KR20040020906A - 집적된 피드백/피드포워드 측정장비를 갖는 반도체프로세싱 모듈 - Google Patents
집적된 피드백/피드포워드 측정장비를 갖는 반도체프로세싱 모듈 Download PDFInfo
- Publication number
- KR20040020906A KR20040020906A KR10-2003-7015045A KR20037015045A KR20040020906A KR 20040020906 A KR20040020906 A KR 20040020906A KR 20037015045 A KR20037015045 A KR 20037015045A KR 20040020906 A KR20040020906 A KR 20040020906A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- processing
- measuring instrument
- instrument
- waveform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70558—Dose control, i.e. achievement of a desired dose
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70641—Focus
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32182—If state of tool, product deviates from standard, adjust system, feedback
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32189—Compare between original solid model and measured manufactured object
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/901,462 US6625497B2 (en) | 2000-11-20 | 2001-07-10 | Semiconductor processing module with integrated feedback/feed forward metrology |
| US09/901,462 | 2001-07-10 | ||
| PCT/US2002/020705 WO2003007365A2 (en) | 2001-07-10 | 2002-07-01 | Semiconductor processing module with integrated feedback/feed forward metrology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040020906A true KR20040020906A (ko) | 2004-03-09 |
Family
ID=25414232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7015045A Abandoned KR20040020906A (ko) | 2001-07-10 | 2002-07-01 | 집적된 피드백/피드포워드 측정장비를 갖는 반도체프로세싱 모듈 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6625497B2 (https=) |
| EP (1) | EP1405338A2 (https=) |
| JP (1) | JP2005521235A (https=) |
| KR (1) | KR20040020906A (https=) |
| AU (1) | AU2002316463A1 (https=) |
| TW (1) | TW546697B (https=) |
| WO (1) | WO2003007365A2 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100985675B1 (ko) * | 2008-11-17 | 2010-10-05 | 하가전자 주식회사 | 전등 스위치선에 연결되어 사용되는 방안 온도조절기 |
| KR101504504B1 (ko) * | 2008-05-21 | 2015-03-20 | 케이엘에이-텐코어 코오포레이션 | 툴 및 프로세스 효과들을 분리하기 위한 기판 매트릭스 |
| KR20220151122A (ko) * | 2021-05-05 | 2022-11-14 | 온투 이노베이션 아이엔씨. | 논리 구조체들에 대한 유효 셀 근사 모델 |
Families Citing this family (125)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US7187994B1 (en) * | 2000-08-18 | 2007-03-06 | Kla-Tencor Technologies Corp. | Method of interfacing ancillary equipment to FIMS processing stations |
| US6625497B2 (en) * | 2000-11-20 | 2003-09-23 | Applied Materials Inc. | Semiconductor processing module with integrated feedback/feed forward metrology |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| US7282889B2 (en) * | 2001-04-19 | 2007-10-16 | Onwafer Technologies, Inc. | Maintenance unit for a sensor apparatus |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| JP3708031B2 (ja) * | 2001-06-29 | 2005-10-19 | 株式会社日立製作所 | プラズマ処理装置および処理方法 |
| US6773939B1 (en) * | 2001-07-02 | 2004-08-10 | Advanced Micro Devices, Inc. | Method and apparatus for determining critical dimension variation in a line structure |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| WO2003012837A1 (fr) * | 2001-07-31 | 2003-02-13 | Asahi Kasei Microsystems Co.,Ltd. | Systeme de gestion de la fabrication de semi-conducteurs |
| US6728591B1 (en) * | 2001-08-01 | 2004-04-27 | Advanced Micro Devices, Inc. | Method and apparatus for run-to-run control of trench profiles |
| US6950716B2 (en) | 2001-08-13 | 2005-09-27 | Applied Materials, Inc. | Dynamic control of wafer processing paths in semiconductor manufacturing processes |
| US6984198B2 (en) * | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| US20030037090A1 (en) * | 2001-08-14 | 2003-02-20 | Koh Horne L. | Tool services layer for providing tool service functions in conjunction with tool functions |
| WO2003026001A2 (en) * | 2001-09-18 | 2003-03-27 | Applied Materials, Inc. | Integrated equipment set for forming an interconnect on a substrate |
| US20030220708A1 (en) * | 2001-11-28 | 2003-11-27 | Applied Materials, Inc. | Integrated equipment set for forming shallow trench isolation regions |
| JP3686866B2 (ja) * | 2001-12-18 | 2005-08-24 | 株式会社日立製作所 | 半導体製造装置及び製造方法 |
| US6858361B2 (en) * | 2002-03-01 | 2005-02-22 | David S. L. Mui | Methodology for repeatable post etch CD in a production tool |
| US6960416B2 (en) * | 2002-03-01 | 2005-11-01 | Applied Materials, Inc. | Method and apparatus for controlling etch processes during fabrication of semiconductor devices |
| US7225047B2 (en) * | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6751518B1 (en) * | 2002-04-29 | 2004-06-15 | Advanced Micro Devices, Inc. | Dynamic process state adjustment of a processing tool to reduce non-uniformity |
| US6895295B1 (en) * | 2002-05-06 | 2005-05-17 | Advanced Micro Devices, Inc. | Method and apparatus for controlling a multi-chamber processing tool |
| US20040206621A1 (en) * | 2002-06-11 | 2004-10-21 | Hongwen Li | Integrated equipment set for forming a low K dielectric interconnect on a substrate |
| US20040007325A1 (en) * | 2002-06-11 | 2004-01-15 | Applied Materials, Inc. | Integrated equipment set for forming a low K dielectric interconnect on a substrate |
| US6924088B2 (en) * | 2002-06-20 | 2005-08-02 | Applied Materials, Inc. | Method and system for realtime CD microloading control |
| US7668702B2 (en) * | 2002-07-19 | 2010-02-23 | Applied Materials, Inc. | Method, system and medium for controlling manufacturing process using adaptive models based on empirical data |
| JP2005535130A (ja) | 2002-08-01 | 2005-11-17 | アプライド マテリアルズ インコーポレイテッド | 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体 |
| US7265382B2 (en) * | 2002-11-12 | 2007-09-04 | Applied Materials, Inc. | Method and apparatus employing integrated metrology for improved dielectric etch efficiency |
| DE10252614A1 (de) * | 2002-11-12 | 2004-05-27 | Infineon Technologies Ag | Verfahren, Vorrichtung, computerlesbares Speichermedium und Computerprogramm-Element zum Überwachen eines Herstellungsprozesses einer Mehrzahl von physikalischen Objekten |
| AU2003290932A1 (en) | 2002-11-15 | 2004-06-15 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US6939476B1 (en) * | 2002-11-20 | 2005-09-06 | National Semiconductor Corporation | Method for real time metal ETCH critical dimension control |
| US6830941B1 (en) * | 2002-12-17 | 2004-12-14 | Advanced Micro Devices, Inc. | Method and apparatus for identifying individual die during failure analysis |
| WO2004063883A2 (en) * | 2003-01-09 | 2004-07-29 | Evolution Robotics, Inc. | Vision- and environment-based programming of robots and/or computer systems |
| US6934929B2 (en) * | 2003-01-13 | 2005-08-23 | Lsi Logic Corporation | Method for improving OPC modeling |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| US7698665B2 (en) * | 2003-04-06 | 2010-04-13 | Luminescent Technologies, Inc. | Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern |
| US7480889B2 (en) * | 2003-04-06 | 2009-01-20 | Luminescent Technologies, Inc. | Optimized photomasks for photolithography |
| US7124394B1 (en) * | 2003-04-06 | 2006-10-17 | Luminescent Technologies, Inc. | Method for time-evolving rectilinear contours representing photo masks |
| US20040200574A1 (en) * | 2003-04-11 | 2004-10-14 | Applied Materials, Inc. | Method for controlling a process for fabricating integrated devices |
| US6889149B2 (en) * | 2003-04-25 | 2005-05-03 | Asm International N.V. | System and method for fingerprinting of semiconductor processing tools |
| US6808942B1 (en) | 2003-05-23 | 2004-10-26 | Texas Instruments Incorporated | Method for controlling a critical dimension (CD) in an etch process |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7228257B1 (en) * | 2003-06-13 | 2007-06-05 | Lam Research Corporation | Architecture for general purpose programmable semiconductor processing system and methods therefor |
| JP4694150B2 (ja) * | 2003-06-20 | 2011-06-08 | 東京エレクトロン株式会社 | 処理方法及び処理システム |
| US7085676B2 (en) * | 2003-06-27 | 2006-08-01 | Tokyo Electron Limited | Feed forward critical dimension control |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US6911399B2 (en) * | 2003-09-19 | 2005-06-28 | Applied Materials, Inc. | Method of controlling critical dimension microloading of photoresist trimming process by selective sidewall polymer deposition |
| US8032348B2 (en) * | 2003-09-30 | 2011-10-04 | Tokyo Electron Limited | System and method for using first-principles simulation to facilitate a semiconductor manufacturing process |
| US8073667B2 (en) * | 2003-09-30 | 2011-12-06 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process |
| US8036869B2 (en) * | 2003-09-30 | 2011-10-11 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model |
| US8050900B2 (en) * | 2003-09-30 | 2011-11-01 | Tokyo Electron Limited | System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process |
| US7094613B2 (en) * | 2003-10-21 | 2006-08-22 | Applied Materials, Inc. | Method for controlling accuracy and repeatability of an etch process |
| US20050136335A1 (en) * | 2003-12-17 | 2005-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Patterned microelectronic mask layer formation method employing multiple feed-forward linewidth measurement |
| US6999848B2 (en) * | 2003-12-19 | 2006-02-14 | Intel Corporation | Process control apparatus, systems, and methods |
| US7018855B2 (en) * | 2003-12-24 | 2006-03-28 | Lam Research Corporation | Process controls for improved wafer uniformity using integrated or standalone metrology |
| US7250309B2 (en) * | 2004-01-09 | 2007-07-31 | Applied Materials, Inc. | Integrated phase angle and optical critical dimension measurement metrology for feed forward and feedback process control |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US7289864B2 (en) * | 2004-07-12 | 2007-10-30 | International Business Machines Corporation | Feature dimension deviation correction system, method and program product |
| US7431795B2 (en) * | 2004-07-29 | 2008-10-07 | Applied Materials, Inc. | Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor |
| JP2006128572A (ja) * | 2004-11-01 | 2006-05-18 | Tokyo Electron Ltd | 露光条件補正方法、基板処理装置およびコンピュータプログラム |
| EP1814143A4 (en) * | 2004-11-16 | 2009-01-21 | Tokyo Electron Ltd | EXPOSURE CONDITIONING SETUP METHOD, SUBSTRATE PROCESSING DEVICE AND COMPUTER PROGRAM |
| US7601272B2 (en) * | 2005-01-08 | 2009-10-13 | Applied Materials, Inc. | Method and apparatus for integrating metrology with etch processing |
| US20060154388A1 (en) * | 2005-01-08 | 2006-07-13 | Richard Lewington | Integrated metrology chamber for transparent substrates |
| US20060162658A1 (en) * | 2005-01-27 | 2006-07-27 | Applied Materials, Inc. | Ruthenium layer deposition apparatus and method |
| US20060240651A1 (en) * | 2005-04-26 | 2006-10-26 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for adjusting ion implant parameters for improved process control |
| JP2006339364A (ja) * | 2005-06-01 | 2006-12-14 | Toshiba Corp | 洗浄方法及び洗浄装置 |
| US7707541B2 (en) * | 2005-09-13 | 2010-04-27 | Luminescent Technologies, Inc. | Systems, masks, and methods for photolithography |
| US7921385B2 (en) * | 2005-10-03 | 2011-04-05 | Luminescent Technologies Inc. | Mask-pattern determination using topology types |
| WO2007041602A2 (en) * | 2005-10-03 | 2007-04-12 | Luminescent Technologies, Inc. | Lithography verification using guard bands |
| WO2007041701A2 (en) * | 2005-10-04 | 2007-04-12 | Luminescent Technologies, Inc. | Mask-patterns including intentional breaks |
| WO2007044557A2 (en) | 2005-10-06 | 2007-04-19 | Luminescent Technologies, Inc. | System, masks, and methods for photomasks optimized with approximate and accurate merit functions |
| US7962113B2 (en) * | 2005-10-31 | 2011-06-14 | Silicon Laboratories Inc. | Receiver with multi-tone wideband I/Q mismatch calibration and method therefor |
| KR20080068820A (ko) * | 2005-11-16 | 2008-07-24 | 가부시키가이샤 니콘 | 기판 처리 방법, 포토마스크의 제조 방법 및 포토마스크,그리고 디바이스 제조 방법 |
| US7631286B2 (en) * | 2005-12-30 | 2009-12-08 | Wafertech Llc | Automated metrology recipe generation |
| DE102006004430B4 (de) * | 2006-01-31 | 2010-06-10 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System für eine fortschrittliche Prozesssteuerung in einem Ätzsystem durch Gasflusssteuerung auf der Grundlage von CD-Messungen |
| US20080011322A1 (en) * | 2006-07-11 | 2008-01-17 | Frank Weber | Cleaning systems and methods |
| US8331645B2 (en) * | 2006-09-20 | 2012-12-11 | Luminescent Technologies, Inc. | Photo-mask and wafer image reconstruction |
| WO2008039674A2 (en) * | 2006-09-20 | 2008-04-03 | Luminescent Technologies, Inc. | Photo-mask and wafer image reconstruction |
| JP5165878B2 (ja) * | 2006-10-20 | 2013-03-21 | 東京エレクトロン株式会社 | 基板処理装置の制御装置、制御方法および制御プログラムを記憶した記憶媒体 |
| US7710572B2 (en) * | 2006-11-30 | 2010-05-04 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| US7493186B2 (en) * | 2006-12-20 | 2009-02-17 | International Business Machines Corporation | Method and algorithm for the control of critical dimensions in a thermal flow process |
| US8688254B2 (en) * | 2007-06-15 | 2014-04-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Multiple tools using a single data processing unit |
| US8232212B2 (en) * | 2008-07-11 | 2012-07-31 | Applied Materials, Inc. | Within-sequence metrology based process tuning for adaptive self-aligned double patterning |
| US8551283B2 (en) | 2010-02-02 | 2013-10-08 | Apple Inc. | Offset control for assembling an electronic device housing |
| US8463016B2 (en) * | 2010-02-05 | 2013-06-11 | Luminescent Technologies, Inc. | Extending the field of view of a mask-inspection image |
| US8555214B2 (en) | 2010-09-14 | 2013-10-08 | Luminescent Technologies, Inc. | Technique for analyzing a reflective photo-mask |
| US8612903B2 (en) | 2010-09-14 | 2013-12-17 | Luminescent Technologies, Inc. | Technique for repairing a reflective photo-mask |
| US8386968B2 (en) | 2010-11-29 | 2013-02-26 | Luminescent Technologies, Inc. | Virtual photo-mask critical-dimension measurement |
| US8458622B2 (en) | 2010-11-29 | 2013-06-04 | Luminescent Technologies, Inc. | Photo-mask acceptance technique |
| US8193005B1 (en) | 2010-12-13 | 2012-06-05 | International Business Machines Corporation | MEMS process method for high aspect ratio structures |
| US8666530B2 (en) | 2010-12-16 | 2014-03-04 | Electro Scientific Industries, Inc. | Silicon etching control method and system |
| US9005852B2 (en) | 2012-09-10 | 2015-04-14 | Dino Technology Acquisition Llc | Technique for repairing a reflective photo-mask |
| JP5652654B2 (ja) * | 2011-02-07 | 2015-01-14 | 株式会社村田製作所 | 成膜システム及び成膜方法 |
| TWI456684B (zh) * | 2011-06-29 | 2014-10-11 | Grand Plastic Technology Co Ltd | 濕製程設備晶圓夾自動進出旋乾機之裝置 |
| US8653454B2 (en) | 2011-07-13 | 2014-02-18 | Luminescent Technologies, Inc. | Electron-beam image reconstruction |
| US9064807B2 (en) * | 2013-02-27 | 2015-06-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated platform for improved wafer manufacturing quality |
| US9091935B2 (en) | 2013-03-11 | 2015-07-28 | Kla-Tencor Corporation | Multistage extreme ultra-violet mask qualification |
| US9494854B2 (en) | 2013-03-14 | 2016-11-15 | Kla-Tencor Corporation | Technique for repairing an EUV photo-mask |
| WO2016037003A1 (en) | 2014-09-03 | 2016-03-10 | Kla-Tencor Corporation | Optimizing the utilization of metrology tools |
| JP6806704B2 (ja) | 2015-05-22 | 2021-01-06 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 方位角方向に調整可能なマルチゾーン静電チャック |
| US10234401B2 (en) * | 2016-02-22 | 2019-03-19 | Qoniac Gmbh | Method of manufacturing semiconductor devices by using sampling plans |
| US9966316B2 (en) | 2016-05-25 | 2018-05-08 | Toshiba Memory Corporation | Deposition supporting system, depositing apparatus and manufacturing method of a semiconductor device |
| WO2017210576A1 (en) * | 2016-06-02 | 2017-12-07 | Universal Instruments Corporation | Semiconductor die offset compensation variation |
| CN112106182A (zh) * | 2018-03-20 | 2020-12-18 | 东京毅力科创株式会社 | 结合有集成半导体加工模块的自感知校正异构平台及其使用方法 |
| US10727143B2 (en) | 2018-07-24 | 2020-07-28 | Lam Research Corporation | Method for controlling core critical dimension variation using flash trim sequence |
| DE102020128407A1 (de) * | 2019-12-15 | 2021-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate-bildung von halbleitervorrichtungen |
| US11574846B2 (en) * | 2019-12-15 | 2023-02-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Gate formation of semiconductor devices |
| WO2021225587A1 (en) * | 2020-05-06 | 2021-11-11 | Kla Corporation | Inter-step feedforward process control in the manufacture of semiconductor devices |
| US12283503B2 (en) | 2020-07-22 | 2025-04-22 | Applied Materials, Inc. | Substrate measurement subsystem |
| US11688616B2 (en) | 2020-07-22 | 2023-06-27 | Applied Materials, Inc. | Integrated substrate measurement system to improve manufacturing process performance |
| CN112133631B (zh) * | 2020-09-25 | 2022-11-18 | 上海华力微电子有限公司 | 改善栅极刻蚀形貌稳定性的方法和刻蚀设备 |
| CN112327581B (zh) * | 2020-10-29 | 2023-08-18 | 中国科学院微电子研究所 | 用于获取最佳曝光剂量的设计版图的优化方法及电子束曝光方法 |
| US12235624B2 (en) | 2021-12-21 | 2025-02-25 | Applied Materials, Inc. | Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing |
| US12339645B2 (en) | 2022-01-25 | 2025-06-24 | Applied Materials, Inc. | Estimation of chamber component conditions using substrate measurements |
| US12216455B2 (en) | 2022-01-25 | 2025-02-04 | Applied Materials, Inc. | Chamber component condition estimation using substrate measurements |
| US12148647B2 (en) | 2022-01-25 | 2024-11-19 | Applied Materials, Inc. | Integrated substrate measurement system |
| CN119170536A (zh) * | 2024-11-21 | 2024-12-20 | 上海邦芯半导体科技有限公司 | 半导体处理机台 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5795056A (en) | 1980-12-05 | 1982-06-12 | Hitachi Ltd | Appearance inspecting process |
| JPS61290312A (ja) | 1985-06-19 | 1986-12-20 | Hitachi Ltd | 断面形状測定装置 |
| US5109430A (en) | 1986-07-22 | 1992-04-28 | Schlumberger Technologies, Inc. | Mask alignment and measurement of critical dimensions in integrated circuits |
| US4911103A (en) | 1987-07-17 | 1990-03-27 | Texas Instruments Incorporated | Processing apparatus and method |
| US5171393A (en) | 1991-07-29 | 1992-12-15 | Moffat William A | Wafer processing apparatus |
| US5653894A (en) | 1992-12-14 | 1997-08-05 | Lucent Technologies Inc. | Active neural network determination of endpoint in a plasma etch process |
| JP3654597B2 (ja) * | 1993-07-15 | 2005-06-02 | 株式会社ルネサステクノロジ | 製造システムおよび製造方法 |
| IL107549A (en) * | 1993-11-09 | 1996-01-31 | Nova Measuring Instr Ltd | Device for measuring the thickness of thin films |
| US5452521A (en) * | 1994-03-09 | 1995-09-26 | Niewmierzycki; Leszek | Workpiece alignment structure and method |
| US5633714A (en) * | 1994-12-19 | 1997-05-27 | International Business Machines Corporation | Preprocessing of image amplitude and phase data for CD and OL measurement |
| US5607800A (en) | 1995-02-15 | 1997-03-04 | Lucent Technologies Inc. | Method and arrangement for characterizing micro-size patterns |
| US5711849A (en) | 1995-05-03 | 1998-01-27 | Daniel L. Flamm | Process optimization in gas phase dry etching |
| US6001699A (en) * | 1996-01-23 | 1999-12-14 | Intel Corporation | Highly selective etch process for submicron contacts |
| US5805290A (en) * | 1996-05-02 | 1998-09-08 | International Business Machines Corporation | Method of optical metrology of unresolved pattern arrays |
| US5944940A (en) | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
| US6143081A (en) | 1996-07-12 | 2000-11-07 | Tokyo Electron Limited | Film forming apparatus and method, and film modifying apparatus and method |
| US6203582B1 (en) * | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US5948203A (en) * | 1996-07-29 | 1999-09-07 | Taiwan Semiconductor Manufacturing Company, Ltd. | Optical dielectric thickness monitor for chemical-mechanical polishing process monitoring |
| US5913102A (en) | 1997-03-20 | 1999-06-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for forming patterned photoresist layers with enhanced critical dimension uniformity |
| US5926690A (en) | 1997-05-28 | 1999-07-20 | Advanced Micro Devices, Inc. | Run-to-run control process for controlling critical dimensions |
| US5965309A (en) | 1997-08-28 | 1999-10-12 | International Business Machines Corporation | Focus or exposure dose parameter control system using tone reversing patterns |
| US5976740A (en) | 1997-08-28 | 1999-11-02 | International Business Machines Corporation | Process for controlling exposure dose or focus parameters using tone reversing pattern |
| US6161054A (en) * | 1997-09-22 | 2000-12-12 | On-Line Technologies, Inc. | Cell control method and apparatus |
| US5963329A (en) | 1997-10-31 | 1999-10-05 | International Business Machines Corporation | Method and apparatus for measuring the profile of small repeating lines |
| US6148239A (en) | 1997-12-12 | 2000-11-14 | Advanced Micro Devices, Inc. | Process control system using feed forward control threads based on material groups |
| US6054710A (en) | 1997-12-18 | 2000-04-25 | Cypress Semiconductor Corp. | Method and apparatus for obtaining two- or three-dimensional information from scanning electron microscopy |
| US6452677B1 (en) * | 1998-02-13 | 2002-09-17 | Micron Technology Inc. | Method and apparatus for detecting defects in the manufacture of an electronic device |
| US6033814A (en) | 1998-02-26 | 2000-03-07 | Micron Technology, Inc. | Method for multiple process parameter matching |
| US6067357A (en) * | 1998-03-04 | 2000-05-23 | Genesys Telecommunications Laboratories Inc. | Telephony call-center scripting by Petri Net principles and techniques |
| IL125338A0 (en) * | 1998-07-14 | 1999-03-12 | Nova Measuring Instr Ltd | Method and apparatus for monitoring and control of photolithography exposure and processing tools |
| JP4601744B2 (ja) * | 1998-07-14 | 2010-12-22 | ノバ メジャリング インスツルメンツ リミテッド | フォトリソグラフィープロセスを制御するための方法およびシステム |
| JP3838788B2 (ja) * | 1998-09-04 | 2006-10-25 | ユニ・チャーム株式会社 | ウェットティッシュの積層体並びにこれが収納された製品 |
| US6225639B1 (en) * | 1999-08-27 | 2001-05-01 | Agere Systems Guardian Corp. | Method of monitoring a patterned transfer process using line width metrology |
| DE19952195A1 (de) * | 1999-10-29 | 2001-05-17 | Infineon Technologies Ag | Anlage zur Bearbeitung von Wafern |
| US6245581B1 (en) | 2000-04-19 | 2001-06-12 | Advanced Micro Devices, Inc. | Method and apparatus for control of critical dimension using feedback etch control |
| US6946394B2 (en) * | 2000-09-20 | 2005-09-20 | Kla-Tencor Technologies | Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process |
| US6625497B2 (en) * | 2000-11-20 | 2003-09-23 | Applied Materials Inc. | Semiconductor processing module with integrated feedback/feed forward metrology |
| US6707562B1 (en) * | 2001-07-02 | 2004-03-16 | Advanced Micro Devices, Inc. | Method of using scatterometry measurements to control photoresist etch process |
-
2001
- 2001-07-10 US US09/901,462 patent/US6625497B2/en not_active Expired - Fee Related
-
2002
- 2002-07-01 EP EP02746770A patent/EP1405338A2/en not_active Withdrawn
- 2002-07-01 JP JP2003513033A patent/JP2005521235A/ja active Pending
- 2002-07-01 AU AU2002316463A patent/AU2002316463A1/en not_active Abandoned
- 2002-07-01 KR KR10-2003-7015045A patent/KR20040020906A/ko not_active Abandoned
- 2002-07-01 WO PCT/US2002/020705 patent/WO2003007365A2/en not_active Ceased
- 2002-07-10 TW TW091115367A patent/TW546697B/zh active
- 2002-11-25 US US10/302,862 patent/US20030106642A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101504504B1 (ko) * | 2008-05-21 | 2015-03-20 | 케이엘에이-텐코어 코오포레이션 | 툴 및 프로세스 효과들을 분리하기 위한 기판 매트릭스 |
| KR100985675B1 (ko) * | 2008-11-17 | 2010-10-05 | 하가전자 주식회사 | 전등 스위치선에 연결되어 사용되는 방안 온도조절기 |
| KR20220151122A (ko) * | 2021-05-05 | 2022-11-14 | 온투 이노베이션 아이엔씨. | 논리 구조체들에 대한 유효 셀 근사 모델 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2003007365A2 (en) | 2003-01-23 |
| TW546697B (en) | 2003-08-11 |
| WO2003007365A3 (en) | 2003-08-28 |
| JP2005521235A (ja) | 2005-07-14 |
| US6625497B2 (en) | 2003-09-23 |
| US20020155629A1 (en) | 2002-10-24 |
| AU2002316463A1 (en) | 2003-01-29 |
| US20030106642A1 (en) | 2003-06-12 |
| EP1405338A2 (en) | 2004-04-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20040020906A (ko) | 집적된 피드백/피드포워드 측정장비를 갖는 반도체프로세싱 모듈 | |
| US6486492B1 (en) | Integrated critical dimension control for semiconductor device manufacturing | |
| US6858361B2 (en) | Methodology for repeatable post etch CD in a production tool | |
| US6924088B2 (en) | Method and system for realtime CD microloading control | |
| JP5416329B2 (ja) | 一体型計測を使用して誘電体エッチング効率を改善する方法及び装置 | |
| US7498106B2 (en) | Method and apparatus for controlling etch processes during fabrication of semiconductor devices | |
| JP4990548B2 (ja) | 半導体装置の製造方法 | |
| JP5028473B2 (ja) | ウェハ均一性制御を用いた動的サンプリング測定法 | |
| US6614540B1 (en) | Method and apparatus for determining feature characteristics using scatterometry | |
| US7234128B2 (en) | Method for improving the critical dimension uniformity of patterned features on wafers | |
| US11300887B2 (en) | Method to change an etch parameter | |
| US6421457B1 (en) | Process inspection using full and segment waveform matching | |
| KR102631626B1 (ko) | 리소그래피 프로세스를 제어하기 위한 방법 및 장치 | |
| Hartig et al. | Practical aspects of TMU based analysis for scatterometry model referencing AM: Advanced metrology | |
| Allgair et al. | Applications of image diagnostics to metrology quality assurance and process control |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| NORF | Unpaid initial registration fee | ||
| PC1904 | Unpaid initial registration fee |
St.27 status event code: A-2-2-U10-U14-oth-PC1904 St.27 status event code: N-2-6-B10-B12-nap-PC1904 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |