DE60130176D1 - Wärmeleitende Platte mit Leiterfolie - Google Patents

Wärmeleitende Platte mit Leiterfolie

Info

Publication number
DE60130176D1
DE60130176D1 DE60130176T DE60130176T DE60130176D1 DE 60130176 D1 DE60130176 D1 DE 60130176D1 DE 60130176 T DE60130176 T DE 60130176T DE 60130176 T DE60130176 T DE 60130176T DE 60130176 D1 DE60130176 D1 DE 60130176D1
Authority
DE
Germany
Prior art keywords
thermally conductive
conductive plate
conductor foil
foil
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130176T
Other languages
English (en)
Other versions
DE60130176T2 (de
Inventor
Akio Yamaguchi
Yasuhiro Kawaguchi
Hideharu Kawai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kitagawa Industries Co Ltd
Original Assignee
Kitagawa Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kitagawa Industries Co Ltd filed Critical Kitagawa Industries Co Ltd
Publication of DE60130176D1 publication Critical patent/DE60130176D1/de
Application granted granted Critical
Publication of DE60130176T2 publication Critical patent/DE60130176T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/258—Alkali metal or alkaline earth metal or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
    • Y10T428/31696—Including polyene monomers [e.g., butadiene, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE2001630176 2000-08-10 2001-08-08 Wärmeleitende Platte mit Leiterfolie Expired - Lifetime DE60130176T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000242788 2000-08-10
JP2000242788A JP3609697B2 (ja) 2000-08-10 2000-08-10 電気・電子装置用の導電性箔付き熱伝導シート

Publications (2)

Publication Number Publication Date
DE60130176D1 true DE60130176D1 (de) 2007-10-11
DE60130176T2 DE60130176T2 (de) 2008-01-10

Family

ID=18733753

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001630176 Expired - Lifetime DE60130176T2 (de) 2000-08-10 2001-08-08 Wärmeleitende Platte mit Leiterfolie

Country Status (4)

Country Link
US (2) US20020037419A1 (de)
EP (1) EP1180798B1 (de)
JP (1) JP3609697B2 (de)
DE (1) DE60130176T2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10151036A1 (de) * 2001-10-16 2003-05-08 Siemens Ag Isolator für ein organisches Elektronikbauteil
EP1831756B1 (de) 2005-08-31 2018-02-21 LG Chem, Ltd. Reflexionsplatte für rückbeleuchtungseinheit und rückbeleuchtungseinheit in einer flüssigkristallanzeige mit guter wärmeleitfähigkeit
US20080166552A1 (en) * 2006-11-06 2008-07-10 Arlon, Inc. Silicone based compositions for thermal interface materials
DE102013218826A1 (de) * 2013-09-19 2015-03-19 Siemens Aktiengesellschaft Kühlkörper
JP2020008247A (ja) * 2018-07-11 2020-01-16 株式会社デンソー 磁気熱量素子および熱磁気サイクル装置
CN114096619B (zh) * 2019-08-08 2023-05-26 积水保力马科技株式会社 导热片及其制造方法
CN110643182B (zh) * 2019-09-17 2021-06-22 厦门市科源电子工业有限公司 一种导电硅橡胶及其制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3959063A (en) * 1971-06-02 1976-05-25 Foseco International Limited Method of protecting a surface from a heat source
JPS585452B2 (ja) * 1975-08-28 1983-01-31 富士写真フイルム株式会社 磁気記録媒体
JPS5566951A (en) * 1978-11-13 1980-05-20 Shin Etsu Chem Co Ltd Primer composition
JPS5765758A (en) * 1980-10-09 1982-04-21 Toray Silicone Co Ltd Primer composition for bonding
US5180625A (en) * 1989-05-03 1993-01-19 Trw Inc. Ceramic aluminum laminate and thermally conductive adhesive therefor
JPH0721308Y2 (ja) * 1990-10-30 1995-05-17 信越化学工業株式会社 熱伝導性シート
JP3182257B2 (ja) * 1993-02-02 2001-07-03 電気化学工業株式会社 放熱シート
US5741579A (en) * 1995-04-28 1998-04-21 Shin-Etsu Polymer Co., Ltd. Heat-conductive sheet
US5753361A (en) * 1996-05-03 1998-05-19 Eastman Kodak Company Fuser member having chromium oxide-filled, addition cured layer
JPH10135383A (ja) * 1996-10-30 1998-05-22 Canon Inc 電子部品搭載基板およびこれを備えた電子機器
JPH10255250A (ja) * 1997-03-11 1998-09-25 Fuji Photo Film Co Ltd 磁気記録媒体およびその製造方法
JP2941801B1 (ja) * 1998-09-17 1999-08-30 北川工業株式会社 熱伝導材
JP2000124660A (ja) * 1998-10-12 2000-04-28 Polymatech Co Ltd 熱伝導性電磁波シールドシート
US6365280B1 (en) * 2000-11-28 2002-04-02 Xerox Corporation Nitrile-silicone rubber surface release layer for electrostatographic members

Also Published As

Publication number Publication date
US6733614B2 (en) 2004-05-11
US20030143412A1 (en) 2003-07-31
US20020037419A1 (en) 2002-03-28
JP2002057254A (ja) 2002-02-22
DE60130176T2 (de) 2008-01-10
JP3609697B2 (ja) 2005-01-12
EP1180798A1 (de) 2002-02-20
EP1180798B1 (de) 2007-08-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition