (1) | CN100523826C (enExample) |
| AU (1) | AU2003249276A1 (enExample) |
| WO (1) | WO2004008163A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI339737B (en) | 2005-04-27 | 2011-04-01 | Aehr Test Systems | Contactor assembly, cartridge, and apparatus and method for testing integrated circuit of device |
| CN101051067B (zh) * | 2006-04-03 | 2010-08-11 | 航天科工防御技术研究试验中心 | 电连接器综合检测控制装置设计方法 |
| MY152599A (en) | 2007-02-14 | 2014-10-31 | Eles Semiconductor Equipment S P A | Test of electronic devices at package level using test boards without sockets |
| EP1959265A1 (en) * | 2007-02-16 | 2008-08-20 | Eles Semiconductor Equipment S.P.A. | Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof |
| US7557594B2 (en) * | 2007-08-14 | 2009-07-07 | Electro Scientific Industries, Inc. | Automated contact alignment tool |
| US7800382B2 (en) | 2007-12-19 | 2010-09-21 | AEHR Test Ststems | System for testing an integrated circuit of a device and its method of use |
| CN101545926B (zh) * | 2008-03-25 | 2011-05-11 | 旺矽科技股份有限公司 | 探针测试装置 |
| DE102009012021B4 (de) * | 2009-03-10 | 2011-02-03 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur |
| US8030957B2 (en) | 2009-03-25 | 2011-10-04 | Aehr Test Systems | System for testing an integrated circuit of a device and its method of use |
| TWI440412B (zh) * | 2011-12-28 | 2014-06-01 | 巨擘科技股份有限公司 | 超薄多層基板之封裝方法 |
| CN103808969A (zh) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | 用于承载待测试电子装置的治具 |
| CN103808979A (zh) * | 2012-11-08 | 2014-05-21 | 富泰华工业(深圳)有限公司 | 用于承载待测试电子装置的治具 |
| CN105548859A (zh) * | 2015-12-09 | 2016-05-04 | 上海精密计量测试研究所 | 用于环境测试的测试设备及方法 |
| KR20250123227A (ko) | 2016-01-08 | 2025-08-14 | 에어 테스트 시스템즈 | 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템 |
| CN106200239B (zh) * | 2016-09-14 | 2019-03-15 | 海信集团有限公司 | 光机照明系统 |
| US10782316B2 (en) * | 2017-01-09 | 2020-09-22 | Delta Design, Inc. | Socket side thermal system |
| KR20240146697A (ko) | 2017-03-03 | 2024-10-08 | 에어 테스트 시스템즈 | 카트리지, 테스트 피스 및 하나 이상의 전자 디바이스들을 테스팅하는 방법 |
| EP4517349A3 (en) | 2020-10-07 | 2025-06-04 | AEHR Test Systems | Electronics tester |
| WO2023278632A1 (en) | 2021-06-30 | 2023-01-05 | Delta Design, Inc. | Temperature control system including contactor assembly |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5148103A (en) * | 1990-10-31 | 1992-09-15 | Hughes Aircraft Company | Apparatus for testing integrated circuits |
| JPH0763788A (ja) * | 1993-08-21 | 1995-03-10 | Hewlett Packard Co <Hp> | プローブおよび電気部品/回路検査装置ならびに電気部品/回路検査方法 |
| US6483328B1 (en) * | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
| US6028437A (en) * | 1997-05-19 | 2000-02-22 | Si Diamond Technology, Inc. | Probe head assembly |
| US6137297A (en) * | 1999-01-06 | 2000-10-24 | Vertest Systemsn Corp. | Electronic test probe interface assembly and method of manufacture |
| JP2001013208A (ja) * | 1999-06-30 | 2001-01-19 | Mitsubishi Electric Corp | 半導体テスト治工具 |
-
2003
- 2003-07-15 WO PCT/US2003/022125 patent/WO2004008163A2/en not_active Ceased
- 2003-07-15 KR KR1020057000799A patent/KR20050029215A/ko not_active Ceased
- 2003-07-15 EP EP03764698A patent/EP1523685A2/en not_active Withdrawn
- 2003-07-15 CN CNB038166755A patent/CN100523826C/zh not_active Expired - Fee Related
- 2003-07-15 AU AU2003249276A patent/AU2003249276A1/en not_active Abandoned
- 2003-07-15 JP JP2004521866A patent/JP2005533254A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU2003249276A1 (en) | 2004-02-02 |
| WO2004008163A2 (en) | 2004-01-22 |
| CN100523826C (zh) | 2009-08-05 |
| WO2004008163A3 (en) | 2004-06-10 |
| EP1523685A2 (en) | 2005-04-20 |
| JP2005533254A (ja) | 2005-11-04 |
| AU2003249276A8 (en) | 2004-02-02 |
| CN1668929A (zh) | 2005-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20050115 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080312 Comment text: Request for Examination of Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20091126 Patent event code: PE09021S01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20100331 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20091126 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |