KR20020082786A - 본딩 공구, 본딩 스테이지, 본딩 공구용 선단부 및 본딩스테이지용 스테이지부 - Google Patents

본딩 공구, 본딩 스테이지, 본딩 공구용 선단부 및 본딩스테이지용 스테이지부 Download PDF

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Publication number
KR20020082786A
KR20020082786A KR1020020022371A KR20020022371A KR20020082786A KR 20020082786 A KR20020082786 A KR 20020082786A KR 1020020022371 A KR1020020022371 A KR 1020020022371A KR 20020022371 A KR20020022371 A KR 20020022371A KR 20020082786 A KR20020082786 A KR 20020082786A
Authority
KR
South Korea
Prior art keywords
bonding
stage
tool
tip
tool surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020020022371A
Other languages
English (en)
Korean (ko)
Inventor
사까따나오끼
마에무라고이찌로
가와우찌히로시
야시끼데쯔오
다까하시도시야
오하라도시아끼
Original Assignee
스미토모덴키고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 스미토모덴키고교가부시키가이샤 filed Critical 스미토모덴키고교가부시키가이샤
Publication of KR20020082786A publication Critical patent/KR20020082786A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07188—Apparatus chuck
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques

Landscapes

  • Wire Bonding (AREA)
KR1020020022371A 2001-04-25 2002-04-24 본딩 공구, 본딩 스테이지, 본딩 공구용 선단부 및 본딩스테이지용 스테이지부 Withdrawn KR20020082786A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00127511 2001-04-25
JP2001127511 2001-04-25
JP2002056989A JP2003017532A (ja) 2001-04-25 2002-03-04 ボンディングツール並びにボンディングステージ及びボンディングツール用先端部並びにボンディングステージ用ステージ部
JPJP-P-2002-00056989 2002-03-04

Publications (1)

Publication Number Publication Date
KR20020082786A true KR20020082786A (ko) 2002-10-31

Family

ID=26614176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020020022371A Withdrawn KR20020082786A (ko) 2001-04-25 2002-04-24 본딩 공구, 본딩 스테이지, 본딩 공구용 선단부 및 본딩스테이지용 스테이지부

Country Status (3)

Country Link
JP (1) JP2003017532A (https=)
KR (1) KR20020082786A (https=)
TW (1) TW543130B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022211370A1 (ko) * 2021-04-02 2022-10-06 일진다이아몬드(주) 초경 몸체에 일체화 된 다결정 다이아몬드 팁을 구비하는 고평탄 본딩 공구

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123413A (ja) * 2005-10-26 2007-05-17 Elpida Memory Inc 半導体装置の製造方法
JP5778341B2 (ja) * 2012-10-23 2015-09-16 東レエンジニアリング株式会社 ボンディングツール冷却装置およびボンディングツール冷却方法
CN116547092A (zh) * 2021-04-02 2023-08-04 日进金刚石株式会社 包括整合在碳化物主体的多晶钻石尖端的高平整度接合工具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022211370A1 (ko) * 2021-04-02 2022-10-06 일진다이아몬드(주) 초경 몸체에 일체화 된 다결정 다이아몬드 팁을 구비하는 고평탄 본딩 공구

Also Published As

Publication number Publication date
TW543130B (en) 2003-07-21
JP2003017532A (ja) 2003-01-17

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St.27 status event code: A-0-1-A10-A12-nap-PA0109

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St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-3-3-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000