KR20020092642A - The method and an+ apparatus plating a shaft - Google Patents

The method and an+ apparatus plating a shaft Download PDF

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Publication number
KR20020092642A
KR20020092642A KR1020010031400A KR20010031400A KR20020092642A KR 20020092642 A KR20020092642 A KR 20020092642A KR 1020010031400 A KR1020010031400 A KR 1020010031400A KR 20010031400 A KR20010031400 A KR 20010031400A KR 20020092642 A KR20020092642 A KR 20020092642A
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KR
South Korea
Prior art keywords
shaft
rotating shaft
fixed
rotation shaft
shafts
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KR1020010031400A
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Korean (ko)
Inventor
김정진
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주식회사 정우이지텍
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Priority to KR1020010031400A priority Critical patent/KR20020092642A/en
Publication of KR20020092642A publication Critical patent/KR20020092642A/en

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C23C18/1628—Specific elements or parts of the apparatus
    • C23C18/163—Supporting devices for articles to be coated
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2223/00—Surface treatments; Hardening; Coating
    • F16C2223/30—Coating surfaces

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: A method and an apparatus for plating shafts are provided to enable mass production and uniformly plate all surface of the shafts by stackingly assembling porous plates and fixing plates. CONSTITUTION: The electroless plating apparatus of shafts comprises a rotation shaft(1) that is rotated by operation of a gear(4); porous plate frames(2) which are fixed to the rotation shaft(1) by a penetration part(21) and a support part(22), and on which a plurality of holes(23) are vertically penetratingly formed so that shafts can be inserted into the holes(23), wherein the rotation shaft(1) is inserted into the penetration part(21), and the support part(22) is downwardly projected on the same extension line of the penetration part(21) so that the support part(22) is coupled onto the outer circumferential surface of the rotation shaft(1); and a shaft fixing set comprising fixing plates(3) which are fixed to the rotation shaft(1) by a penetration part(31) and a support part(32) so that the fixing plates(3) are assembled into upper and lower steps of the shafts inserted into the porous plate frames(2), wherein the rotation shaft(1) is inserted into the penetration part(31), and the support part(32) is downwardly projected on the same extension line of the penetration part(31) so that the support part(32) is coupled onto the outer circumferential surface of the rotation shaft(1).

Description

축의 도금방법 및 장치{The method and an+ apparatus plating a shaft}The method and an + apparatus plating a shaft}

본 발명은 축(shaft)의 도금에 적용되는 것으로, 특히 축을 협소공간에서 대량생산이 가능하면서 균일한 도금층을 얻을 수 있도록 한 것이다.The present invention is applied to the plating of the shaft (shaft), it is possible to obtain a uniform plating layer while being able to mass-produce the shaft in a narrow space, in particular.

현재 축의 도금방법은 각각의 축을 고정시킬 수 있는 지그를 이용하는 전기도금의 방식과 격자형태로 다수개의 칸막이가 형성된 수납통에 샤프트를 삽입시킨 상태에서 무전해 도금에 의한 방식을 채용하고 있는 것이다.Currently, the plating method of the shaft adopts a method of electroplating using a jig capable of fixing each shaft and an electroless plating method in which a shaft is inserted into a storage box in which a plurality of partitions are formed in a lattice form.

그러나 전기도금은 도금의 치밀도가 떨어지고 음극과 연결되어 있는 지그에 축을 일일이 연결하여야 하는 작업으로 생산성이 낮기 때문에 최근에는 다수개를 일시에 생산가능한 수납통을 이용한 무전해도금을 사용하고 있는 것이다.However, since electroplating has a low density of plating and a shaft must be connected to a jig connected to a cathode one by one, productivity is low. Recently, electroplating using a storage container capable of producing a large number of times is used.

그러나 수납통에 축을 삽입시켰을 경우에 일반적으로 길죽한 봉이나 관타입으로 이루어진 축이 수납통에서 기울기를 갖게 됨으로 이로인한 수납통의 선단과 밀착되어 선 접촉이 이루어지게 된다.However, when the shaft is inserted into the storage container, the shaft generally made of elongated rod or tube type has an inclination in the storage container so that the line contact is made in close contact with the tip of the storage container.

따라서 이러한 선 접촉은 수납통을 유동토록 하여 접촉된 부분의 도금이 이루어지도록 하고 있으나 선 접촉에 의한 도금의 불량상태가 발생되는 것이다.Therefore, the line contact is to cause the plating of the contacted portion to flow through the storage container, but a poor state of plating due to the line contact occurs.

즉 도 5에 도시된 바와 같이 축(10)을 삽입할 수 있는 다수개의 격자상의 칸막이(100)가 형성된 수납통(200)을 이용하여 축을 삽입한 상태에서 도금액에 침지시켜 축의 표면에 도금층이 형성토록 하고 있는 것이다.That is, as shown in FIG. 5, the plating layer is formed on the surface of the shaft by being immersed in the plating liquid in the state in which the shaft is inserted using the storage container 200 in which the plurality of lattice partitions 100 into which the shaft 10 can be inserted are formed. It is doing it forever.

따라서 이러한 수납통의 유동을 위한 별도의 장치나 수단이 필요하게 되고, 또한 다 많은 양의 생산을 위하여는 더 많은 칸막이를 갖는 수납통이 요구되어짐으로 장치의 대형화가 이루어져야 하는 등의 단점이 있다.Therefore, there is a need for a separate device or means for the flow of such a container, and also for the production of a large amount of the container having a large number of partitions is required to increase the size of the device.

따라서 본 발명은 상기한 종래의 문제점을 해결하기 위하여 안출한 것으로서, 기어의 작동에 의하여 회전되어지는 회전축에 축을 끼울 수 있도록 한 다공판과 다공판에 끼워진 축을 상,하부에서 고정시킬 수 있도록 하기 위한 고정판을 적층되게 조립할 수 있도록 하여 대량생산은 물론 축에 균일한 도금이 가능토록 한 것이다.Therefore, the present invention has been made in order to solve the above-mentioned problems, for fixing the upper and lower shafts fitted to the perforated plate and the perforated plate to be fitted to the axis of rotation that is rotated by the operation of the gear It is possible to assemble the fixed plate in a stack so that it is possible to mass production as well as to uniform plating on the shaft.

도 1은 본 발명에 따른 축의 도금장치 일 실시 예의 사시도.1 is a perspective view of one embodiment of a plating apparatus for a shaft according to the present invention.

도 2는 축이 다공판에 끼워져 고정판에 의하여 고정된 상태의 사시도.2 is a perspective view of a state in which a shaft is fitted to a porous plate and fixed by a fixing plate;

도 3은 다공판의 이면 사시도.3 is a rear perspective view of the porous plate;

도 4는 고정판의 이면 사시도.4 is a rear perspective view of the fixing plate;

도 5는 본 발명에 따른 축의 도금장치의 사용 상태 단면도.5 is a cross-sectional view of the use state of the plating apparatus of the shaft according to the present invention.

도 6은 종래 축의 도금을 우한 수납통의 일 실시 예를 나타낸 개략도.Figure 6 is a schematic view showing an embodiment of a storage container with plating of the conventional shaft.

<도면의주요부분에대한부호의설명>Explanation of symbols on the main parts of the drawing

1: 회전축 2: 다공판틀1: rotating shaft 2: perforated frame

3: 고정판 4: 기어3: fixed plate 4: gear

10: 샤프트10: shaft

이하에서는 첨부 도면을 참조하여 본 발명의 가장 바람직한 일 실시 예를 상세히 설명하기로 한다. 우선, 각 도면을 설명함에 있어, 본 발명의 도면이 종래의 도면과 일치될 경우에는 동일한 도면 부호를 사용함과 동시에 동일한 구성 요소들에 한해서도 비록 다른 도면상에 도시되더라도 가능한 한 동일한 참조부호를 사용토록 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in describing the drawings, when the drawings of the present invention are consistent with the conventional drawings, the same reference numerals are used, and the same reference numerals are used as much as possible even if they are shown in different drawings. Do it.

도 1에 도시된 바와 같이 본 발명은 기어(4)의 작동에 의하여 자전되어지는 회전축(1)과, 회전축(1)이 삽입되어지는 통공부(21)와 통공부(21)의 동일 연장선상으로 하향 돌출되어 회전축(1)의 외주면으로 결합되어지는 지지부(22)에 의하여 회전축에 고정되고 상,하부로 관통되어진 다수개의 구멍(23)에 의하여 샤프트(10)를 끼울 수 있도록 된 다공판틀(2)과, 회전축(1)이 삽입되어지는 통공부(31)와 통공부(31)의 동일 연장선상으로 하향 돌출되어 회전축(1)의 외주면으로 결합되어지는 지지부(32)에 의하여 회전축에 고정토록 되어 다공판틀(2)에 끼워진 샤프트(10)의 상,하단에 조립됨으로서 샤프트를 고정시킬 수 있도록 하기 위한 고정판(3)으로 이루어진 샤프트 고정세트를 이용하여 샤프트를 한꺼번에 다수개 고정시킨 상태에서 도금액에 침수시켜 연속 회전토록 함으로서 샤프트의 표면에 균일한 도금층이 형성토록 한 것이다.As shown in FIG. 1, in the present invention, the rotating shaft 1 is rotated by the operation of the gear 4, and the same extending line between the through-hole 21 and the through-hole 21 into which the rotating shaft 1 is inserted. Perforated plate frame which can be fitted into the shaft 10 by a plurality of holes 23 are fixed to the rotating shaft by the support portion 22 is projected downward to the outer peripheral surface of the rotating shaft 1 and penetrated up and down (2) and the support shaft 32 is projected downward on the same extension line of the through hole 31 and the through hole 31 into which the rotary shaft 1 is inserted and coupled to the outer circumferential surface of the rotary shaft 1 to the rotary shaft. A state in which a plurality of shafts are fixed at a time by using a shaft fixing set composed of a fixing plate 3 for fixing the shaft by being assembled at the upper and lower ends of the shaft 10 fitted to the porous plate frame 2 so as to be fixed. Soak in the plating solution in the continuous rotary soil A uniform coating layer on the surface by the shaft to the ever formed.

이때 상기 다공판틀(2)에 형성된 구멍(23)의 규격은 도금시키고자 하는 샤프트의 굵기에 따라 달리할 수 있는 것으로, 다공판틀(2)의 구멍(23)에 끼우고자 하는 샤프트의 굵기보다 약간 크게 형성되어야 샤프트의 삽탈이 용이하고 구멍과 접촉된 부분으로의 균일한 도금층 형성이 가능하게 되는 것이다.In this case, the size of the hole 23 formed in the porous plate frame 2 may vary depending on the thickness of the shaft to be plated, and the size of the shaft to be inserted into the hole 23 of the porous plate frame 2 is different. It should be formed slightly larger than the thickness to facilitate the insertion and removal of the shaft and to form a uniform plating layer in contact with the hole.

또한 상기 다공판틀(2)은 2단으로 끼워서 샤프트(1)의 양측을 고정토록 하여 샤프트의 균형을 유지토록 함으로서 샤프트의 기울어짐을 방지할 수 있는 것이다.In addition, the porous plate frame 2 is inserted into two stages to fix both sides of the shaft 1 to maintain the balance of the shaft to prevent the inclination of the shaft.

또한 상기 회전축(1)에 샤프트 고정세트를 2단 이상 끼워서 사용토록 함으로서 한 번의 도금작업으로 더욱 많은 양의 샤프트(10)를 도금시킬 수 있는 것이다.In addition, by inserting two or more stages of the shaft fixing set into the rotary shaft 1, a larger amount of the shaft 10 can be plated by one plating operation.

따라서 상기한 도금장치를 이용하여 샤프트를 도금토록 하기 위해서는, 우선 회전축(1)의 하부에 고정판(3)을 끼워서 조립시킨 후, 고정판의 상부로 다공판틀(2)을 2단으로 끼워서 조립시킨 후, 다공판틀의 구멍(23)에 샤프트(10)를 끼워서 매운 후, 다공판틀에 끼워진 샤프트의 상단으로 또 다른 고정판(3)을 끼워서 샤프트를 고정시킨 후, 도 5에 도시된 바와 같이Therefore, in order to plate the shaft by using the above-described plating apparatus, first, the fixing plate 3 is assembled to the lower part of the rotating shaft 1, and then the porous plate frame 2 is inserted into the upper part of the fixing plate in two stages. Then, after filling the shaft 10 into the hole 23 of the porous plate frame, and after fixing the shaft by inserting another fixing plate 3 to the upper end of the shaft fitted in the porous plate frame, as shown in Figure 5

도금액(20)이 담겨진 도금조(30)의 양 측에 회전축을 수평으로 고정시켜 침수시키고 기어(4)의 가동에 의하여 회전축이 연속적으로 자전토록 함으로서 샤프트 고정세트가 동시에 자전되면서 샤프트 고정세트에 고정되어진 다수개의 샤프트를 도금액 속에 침수시켜 표면에 도금층이 형성되게 되는 것이다.The rotating shaft is fixed to both sides of the plating bath 30 in which the plating solution 20 is contained and flooded, and the rotating shaft is rotated continuously by the operation of the gear 4 so that the shaft fixed set rotates simultaneously and is fixed to the shaft fixed set. The plating layer is formed on the surface by immersing the plurality of shafts in the plating solution.

이때 샤프트의 표면에 형성되어지는 도금층은 다공판틀과 고정판에 의하여 다수개의 샤프트가 일정 간격으로 유지되면서 양측이 고정되어지기 때문에 샤프트 고정세트의 회전 시에도 샤프트가 기울어지지 않고 수평 상태를 유지토록 함으로서 샤프트 표면으로 균일한 도금층을 형성시킬 수 있는 것이다.At this time, the plated layer formed on the surface of the shaft is fixed to both sides by a plurality of shafts are maintained at a predetermined interval by the perforated plate frame and the fixed plate, so that the shaft does not tilt even when the shaft fixed set is rotated to maintain a horizontal state. It is possible to form a uniform plating layer on the shaft surface.

따라서 본 발명에 의한 샤프트의 무전해 도금장치를 이용하여 샤프트를 도금시키는 방법은 한 번의 도금 작업으로 표면에 균일한 도금층이 형성되어진 다수개의 샤프트를 생산할 수 있기 때문에 우수한 품질의 대량 생산이 가능하게 되는 장점이 있다.Therefore, the method of plating the shaft using the electroless plating apparatus of the shaft according to the present invention can produce a large number of shafts having a uniform plating layer formed on the surface by one plating operation, thereby enabling mass production of excellent quality. There is an advantage.

Claims (3)

기어(4)의 작동에 의하여 자전되어지는 회전축(1)에 고정되어지는 샤프트 고정세트를 이용하여 다수개의 샤프트를 일정 간격을 유지하면서 양측이 고정토록 한 후, 도금액에 침수시킨 상태에서 회전축을 연속 회전시켜 다수개의 샤프트 표면에 균일한 도금층을 형성토록 한 샤프트의 무전해 도금방법.After a plurality of shafts are fixed at both sides by using a shaft fixing set fixed to a rotating shaft 1 rotated by the operation of the gear 4, the rotating shaft is continuously immersed in a plating solution. Electroless plating method of a shaft to rotate to form a uniform plating layer on a plurality of shaft surfaces. 기어(4)의 작동에 의하여 자전되어지는 회전축(1)과, 회전축(1)이 삽입되어지는 통공부(21)와 통공부(21)의 동일 연장선상으로 하향 돌출되어 회전축(1)의 외주면으로 결합되어지는 지지부(22)에 의하여 회전축에 고정되고 상,하부로 관통되어진 다수개의 구멍(23)에 의하여 샤프트(10)를 끼울 수 있도록 된 다공판틀(2)과, 회전축(1)이 삽입되어지는 통공부(31)와 통공부(31)의 동일 연장선상으로 하향 돌출되어 회전축(1)의 외주면으로 결합되어지는 지지부(32)에 의하여 회전축에 고정토록 되어 다공판틀(2)에 끼워진 샤프트(10)의 상,하단에 조립되어지는 고정판(3)으로 이루어진 샤프트 고정세트를 포함하는 샤프트 무전해 도금장치.The outer circumferential surface of the rotating shaft 1 is projected downward on the same extension line between the rotating shaft 1 rotated by the operation of the gear 4 and the through-hole 21 and the through-hole 21 into which the rotating shaft 1 is inserted. Perforated plate frame (2) and the rotating shaft (1) is fixed to the rotating shaft by the support portion 22 is coupled to the upper and lower through holes 23 to be fitted into the shaft (10) The through-hole 31 and the through-hole 31 are projected downward on the same extension line to be fixed to the rotating shaft by the support portion 32 coupled to the outer circumferential surface of the rotating shaft 1 to the porous plate frame 2. Shaft electroless plating apparatus including a shaft fixing set consisting of a fixed plate (3) to be assembled at the upper and lower ends of the fitted shaft (10). 제 2항에 있어서, 상기 회전축(1)에 끼워져 조립되어지는 샤프트 고정세트를 2단 이상 포함하는 샤프트 무전해 도금장치.3. The shaft electroless plating apparatus according to claim 2, comprising two or more stages of a shaft fixing set fitted to the rotary shaft (1).
KR1020010031400A 2001-06-05 2001-06-05 The method and an+ apparatus plating a shaft KR20020092642A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881870A (en) * 2014-11-25 2016-08-24 新疆天业（集团）有限公司 Rotary porous plate device
CN111364029A (en) * 2019-10-17 2020-07-03 横店集团东磁股份有限公司 Repairing device for large-scale shaft parts

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6152367A (en) * 1984-08-20 1986-03-15 C Uyemura & Co Ltd Plating device for plate work
JPS61120343A (en) * 1984-11-14 1986-06-07 Chuo Seisakusho:Kk Plating device of magnetic disk substrate
JPS61133380A (en) * 1984-12-03 1986-06-20 Katsukawa Kogyo Kk Chemical surface treatment
JPS6231023A (en) * 1985-08-01 1987-02-10 Chuo Seisakusho:Kk Plating device for magnetic disk substrate
JPS6286167A (en) * 1985-07-12 1987-04-20 Furukawa Electric Co Ltd:The Electroless plating device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6152367A (en) * 1984-08-20 1986-03-15 C Uyemura & Co Ltd Plating device for plate work
JPS61120343A (en) * 1984-11-14 1986-06-07 Chuo Seisakusho:Kk Plating device of magnetic disk substrate
JPS61133380A (en) * 1984-12-03 1986-06-20 Katsukawa Kogyo Kk Chemical surface treatment
JPS6286167A (en) * 1985-07-12 1987-04-20 Furukawa Electric Co Ltd:The Electroless plating device
JPS6231023A (en) * 1985-08-01 1987-02-10 Chuo Seisakusho:Kk Plating device for magnetic disk substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105881870A (en) * 2014-11-25 2016-08-24 新疆天业（集团）有限公司 Rotary porous plate device
CN111364029A (en) * 2019-10-17 2020-07-03 横店集团东磁股份有限公司 Repairing device for large-scale shaft parts

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