KR20010097156A - Adhesive tape for the electronic parts - Google Patents
Adhesive tape for the electronic parts Download PDFInfo
- Publication number
- KR20010097156A KR20010097156A KR1020000020987A KR20000020987A KR20010097156A KR 20010097156 A KR20010097156 A KR 20010097156A KR 1020000020987 A KR1020000020987 A KR 1020000020987A KR 20000020987 A KR20000020987 A KR 20000020987A KR 20010097156 A KR20010097156 A KR 20010097156A
- Authority
- KR
- South Korea
- Prior art keywords
- weight
- parts
- adhesive tape
- group
- component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/18—Homopolymers or copolymers of nitriles
- C09J133/20—Homopolymers or copolymers of acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
- C08K5/3417—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
본 발명은 리드, 다이패드, 방열판, 반도체 칩과 같이 반도체 장치를 구성하는 리드프레임 주변의 부품들 접착에 사용되는 내열성을 지닌 전자부품용 접착테이프에 관한 것으로서, 기존의 접착테이프에 비해 접착력, 내열성, 전기적 특성의 제반 물성이 고루 우수한 접착테이프를 제조하기 위해 안출된 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape for an electronic component having heat resistance used for bonding components around a lead frame constituting a semiconductor device such as a lead, a die pad, a heat sink, and a semiconductor chip. In order to produce excellent adhesive tape with all the physical properties of electrical properties.
본 발명은 중량평균분자량이 100,000~2,000,000 범위이고, 카르복실기와 같은 관능기가 함유되어 있는 아크릴 수지, 비스페놀 A계 에폭시와 크레졸노볼락에폭시 혹은 페놀노볼락에폭시와의 에폭시혼합수지, 한 분자 내에 2개 이상의 말레이미드기를 함유한 화합물, 방향족 디아민계 화합물, 액상 실리콘수지, 무기 또는 유기입자로 된 충전제 및 용제로 구성된 접착조성물이 내열성 필름의 일면 또는 양면에 도포되어 있는 것을 특징으로 한 접착테이프에 관한 것으로서, 이와 같은 접착테이프는 접착력, 내열성 등의 제반물성이 우수하여 특히 반도체 칩 등의 전자부품으로 사용할 때 유용하다.The present invention has a weight average molecular weight ranging from 100,000 to 2,000,000, and an acrylic resin containing a functional group such as a carboxyl group, an epoxy mixed resin of bisphenol A-based epoxy and cresol novolac epoxy or phenol novolac epoxy, two or more in one molecule. An adhesive tape comprising an adhesive composition composed of a compound containing a maleimide group, an aromatic diamine compound, a liquid silicone resin, a filler made of inorganic or organic particles, and a solvent is applied to one or both surfaces of a heat resistant film. Such adhesive tapes have excellent physical properties such as adhesive strength and heat resistance, and are particularly useful when used as electronic components such as semiconductor chips.
Description
본 발명은 리드, 다이패드, 방열판, 반도체 칩과 같이 반도체 장치를 구성하는 리드프레임 주변의 부품들 접착에 사용할 수 있는 전자 부품용 접착테이프에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape for electronic components that can be used to bond components around a lead frame constituting a semiconductor device such as a lead, a die pad, a heat sink, and a semiconductor chip.
기존의 수지패키지형 반도체 장치에 사용되는 접착테이프에는 리드프레임 고정용 접착테이프, 방열판 접착용 테이프, TAB 캐리어 테이프 등이 있는데, 리드프레임 고정용 접착테이프는 리드프레임의 리드를 고정하여 리드프레임 자체 및 반도체 조립 공정 전체의 수율 및 생산성 향상을 목적으로 사용되며, 일반적으로 리드프레임 메이커에서 리드프레임 위에 접착되고, 반도체 조립업체에서는 이것을 이용하여 반도체 칩을 탑재한 후에 수지로 패키징하게 되는데, 이때 사용되는 리드프레임 고정용 접착테이프는 반도체 수준에서 일반적인 신뢰성 및 테이핑시의 작업성, 테이핑 후의 접착력 등이 우수해야 함은 물론 반도체 장치의 조립공정에서의 가열에 견딜 수 있는 충분한 내열성을 갖추어야 한다.Adhesive tapes used in conventional resin packaged semiconductor devices include adhesive tapes for fixing leadframes, adhesive tapes for heat sinks, and TAB carrier tapes. Adhesive tapes for fixing leadframes can be applied to the leadframe itself by fixing leads of leadframes. It is used to improve the yield and productivity of the entire semiconductor assembly process, and is generally bonded onto a lead frame in a lead frame maker, and a semiconductor assembly company uses this to mount a semiconductor chip and package it with a resin. Adhesive tape for frame fixing should be excellent in general reliability at the semiconductor level, workability during taping, adhesive strength after taping, etc., as well as sufficient heat resistance to withstand heating in the assembly process of the semiconductor device.
이와 같은 용도에 사용되는 기존의 접착테이프로는, 예를 들어, 폴리이미드 필름 등의 내열성 지지필름상에, 폴리아크릴로니트릴, 폴리아크릴레이트 혹은 아크릴로니트릴-부타디엔 공중합체 등을 단독으로 도포하거나 또는 열경화성수지를 혼합하여 도포한 것들이 사용되었다. 그러나, 근래들어 반도체 장치 내부에 있어서도 다핀화하거나, 방열성의 확보에 대한 요구로 인하여 패키지 구조가 복잡화하고 있으며, 접착테이프의 접착부에 대해서는 전기적, 물리적, 열적특성이나 취급 특성에 대한 요구가 엄격해지고 있는 실정이다. 그러나 종래의 접착테이프의 경우는 상기와 같은 요구를 만족시킬 정도로 열적특성, 치수안정성, 전기적 특성이 충분치 않으며, 특히 히트싱크와 리드핀을 접착시키거나, 반도체 칩과 리드핀을 절연 테이프로 접합시키는 공정에서는 리드프레임 등의 금속재료를 변형시키거나, 손상시킬 우려가 있는 등의 문제점이 있다.Existing adhesive tapes used for such applications include, for example, polyacrylonitrile, polyacrylate, or acrylonitrile-butadiene copolymers alone or the like on a heat resistant support film such as a polyimide film. Or those coated with a mixture of thermosetting resins were used. However, in recent years, even in the semiconductor device, the package structure has been complicated by the demand for multi-pinning or securing heat dissipation properties, and the requirements for the electrical, physical, thermal, and handling characteristics of the adhesive tape are becoming more stringent. It is true. However, in the case of the conventional adhesive tape, thermal, dimensional stability, and electrical characteristics are not sufficient to satisfy the above requirements, and in particular, the heat sink and the lead fins are bonded, or the semiconductor chip and the lead pins are bonded with insulating tape. In the process, there is a problem of deforming or damaging metal materials such as lead frames.
이와 같은 문제점을 해결하기 위해 USP 5,494,757, USP 5,500,294에서는 피페라지닐 에틸아미노카르보닐기를 갖는 부타디엔-아크릴로 니트릴 공중합체, 2개 이상의 말레이미드기를 함유한 화합물, 디아민 함유 폴리실록산 화합물 등으로 구성된 접착제를 사용하는 방법이 제시되어 있는데, 이 경우에는 비교적 저온에서 접착, 경화할 수 있고 내열성, 전기적 특성이 우수한 반면, 아웃가스가 다량 발생하거나 내흡습성이 떨어지는 등의 문제점이 잔존한다.In order to solve this problem, USP 5,494,757, USP 5,500,294 uses an adhesive consisting of a butadiene-acrylonitrile copolymer having a piperazinyl ethylaminocarbonyl group, a compound containing two or more maleimide groups, a diamine-containing polysiloxane compound, and the like. In this case, there are problems such as adhesion and curing at a relatively low temperature, excellent heat resistance and electrical properties, but a large amount of outgas or poor hygroscopicity.
본 발명은 상기와 같은 문제점을 해결하기 위해 안출된 것으로서, 비교적 저온에서 접착, 경화할 수 있고 내열성, 전기절연성 및 내흡습성이 고루 우수하고 아웃가스의 발생이 적기 때문에 특히 반도체 부품들간의 접착에 유용한 접착테이프를 제공하는데 그 목적이 있는 것이다.The present invention has been made to solve the above problems, and is particularly useful for bonding between semiconductor components because it can be bonded and cured at a relatively low temperature, has excellent heat resistance, electrical insulation and hygroscopicity, and generates less outgas. The purpose is to provide an adhesive tape.
본 발명은 중량평균분자량이 100,000~200,000 범위에 있으며, 카르복실기, 아민기, 글리시딜기, 술폰기, 알콜기, 아미노기 중에서 선택된 1 또는 2 이상의 관능기를 함유한 아크릴수지(성분 A)와, 비스페놀A계 에폭시와 크레졸노볼락 에폭시 또는 페놀노볼락에폭시와의 에폭시혼합수지(성분 B)와, 한 분자 내에서 2개 이상의 말레이미드기를 함유하는 화합물(성분 C)과, 방향족 디아민계 화합물(성분 D)과, 에폭시기를 지닌 액상실리콘수지(성분 E)와, 무기 또는 유기성분의 입자로 된 충전제(성분 F) 및 용제로 구성된 접착조성물이 내열성 필름이 한면 또는 양면에 도포되어 있는 것을 특징으로 하는 전자부품용 접착테이프에 관한 것이다.The present invention has a weight average molecular weight in the range of 100,000 to 200,000, and contains an acrylic resin (component A) containing at least one functional group selected from a carboxyl group, an amine group, a glycidyl group, a sulfone group, an alcohol group and an amino group, and a bisphenol A Epoxy mixture resin (component B) of a system type epoxy and a cresol novolak epoxy or a phenol novolak epoxy, the compound (component C) containing two or more maleimide groups in one molecule, and an aromatic diamine type compound (component D) And an adhesive composition comprising a liquid silicone resin (component E) having an epoxy group, a filler (component F) composed of particles of inorganic or organic components, and a solvent, wherein a heat resistant film is coated on one or both surfaces. It relates to an adhesive tape for.
이하에서 본 발명을 구체적으로 설명한다.Hereinafter, the present invention will be described in detail.
본 발명에서 사용되는 아크릴 수지(성분 A)는 중량평균 분자량이 100,000~2,000,000인 것으로, 중합체 내에 카르복실기, 아민기, 글리시딜기, 술폰기, 알콜기, 아미노기 중에서 선택된 1 또는 2 이상의 관능기를 지니며, 유리전이온도가 -50℃~150℃ 범위에 있는 것이 사용된다. 이때 중량평균분자량이 100,000 보다 낮으면 열안정성이 불량해지고 접착력, 내열성이 저하하며, 2,000,000 보다 크게 되면 용매에 대한 용해성이 나빠지고 용액 제조시 점도가 증가하여 작업성이 불량해진다.The acrylic resin (component A) used in the present invention has a weight average molecular weight of 100,000 to 2,000,000, and has at least one functional group selected from a carboxyl group, an amine group, a glycidyl group, a sulfone group, an alcohol group, and an amino group in the polymer. The glass transition temperature is used in the range of -50 to 150 ℃. At this time, if the weight average molecular weight is less than 100,000, the thermal stability is poor, the adhesion and heat resistance is lowered, and if the weight average molecular weight is greater than 2,000,000, the solubility in the solvent is deteriorated and the viscosity is increased during solution preparation, resulting in poor workability.
그리고, 본 발명에 사용되는 아크릴 수지는 아크릴로니트릴 10~60중량%, 탄소수가 2~12개인 알킬기를 가진 알킬아크릴레이트 20~80중량% 및 카르복실기, 알콜기, 술폰기, 글리시딜기, 아미노기 중 1개 이상의 관능기와 이중결합을 지닌 단량체 0.1~20중량%로 구성된 단량체 혼합물을 공중합시켜 얻는다. 이때, 관능기를 가진 단량체가 0.1중량% 보다 적게 사용되면 접착력, 내열성이 떨어지고, 20중량% 보다 많이 사용되면 용액상태에서의 안정성이 떨어진다.The acrylic resin used in the present invention is 10 to 60% by weight of acrylonitrile, 20 to 80% by weight of alkyl acrylate having an alkyl group having 2 to 12 carbon atoms, and a carboxyl group, alcohol group, sulfone group, glycidyl group and amino group. Obtained by copolymerizing the monomer mixture consisting of 0.1 to 20% by weight of a monomer having at least one functional group and a double bond. At this time, when the monomer having a functional group is used less than 0.1% by weight, the adhesive strength and heat resistance is lowered, and when more than 20% by weight is used, the stability in solution is inferior.
그리고, 성분 B(에폭시혼합수지)의 경우에는 성분 A 100중량부에 대하여 비스페놀A계 에폭시 20~500중량부(보다 바람직하게는 80~200중량부)와 크레졸노볼락에폭시 또는 페놀노볼락에폭시 10~200중량부(보다 바람직하게는 40~100중량부)를 사용한다. 이 경우에 있어서, 비스페놀A계 에폭시를 20중량부 미만 사용한 경우는 접착력이 저하되며, 500중량부 초과 사용한 경우는 내열성이 저하된다. 또 크레졸노볼락에폭시 또는 페놀노볼락에폭시가 10중량부 미만일때는 내열성이 나빠지며, 200중량부 초과 사용하면 접착력이 떨어진다.In the case of component B (epoxy mixture resin), 20 to 500 parts by weight of bisphenol A epoxy (more preferably 80 to 200 parts by weight) and cresol novolac epoxy or phenol novolac epoxy 10 based on 100 parts by weight of component A 200 weight part (more preferably, 40-100 weight part) is used. In this case, when less than 20 weight part of bisphenol A epoxy is used, adhesive force falls, and when more than 500 weight part is used, heat resistance falls. In addition, when the cresol novolac epoxy or the phenol novolac epoxy is less than 10 parts by weight, the heat resistance is worse, and when used in excess of 200 parts by weight, the adhesive strength is reduced.
성분 C는 하기 화학식 1 또는 화학식 2로 나타내는 화합물과 같이 1분자내에 2개 이상의 말레이미드기를 함유한 화합물로서, 그 사용량은 성분 A 100중량부에 대하여 10~200중량부 첨가하는 것이 바람직한데, 10중량부 보다 적은 경우에는 내열성 및 경화 후 탄성율 및 기계적 강도가 저하되고, 과다한 경우에는 접착력이 저하된다.Component C is a compound containing two or more maleimide groups in one molecule, such as the compound represented by the following Chemical Formula 1 or Chemical Formula 2, and its amount is preferably 10 to 200 parts by weight based on 100 parts by weight of component A. When less than the weight part, heat resistance and the elastic modulus and mechanical strength after curing decrease, and when excessive, the adhesive force decreases.
성분 D(방향족디아민계 화합물)의 경우에는 에폭시수지와 비스말레이미드수지 함량에 대하여 적합한 양이 들어가야 되는데, 대략 성분 B와 성분 C의 총 사용량 100중량부에 대하여 1~100중량부 범위에서 사용하며, 부족하거나 과다한 경우는 내용제성, 내열성, 전기저항 등이 저하된다. 본 발명에서는 특히 전기적 특성과 내열성, 내약품성이 우수한 방향족 디아민 화합물을 사용하는 것이 좋으며, 경화반응을 촉진하기 위하여 경화촉진제를 사용할 수 있다.In the case of component D (aromatic diamine-based compound), a suitable amount should be included with respect to the epoxy resin and bismaleimide resin content, and it is used in the range of 1 to 100 parts by weight based on 100 parts by weight of the total amount of component B and component C. In case of lack or excessive, solvent resistance, heat resistance, electrical resistance, etc. are lowered. In the present invention, it is particularly preferable to use an aromatic diamine compound having excellent electrical properties, heat resistance, and chemical resistance, and a curing accelerator may be used to promote a curing reaction.
성분 E(에폭시기를 지닌 실리콘수지)의 경우에는 실리콘성분 등이 접착제내에서 화학결합을 시켜줌으로써 접착제의 내열성, 내흡수성, 전기절연성이 향상되어 접착테이프의 내구성, 신뢰성을 부여하는데, 그 사용량은 성분 B 100중량부에 대하여 0.1~20중량부 범위에서 첨가한다. 이때 0.1중량부 보다 적게 첨가하는 경우 내열성 등의 성능향상이 미미하며, 20중량부 초과 첨가하는 경우 접착력이 저하된다.In the case of component E (silicone resin having an epoxy group), a silicone component, etc., chemically bonds in the adhesive, thereby improving heat resistance, water absorption, and electrical insulation of the adhesive, thereby providing durability and reliability of the adhesive tape. It adds in 0.1-20 weight part with respect to 100 weight part of B. At this time, when the addition of less than 0.1 parts by weight, the improvement in performance such as heat resistance is insignificant.
그리고, 성분 F(무기 또는 유기성분의 입자)의 경우에는 성분 A 100중량부에 대하여 1~50중량부 첨가하는 것이 좋은데, 1중량부 보다 적게 첨가되는 경우에는 접착성이 과다하여 작업성과 탄성율이 저하되고, 50중량부 초과하여 첨가하는 경우에는 접착력이 떨어진다. 이때 사용할 수 있는 무기충전제로는 산화아연, 실리카, 알루미나 및 지리콘 분말 등이 있으며, 유기 충전제로는 분말상의 아크릴수지, 폴리아마이드수지 또는 실리콘 등이 있다.In the case of component F (particles of inorganic or organic components), it is preferable to add 1 to 50 parts by weight with respect to 100 parts by weight of component A. When less than 1 part by weight is added, the workability and elastic modulus are excessive. It falls, and when it adds more than 50 weight part, adhesive force falls. At this time, inorganic fillers that can be used include zinc oxide, silica, alumina and zircon powders, and organic fillers include powdery acrylic resins, polyamide resins, or silicon.
이상과 같은 조성으로 준비된 접착조성물은 점도가 100~2000cps(보다 좋기로는 300~1000cps)가 되도록 용제에 용해하여 사용한다.The adhesive composition prepared in the above composition is dissolved in a solvent so as to have a viscosity of 100 to 2000 cps (preferably 300 to 1000 cps).
본 발명에서는 상기 접착 조성물을 내열성 필름 위에 건조후의 두께가 10~50㎛이 되도록 도포하고 80~120℃에서 1~20분 동안 건조한 후 박리성 필름을 붙이고 80~120℃에서 5~30분 동안 반경화시키는 일반적인 접착테이프 제조공정을 거쳐 원하는 내열성 접착테이프를 얻는다.In the present invention, the adhesive composition is applied on the heat resistant film after drying to have a thickness of 10 to 50 μm, and dried at 80 to 120 ° C. for 1 to 20 minutes, and then attached to a release film and a radius of 5 to 30 minutes at 80 to 120 ° C. The desired heat-resistant adhesive tape is obtained through a general adhesive tape manufacturing process.
이때 사용될 수 있는 내열성 필름으로는, 예를 들면, 폴리이미드, 폴리페닐렌 술피드, 폴리에틸렌테레프탈레이트, 폴리에틸렌나프탈레이트 등의 내열성 수지 필름 등이 사용될 수 있으며, 그 두께는 대략 10~200㎛(보다 바람직하게는 25~150㎛)가 적당하다.At this time, as the heat-resistant film that can be used, for example, a heat-resistant resin film such as polyimide, polyphenylene sulfide, polyethylene terephthalate, polyethylene naphthalate and the like can be used, the thickness is approximately 10 ~ 200㎛ (more Preferably 25-150 micrometers) is suitable.
한편, 본 발명에서 사용 가능한 박리성 필름으로는 폴리프로필렌 필름, 불소수지계 필름, 폴리에틸렌 필름, 폴리에틸렌 테레프탈레이트 필름, 종이 및 경우에 따라 이들에 실리콘 수지로 박리성을 부여한 필름 등이 있다.On the other hand, as a peelable film which can be used by this invention, a polypropylene film, a fluororesin-type film, a polyethylene film, a polyethylene terephthalate film, paper, and the film which provided them with silicone resin in some cases, etc. are mentioned.
이하에서 실시예 및 비교예를 들어 본 발명을 좀 더 구체적으로 설명한다.Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples.
<실시예 1><Example 1>
아크릴로니트릴 32중량%, 부틸아크릴레이트 63중량% 및 메타아크릴산 5중량%로 구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 1,000,000의 아크릴수지 100중량부에 비스페놀A계 에폭시(에폭시 당량 400) 100중량부, 크레졸노볼락에폭시(에폭시 당량 200) 50중량부, N,N'-(4,4-디페닐메탄)비스말레이미드 25중량부, 디아미노디페닐메탄 25중량부, 에폭시기를 가진 액상 실리콘수지 2중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞추었다.Bisphenol A epoxy (Epoxy equivalent 400) to 100 parts by weight of an acrylic resin having a weight average molecular weight of 1,000,000 obtained by copolymerizing a monomer mixture composed of 32% by weight of acrylonitrile, 63% by weight of butylacrylate and 5% by weight of methacrylic acid in the presence of a polymerization initiator. ) 100 parts by weight, cresol novolac epoxy (epoxy equivalent 200) 50 parts by weight, 25 parts by weight of N, N '-(4,4-diphenylmethane) bismaleimide, 25 parts by weight of diaminodiphenylmethane, epoxy group 2 parts by weight of the liquid silicone resin and 6 parts by weight of zinc oxide having an average particle size were added and mixed, and the viscosity of the solution was adjusted to 800 to 1000 cps using methyl ethyl ketone and toluene solvent.
이 접착제를 이용하여 두께가 50㎛인 폴리이미드 필름(상품명 : KAPTON, DUPONT社 제조)위에 건조후의 두께가 20㎛이 되도록 도포하고, 120℃에서 5분 동안 건조한 후, 두께가 38㎛ 폴리에틸렌 테레프탈레이트 필름을 라미네이트하여, 접착테이프를 제조하였다.The adhesive was applied onto a polyimide film having a thickness of 50 μm (trade name: KAPTON, manufactured by DUPONT) so as to have a thickness of 20 μm after drying, and dried at 120 ° C. for 5 minutes, followed by 38 μm polyethylene terephthalate. The film was laminated to prepare an adhesive tape.
<실시예 2><Example 2>
아크릴로니트릴 30중량%, 부틸아크릴레이트 65중량% 및 글리시딜아크릴레이트 5중량%로 구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 1,200,000의 아크릴수지 100중량부에 비스페놀A계 에폭시 200중량부, 크레졸노볼락에폭시 100중량부, N,N'-(4,4-디페닐메탄)비스말레이미드 50중량부, 디아미노디페닐메탄 50중량부, 에폭시기를 가진 액상 실리콘수지 2중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞춘다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.Bisphenol A epoxy 200 to 100 parts by weight of an acrylic resin having a weight average molecular weight of 1,200,000 obtained by copolymerizing a monomer mixture composed of 30% by weight of acrylonitrile, 65% by weight of butyl acrylate and 5% by weight of glycidyl acrylate in the presence of a polymerization initiator. Parts by weight, 100 parts by weight of cresol novolac epoxy, 50 parts by weight of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by weight of diaminodiphenylmethane, 2 parts by weight of liquid silicone resin having an epoxy group 6 parts by weight of zinc oxide having an average particle size of 2.0 µm was added and mixed, and the solution was adjusted to 800-1000 cps using methyl ethyl ketone and toluene solvent, and then bonded in the same manner as in Example 1 using this adhesive. The tape was made.
<실시예 3><Example 3>
아크릴로니트릴 40중량%, 부틸아크릴레이트 52중량%, 하이드록시에틸메타아크릴레이트 3중량% 및 글리시딜아크릴레이트 5중량%로 구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 900,000의 아크릴수지 100중량부에 비스페놀A계 에폭시 200중량부, 크레졸노볼락에폭시 100중량부, N,N'-(4,4-디페닐메탄)비스말레이미드 50중량부, 디아미노디페닐메탄 50중량부, 에폭시기를 가진 액상 실리콘수지 2중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞춘다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.Acrylonitrile having a weight average molecular weight of 900,000 obtained by copolymerizing a monomer mixture composed of 40% by weight of acrylonitrile, 52% by weight of butylacrylate, 3% by weight of hydroxyethyl methacrylate and 5% by weight of glycidylacrylate in the presence of a polymerization initiator. 200 parts by weight of bisphenol A epoxy, 100 parts by weight of cresol novolac epoxy, 50 parts by weight of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by weight of diaminodiphenylmethane 2 parts by weight of a liquid silicone resin having an epoxy group and 6 parts by weight of zinc oxide having an average particle size of 2.0 μm were added and mixed.The solution was adjusted to 800 to 1000 cps using methyl ethyl ketone and toluene solvent, and then the adhesive was prepared. Adhesive tape was prepared in the same manner as in Example 1.
<비교예 1>Comparative Example 1
아크릴로니트릴 30중량%, 부틸아크릴레이트 65중량%, 메타아크릴산 5중량%로 구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 1,200,000의 아크릴수지 100중량부에 비스페놀A계 에폭시 300중량부, 디아미노디페닐메탄 50중량부, 에폭시기를 가진 액상 실리콘수지 2중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞춘다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.300 parts by weight of bisphenol A epoxy based on 100 parts by weight of an acrylic resin having a weight average molecular weight of 1,200,000 obtained by copolymerizing a monomer mixture composed of 30% by weight of acrylonitrile, 65% by weight of butyl acrylate and 5% by weight of methacrylic acid in the presence of a polymerization initiator, 50 parts by weight of diaminodiphenylmethane, 2 parts by weight of a liquid silicone resin having an epoxy group, and 6 parts by weight of zinc oxide having an average particle size of 2.0 µm were added and mixed. After adjusting to 1000 cps, the adhesive tape was prepared in the same manner as in Example 1 using this adhesive.
<비교예 2>Comparative Example 2
아크릴로니트릴 30중량%, 부틸아크릴레이트 60중량%, 메타아크릴산 5중량%로구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 1,200,000의 아크릴수지 100중량부에 비스페놀A계 에폭시 200중량부, 크레졸노볼락에폭시 100중량부, N,N'-(4,4-디페닐메탄)비스말레이미드 50중량부, 디아미노디페닐메탄 50중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞춘다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.200 parts by weight of bisphenol A epoxy based on 100 parts by weight of an acrylic resin having a weight average molecular weight of 1,200,000 obtained by copolymerizing a monomer mixture composed of 30% by weight of acrylonitrile, 60% by weight of butyl acrylate and 5% by weight of methacrylic acid in the presence of a polymerization initiator, 100 parts by weight of cresol novolac epoxy, 50 parts by weight of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by weight of diaminodiphenylmethane, and 6 parts by weight of zinc oxide having an average particle size of 2.0 μm. After addition and mixing, using a methyl ethyl ketone and toluene solvent to adjust the viscosity of the solution to 800 ~ 1000cps, using this adhesive was prepared in the same manner as in Example 1.
<비교예 3>Comparative Example 3
아크릴로니트릴 40중량%와 부틸아크릴레이트 60중량%로 구성된 단량체 혼합물을 중합개시제 존재하에 공중합시켜 얻어진 중량평균 분자량 1,000,000의 아크릴수지 100중량부에 비스페놀A계 에폭시 50중량부, 크레졸노볼락에폭시 200중량부, N,N'-(4,4-디페닐메탄)비스말레이미드 50중량부, 디아미노디페닐메탄 50중량부, 에폭시기를 가진 액상 실리콘수지 2중량부, 평균입자크기가 2.0㎛인 산화아연 6중량부를 첨가 혼합하고, 메틸에틸케톤과 톨루엔 용제를 이용하여 용액의 점도를 800~1000cps로 맞춘다음, 이 접착제를 이용하여 실시예 1과 같은 방법으로 접착테이프를 제조하였다.50 parts by weight of bisphenol A epoxy and 200 parts by weight of cresol novolac epoxy in 100 parts by weight of an acrylic resin having a weight average molecular weight of 1,000,000 obtained by copolymerizing a monomer mixture composed of 40% by weight of acrylonitrile and 60% by weight of butylacrylate in the presence of a polymerization initiator. Part, 50 parts by weight of N, N '-(4,4-diphenylmethane) bismaleimide, 50 parts by weight of diaminodiphenylmethane, 2 parts by weight of liquid silicone resin having an epoxy group, and an oxidation having an average particle size of 2.0 μm. 6 parts by weight of zinc was added and mixed, and the viscosity of the solution was adjusted to 800 to 1000 cps using methyl ethyl ketone and toluene solvent, and then the adhesive tape was prepared in the same manner as in Example 1 using this adhesive.
상기 실시예 및 비교예에서 제조된 접착테이프의 물성을 평가하여 하기 표 1에 나타내었으며, 이때 물성은 하기 방법에 의해 평가하였다.The physical properties of the adhesive tapes prepared in Examples and Comparative Examples were shown in Table 1 below, and the physical properties were evaluated by the following methods.
접착력Adhesion
150℃로 유지되고 있는 열판 위에 동박을 얹어 놓고, 상기 실시예 및 비교예에서 제조된 TAPE을 5㎏/㎠의 압력으로 0.5초간 압착한 후, 175℃ 열풍오븐에서 1시간동안 경화시킨 후 인장강도시험기를 이용하여 T-PEEL 강도를 측정하였다.The copper foil was placed on a hot plate maintained at 150 ° C., and the TAPE prepared in Examples and Comparative Examples was pressed at a pressure of 5 kg / cm 2 for 0.5 seconds, and then cured for 1 hour in a 175 ° C. hot air oven, followed by tensile strength. T-PEEL strength was measured using a tester.
열분해온도Pyrolysis temperature
DUPONT V4. 1C 2200 모델 TGA 이용 측정하여 질량이 5% 감소한 온도를 열분해 온도로 하였다.DUPONT V4. The temperature at which the mass was reduced by 5% as measured using the 1C 2200 model TGA was used as the pyrolysis temperature.
아웃가스Outgas
건조기에서 170℃에서 1시간 동안 보관한 뒤 무게변화를 측정하였다.After storage for 1 hour at 170 ℃ in a dryer the weight change was measured.
흡습율Moisture absorption
23℃ 물에 24시간 동안 담근 후 무게변화를 측정하였다.The weight change was measured after soaking in water at 23 ° C. for 24 hours.
탄성률Modulus
170℃에서 5시간 동안 경과한 후 인장강도시험기를 이용하여 탄성률을 측정하였다.After elapse of 5 hours at 170 ℃ the elastic modulus was measured using a tensile strength tester.
상기 실시예 및 비교예를 분석해보면 본 발명에 따라 제조된 실시예들의 경우에는 접착력, 내열성, 내흡습성 등의 전반적인 물성이 골고루 우수한 반면에 비교예들의 경우에는, 예를 들어, 비교예 1의 경우에는 아웃가스의 발생이 많고 내열성, 탄성율이 낮은 단점을 지니고, 비교예 2의 경우에는 내흡습성이 특히 나쁘며, 비교예 3의 경우는 특히 접착력이 나쁜 단점을 지닌다.In the analysis of the examples and comparative examples, the examples prepared according to the present invention have excellent overall physical properties such as adhesion, heat resistance, and hygroscopicity, while in the case of the comparative examples, for example, in the case of Comparative Example 1 Has a disadvantage of high outgas generation and low heat resistance, low modulus of elasticity, Comparative Example 2 has a particularly bad hygroscopicity, Comparative Example 3 has a particularly bad adhesive strength.
이와 같이 본 발명에 따른 접착테이프는 접착력, 내열성, 내흡습성 등의 전반적 물성이 고루 우수하여 반도체 장치와 같이 신뢰성을 요구하는 전자제품들의 부품용 접착테이프로 매우 유용하다.As described above, the adhesive tape according to the present invention is very useful as adhesive tape for components of electronic products requiring reliability such as semiconductor devices due to excellent overall physical properties such as adhesive strength, heat resistance, and hygroscopicity.
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000020987A KR100607372B1 (en) | 2000-04-20 | 2000-04-20 | Adhesive tape for the electronic parts |
| TW089116792A TW562846B (en) | 2000-04-20 | 2000-08-18 | Adhesive tape for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000020987A KR100607372B1 (en) | 2000-04-20 | 2000-04-20 | Adhesive tape for the electronic parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20010097156A true KR20010097156A (en) | 2001-11-08 |
| KR100607372B1 KR100607372B1 (en) | 2006-08-02 |
Family
ID=19665853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020000020987A KR100607372B1 (en) | 2000-04-20 | 2000-04-20 | Adhesive tape for the electronic parts |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100607372B1 (en) |
| TW (1) | TW562846B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102574409B1 (en) | 2019-07-01 | 2023-09-04 | 삼성전기주식회사 | Semiconductor package |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03103424A (en) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | Maleimide resin composition |
| JPH03119052A (en) * | 1989-10-02 | 1991-05-21 | Toray Ind Inc | Epoxy resin composition |
| JPH07173449A (en) * | 1993-12-17 | 1995-07-11 | Hitachi Chem Co Ltd | Acrylic adhesive composition and adhesive film made thereof |
| US5863988A (en) * | 1995-12-25 | 1999-01-26 | Tomoegawa Paper Co., Ltd. | Liquid adhesive for electronic parts and adhesive tape |
| KR100302212B1 (en) * | 1999-01-22 | 2001-09-22 | 한형수 | Method for the preparation of the adhesive tape for the electronic parts |
| KR100524858B1 (en) * | 1999-01-22 | 2005-10-28 | 도레이새한 주식회사 | Method for the preparation of the adhesive tape for the electronic parts |
-
2000
- 2000-04-20 KR KR1020000020987A patent/KR100607372B1/en not_active IP Right Cessation
- 2000-08-18 TW TW089116792A patent/TW562846B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW562846B (en) | 2003-11-21 |
| KR100607372B1 (en) | 2006-08-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100541175B1 (en) | Thermally conductive pressure-sensitive adhesive and adhesive sheet containing the same | |
| KR100287238B1 (en) | Adhesive Tapes and Liquid Adhesives for Electronic Components | |
| KR20000011479A (en) | Adhesive composition and adhesive sheet | |
| US6312801B1 (en) | Adhesive tape for electronic parts | |
| KR102470719B1 (en) | Resin composition and resin sheet | |
| JP4994743B2 (en) | Film adhesive and method of manufacturing semiconductor package using the same | |
| JP2007059787A (en) | Adhesive film for semiconductor and semiconductor device using it | |
| JP2005307037A (en) | Film-shaped epoxy resin composition | |
| EP1026217B1 (en) | Method of producing adhesive tape for electronic parts | |
| JPH11181368A (en) | Heat-conductive pressure-sensitive adhesive sheets and method for fixing electronic part to heat-radiating member by using the same | |
| KR20130045187A (en) | Thermal conductive adhesive composition, and adhesive sheet and thermal conductive dicing and die attach film using the same | |
| JP2007284670A (en) | Adhesive film and semiconductor device by using the same | |
| KR100302212B1 (en) | Method for the preparation of the adhesive tape for the electronic parts | |
| US20120114934A1 (en) | Bonding sheet | |
| TWI758489B (en) | Resin composition and resin sheet | |
| KR100607372B1 (en) | Adhesive tape for the electronic parts | |
| JP2010258086A (en) | Adhesive sheet for semiconductor, and dicing tape integrated type adhesive sheet for semiconductor | |
| JP5481828B2 (en) | Adhesive composition, film adhesive, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device, and method for manufacturing semiconductor device | |
| KR100530519B1 (en) | Manufacturing method of adhesive tapes for the electronic parts | |
| JP2002121520A (en) | Adhesive tape for electronic part | |
| KR100524858B1 (en) | Method for the preparation of the adhesive tape for the electronic parts | |
| JP3083814B1 (en) | Electronic component adhesive tape | |
| KR100625054B1 (en) | Thermally stable adhesive tape | |
| JP2017137453A (en) | Glue film | |
| KR19980068296A (en) | Heat-resistant adhesive tape for electronic parts |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| N231 | Notification of change of applicant | ||
| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant | ||
| FPAY | Annual fee payment |
Payment date: 20130704 Year of fee payment: 8 |
|
| FPAY | Annual fee payment |
Payment date: 20140707 Year of fee payment: 9 |
|
| LAPS | Lapse due to unpaid annual fee |