KR200354556Y1 - 전자기적, 전기적 및 기계적 접촉이 최적화된 프린트회로기판 - Google Patents

전자기적, 전기적 및 기계적 접촉이 최적화된 프린트회로기판 Download PDF

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Publication number
KR200354556Y1
KR200354556Y1 KR20-2003-0034745U KR20030034745U KR200354556Y1 KR 200354556 Y1 KR200354556 Y1 KR 200354556Y1 KR 20030034745 U KR20030034745 U KR 20030034745U KR 200354556 Y1 KR200354556 Y1 KR 200354556Y1
Authority
KR
South Korea
Prior art keywords
printed circuit
circuit board
communication device
radio communication
present
Prior art date
Application number
KR20-2003-0034745U
Other languages
English (en)
Korean (ko)
Inventor
야노스-게롤트 엔더라인
로베르트 칼릭키
보도 보이데
Original Assignee
지멘스 악티엔게젤샤프트
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 지멘스 악티엔게젤샤프트 filed Critical 지멘스 악티엔게젤샤프트
Application granted granted Critical
Publication of KR200354556Y1 publication Critical patent/KR200354556Y1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR20-2003-0034745U 2002-11-06 2003-11-06 전자기적, 전기적 및 기계적 접촉이 최적화된 프린트회로기판 KR200354556Y1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE20217220.1 2002-11-06
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (1)

Publication Number Publication Date
KR200354556Y1 true KR200354556Y1 (ko) 2004-06-25

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20-2003-0034745U KR200354556Y1 (ko) 2002-11-06 2003-11-06 전자기적, 전기적 및 기계적 접촉이 최적화된 프린트회로기판

Country Status (7)

Country Link
KR (1) KR200354556Y1 (fr)
CN (1) CN2673034Y (fr)
BR (1) BR8302617U (fr)
DE (1) DE20217220U1 (fr)
ES (1) ES1056010Y (fr)
FR (1) FR2846846B3 (fr)
IT (1) ITMI20030514U1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307647U1 (de) * 2003-05-12 2003-07-31 Siemens Ag Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens Ag Leiterplatte für ein Funkmodul

Also Published As

Publication number Publication date
ES1056010U (es) 2004-02-16
ITMI20030514V0 (it) 2003-11-04
BR8302617U (pt) 2004-12-07
DE20217220U1 (de) 2003-02-27
ITMI20030514U1 (it) 2004-05-07
FR2846846B3 (fr) 2004-10-08
FR2846846A3 (fr) 2004-05-07
CN2673034Y (zh) 2005-01-19
ES1056010Y (es) 2004-06-01

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