ES1056010U - Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. - Google Patents
Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.Info
- Publication number
- ES1056010U ES1056010U ES200302536U ES200302536U ES1056010U ES 1056010 U ES1056010 U ES 1056010U ES 200302536 U ES200302536 U ES 200302536U ES 200302536 U ES200302536 U ES 200302536U ES 1056010 U ES1056010 U ES 1056010U
- Authority
- ES
- Spain
- Prior art keywords
- electro
- translation
- magnetic
- machine
- legally binding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09181—Notches in edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Combinations Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Printed Boards (AREA)
Abstract
1. Placa de circuito impreso con contacto electro-magnético, eléctrico y mecánico optimizado para una instalación de radio con un lado superior y un lado inferior y con una estructura de banda de conductores, que está preparada para el equipamiento con componentes, caracterizada porque el equipamiento con componentes está dispuesto exclusivamente sobre el lado superior de la placa de circuito impreso, mientras que el lado inferior de la placa de circuito impreso sirve como conexión de masa y/o térmica, que soporta un contacto electromagnético optimizado de la instalación de radio en un interfaz de alta frecuencia.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20217220U DE20217220U1 (de) | 2002-11-06 | 2002-11-06 | Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung |
Publications (2)
Publication Number | Publication Date |
---|---|
ES1056010U true ES1056010U (es) | 2004-02-16 |
ES1056010Y ES1056010Y (es) | 2004-06-01 |
Family
ID=7976745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES200302536U Expired - Fee Related ES1056010Y (es) | 2002-11-06 | 2003-11-05 | Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. |
Country Status (7)
Country | Link |
---|---|
KR (1) | KR200354556Y1 (es) |
CN (1) | CN2673034Y (es) |
BR (1) | BR8302617U (es) |
DE (1) | DE20217220U1 (es) |
ES (1) | ES1056010Y (es) |
FR (1) | FR2846846B3 (es) |
IT (1) | ITMI20030514U1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20307647U1 (de) * | 2003-05-12 | 2003-07-31 | Siemens Ag | Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung |
DE20314526U1 (de) * | 2003-09-12 | 2003-11-20 | Siemens Ag | Leiterplatte für ein Funkmodul |
-
2002
- 2002-11-06 DE DE20217220U patent/DE20217220U1/de not_active Expired - Lifetime
-
2003
- 2003-10-21 FR FR0312277A patent/FR2846846B3/fr not_active Expired - Fee Related
- 2003-11-04 IT IT000514U patent/ITMI20030514U1/it unknown
- 2003-11-05 BR BR8302617-7U patent/BR8302617U/pt not_active IP Right Cessation
- 2003-11-05 ES ES200302536U patent/ES1056010Y/es not_active Expired - Fee Related
- 2003-11-06 KR KR20-2003-0034745U patent/KR200354556Y1/ko not_active IP Right Cessation
- 2003-11-06 CN CNU2003201039966U patent/CN2673034Y/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR200354556Y1 (ko) | 2004-06-25 |
ITMI20030514U1 (it) | 2004-05-07 |
DE20217220U1 (de) | 2003-02-27 |
ITMI20030514V0 (it) | 2003-11-04 |
FR2846846A3 (fr) | 2004-05-07 |
FR2846846B3 (fr) | 2004-10-08 |
CN2673034Y (zh) | 2005-01-19 |
ES1056010Y (es) | 2004-06-01 |
BR8302617U (pt) | 2004-12-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG1K | Utility model granted | ||
FD1K | Utility model lapsed |
Effective date: 20100309 |