KR20010107701A - 형상측정기 - Google Patents
형상측정기 Download PDFInfo
- Publication number
- KR20010107701A KR20010107701A KR1020010028565A KR20010028565A KR20010107701A KR 20010107701 A KR20010107701 A KR 20010107701A KR 1020010028565 A KR1020010028565 A KR 1020010028565A KR 20010028565 A KR20010028565 A KR 20010028565A KR 20010107701 A KR20010107701 A KR 20010107701A
- Authority
- KR
- South Korea
- Prior art keywords
- unit
- measurement
- measuring
- carrier
- imaging
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title claims abstract description 112
- 238000003384 imaging method Methods 0.000 claims abstract description 37
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 2
- 230000002452 interceptive effect Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 52
- 239000004065 semiconductor Substances 0.000 description 45
- 238000012545 processing Methods 0.000 description 30
- 238000005286 illumination Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
Claims (5)
- 측정 대상을 탑재하기 위한 스테이지,상기 측정 대상을 촬상하기 위한 촬상부, 및상기 측정 대상의 측정해야 할 부위까지 상기 촬상부와 상기 측정 대상을 상대적으로 이동시키는 이동부를 구비하고,상기 이동부는 상기 스테이지를 이동시키지 않고 상기 촬상부를 이동시킴으로써 상기 이동을 실현하는 것을 특징으로 하는 형상측정기.
- 측정 대상을 탑재하기 위한 스테이지,상기 측정 대상의 형상을 측정하는 측정부,상기 측정 대상의 측정해야 할 부위까지 상기 측정부와 상기 측정 대상을 상대적으로 이동시키는 이동부, 및상기 측정부와 상기 이동부의 적어도 일부를 수용하는 케이스를 구비하고,상기 케이스는 상기 측정 대상과 대향하는 부위에 상기 측정부의 상기 이동을 방해하지 않는 크기의 개구를 가지며, 상기 측정부 선단은 상기 개구에서 상기 측정 대상측으로 노출되고,상기 개구에는 상기 케이스 내의 먼지가 상기 측정 대상측으로 새는 것을 방지하기 위해서 상기 측정부의 상기 이동을 방해하는 일 없이 상기 측정부 이외의 부분을 덮는 방진부재가 배치되어 있는 것을 특징으로 하는 형상측정기.
- 제 2 항에 있어서, 상기 방진부재를 휘게 하여 이 방진부재와 개구의 간극에서 상기 케이스 내로 흘러들어가는 공기류를 형성하기 위해서, 상기 케이스 내부의 기압을 감압하는 감압수단을 구비하는 것을 특징으로 하는 형상측정기.
- 측정 대상을 탑재하기 위한 스테이지,상기 측정 대상의 형상을 측정하는 측정부, 및상기 측정 대상의 측정해야 할 부위까지 상기 측정부를 상대적으로 이동시키는 이동부를 구비하고,상기 측정부는 레이저광을 상기 측정 대상에 향하여 경사 방향으로 조사하는 조사부, 상기 레이저광의 반사광을 수광하는 수광부, 및 상기 측정 대상의 상기 레이저광 조사부위를 바꾸지 않고 상기 레이저광이 입사되는 방향을 바꾸기 위하여, 상기 조사부와 상기 수광부의 위치 관계를 유지한 상태로 상기 조사부와 상기 수광부를 회전시키는 회전구동부를 포함하는 것을 특징으로 하는 형상측정기.
- 제 4 항에 있어서, 상기 측정부는 상기 측정 대상을 촬상하기 위한 촬상부를 구비하고, 상기 수광부로부터의 출력에 따라 상기 측정 대상으로부터의 상기 촬상부의 광축방향의 거리를 검출하는 것을 특징으로 하는 형상측정기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-155493 | 2000-05-25 | ||
JP2000155493A JP4649704B2 (ja) | 2000-05-25 | 2000-05-25 | 形状測定機 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080018385A Division KR100910948B1 (ko) | 2000-05-25 | 2008-02-28 | 형상측정기 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010107701A true KR20010107701A (ko) | 2001-12-07 |
KR100837125B1 KR100837125B1 (ko) | 2008-06-11 |
Family
ID=18660429
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010028565A KR100837125B1 (ko) | 2000-05-25 | 2001-05-24 | 형상측정기 |
KR1020080018385A KR100910948B1 (ko) | 2000-05-25 | 2008-02-28 | 형상측정기 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080018385A KR100910948B1 (ko) | 2000-05-25 | 2008-02-28 | 형상측정기 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6762399B2 (ko) |
JP (1) | JP4649704B2 (ko) |
KR (2) | KR100837125B1 (ko) |
TW (1) | TW526325B (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100920309B1 (ko) * | 2002-12-28 | 2009-10-08 | 주식회사 포스코 | 열연강판의 형상 측정장치 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060086604A1 (en) * | 1996-09-24 | 2006-04-27 | Puskas William L | Organism inactivation method and system |
JP3697477B2 (ja) * | 2001-08-06 | 2005-09-21 | ソニー株式会社 | 基板収納容器測定装置および基板収納容器測定用治具 |
US7924440B2 (en) * | 2008-08-19 | 2011-04-12 | Silverbrook Research Pty Ltd | Imaging apparatus for imaging integrated circuits on an integrated circuit carrier |
WO2010019980A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Measuring apparatus for performing positional analysis on an integrated circuit carrier |
US20100045458A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Safety system for an integrated circuit alignment testing apparatus |
US7880900B2 (en) | 2008-08-19 | 2011-02-01 | Silverbrook Research Pty Ltd | Measuring apparatus for performing positional analysis on an integrated circuit carrier |
US20100045729A1 (en) * | 2008-08-19 | 2010-02-25 | Silverbrook Research Pty Ltd | Method for testing alignment of a test bed with a plurality of integrated circuits thereon |
US8593278B2 (en) * | 2010-03-29 | 2013-11-26 | Mckesson Automation Inc. | Medication storage device usage status notifications |
JP5648692B2 (ja) * | 2010-10-27 | 2015-01-07 | 株式会社ニコン | 形状測定装置、形状測定方法、構造物の製造方法およびプログラム |
US10593576B2 (en) | 2015-03-03 | 2020-03-17 | Brooks Automation (Germany) Gmbh | Inspection system |
JP7147127B2 (ja) * | 2018-12-27 | 2022-10-05 | 株式会社東京精密 | 形状測定装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60201639A (ja) * | 1984-03-27 | 1985-10-12 | Fujitsu Ltd | ウエハ−検査装置 |
KR910007348B1 (ko) * | 1987-11-25 | 1991-09-25 | 인더스트리얼 테크놀로지 리써어치 인스티튜트 | 다수의 개별 도형 판별용 기계시각 인식 방법 및 장치 |
KR970006422B1 (ko) * | 1993-12-13 | 1997-04-28 | 한국과학기술연구원 | 자유곡면의 3차원 형상정보 획득 장치 및 그 방법 |
JP3768583B2 (ja) * | 1996-02-28 | 2006-04-19 | 浜松ホトニクス株式会社 | レーザー加工装置 |
JPH11201719A (ja) * | 1998-01-09 | 1999-07-30 | Nikon Corp | 位置測定装置及びレーザ加工装置 |
US6603103B1 (en) * | 1998-07-08 | 2003-08-05 | Ppt Vision, Inc. | Circuit for machine-vision system |
IL125337A0 (en) * | 1998-07-14 | 1999-03-12 | Nova Measuring Instr Ltd | Method and apparatus for lithography monitoring and process control |
JP3481144B2 (ja) * | 1998-08-31 | 2003-12-22 | 東芝セラミックス株式会社 | 面取り幅測定装置 |
-
2000
- 2000-05-25 JP JP2000155493A patent/JP4649704B2/ja not_active Expired - Lifetime
-
2001
- 2001-05-24 TW TW090112535A patent/TW526325B/zh not_active IP Right Cessation
- 2001-05-24 KR KR1020010028565A patent/KR100837125B1/ko active IP Right Grant
- 2001-05-24 US US09/863,447 patent/US6762399B2/en not_active Expired - Lifetime
-
2008
- 2008-02-28 KR KR1020080018385A patent/KR100910948B1/ko active IP Right Grant
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100920309B1 (ko) * | 2002-12-28 | 2009-10-08 | 주식회사 포스코 | 열연강판의 형상 측정장치 |
Also Published As
Publication number | Publication date |
---|---|
US6762399B2 (en) | 2004-07-13 |
KR100837125B1 (ko) | 2008-06-11 |
US20020017599A1 (en) | 2002-02-14 |
KR20080025389A (ko) | 2008-03-20 |
TW526325B (en) | 2003-04-01 |
JP2001336918A (ja) | 2001-12-07 |
KR100910948B1 (ko) | 2009-08-05 |
JP4649704B2 (ja) | 2011-03-16 |
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