ES1056010U - Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. - Google Patents

Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.

Info

Publication number
ES1056010U
ES1056010U ES200302536U ES200302536U ES1056010U ES 1056010 U ES1056010 U ES 1056010U ES 200302536 U ES200302536 U ES 200302536U ES 200302536 U ES200302536 U ES 200302536U ES 1056010 U ES1056010 U ES 1056010U
Authority
ES
Spain
Prior art keywords
electro
translation
magnetic
machine
legally binding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES200302536U
Other languages
English (en)
Other versions
ES1056010Y (es
Inventor
Janos-Gerold Enderlein
Robert Kalicki
Bodo Woyde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of ES1056010U publication Critical patent/ES1056010U/es
Application granted granted Critical
Publication of ES1056010Y publication Critical patent/ES1056010Y/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0215Grounding of printed circuits by connection to external grounding means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0715Shielding provided by an outer layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • H05K2201/09181Notches in edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

1. Placa de circuito impreso con contacto electro-magnético, eléctrico y mecánico optimizado para una instalación de radio con un lado superior y un lado inferior y con una estructura de banda de conductores, que está preparada para el equipamiento con componentes, caracterizada porque el equipamiento con componentes está dispuesto exclusivamente sobre el lado superior de la placa de circuito impreso, mientras que el lado inferior de la placa de circuito impreso sirve como conexión de masa y/o térmica, que soporta un contacto electromagnético optimizado de la instalación de radio en un interfaz de alta frecuencia.
ES200302536U 2002-11-06 2003-11-05 Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado. Expired - Fee Related ES1056010Y (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20217220U DE20217220U1 (de) 2002-11-06 2002-11-06 Leiterplatte mit optimierter elektromagnetischer, elektrischer und mechanischer Kontaktierung

Publications (2)

Publication Number Publication Date
ES1056010U true ES1056010U (es) 2004-02-16
ES1056010Y ES1056010Y (es) 2004-06-01

Family

ID=7976745

Family Applications (1)

Application Number Title Priority Date Filing Date
ES200302536U Expired - Fee Related ES1056010Y (es) 2002-11-06 2003-11-05 Placa de circuito impreso con contacto electro-magnetico, electrico y mecanico optimizado.

Country Status (7)

Country Link
KR (1) KR200354556Y1 (es)
CN (1) CN2673034Y (es)
BR (1) BR8302617U (es)
DE (1) DE20217220U1 (es)
ES (1) ES1056010Y (es)
FR (1) FR2846846B3 (es)
IT (1) ITMI20030514U1 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20307647U1 (de) * 2003-05-12 2003-07-31 Siemens Ag Bauelementemodul, insbesondere für mobile Endgeräte mit optimierter Basisband/HF-Anordnung
DE20314526U1 (de) * 2003-09-12 2003-11-20 Siemens Ag Leiterplatte für ein Funkmodul

Also Published As

Publication number Publication date
KR200354556Y1 (ko) 2004-06-25
ITMI20030514U1 (it) 2004-05-07
DE20217220U1 (de) 2003-02-27
ITMI20030514V0 (it) 2003-11-04
FR2846846A3 (fr) 2004-05-07
FR2846846B3 (fr) 2004-10-08
CN2673034Y (zh) 2005-01-19
ES1056010Y (es) 2004-06-01
BR8302617U (pt) 2004-12-07

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Legal Events

Date Code Title Description
FG1K Utility model granted
FD1K Utility model lapsed

Effective date: 20100309