KR20040023231A - 반도체 제조를 위한 베이크 장치 - Google Patents
반도체 제조를 위한 베이크 장치 Download PDFInfo
- Publication number
- KR20040023231A KR20040023231A KR1020020054913A KR20020054913A KR20040023231A KR 20040023231 A KR20040023231 A KR 20040023231A KR 1020020054913 A KR1020020054913 A KR 1020020054913A KR 20020054913 A KR20020054913 A KR 20020054913A KR 20040023231 A KR20040023231 A KR 20040023231A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- chamber
- cover
- hot plate
- thin film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (5)
- 웨이퍼가 안착되는 핫 플레이트가 내부에 구비되는 챔버와;상기 챔버의 상부를 폐쇄되도록 하는 커버: 및상기 커버의 내측면에는 수직 방사율 계수가 낮은 재질의 박막이 구비되도록 하는 반도체 제조를 위한 베이크 장치.
- 제 1 항에 있어서, 상기 박막은 상기 챔버의 내부에 구비되는 상기 핫 플레이트의 직상부측 상기 커버의 내측 상부면에 형성되는 반도체 제조를 위한 베이크 장치.
- 제 1 항에 있어서, 상기 박막은 상기 핫 플레이트측 표면을 연마에 의해서 경면 처리한 반도체 제조를 위한 베이크 장치.
- 제 1 항에 있어서, 상기 박막은 수직 방사율 계수가 0.02 ~ 0.05인 금속인 반도체 제조를 위한 베이크 장치.
- 제 1 항에 있어서, 상기 박막은 유기물에 의한 부식에 강한 재질로서 이루어지는 반도체 제조를 위한 베이크 장치.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0054913A KR100475737B1 (ko) | 2002-09-11 | 2002-09-11 | 반도체 제조를 위한 베이크 장치 |
JP2003017747A JP2004104069A (ja) | 2002-09-11 | 2003-01-27 | 半導体デバイス製造のためのベーク装置 |
US10/655,306 US6808391B2 (en) | 2002-09-11 | 2003-09-05 | Baking apparatus for manufacturing a semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0054913A KR100475737B1 (ko) | 2002-09-11 | 2002-09-11 | 반도체 제조를 위한 베이크 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040023231A true KR20040023231A (ko) | 2004-03-18 |
KR100475737B1 KR100475737B1 (ko) | 2005-03-10 |
Family
ID=31987385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2002-0054913A KR100475737B1 (ko) | 2002-09-11 | 2002-09-11 | 반도체 제조를 위한 베이크 장치 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6808391B2 (ko) |
JP (1) | JP2004104069A (ko) |
KR (1) | KR100475737B1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008016768A (ja) * | 2006-07-10 | 2008-01-24 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
US20080008837A1 (en) * | 2006-07-10 | 2008-01-10 | Yasuhiro Shiba | Substrate processing apparatus and substrate processing method for heat-treating substrate |
US8847122B2 (en) * | 2009-06-08 | 2014-09-30 | Macronix International Co., Ltd. | Method and apparatus for transferring substrate |
US9097463B2 (en) * | 2010-02-23 | 2015-08-04 | Ngk Insulators, Ltd. | Housing for heating and use method of the same, heating jig and use method of the same, and operation method of heating device |
WO2018022456A1 (en) | 2016-07-26 | 2018-02-01 | Cree, Inc. | Light emitting diodes, components and related methods |
CN109992138B (zh) * | 2017-12-29 | 2022-06-21 | 蓝思科技(长沙)有限公司 | 薄膜触控感应器的制作方法及薄膜触控感应器 |
US11121298B2 (en) | 2018-05-25 | 2021-09-14 | Creeled, Inc. | Light-emitting diode packages with individually controllable light-emitting diode chips |
US11335833B2 (en) | 2018-08-31 | 2022-05-17 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
USD902448S1 (en) | 2018-08-31 | 2020-11-17 | Cree, Inc. | Light emitting diode package |
US11233183B2 (en) | 2018-08-31 | 2022-01-25 | Creeled, Inc. | Light-emitting diodes, light-emitting diode arrays and related devices |
CN111090181A (zh) * | 2018-10-23 | 2020-05-01 | 李东明 | 可多元加热机构的基板烘烤机台 |
CN111090182A (zh) * | 2018-10-23 | 2020-05-01 | 李东明 | 基板烘烤机台的热风流向控制机构 |
US11101411B2 (en) | 2019-06-26 | 2021-08-24 | Creeled, Inc. | Solid-state light emitting devices including light emitting diodes in package structures |
DE102020123546A1 (de) | 2020-09-09 | 2022-03-10 | Aixtron Se | CVD-Reaktor mit einer Kühlfläche mit bereichsweise vergrößerter Emissivität |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5429498A (en) * | 1991-12-13 | 1995-07-04 | Tokyo Electron Sagami Kabushiki Kaisha | Heat treatment method and apparatus thereof |
JPH1174188A (ja) * | 1997-08-27 | 1999-03-16 | Dainippon Screen Mfg Co Ltd | 基板加熱処理装置 |
JP2000021733A (ja) * | 1998-07-03 | 2000-01-21 | Dainippon Screen Mfg Co Ltd | 基板加熱装置 |
KR20000019347A (ko) * | 1998-09-10 | 2000-04-06 | 윤종용 | 베이크 장치 |
JP2000124096A (ja) * | 1998-10-16 | 2000-04-28 | Matsushita Electric Ind Co Ltd | 熱処理炉装置 |
US6450805B1 (en) * | 1999-08-11 | 2002-09-17 | Tokyo Electron Limited | Hot plate cooling method and heat processing apparatus |
US6579579B2 (en) * | 2000-12-29 | 2003-06-17 | Alcan Technology & Management Ltd. | Container made of a light metal alloy and process for its manufacture |
US6575739B1 (en) * | 2002-04-15 | 2003-06-10 | Wafermasters, Inc. | Configurable wafer furnace |
-
2002
- 2002-09-11 KR KR10-2002-0054913A patent/KR100475737B1/ko active IP Right Grant
-
2003
- 2003-01-27 JP JP2003017747A patent/JP2004104069A/ja active Pending
- 2003-09-05 US US10/655,306 patent/US6808391B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6808391B2 (en) | 2004-10-26 |
US20040048219A1 (en) | 2004-03-11 |
JP2004104069A (ja) | 2004-04-02 |
KR100475737B1 (ko) | 2005-03-10 |
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