KR20040072231A - 에스오아이 웨이퍼의 제조방법 - Google Patents
에스오아이 웨이퍼의 제조방법 Download PDFInfo
- Publication number
- KR20040072231A KR20040072231A KR1020030008216A KR20030008216A KR20040072231A KR 20040072231 A KR20040072231 A KR 20040072231A KR 1020030008216 A KR1020030008216 A KR 1020030008216A KR 20030008216 A KR20030008216 A KR 20030008216A KR 20040072231 A KR20040072231 A KR 20040072231A
- Authority
- KR
- South Korea
- Prior art keywords
- thickness
- oxide film
- buried oxide
- silicon
- substrate
- Prior art date
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Classifications
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- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02B—HYDRAULIC ENGINEERING
- E02B3/00—Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites; Sealings or joints for engineering works in general
- E02B3/04—Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
- E02B3/12—Revetment of banks, dams, watercourses, or the like, e.g. the sea-floor
- E02B3/14—Preformed blocks or slabs for forming essentially continuous surfaces; Arrangements thereof
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- A—HUMAN NECESSITIES
- A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
- A01G—HORTICULTURE; CULTIVATION OF VEGETABLES, FLOWERS, RICE, FRUIT, VINES, HOPS OR SEAWEED; FORESTRY; WATERING
- A01G9/00—Cultivation in receptacles, forcing-frames or greenhouses; Edging for beds, lawn or the like
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- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D17/00—Excavations; Bordering of excavations; Making embankments
- E02D17/20—Securing of slopes or inclines
- E02D17/205—Securing of slopes or inclines with modular blocks, e.g. pre-fabricated
-
- E—FIXED CONSTRUCTIONS
- E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
- E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
- E02D2600/00—Miscellaneous
- E02D2600/20—Miscellaneous comprising details of connection between elements
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mining & Mineral Resources (AREA)
- Life Sciences & Earth Sciences (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Paleontology (AREA)
- Environmental Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Ocean & Marine Engineering (AREA)
- Mechanical Engineering (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (6)
- 반도체 기판을 준비하는 단계;상기 기판을 표면산화시켜 상기 기판 표면에 비교적 얇은 제 1 두께를 가지는 매몰 산화막을 형성하는 단계;상기 매몰 산화막 상부에 반도체층을 형성하는 단계;상기 반도체층이 형성된 기판을 열산화시켜 상기 반도체층 표면에 열산화막을 형성하는 단계; 및상기 열산화막을 제거하는 단계를 포함하고,상기 열산화 후 상기 반도체층은 소정 두께만큼 감소된 두께를 가지고, 상기 매몰 산화막은 상기 제 1 두께보다 소정 두께만큼 증가된 제 2 두께를 가지는 SOI 웨이퍼의 제조방법.
- 제 1 항에 있어서,상기 표면산화는 상기 반도체 기판을 대기 중에 방치하거나 산화반응제에 노출시키는 것으로 이루어진 것을 특징으로 하는 SOI 웨이퍼의 제조방법.
- 제 1 항 또는 제 2 항에 있어서,상기 매몰 산화막의 제 1 두께는 1 내지 50Å인 것을 특징으로 하는 SOI 웨이퍼의 제조방법.
- 제 3 항에 있어서,상기 매몰 산화막의 제 2 두께는 10 내지 500Å인 것을 특징으로 하는 SOI 웨이퍼의 제조방법.
- 제 1 항에 있어서,상기 반도체층은 비정질 실리콘막 또는 폴리실리콘막으로 이루어진 것을 특징으로 하는 SOI 웨이퍼의 제조방법.
- 제 1 항 또는 제 5 항에 있어서,상기 열산화 후 상기 반도체층은 100 내지 1000Å의 두께를 가지는 것을 특징으로 하는 SOI 웨이퍼의 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008216A KR100970551B1 (ko) | 2003-02-10 | 2003-02-10 | 에스오아이 웨이퍼의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030008216A KR100970551B1 (ko) | 2003-02-10 | 2003-02-10 | 에스오아이 웨이퍼의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040072231A true KR20040072231A (ko) | 2004-08-18 |
KR100970551B1 KR100970551B1 (ko) | 2010-07-16 |
Family
ID=37359816
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030008216A KR100970551B1 (ko) | 2003-02-10 | 2003-02-10 | 에스오아이 웨이퍼의 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100970551B1 (ko) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3660469B2 (ja) * | 1996-07-05 | 2005-06-15 | 日本電信電話株式会社 | Soi基板の製造方法 |
JP4501263B2 (ja) * | 2000-09-20 | 2010-07-14 | 三菱マテリアル株式会社 | Soi基板の製造方法 |
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2003
- 2003-02-10 KR KR1020030008216A patent/KR100970551B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
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KR100970551B1 (ko) | 2010-07-16 |
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