ES1053051Y - Placa de circuitos impresos con plaqueta dorsal de masa. - Google Patents
Placa de circuitos impresos con plaqueta dorsal de masa.Info
- Publication number
- ES1053051Y ES1053051Y ES200202577U ES200202577U ES1053051Y ES 1053051 Y ES1053051 Y ES 1053051Y ES 200202577 U ES200202577 U ES 200202577U ES 200202577 U ES200202577 U ES 200202577U ES 1053051 Y ES1053051 Y ES 1053051Y
- Authority
- ES
- Spain
- Prior art keywords
- plate
- dorsal
- printed circuit
- mass
- circuit plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09254—Branched layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Pens And Brushes (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20208478U DE20208478U1 (de) | 2002-05-29 | 2002-05-29 | Leiterplatte mit rückseitigem Massepad |
Publications (2)
Publication Number | Publication Date |
---|---|
ES1053051U ES1053051U (es) | 2003-03-01 |
ES1053051Y true ES1053051Y (es) | 2003-06-16 |
Family
ID=7971699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES200202577U Expired - Fee Related ES1053051Y (es) | 2002-05-29 | 2002-10-25 | Placa de circuitos impresos con plaqueta dorsal de masa. |
Country Status (5)
Country | Link |
---|---|
CN (1) | CN2572720Y (es) |
DE (1) | DE20208478U1 (es) |
ES (1) | ES1053051Y (es) |
FR (1) | FR2840503B3 (es) |
IT (1) | ITMI20030013U1 (es) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20314526U1 (de) * | 2003-09-12 | 2003-11-20 | Siemens Ag | Leiterplatte für ein Funkmodul |
CN102509957B (zh) * | 2011-10-18 | 2014-02-19 | 华为终端有限公司 | 一种通用串行总线usb公头 |
-
2002
- 2002-05-29 DE DE20208478U patent/DE20208478U1/de not_active Expired - Lifetime
- 2002-08-21 CN CN02247544U patent/CN2572720Y/zh not_active Expired - Fee Related
- 2002-09-12 FR FR0211315A patent/FR2840503B3/fr not_active Expired - Fee Related
- 2002-10-25 ES ES200202577U patent/ES1053051Y/es not_active Expired - Fee Related
-
2003
- 2003-01-16 IT ITMI20030013 patent/ITMI20030013U1/it unknown
Also Published As
Publication number | Publication date |
---|---|
ES1053051U (es) | 2003-03-01 |
FR2840503B3 (fr) | 2004-04-30 |
CN2572720Y (zh) | 2003-09-10 |
ITMI20030013U1 (it) | 2003-11-30 |
DE20208478U1 (de) | 2002-08-29 |
FR2840503A3 (fr) | 2003-12-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG1K | Utility model granted | ||
FD1K | Utility model lapsed |
Effective date: 20100309 |