ITMI20030514U1 - Piastra a circuiti stampati con contattazione elettromagnetica elettrica e meccanica ottimizzata - Google Patents

Piastra a circuiti stampati con contattazione elettromagnetica elettrica e meccanica ottimizzata Download PDF

Info

Publication number
ITMI20030514U1
ITMI20030514U1 IT000514U ITMI20030514U ITMI20030514U1 IT MI20030514 U1 ITMI20030514 U1 IT MI20030514U1 IT 000514 U IT000514 U IT 000514U IT MI20030514 U ITMI20030514 U IT MI20030514U IT MI20030514 U1 ITMI20030514 U1 IT MI20030514U1
Authority
IT
Italy
Prior art keywords
printed circuit
circuit board
upper side
equipment
radio device
Prior art date
Application number
IT000514U
Other languages
English (en)
Italian (it)
Inventor
Janos-Gerold Enderlein
Robert Kalicki
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ITMI20030514V0 publication Critical patent/ITMI20030514V0/it
Publication of ITMI20030514U1 publication Critical patent/ITMI20030514U1/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
IT000514U 2002-11-06 2003-11-04 Piastra a circuiti stampati con contattazione elettromagnetica elettrica e meccanica ottimizzata ITMI20030514U1 (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (2)

Publication Number Publication Date
ITMI20030514V0 ITMI20030514V0 (it) 2003-11-04
ITMI20030514U1 true ITMI20030514U1 (it) 2004-05-07

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
IT000514U ITMI20030514U1 (it) 2002-11-06 2003-11-04 Piastra a circuiti stampati con contattazione elettromagnetica elettrica e meccanica ottimizzata

Country Status (7)

Country Link
KR (1) KR200354556Y1 (es)
CN (1) CN2673034Y (es)
BR (1) BR8302617U (es)
DE (1) DE20217220U1 (es)
ES (1) ES1056010Y (es)
FR (1) FR2846846B3 (es)
IT (1) ITMI20030514U1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307647U1 (de) * 2003-05-12 2003-07-31 Siemens AG, 80333 München Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens AG, 80333 München Leiterplatte für ein Funkmodul

Also Published As

Publication number Publication date
CN2673034Y (zh) 2005-01-19
DE20217220U1 (de) 2003-02-27
ES1056010U (es) 2004-02-16
ITMI20030514V0 (it) 2003-11-04
ES1056010Y (es) 2004-06-01
FR2846846A3 (fr) 2004-05-07
BR8302617U (pt) 2004-12-07
KR200354556Y1 (ko) 2004-06-25
FR2846846B3 (fr) 2004-10-08

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