KR20100009747A - Paste wheel - Google Patents

Paste wheel Download PDF

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Publication number
KR20100009747A
KR20100009747A KR1020080070513A KR20080070513A KR20100009747A KR 20100009747 A KR20100009747 A KR 20100009747A KR 1020080070513 A KR1020080070513 A KR 1020080070513A KR 20080070513 A KR20080070513 A KR 20080070513A KR 20100009747 A KR20100009747 A KR 20100009747A
Authority
KR
South Korea
Prior art keywords
paste wheel
paste
chip
plating liquid
groove
Prior art date
Application number
KR1020080070513A
Other languages
Korean (ko)
Other versions
KR101019951B1 (en
Inventor
문재철
Original Assignee
(주)넥셈
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by (주)넥셈 filed Critical (주)넥셈
Priority to KR1020080070513A priority Critical patent/KR101019951B1/en
Publication of KR20100009747A publication Critical patent/KR20100009747A/en
Application granted granted Critical
Publication of KR101019951B1 publication Critical patent/KR101019951B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The present invention relates to a paste wheel, and more particularly, by forming one or more regular grooves on the circumferential surface of the paste wheel, the plating liquid is rotated while being filled with a plating liquid (paste) in the groove and then contacted with the array type chip. Paste wheel applied to the chip.

Description

Paste Wheel

The present invention relates to a paste wheel, and more particularly, by forming one or more regular grooves on the circumferential surface of the paste wheel, the plating liquid is rotated while being filled with a plating liquid (paste) in the groove and then contacted with the array type chip. Paste wheel applied to the chip.

A typical paste wheel is a method in which the electrode solution is applied while the chip 2 is loaded and placed continuously on a tape 3 of a continuous form as a film between two paste wheels 1, as shown in FIG. have.

At this time, one or more slots are formed in the paste wheel 1 to be rotated while the plating liquid (not shown) of the plating tank is filled in the slots, and then the plating liquid buried outside the slots is removed by the wiper 4, and then the chip 2 The plating liquid is applied while contacting with the paste, and when the paste is applied with a conventional paste wheel, the surface of the plating liquid does not come out of the slot smoothly, so that the coating surface is formed like a jar, or the coating surface is irregularly formed. There was a problem.

As a result, the current flowing through the chip becomes inconsistent, causing many problems such as instability and deterioration of product quality.

Patent No. 10-2007-0013474 filed by the present applicant in order to solve this problem is proposed a paste wheel that is formed in the form of the upper and lower strait of the slot shape is open to the outside can be applied more smoothly.

The paste wheel described above may form an electrode by applying the entire surface of the chip, and there is a risk that the coating surface of the electrode is not uniform and the current flowing through the chip is not constant due to waste of the plating solution.

Accordingly, the present invention provides a paste wheel for coating an array type chip, wherein the paste wheel forms one or more regular grooves on the circumferential surface to provide a paste wheel in which electrodes formed on the chip can be formed with dots. Its purpose is to.

In addition, another object of the present invention is to provide a paste wheel capable of producing the most suitable diameter and spacing of the grooves formed in the paste wheel in consideration of the size of the chip and the use environment.

The paste wheel according to the present invention provides a paste wheel for coating an array type chip, wherein the paste wheel forms one or more regular grooves on the circumferential surface, and the electrodes formed on the chip may be formed with dots. It provides a paste wheel that can be most suitably produced in consideration of the size of the chip and the environment of the grooves formed in the paste wheel.

The present invention relates to a paste wheel, and more particularly, by forming one or more regular grooves on the circumferential surface of the paste wheel, the plating liquid is rotated while being filled with a plating liquid (paste) in the groove and then contacted with the array type chip. Paste wheel applied to the chip.

Hereinafter, preferred embodiments of the present invention by referring to the accompanying drawings in detail as follows.

FIG. 2 is a structural example of the present invention, and FIG. 3 is a structural example of a chip that can be produced as a paste wheel according to the present invention. The paste wheel according to the present invention is a paste wheel used for applying an external electrode of an array type chip. In the present invention, at least one groove 5 is formed on the circumferential surface of the paste wheel compound 1b at regular intervals so that the plating liquid is applied while being rotated while the plating liquid is filled in the groove 5 and contacting the chip 2. It is characterized by being.

First, the paste wheel 1 is formed of a metal rotating plate 1a to which a rotating shaft is coupled, and a compound 1b (composite material) formed on the circumferential surface of the rotating plate. The compound (1b) is preferably formed of synthetic rubber (synthetic rubber) or silicon, usually shore hardness of about 81 ~ 89, tensile strength of 140kgf / cm 2 or more, elongation of 200% or more Is preferred.

The rotary plate 1a may be formed with a key groove for coupling with an axis (not shown). However, in the present embodiment, a hole 7 is formed at a predetermined position to fix the hole in the hole 7. To prevent slippage with the rotating shaft.

One or more grooves are formed at regular intervals on the circumferential surface of the compound 1b, and the paste wheel is rotated in a state where a pair of paste wheels face each other as shown in FIG. 1 to a plating bath (not shown). Part is contained and rotated. At this time, the plating liquid in the plating bath is buried in the circumferential surface and the groove 5 of the compound 1b, and the plating liquid buried in the circumferential surface by the wiper 4 is removed. Then, when the grooves 5 formed in the compound 1b and the chip 2 come into contact with each other, the plating liquid filled in the grooves 5 is applied to the chip 2 while the compound 1b is pressurized.

Preferably, the groove 5 has a diameter of 0.5 to 2 mm. If the groove 5 is too large, the electrodes 6 may come into contact with each other or the plating liquid may randomly flow down. The discharge of the plating liquid may not be smooth, and thus the electrode 6 may not be formed to a desired size.

Preferably, the grooves 5 are divided at regular intervals. Usually, the grooves 5 are preferably formed between 18 and 36 in one row.

As a result, it is preferable to form the angle α between the grooves 5 between 10 and 20 degrees.

1 is a state diagram used in the conventional paste wheel

2 is a structural example of the present invention

Figure 3 is an illustration of the configuration of a chip that can be produced with a paste wheel according to the present invention

<Description of Symbols for Major Parts of Drawings>

1. Paste Wheel 1a. Tumbler 1b. Compound

2. Chip 3. Tape 4. Wiper

5. Groove 6. Electrode 7. Hole

Claims (3)

In the paste wheel used to apply the external electrode of the array type chip, One or more grooves 5 are formed on the circumferential surface of the paste wheel compound 1b at regular intervals so that the plating liquid is applied while being rotated while the plating liquid is filled in the groove 5 and contacting the chip 2. Phosphorus paste wheel The method of claim 1, Paste wheel, characterized in that the groove (5) is between 0.5 and 2 mm in diameter The method of claim 1, Paste wheel, characterized in that the angle between the groove and the groove (α) is formed between 10 to 20 °
KR1020080070513A 2008-07-21 2008-07-21 Paste Wheel KR101019951B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080070513A KR101019951B1 (en) 2008-07-21 2008-07-21 Paste Wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080070513A KR101019951B1 (en) 2008-07-21 2008-07-21 Paste Wheel

Publications (2)

Publication Number Publication Date
KR20100009747A true KR20100009747A (en) 2010-01-29
KR101019951B1 KR101019951B1 (en) 2011-03-09

Family

ID=41818018

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080070513A KR101019951B1 (en) 2008-07-21 2008-07-21 Paste Wheel

Country Status (1)

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KR (1) KR101019951B1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210127457A (en) 2020-04-14 2021-10-22 정창훈 Paste Wheel
KR102230867B1 (en) 2020-06-18 2021-03-23 (주)넥셈 paste wheel with improved applicability
KR102196694B1 (en) 2020-06-18 2020-12-30 (주)넥셈 paste wheels with increased productivity
KR20220010318A (en) 2020-07-17 2022-01-25 (주)넥셈 paste wheels with increased productivity

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070062106A (en) * 2005-12-12 2007-06-15 삼성전자주식회사 Printing plate, method for fabricating the same and roll printing apparatus and method for fabricating display device using the the same
JP2008159812A (en) 2006-12-22 2008-07-10 Sharp Corp Device for forming semiconductor layer and method for forming semiconductor layer
KR101223028B1 (en) * 2007-01-05 2013-01-17 엘지전자 주식회사 Method of preparing the front electrode of solar cell, method of preparing solar cell, and solar cell

Also Published As

Publication number Publication date
KR101019951B1 (en) 2011-03-09

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