BR8302617U - Placa de circuito impresso com contactação eletromagnética, elétrica e mecânica otimizada - Google Patents

Placa de circuito impresso com contactação eletromagnética, elétrica e mecânica otimizada

Info

Publication number
BR8302617U
BR8302617U BR8302617-7U BR8302617U BR8302617U BR 8302617 U BR8302617 U BR 8302617U BR 8302617 U BR8302617 U BR 8302617U BR 8302617 U BR8302617 U BR 8302617U
Authority
BR
Brazil
Prior art keywords
circuit board
printed circuit
electrical
mechanical contact
optimized electromagnetic
Prior art date
Application number
BR8302617-7U
Other languages
English (en)
Inventor
Janos-Gerold Enderlein
Robert Kalicki
Bodo Woyde
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BR8302617U publication Critical patent/BR8302617U/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

"PLACA DE CIRCUITO IMPRESSO COM CONTACTAçãO ELETROMAGNéTICA, ELéTRICA E MECâNICA OTIMIZADA". O presente modelo refere-se a uma placa de circuito impresso para uma instalação de radiofreq³ência com um lado superior e com um lado inferior e com uma estrutura de trilhas condutoras preparada para ser equipada com elementos de componentes exclusivamente no lado superior da placa de circuito impresso, enquanto o lado inferior da placa de circuito impresso serve como ligação de massa e/ou ligação térmica. O lado inferior da placa de circuito impresso apóia uma contactação eletromagnética otimizada da instalação de radiofreq³ência em uma interface de alta freq³ência.
BR8302617-7U 2002-11-06 2003-11-05 Placa de circuito impresso com contactação eletromagnética, elétrica e mecânica otimizada BR8302617U (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (1)

Publication Number Publication Date
BR8302617U true BR8302617U (pt) 2004-12-07

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8302617-7U BR8302617U (pt) 2002-11-06 2003-11-05 Placa de circuito impresso com contactação eletromagnética, elétrica e mecânica otimizada

Country Status (7)

Country Link
KR (1) KR200354556Y1 (pt)
CN (1) CN2673034Y (pt)
BR (1) BR8302617U (pt)
DE (1) DE20217220U1 (pt)
ES (1) ES1056010Y (pt)
FR (1) FR2846846B3 (pt)
IT (1) ITMI20030514U1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307647U1 (de) * 2003-05-12 2003-07-31 Siemens Ag Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens Ag Leiterplatte für ein Funkmodul

Also Published As

Publication number Publication date
KR200354556Y1 (ko) 2004-06-25
CN2673034Y (zh) 2005-01-19
ITMI20030514U1 (it) 2004-05-07
ITMI20030514V0 (it) 2003-11-04
DE20217220U1 (de) 2003-02-27
FR2846846A3 (fr) 2004-05-07
ES1056010Y (es) 2004-06-01
ES1056010U (es) 2004-02-16
FR2846846B3 (fr) 2004-10-08

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 4A E 5A ANUIDADES

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 NA RPI 1995 DE 31/03/2009.

B15K Others concerning applications: alteration of classification

Ipc: H05K 1/02 (2006.01), H05K 1/18 (2006.01)