KR20040015228A - 고분자 도파로 제작 방법 - Google Patents
고분자 도파로 제작 방법 Download PDFInfo
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- KR20040015228A KR20040015228A KR10-2003-7014233A KR20037014233A KR20040015228A KR 20040015228 A KR20040015228 A KR 20040015228A KR 20037014233 A KR20037014233 A KR 20037014233A KR 20040015228 A KR20040015228 A KR 20040015228A
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- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
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- 239000012964 benzotriazole Substances 0.000 description 1
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- VZFQOWRKGJDEBG-UHFFFAOYSA-N biphenylene;methane Chemical group C.C1=CC=C2C3=CC=CC=C3C2=C1 VZFQOWRKGJDEBG-UHFFFAOYSA-N 0.000 description 1
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- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 1
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- YYGBVRCTHASBKD-UHFFFAOYSA-M methylene green Chemical compound [Cl-].C1=CC(N(C)C)=C([N+]([O-])=O)C2=[S+]C3=CC(N(C)C)=CC=C3N=C21 YYGBVRCTHASBKD-UHFFFAOYSA-M 0.000 description 1
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- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 description 1
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- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 125000001567 quinoxalinyl group Chemical class N1=C(C=NC2=CC=CC=C12)* 0.000 description 1
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- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/846,697 | 2001-05-01 | ||
| US09/846,697 US7011932B2 (en) | 2001-05-01 | 2001-05-01 | Polymer waveguide fabrication process |
| PCT/US2002/010770 WO2002088794A1 (en) | 2001-05-01 | 2002-04-04 | Polymer waveguide fabrication process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20040015228A true KR20040015228A (ko) | 2004-02-18 |
Family
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| KR10-2003-7014233A Withdrawn KR20040015228A (ko) | 2001-05-01 | 2002-04-04 | 고분자 도파로 제작 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7011932B2 (enExample) |
| EP (1) | EP1393102A4 (enExample) |
| JP (1) | JP2004525426A (enExample) |
| KR (1) | KR20040015228A (enExample) |
| CN (1) | CN1561458A (enExample) |
| WO (1) | WO2002088794A1 (enExample) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US6778753B2 (en) * | 2001-07-25 | 2004-08-17 | E. I. Du Pont De Nemours And Company | Halogenated optical polymer composition |
| WO2003102500A1 (en) * | 2002-06-04 | 2003-12-11 | Olympus Corporation | Method of obtaining 3-d coordinates |
| US7006753B2 (en) * | 2002-12-18 | 2006-02-28 | General Electric Company | Optical waveguide devices with deuterated amorphous carbon core structures |
| DE10340608A1 (de) * | 2003-08-29 | 2005-03-24 | Infineon Technologies Ag | Polymerformulierung und Verfahren zur Herstellung einer Dielektrikumsschicht |
| DE10340609A1 (de) * | 2003-08-29 | 2005-04-07 | Infineon Technologies Ag | Polymerformulierung und Verfahren zur Herstellung einer Dielektrikumsschicht |
| JP2005173039A (ja) * | 2003-12-09 | 2005-06-30 | Nitto Denko Corp | 光導波路の製法 |
| JP2005181958A (ja) * | 2003-12-22 | 2005-07-07 | Rohm & Haas Electronic Materials Llc | レーザーアブレーションを用いる電子部品および光学部品の形成方法 |
| JP2007523642A (ja) * | 2004-01-28 | 2007-08-23 | ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、ミシガン | ヒト前立腺癌の骨への移動および浸潤を調節する骨芽細胞因子 |
| US7378456B2 (en) * | 2004-01-30 | 2008-05-27 | Promerus Llc | Directly photodefinable polymer compositions and methods thereof |
| TWI294258B (en) * | 2004-08-03 | 2008-03-01 | Rohm & Haas Elect Mat | Methods of forming devices having optical functionality |
| US20060281021A1 (en) * | 2005-05-26 | 2006-12-14 | Inphase Technologies, Inc. | Illuminative treatment of holographic media |
| US20060275670A1 (en) * | 2005-05-26 | 2006-12-07 | Inphase Technologies, Inc. | Post-curing of holographic media |
| US7759407B2 (en) * | 2005-07-22 | 2010-07-20 | Molecular Imprints, Inc. | Composition for adhering materials together |
| US8808808B2 (en) * | 2005-07-22 | 2014-08-19 | Molecular Imprints, Inc. | Method for imprint lithography utilizing an adhesion primer layer |
| US8557351B2 (en) * | 2005-07-22 | 2013-10-15 | Molecular Imprints, Inc. | Method for adhering materials together |
| US8846195B2 (en) * | 2005-07-22 | 2014-09-30 | Canon Nanotechnologies, Inc. | Ultra-thin polymeric adhesion layer |
| US7391949B2 (en) * | 2005-09-27 | 2008-06-24 | The Regents Of The University Of California | Low loss hollow core optical waveguide |
| JP4622878B2 (ja) * | 2006-02-09 | 2011-02-02 | 株式会社豊田中央研究所 | 光導波路の製造方法 |
| US8017193B1 (en) * | 2008-08-06 | 2011-09-13 | Hrl Laboratories, Llc | Monomeric formulation for making polymer waveguides |
| US20080101744A1 (en) * | 2006-10-31 | 2008-05-01 | Honeywell International Inc. | Optical Waveguide Sensor Devices and Methods For Making and Using Them |
| US8361546B2 (en) * | 2008-10-30 | 2013-01-29 | Molecular Imprints, Inc. | Facilitating adhesion between substrate and patterned layer |
| JP5614018B2 (ja) * | 2009-09-17 | 2014-10-29 | 日立化成株式会社 | 光導波路及び光電気複合基板の製造方法並びにそれにより得られる光導波路及び光電気複合基板 |
| US20110104388A1 (en) * | 2009-11-02 | 2011-05-05 | Harris Corporation | Method for making an optical device including a curable index matching elastomeric solid layer |
| US20110165412A1 (en) * | 2009-11-24 | 2011-07-07 | Molecular Imprints, Inc. | Adhesion layers in nanoimprint lithograhy |
| WO2012151497A1 (en) * | 2011-05-04 | 2012-11-08 | The University Of Akron | Suppression of dewetting of polymer films via inexpensive soft lithography |
| RU2011140310A (ru) * | 2011-09-16 | 2013-04-10 | Конинклейке Филипс Электроникс Н.В. | Высокочастотная волоноводная структура |
| KR102396005B1 (ko) * | 2013-10-21 | 2022-05-10 | 닛산 가가쿠 가부시키가이샤 | 광도파로의 제조방법 |
| WO2015146499A1 (ja) | 2014-03-28 | 2015-10-01 | テルモ株式会社 | 蛍光センサ |
| WO2015179553A2 (en) | 2014-05-21 | 2015-11-26 | Iowa State University Research Foundation, Inc. | Poly(acrylated polyol) and method for making and using thereof as asphalt rubber modifiers, adhesives, fracking additives, or fracking fluids |
| CN104076439A (zh) * | 2014-06-19 | 2014-10-01 | 清华大学 | 一种波导及其制备方法 |
| WO2018031373A1 (en) | 2016-08-12 | 2018-02-15 | Iowa State University Research Foundation, Inc. | Acrylated and acylated or acetalized polyol as a biobased substitute for hard, rigid thermoplastic and thermoplastic and thermoset materials |
| CN106410345A (zh) * | 2016-10-31 | 2017-02-15 | 清华大学 | 基于压力控制的惰性气体的太赫兹波导器件及控制方法 |
| JP6909627B2 (ja) * | 2017-04-28 | 2021-07-28 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
| US10670959B2 (en) | 2017-05-10 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Pellicle and method of using the same |
| CN108957628A (zh) * | 2018-09-20 | 2018-12-07 | 广西师范大学 | 一种基于二硫化钼的长程介质加载的混合等离子波导 |
| JP7135670B2 (ja) * | 2018-09-27 | 2022-09-13 | 住友電気工業株式会社 | 光ファイバ及び紫外線硬化型樹脂組成物 |
| CN111694094A (zh) * | 2020-06-16 | 2020-09-22 | 王亚非 | 一种wpcw管结构 |
| CN113866880A (zh) * | 2021-10-09 | 2021-12-31 | 温州大学 | 一种基于飞秒激光直写的光学模拟平台制备方法 |
| CN115912026B (zh) * | 2022-11-29 | 2025-06-27 | 吉林大学 | 一种基于铒镱共掺聚合物复合结构芯层的光波导放大器及其制备方法 |
| WO2025183093A1 (ja) * | 2024-02-28 | 2025-09-04 | 京セラ株式会社 | 光回路基板および実装構造体 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4609252A (en) | 1979-04-02 | 1986-09-02 | Hughes Aircraft Company | Organic optical waveguide device and method of making |
| JPH01138509A (ja) | 1987-11-26 | 1989-05-31 | Asahi Chem Ind Co Ltd | 高密度光導波路及びその製法 |
| US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
| US5263111A (en) * | 1991-04-15 | 1993-11-16 | Raychem Corporation | Optical waveguide structures and formation methods |
| TW262537B (enExample) | 1993-07-01 | 1995-11-11 | Allied Signal Inc | |
| KR19990014683A (ko) | 1995-06-28 | 1999-02-25 | 샬크비즈크 피이터 코르넬리스, 페트 귄터 | 5층식 광학장치 |
| JPH09258051A (ja) * | 1996-03-22 | 1997-10-03 | Toyota Central Res & Dev Lab Inc | リッジ型光導波路の製造方法 |
| JPH1039151A (ja) | 1996-07-25 | 1998-02-13 | Hitachi Cable Ltd | 光導波路及びその製造方法 |
| US6306563B1 (en) * | 1999-06-21 | 2001-10-23 | Corning Inc. | Optical devices made from radiation curable fluorinated compositions |
-
2001
- 2001-05-01 US US09/846,697 patent/US7011932B2/en not_active Expired - Fee Related
-
2002
- 2002-04-04 WO PCT/US2002/010770 patent/WO2002088794A1/en not_active Ceased
- 2002-04-04 CN CNA028133900A patent/CN1561458A/zh active Pending
- 2002-04-04 EP EP02725539A patent/EP1393102A4/en not_active Withdrawn
- 2002-04-04 KR KR10-2003-7014233A patent/KR20040015228A/ko not_active Withdrawn
- 2002-04-04 JP JP2002586039A patent/JP2004525426A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP1393102A4 (en) | 2006-05-24 |
| US7011932B2 (en) | 2006-03-14 |
| CN1561458A (zh) | 2005-01-05 |
| US20020164547A1 (en) | 2002-11-07 |
| JP2004525426A (ja) | 2004-08-19 |
| EP1393102A1 (en) | 2004-03-03 |
| WO2002088794A1 (en) | 2002-11-07 |
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| PA0105 | International application |
Patent event date: 20031031 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |