CN100523826C - 一种将测试部件电连接到测试机以对测试部件上的电子线路进行测试的装置 - Google Patents

一种将测试部件电连接到测试机以对测试部件上的电子线路进行测试的装置 Download PDF

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Publication number
CN100523826C
CN100523826C CNB038166755A CN03816675A CN100523826C CN 100523826 C CN100523826 C CN 100523826C CN B038166755 A CNB038166755 A CN B038166755A CN 03816675 A CN03816675 A CN 03816675A CN 100523826 C CN100523826 C CN 100523826C
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CN
China
Prior art keywords
contactor
assembly
terminals
electrical
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038166755A
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English (en)
Chinese (zh)
Other versions
CN1668929A (zh
Inventor
D·P·Ⅱ里士满
J·约万诺维奇
F·O·乌厄
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Aehr Test Systems Inc
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Aehr Test Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/197,104 external-priority patent/US6867608B2/en
Priority claimed from US10/197,133 external-priority patent/US6853209B1/en
Application filed by Aehr Test Systems Inc filed Critical Aehr Test Systems Inc
Publication of CN1668929A publication Critical patent/CN1668929A/zh
Application granted granted Critical
Publication of CN100523826C publication Critical patent/CN100523826C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
CNB038166755A 2002-07-16 2003-07-15 一种将测试部件电连接到测试机以对测试部件上的电子线路进行测试的装置 Expired - Fee Related CN100523826C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/197,104 2002-07-16
US10/197,104 US6867608B2 (en) 2002-07-16 2002-07-16 Assembly for electrically connecting a test component to a testing machine for testing electrical circuits on the test component
US10/197,133 US6853209B1 (en) 2002-07-16 2002-07-16 Contactor assembly for testing electrical circuits
US10/197,133 2002-07-16

Publications (2)

Publication Number Publication Date
CN1668929A CN1668929A (zh) 2005-09-14
CN100523826C true CN100523826C (zh) 2009-08-05

Family

ID=30117843

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038166755A Expired - Fee Related CN100523826C (zh) 2002-07-16 2003-07-15 一种将测试部件电连接到测试机以对测试部件上的电子线路进行测试的装置

Country Status (6)

Country Link
EP (1) EP1523685A2 (enExample)
JP (1) JP2005533254A (enExample)
KR (1) KR20050029215A (enExample)
CN (1) CN100523826C (enExample)
AU (1) AU2003249276A1 (enExample)
WO (1) WO2004008163A2 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5085534B2 (ja) 2005-04-27 2012-11-28 エイアー テスト システムズ 電子デバイスを試験するための装置
CN101051067B (zh) * 2006-04-03 2010-08-11 航天科工防御技术研究试验中心 电连接器综合检测控制装置设计方法
MY152599A (en) 2007-02-14 2014-10-31 Eles Semiconductor Equipment S P A Test of electronic devices at package level using test boards without sockets
EP1959265A1 (en) * 2007-02-16 2008-08-20 Eles Semiconductor Equipment S.P.A. Testing integrated circuits on a wafer with a cartridge leaving exposed a surface thereof
US7557594B2 (en) * 2007-08-14 2009-07-07 Electro Scientific Industries, Inc. Automated contact alignment tool
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
CN101545926B (zh) * 2008-03-25 2011-05-11 旺矽科技股份有限公司 探针测试装置
DE102009012021B4 (de) * 2009-03-10 2011-02-03 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Messvorrichtung zur elektrischen Vermessung einer einseitig an einer Messseite elektrisch kontaktierbaren Messstruktur
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
TWI440412B (zh) * 2011-12-28 2014-06-01 巨擘科技股份有限公司 超薄多層基板之封裝方法
CN103808979A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN103808969A (zh) * 2012-11-08 2014-05-21 富泰华工业（深圳）有限公司 用于承载待测试电子装置的治具
CN105548859A (zh) * 2015-12-09 2016-05-04 上海精密计量测试研究所 用于环境测试的测试设备及方法
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
CN106200239B (zh) * 2016-09-14 2019-03-15 海信集团有限公司 光机照明系统
US10782316B2 (en) * 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
EP4653878A2 (en) 2017-03-03 2025-11-26 AEHR Test Systems Electronics tester
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
WO2023278632A1 (en) 2021-06-30 2023-01-05 Delta Design, Inc. Temperature control system including contactor assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313157A (en) * 1990-10-31 1994-05-17 Hughes Aircraft Company Probe for jesting an electrical circuit chip
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US6292007B1 (en) * 1997-05-19 2001-09-18 Si Diamond Technology Inc. Probe head assembly
CN1328644A (zh) * 1998-12-02 2001-12-26 佛姆法克特股份有限公司 用于探测具有突起的接触元件的晶片的探测卡
US20020075025A1 (en) * 1999-06-30 2002-06-20 Masahiro Tanaka Semiconductor testing tool

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0763788A (ja) * 1993-08-21 1995-03-10 Hewlett Packard Co <Hp> プローブおよび電気部品／回路検査装置ならびに電気部品／回路検査方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5313157A (en) * 1990-10-31 1994-05-17 Hughes Aircraft Company Probe for jesting an electrical circuit chip
US6292007B1 (en) * 1997-05-19 2001-09-18 Si Diamond Technology Inc. Probe head assembly
CN1328644A (zh) * 1998-12-02 2001-12-26 佛姆法克特股份有限公司 用于探测具有突起的接触元件的晶片的探测卡
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US20020075025A1 (en) * 1999-06-30 2002-06-20 Masahiro Tanaka Semiconductor testing tool

Also Published As

Publication number Publication date
EP1523685A2 (en) 2005-04-20
AU2003249276A8 (en) 2004-02-02
WO2004008163A3 (en) 2004-06-10
JP2005533254A (ja) 2005-11-04
KR20050029215A (ko) 2005-03-24
CN1668929A (zh) 2005-09-14
AU2003249276A1 (en) 2004-02-02
WO2004008163A2 (en) 2004-01-22

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090805

Termination date: 20110715