ES1056010Y - Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. - Google Patents

Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.

Info

Publication number
ES1056010Y
ES1056010Y ES200302536U ES200302536U ES1056010Y ES 1056010 Y ES1056010 Y ES 1056010Y ES 200302536 U ES200302536 U ES 200302536U ES 200302536 U ES200302536 U ES 200302536U ES 1056010 Y ES1056010 Y ES 1056010Y
Authority
ES
Spain
Prior art keywords
magnetic
electrical
printed circuit
circuit plate
mechanical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES200302536U
Other languages
English (en)
Other versions
ES1056010U (es
Inventor
Janos-Gerold Enderlein
Robert Kalicki
Bodo Woyde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES1056010U publication Critical patent/ES1056010U/es
Application granted granted Critical
Publication of ES1056010Y publication Critical patent/ES1056010Y/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)
ES200302536U 2002-11-06 2003-11-05 Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. Expired - Fee Related ES1056010Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (2)

Publication Number Publication Date
ES1056010U ES1056010U (es) 2004-02-16
ES1056010Y true ES1056010Y (es) 2004-06-01

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200302536U Expired - Fee Related ES1056010Y (es) 2002-11-06 2003-11-05 Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.

Country Status (7)

Country Link
KR (1) KR200354556Y1 (es)
CN (1) CN2673034Y (es)
BR (1) BR8302617U (es)
DE (1) DE20217220U1 (es)
ES (1) ES1056010Y (es)
FR (1) FR2846846B3 (es)
IT (1) ITMI20030514U1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307647U1 (de) * 2003-05-12 2003-07-31 Siemens AG, 80333 München Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens AG, 80333 München Leiterplatte für ein Funkmodul

Also Published As

Publication number Publication date
CN2673034Y (zh) 2005-01-19
KR200354556Y1 (ko) 2004-06-25
ITMI20030514V0 (it) 2003-11-04
FR2846846B3 (fr) 2004-10-08
DE20217220U1 (de) 2003-02-27
BR8302617U (pt) 2004-12-07
ITMI20030514U1 (it) 2004-05-07
FR2846846A3 (fr) 2004-05-07
ES1056010U (es) 2004-02-16

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Legal Events

Date Code Title Description
FG1K Utility model granted
FD1K Utility model lapsed

Effective date: 20100309