KR20040024858A - 치수 안정성 복합 물품 및 이것의 제조 방법 - Google Patents
치수 안정성 복합 물품 및 이것의 제조 방법 Download PDFInfo
- Publication number
- KR20040024858A KR20040024858A KR10-2003-7015588A KR20037015588A KR20040024858A KR 20040024858 A KR20040024858 A KR 20040024858A KR 20037015588 A KR20037015588 A KR 20037015588A KR 20040024858 A KR20040024858 A KR 20040024858A
- Authority
- KR
- South Korea
- Prior art keywords
- radiation
- metal foil
- layer
- master
- foil backing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/02—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light
- G02B26/026—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the intensity of light based on the rotation of particles under the influence of an external field, e.g. gyricons, twisting ball displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/068—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using ionising radiations (gamma, X, electrons)
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/40—Metallic substrate based on other transition elements
- B05D2202/45—Metallic substrate based on other transition elements based on Cu
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
- B05D2252/02—Sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0263—After-treatment with IR heaters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
- Y10T428/2462—Composite web or sheet with partial filling of valleys on outer surface
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Materials For Medical Uses (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/871,421 US6858253B2 (en) | 2001-05-31 | 2001-05-31 | Method of making dimensionally stable composite article |
| US09/871,421 | 2001-05-31 | ||
| PCT/US2002/010019 WO2002098582A2 (en) | 2001-05-31 | 2002-04-01 | Dimensionally stable composite article and method of making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040024858A true KR20040024858A (ko) | 2004-03-22 |
Family
ID=25357404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7015588A Withdrawn KR20040024858A (ko) | 2001-05-31 | 2002-04-01 | 치수 안정성 복합 물품 및 이것의 제조 방법 |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6858253B2 (enExample) |
| EP (1) | EP1423209B1 (enExample) |
| JP (1) | JP2004538130A (enExample) |
| KR (1) | KR20040024858A (enExample) |
| CN (1) | CN100344383C (enExample) |
| AT (1) | ATE333327T1 (enExample) |
| AU (1) | AU2002258673A1 (enExample) |
| DE (1) | DE60213254T2 (enExample) |
| WO (1) | WO2002098582A2 (enExample) |
Families Citing this family (48)
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|---|---|---|---|---|
| EP1362682A1 (en) * | 2002-05-13 | 2003-11-19 | ZBD Displays Ltd, | Method and apparatus for liquid crystal alignment |
| ITBO20030024A1 (it) * | 2003-01-17 | 2004-07-18 | Canti & Figli Srl | Procedimento e macchina per il rivestimento di elementi |
| US8435373B2 (en) * | 2005-06-20 | 2013-05-07 | Microcontinumm, Inc. | Systems and methods for roll-to-roll patterning |
| US7833389B1 (en) * | 2005-01-21 | 2010-11-16 | Microcontinuum, Inc. | Replication tools and related fabrication methods and apparatus |
| US9307648B2 (en) * | 2004-01-21 | 2016-04-05 | Microcontinuum, Inc. | Roll-to-roll patterning of transparent and metallic layers |
| US7674103B2 (en) | 2005-01-21 | 2010-03-09 | Microcontinuum, Inc. | Replication tools and related fabrication methods and apparatus |
| US8071260B1 (en) * | 2004-06-15 | 2011-12-06 | Inphase Technologies, Inc. | Thermoplastic holographic media |
| DE102005035860A1 (de) * | 2005-02-17 | 2006-08-24 | Karl W. Niemann Gmbh & Co.Kg | Verfahren zum Beschichten von Werkstücken mit rutschfestem Belag |
| US10421313B2 (en) * | 2005-03-24 | 2019-09-24 | Richard Lavosky | Electron-beam coating device |
| US20070149001A1 (en) * | 2005-12-22 | 2007-06-28 | Uka Harshad K | Flexible circuit |
| WO2007100849A2 (en) | 2006-02-27 | 2007-09-07 | Microcontinuum, Inc. | Formation of pattern replicating tools |
| US7807938B2 (en) * | 2006-06-22 | 2010-10-05 | Sabic Innovative Plastics Ip B.V. | Mastering tools and systems and methods for forming a plurality of cells on the mastering tools |
| US8262381B2 (en) * | 2006-06-22 | 2012-09-11 | Sabic Innovative Plastics Ip B.V. | Mastering tools and systems and methods for forming a cell on the mastering tools |
| US7771795B2 (en) * | 2007-08-15 | 2010-08-10 | S.D. Warren Company | Powder coatings and methods of forming powder coatings |
| EP2168775A1 (en) * | 2008-09-29 | 2010-03-31 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | A device and a method for curing patterns of a substance at a surface of a foil |
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| US8845912B2 (en) | 2010-11-22 | 2014-09-30 | Microcontinuum, Inc. | Tools and methods for forming semi-transparent patterning masks |
| SG195168A1 (en) | 2011-05-31 | 2013-12-30 | 3M Innovative Properties Co | Methods for making differentially pattern cured microstructured articles |
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| US9953845B2 (en) | 2011-09-23 | 2018-04-24 | Te Connectivity Corporation | Methods and systems for forming electronic modules |
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| US20140175707A1 (en) | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Methods of using nanostructured transfer tape and articles made therefrom |
| US20140242343A1 (en) | 2013-02-27 | 2014-08-28 | 3M Innovative Properties Company | Lamination transfer films for forming embedded nanostructures |
| US9589797B2 (en) | 2013-05-17 | 2017-03-07 | Microcontinuum, Inc. | Tools and methods for producing nanoantenna electronic devices |
| US9246134B2 (en) | 2014-01-20 | 2016-01-26 | 3M Innovative Properties Company | Lamination transfer films for forming articles with engineered voids |
| JP2017504837A (ja) * | 2014-01-20 | 2017-02-09 | スリーエム イノベイティブ プロパティズ カンパニー | 凹入構造を形成するための積層転写フィルム |
| US20150202834A1 (en) | 2014-01-20 | 2015-07-23 | 3M Innovative Properties Company | Lamination transfer films for forming antireflective structures |
| CN105916668B (zh) | 2014-01-22 | 2018-09-28 | 3M创新有限公司 | 用于窗用玻璃的微光学元件 |
| TW201539736A (zh) | 2014-03-19 | 2015-10-16 | 3M Innovative Properties Co | 用於藉白光成色之 oled 裝置的奈米結構 |
| WO2015171456A1 (en) | 2014-05-08 | 2015-11-12 | 3M Innovative Properties Company | Pressure sensitive adhesive tape with microstructured elastomeric core |
| US9472788B2 (en) | 2014-08-27 | 2016-10-18 | 3M Innovative Properties Company | Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures |
| JP7009992B2 (ja) | 2014-10-20 | 2022-01-26 | スリーエム イノベイティブ プロパティズ カンパニー | 断熱グレージングユニット及び微細構造化拡散部を含む微小光学層並びに方法 |
| JP6967832B2 (ja) * | 2014-10-28 | 2021-11-17 | デクセリアルズ株式会社 | エンボスフィルム、枚葉フィルム、転写物、およびエンボスフィルムの製造方法 |
| US10106643B2 (en) | 2015-03-31 | 2018-10-23 | 3M Innovative Properties Company | Dual-cure nanostructure transfer film |
| US10518512B2 (en) | 2015-03-31 | 2019-12-31 | 3M Innovative Properties Company | Method of forming dual-cure nanostructure transfer film |
| KR20180020221A (ko) | 2015-06-19 | 2018-02-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 세그먼트화된 및 비-세그먼트화된 전사 테이프, 그로부터의 물품 및 그의 제조 및 사용 방법 |
| WO2016205189A1 (en) | 2015-06-19 | 2016-12-22 | 3M Innovative Properties Company | Micro-optical assemblies including transparent substrates having graphic layer and method of making thereof |
| US10435590B2 (en) | 2015-06-19 | 2019-10-08 | 3M Innovative Properties Company | Segmented transfer tape and method of making and use thereof |
| US10656312B2 (en) | 2015-06-30 | 2020-05-19 | 3M Innovative Properties Company | Insulated glazing units and microoptical layer including microstructured anisotropic diffuser and methods |
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| EP3412121A4 (en) | 2016-02-01 | 2020-01-22 | Elcoflex OY | METHOD FOR MANUFACTURING AN EXTREMELY THIN FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD, AND FLEXIBLE MULTILAYER PRINTED CIRCUIT BOARD |
| KR102387107B1 (ko) | 2016-07-22 | 2022-04-15 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 세라믹 전구체로서의 중합체성 접착제 층 |
| KR102398255B1 (ko) | 2016-07-22 | 2022-05-16 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 세라믹 전구체로서의 실록산계 접착제 층 |
| US11283189B2 (en) | 2017-05-02 | 2022-03-22 | Rogers Corporation | Connected dielectric resonator antenna array and method of making the same |
| CN109187622A (zh) * | 2018-07-24 | 2019-01-11 | 彩虹显示器件股份有限公司 | 一种高分辨显示用电子玻璃热收缩的测量方法 |
| CN110760896A (zh) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | 一种工作版的防皱电铸工艺 |
| TWI820237B (zh) | 2018-10-18 | 2023-11-01 | 美商羅傑斯公司 | 聚合物結構、其立體光刻製造方法以及包含該聚合物結構之電子裝置 |
| CN112264278A (zh) * | 2020-09-21 | 2021-01-26 | 江苏苏缘幕墙材料有限公司 | 一种立体花色铝单板的表面处理工艺 |
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| US5847327A (en) | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
| GB9623185D0 (en) | 1996-11-09 | 1997-01-08 | Epigem Limited | Improved micro relief element and preparation thereof |
| CN1145917C (zh) * | 1996-12-24 | 2004-04-14 | 施乐有限公司 | 转动球显示器及使用它的方法 |
| US5815306A (en) | 1996-12-24 | 1998-09-29 | Xerox Corporation | "Eggcrate" substrate for a twisting ball display |
| US6358442B1 (en) * | 1997-03-19 | 2002-03-19 | Metallized Products, Inc. | Animated light diffracting, prismatic refracting, and/or holographic surface papers, board and other substrates and low-cost pattern transfer method of manufacturing the same |
| SG71168A1 (en) * | 1997-11-14 | 2000-03-21 | Gen Electric | Method for producing textured thermoplastic film |
| US20010008169A1 (en) | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
| US6521325B1 (en) | 1999-06-01 | 2003-02-18 | 3M Innovative Properties Company | Optically transmissive microembossed receptor media |
-
2001
- 2001-05-31 US US09/871,421 patent/US6858253B2/en not_active Expired - Fee Related
-
2002
- 2002-04-01 EP EP02728629A patent/EP1423209B1/en not_active Expired - Lifetime
- 2002-04-01 WO PCT/US2002/010019 patent/WO2002098582A2/en not_active Ceased
- 2002-04-01 AT AT02728629T patent/ATE333327T1/de not_active IP Right Cessation
- 2002-04-01 CN CNB028111354A patent/CN100344383C/zh not_active Expired - Fee Related
- 2002-04-01 KR KR10-2003-7015588A patent/KR20040024858A/ko not_active Withdrawn
- 2002-04-01 JP JP2003501612A patent/JP2004538130A/ja active Pending
- 2002-04-01 DE DE60213254T patent/DE60213254T2/de not_active Expired - Fee Related
- 2002-04-01 AU AU2002258673A patent/AU2002258673A1/en not_active Abandoned
-
2004
- 2004-03-01 US US10/790,898 patent/US20040170809A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| CN1512920A (zh) | 2004-07-14 |
| US6858253B2 (en) | 2005-02-22 |
| US20040170809A1 (en) | 2004-09-02 |
| DE60213254T2 (de) | 2007-04-26 |
| JP2004538130A (ja) | 2004-12-24 |
| WO2002098582A2 (en) | 2002-12-12 |
| US20030059578A1 (en) | 2003-03-27 |
| EP1423209A2 (en) | 2004-06-02 |
| ATE333327T1 (de) | 2006-08-15 |
| AU2002258673A1 (en) | 2002-12-16 |
| EP1423209B1 (en) | 2006-07-19 |
| WO2002098582A3 (en) | 2004-03-18 |
| DE60213254D1 (de) | 2006-08-31 |
| CN100344383C (zh) | 2007-10-24 |
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